TWI446522B - 半導體裝置及其製造方法 - Google Patents

半導體裝置及其製造方法 Download PDF

Info

Publication number
TWI446522B
TWI446522B TW097112894A TW97112894A TWI446522B TW I446522 B TWI446522 B TW I446522B TW 097112894 A TW097112894 A TW 097112894A TW 97112894 A TW97112894 A TW 97112894A TW I446522 B TWI446522 B TW I446522B
Authority
TW
Taiwan
Prior art keywords
gate electrode
insulating film
film
semiconductor device
tantalum nitride
Prior art date
Application number
TW097112894A
Other languages
English (en)
Chinese (zh)
Other versions
TW200849557A (en
Inventor
Yoshiaki Kikuchi
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of TW200849557A publication Critical patent/TW200849557A/zh
Application granted granted Critical
Publication of TWI446522B publication Critical patent/TWI446522B/zh

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/01Manufacture or treatment
    • H10D64/021Manufacture or treatment using multiple gate spacer layers, e.g. bilayered sidewall spacers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/01Manufacture or treatment
    • H10D30/021Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/0223Manufacture or treatment of FETs having insulated gates [IGFET] having source and drain regions or source and drain extensions self-aligned to sides of the gate
    • H10D30/0227Manufacture or treatment of FETs having insulated gates [IGFET] having source and drain regions or source and drain extensions self-aligned to sides of the gate having both lightly-doped source and drain extensions and source and drain regions self-aligned to the sides of the gate, e.g. lightly-doped drain [LDD] MOSFET or double-diffused drain [DDD] MOSFET
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/601Insulated-gate field-effect transistors [IGFET] having lightly-doped drain or source extensions, e.g. LDD IGFETs or DDD IGFETs 
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/01Manufacture or treatment
    • H10D64/017Manufacture or treatment using dummy gates in processes wherein at least parts of the final gates are self-aligned to the dummy gates, i.e. replacement gate processes

Landscapes

  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Electrodes Of Semiconductors (AREA)
TW097112894A 2007-04-18 2008-04-09 半導體裝置及其製造方法 TWI446522B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007108953 2007-04-18
JP2008060164A JP5282419B2 (ja) 2007-04-18 2008-03-10 半導体装置及びその製造方法

Publications (2)

Publication Number Publication Date
TW200849557A TW200849557A (en) 2008-12-16
TWI446522B true TWI446522B (zh) 2014-07-21

Family

ID=40147954

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097112894A TWI446522B (zh) 2007-04-18 2008-04-09 半導體裝置及其製造方法

Country Status (4)

Country Link
JP (1) JP5282419B2 (enExample)
KR (1) KR101457006B1 (enExample)
CN (1) CN101335300B (enExample)
TW (1) TWI446522B (enExample)

