TWI453229B - 環氧樹脂組合物 - Google Patents

環氧樹脂組合物 Download PDF

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Publication number
TWI453229B
TWI453229B TW095148201A TW95148201A TWI453229B TW I453229 B TWI453229 B TW I453229B TW 095148201 A TW095148201 A TW 095148201A TW 95148201 A TW95148201 A TW 95148201A TW I453229 B TWI453229 B TW I453229B
Authority
TW
Taiwan
Prior art keywords
epoxy resin
weight
parts
resin composition
reactive diluent
Prior art date
Application number
TW095148201A
Other languages
English (en)
Chinese (zh)
Other versions
TW200734367A (en
Inventor
Seong-Roon Jeong
Do-Hyun Kim
Jae-Won Lee
Young-Il Kim
Original Assignee
Sds Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sds Co Ltd filed Critical Sds Co Ltd
Publication of TW200734367A publication Critical patent/TW200734367A/zh
Application granted granted Critical
Publication of TWI453229B publication Critical patent/TWI453229B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW095148201A 2005-12-26 2006-12-21 環氧樹脂組合物 TWI453229B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050129793A KR101148051B1 (ko) 2005-12-26 2005-12-26 에폭시 수지 조성물

Publications (2)

Publication Number Publication Date
TW200734367A TW200734367A (en) 2007-09-16
TWI453229B true TWI453229B (zh) 2014-09-21

Family

ID=38218210

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095148201A TWI453229B (zh) 2005-12-26 2006-12-21 環氧樹脂組合物

Country Status (5)

Country Link
JP (1) JP2009521589A (ko)
KR (1) KR101148051B1 (ko)
CN (1) CN101351501B (ko)
TW (1) TWI453229B (ko)
WO (1) WO2007075014A1 (ko)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100966260B1 (ko) * 2007-11-28 2010-06-28 (주)에버텍엔터프라이즈 저습성 및 고신뢰성을 갖는 다이 접착용 전기 전도성 접착조성물
KR101368986B1 (ko) 2007-12-28 2014-02-28 에스케이케미칼주식회사 엘시디 구동소자용 에폭시 수지 조성물
KR101623670B1 (ko) * 2012-01-18 2016-05-23 미쓰이 가가쿠 가부시키가이샤 조성물, 조성물로 이루어지는 표시 디바이스 단면 시일제, 표시 디바이스 및 그의 제조 방법
CN103554835B (zh) * 2013-10-16 2015-09-09 太原理工大学 一种中低温快速固化增强用环氧树脂材料的制备方法
WO2015141717A1 (ja) * 2014-03-20 2015-09-24 日本ゼオン株式会社 感放射線樹脂組成物及び電子部品
JP6283624B2 (ja) * 2015-05-28 2018-02-21 日東電工株式会社 中空型電子デバイス封止用シート、中空型電子デバイスパッケージの製造方法、及び、中空型電子デバイスパッケージ
WO2017110919A1 (ja) 2015-12-25 2017-06-29 東レ株式会社 エポキシ樹脂組成物、繊維強化複合材料、成形品および圧力容器
CN109385047B (zh) * 2018-10-31 2020-11-10 成都市冠宇复合材料制品有限公司 一种树脂组合物及其制备方法
KR102258362B1 (ko) 2020-10-19 2021-06-01 권용문 문경약돌을 먹인 한우의 사골농축액을 이용한 다용도 간장소스 조성물 및 그 제조방법
KR20230157487A (ko) * 2021-07-12 2023-11-16 아사히 가세이 가부시키가이샤 에폭시 수지 조성물, 필름, 필름의 제조 방법, 및 경화물

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200508314A (en) * 2003-06-04 2005-03-01 Sekisui Chemical Co Ltd A liquid crystal display device and curing resin composition, sealing material for the same
TWI237021B (en) * 2001-07-27 2005-08-01 Showa Denko Kk Polymerizable compound, production process of the compound, polymerizable composition containing the compound, cured product obtained by curing the composition, and production process of the cured product
TWI239968B (en) * 1998-01-16 2005-09-21 Loctite Corp Curable epoxy-based compositions

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JPS6456719A (en) * 1987-08-26 1989-03-03 Sanyu Resin Kk Casting resin composition for electronic parts
KR910010026B1 (ko) * 1988-12-19 1991-12-10 주식회사 럭키 액상에폭시 수지 조성물 및 그의 제조방법
JPH0627183B2 (ja) * 1990-03-30 1994-04-13 ソマール株式会社 液状エポキシ樹脂組成物
KR940014615A (ko) * 1992-12-29 1994-07-19 김충세 포커스 팩(focus pack)봉지제용 열경화성 에폭시수지 조성물
JP3141970B2 (ja) * 1993-06-30 2001-03-07 ソマール株式会社 液状エポキシ樹脂組成物
JPH09151303A (ja) * 1995-09-25 1997-06-10 Nissan Chem Ind Ltd エポキシ樹脂組成物
US6180696B1 (en) * 1997-02-19 2001-01-30 Georgia Tech Research Corporation No-flow underfill of epoxy resin, anhydride, fluxing agent and surfactant
RU2195474C2 (ru) * 1997-07-24 2002-12-27 Локтайт Корпорейшн Композиция термореактивной смолы (ее варианты), конструкция крепления полупроводникового устройства и способ изготовления полупроводникового устройства с использованием композиции термореактивной смолы
JP2000178411A (ja) * 1998-12-17 2000-06-27 Hitachi Chem Co Ltd 難燃性エポキシ樹脂組成物及びこの組成物を用いた電気部品
JP4718070B2 (ja) * 1999-06-17 2011-07-06 ヘンケル コーポレイション アンダーフィル封止および補修方法
CN1125488C (zh) * 2000-08-25 2003-10-22 中国科学院化学研究所 一种半导体封装用的液体环氧组合物及其用途
US6548575B2 (en) * 2000-12-13 2003-04-15 National Starch And Chemical Investment Holding Corporation High temperature underfilling material with low exotherm during use
TWI229929B (en) * 2001-01-29 2005-03-21 Ube Industries Underfill material for COF mounting and electronic components
JP2003002951A (ja) * 2001-06-25 2003-01-08 New Japan Chem Co Ltd 液状エポキシ樹脂組成物の薄膜硬化物
JP2003026766A (ja) * 2001-07-13 2003-01-29 New Japan Chem Co Ltd エポキシ系反応性希釈剤及び該希釈剤を含む液状エポキシ樹脂組成物
JP2003160644A (ja) * 2001-11-27 2003-06-03 Matsushita Electric Works Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
TW561162B (en) 2003-06-11 2003-11-11 Chang Chun Plastics Co Ltd Epoxy resin composition for encapsulation of optical semiconductor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI239968B (en) * 1998-01-16 2005-09-21 Loctite Corp Curable epoxy-based compositions
TWI237021B (en) * 2001-07-27 2005-08-01 Showa Denko Kk Polymerizable compound, production process of the compound, polymerizable composition containing the compound, cured product obtained by curing the composition, and production process of the cured product
TW200508314A (en) * 2003-06-04 2005-03-01 Sekisui Chemical Co Ltd A liquid crystal display device and curing resin composition, sealing material for the same

Also Published As

Publication number Publication date
WO2007075014A1 (en) 2007-07-05
CN101351501A (zh) 2009-01-21
KR101148051B1 (ko) 2012-05-25
JP2009521589A (ja) 2009-06-04
TW200734367A (en) 2007-09-16
CN101351501B (zh) 2011-05-18
KR20070068071A (ko) 2007-06-29

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