Families Citing this family (106)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8048733B2 (en) * 2009-10-09 2011-11-01 Taiwan Semiconductor Manufacturing Company, Ltd. Method for fabricating a gate structure
KR102072118B1 (ko) * 2009-11-13 2020-01-31 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치 및 이 표시 장치를 구비한 전자 기기
CN102479722B (zh) * 2010-11-30 2014-03-12 中芯国际集成电路制造(北京)有限公司 晶体管的制作方法
CN102479694B (zh) * 2010-11-30 2013-09-04 中芯国际集成电路制造(北京)有限公司 一种金属栅极及mos晶体管的形成方法
CN102487085B (zh) * 2010-12-01 2014-04-23 中国科学院微电子研究所 半导体器件及其制造方法
US10283321B2 (en) 2011-01-18 2019-05-07 Applied Materials, Inc. Semiconductor processing system and methods using capacitively coupled plasma
US9064815B2 (en) 2011-03-14 2015-06-23 Applied Materials, Inc. Methods for etch of metal and metal-oxide films
US8999856B2 (en) 2011-03-14 2015-04-07 Applied Materials, Inc. Methods for etch of sin films
CN102738225A (zh) * 2011-04-06 2012-10-17 联华电子股份有限公司 半导体元件及其制作方法
US8334198B2 (en) * 2011-04-12 2012-12-18 Taiwan Semiconductor Manufacturing Company, Ltd. Method of fabricating a plurality of gate structures
CN102779751B (zh) * 2011-05-11 2015-09-09 中国科学院微电子研究所 一种半导体器件的制造方法
CN102956544B (zh) * 2011-08-25 2015-06-17 中芯国际集成电路制造(上海)有限公司 金属互连线的制造方法
US20130260564A1 (en) * 2011-09-26 2013-10-03 Applied Materials, Inc. Insensitive dry removal process for semiconductor integration
US9059263B2 (en) 2011-11-09 2015-06-16 QUALCOMM Incorpated Low-K dielectric protection spacer for patterning through substrate vias through a low-K wiring layer
CN103545209A (zh) * 2012-07-13 2014-01-29 中芯国际集成电路制造(上海)有限公司 形成高k金属栅极器件的方法
US9267739B2 (en) 2012-07-18 2016-02-23 Applied Materials, Inc. Pedestal with multi-zone temperature control and multiple purge capabilities
US9373517B2 (en) 2012-08-02 2016-06-21 Applied Materials, Inc. Semiconductor processing with DC assisted RF power for improved control
US9132436B2 (en) 2012-09-21 2015-09-15 Applied Materials, Inc. Chemical control features in wafer process equipment
US10256079B2 (en) 2013-02-08 2019-04-09 Applied Materials, Inc. Semiconductor processing systems having multiple plasma configurations
US9362130B2 (en) 2013-03-01 2016-06-07 Applied Materials, Inc. Enhanced etching processes using remote plasma sources
KR102106885B1 (ko) * 2013-03-15 2020-05-06 삼성전자 주식회사 실리콘 산화막 증착용 전구체 조성물 및 상기 전구체 조성물을 이용한 반도체 소자 제조 방법
US9299537B2 (en) 2014-03-20 2016-03-29 Applied Materials, Inc. Radial waveguide systems and methods for post-match control of microwaves
US9903020B2 (en) 2014-03-31 2018-02-27 Applied Materials, Inc. Generation of compact alumina passivation layers on aluminum plasma equipment components
US9309598B2 (en) 2014-05-28 2016-04-12 Applied Materials, Inc. Oxide and metal removal
US9461144B2 (en) * 2014-06-13 2016-10-04 Taiwan Semiconductor Manufacturing Company, Ltd. Method for semiconductor device fabrication
US9613822B2 (en) 2014-09-25 2017-04-04 Applied Materials, Inc. Oxide etch selectivity enhancement
US9355922B2 (en) 2014-10-14 2016-05-31 Applied Materials, Inc. Systems and methods for internal surface conditioning in plasma processing equipment
US9966240B2 (en) 2014-10-14 2018-05-08 Applied Materials, Inc. Systems and methods for internal surface conditioning assessment in plasma processing equipment
US11637002B2 (en) 2014-11-26 2023-04-25 Applied Materials, Inc. Methods and systems to enhance process uniformity
US10573496B2 (en) 2014-12-09 2020-02-25 Applied Materials, Inc. Direct outlet toroidal plasma source
US10224210B2 (en) 2014-12-09 2019-03-05 Applied Materials, Inc. Plasma processing system with direct outlet toroidal plasma source
US11257693B2 (en) 2015-01-09 2022-02-22 Applied Materials, Inc. Methods and systems to improve pedestal temperature control
US20160225652A1 (en) 2015-02-03 2016-08-04 Applied Materials, Inc. Low temperature chuck for plasma processing systems
US9728437B2 (en) 2015-02-03 2017-08-08 Applied Materials, Inc. High temperature chuck for plasma processing systems
US9881805B2 (en) 2015-03-02 2018-01-30 Applied Materials, Inc. Silicon selective removal
US9741593B2 (en) 2015-08-06 2017-08-22 Applied Materials, Inc. Thermal management systems and methods for wafer processing systems
US9691645B2 (en) 2015-08-06 2017-06-27 Applied Materials, Inc. Bolted wafer chuck thermal management systems and methods for wafer processing systems
US9349605B1 (en) 2015-08-07 2016-05-24 Applied Materials, Inc. Oxide etch selectivity systems and methods
US10504700B2 (en) 2015-08-27 2019-12-10 Applied Materials, Inc. Plasma etching systems and methods with secondary plasma injection
US10522371B2 (en) 2016-05-19 2019-12-31 Applied Materials, Inc. Systems and methods for improved semiconductor etching and component protection
US10504754B2 (en) 2016-05-19 2019-12-10 Applied Materials, Inc. Systems and methods for improved semiconductor etching and component protection
JP6594261B2 (ja) * 2016-05-24 2019-10-23 ルネサスエレクトロニクス株式会社 半導体装置
US9865484B1 (en) 2016-06-29 2018-01-09 Applied Materials, Inc. Selective etch using material modification and RF pulsing
US10062575B2 (en) 2016-09-09 2018-08-28 Applied Materials, Inc. Poly directional etch by oxidation
US10629473B2 (en) 2016-09-09 2020-04-21 Applied Materials, Inc. Footing removal for nitride spacer
US9934942B1 (en) 2016-10-04 2018-04-03 Applied Materials, Inc. Chamber with flow-through source
US10062585B2 (en) 2016-10-04 2018-08-28 Applied Materials, Inc. Oxygen compatible plasma source
US10546729B2 (en) 2016-10-04 2020-01-28 Applied Materials, Inc. Dual-channel showerhead with improved profile
US10062579B2 (en) 2016-10-07 2018-08-28 Applied Materials, Inc. Selective SiN lateral recess
US9947549B1 (en) 2016-10-10 2018-04-17 Applied Materials, Inc. Cobalt-containing material removal
US9768034B1 (en) 2016-11-11 2017-09-19 Applied Materials, Inc. Removal methods for high aspect ratio structures
US10163696B2 (en) 2016-11-11 2018-12-25 Applied Materials, Inc. Selective cobalt removal for bottom up gapfill
US10242908B2 (en) 2016-11-14 2019-03-26 Applied Materials, Inc. Airgap formation with damage-free copper
US10026621B2 (en) 2016-11-14 2018-07-17 Applied Materials, Inc. SiN spacer profile patterning
US10566206B2 (en) 2016-12-27 2020-02-18 Applied Materials, Inc. Systems and methods for anisotropic material breakthrough
US10403507B2 (en) 2017-02-03 2019-09-03 Applied Materials, Inc. Shaped etch profile with oxidation
US10431429B2 (en) 2017-02-03 2019-10-01 Applied Materials, Inc. Systems and methods for radial and azimuthal control of plasma uniformity
US10043684B1 (en) 2017-02-06 2018-08-07 Applied Materials, Inc. Self-limiting atomic thermal etching systems and methods
US10319739B2 (en) 2017-02-08 2019-06-11 Applied Materials, Inc. Accommodating imperfectly aligned memory holes
US10943834B2 (en) 2017-03-13 2021-03-09 Applied Materials, Inc. Replacement contact process
US10319649B2 (en) 2017-04-11 2019-06-11 Applied Materials, Inc. Optical emission spectroscopy (OES) for remote plasma monitoring
US11276559B2 (en) 2017-05-17 2022-03-15 Applied Materials, Inc. Semiconductor processing chamber for multiple precursor flow
US11276590B2 (en) 2017-05-17 2022-03-15 Applied Materials, Inc. Multi-zone semiconductor substrate supports
JP7176860B6 (ja) 2017-05-17 2022-12-16 アプライド マテリアルズ インコーポレイテッド 前駆体の流れを改善する半導体処理チャンバ
US10049891B1 (en) 2017-05-31 2018-08-14 Applied Materials, Inc. Selective in situ cobalt residue removal
US10497579B2 (en) 2017-05-31 2019-12-03 Applied Materials, Inc. Water-free etching methods
US10920320B2 (en) 2017-06-16 2021-02-16 Applied Materials, Inc. Plasma health determination in semiconductor substrate processing reactors
US10541246B2 (en) 2017-06-26 2020-01-21 Applied Materials, Inc. 3D flash memory cells which discourage cross-cell electrical tunneling
US10727080B2 (en) 2017-07-07 2020-07-28 Applied Materials, Inc. Tantalum-containing material removal
US10541184B2 (en) 2017-07-11 2020-01-21 Applied Materials, Inc. Optical emission spectroscopic techniques for monitoring etching
US10354889B2 (en) 2017-07-17 2019-07-16 Applied Materials, Inc. Non-halogen etching of silicon-containing materials
US10170336B1 (en) 2017-08-04 2019-01-01 Applied Materials, Inc. Methods for anisotropic control of selective silicon removal
US10043674B1 (en) 2017-08-04 2018-08-07 Applied Materials, Inc. Germanium etching systems and methods
US10297458B2 (en) 2017-08-07 2019-05-21 Applied Materials, Inc. Process window widening using coated parts in plasma etch processes
US10283324B1 (en) 2017-10-24 2019-05-07 Applied Materials, Inc. Oxygen treatment for nitride etching
US10128086B1 (en) 2017-10-24 2018-11-13 Applied Materials, Inc. Silicon pretreatment for nitride removal
US10256112B1 (en) 2017-12-08 2019-04-09 Applied Materials, Inc. Selective tungsten removal
US10903054B2 (en) 2017-12-19 2021-01-26 Applied Materials, Inc. Multi-zone gas distribution systems and methods
US11328909B2 (en) 2017-12-22 2022-05-10 Applied Materials, Inc. Chamber conditioning and removal processes
US10854426B2 (en) 2018-01-08 2020-12-01 Applied Materials, Inc. Metal recess for semiconductor structures
US10679870B2 (en) 2018-02-15 2020-06-09 Applied Materials, Inc. Semiconductor processing chamber multistage mixing apparatus
US10964512B2 (en) 2018-02-15 2021-03-30 Applied Materials, Inc. Semiconductor processing chamber multistage mixing apparatus and methods
TWI716818B (zh) 2018-02-28 2021-01-21 美商應用材料股份有限公司 形成氣隙的系統及方法
US10593560B2 (en) 2018-03-01 2020-03-17 Applied Materials, Inc. Magnetic induction plasma source for semiconductor processes and equipment
US10319600B1 (en) 2018-03-12 2019-06-11 Applied Materials, Inc. Thermal silicon etch
US10497573B2 (en) 2018-03-13 2019-12-03 Applied Materials, Inc. Selective atomic layer etching of semiconductor materials
US10573527B2 (en) 2018-04-06 2020-02-25 Applied Materials, Inc. Gas-phase selective etching systems and methods
US10490406B2 (en) 2018-04-10 2019-11-26 Appled Materials, Inc. Systems and methods for material breakthrough
US10699879B2 (en) 2018-04-17 2020-06-30 Applied Materials, Inc. Two piece electrode assembly with gap for plasma control
US10886137B2 (en) 2018-04-30 2021-01-05 Applied Materials, Inc. Selective nitride removal
US10755941B2 (en) 2018-07-06 2020-08-25 Applied Materials, Inc. Self-limiting selective etching systems and methods
US10872778B2 (en) 2018-07-06 2020-12-22 Applied Materials, Inc. Systems and methods utilizing solid-phase etchants
US10672642B2 (en) 2018-07-24 2020-06-02 Applied Materials, Inc. Systems and methods for pedestal configuration
US10892198B2 (en) 2018-09-14 2021-01-12 Applied Materials, Inc. Systems and methods for improved performance in semiconductor processing
US11049755B2 (en) 2018-09-14 2021-06-29 Applied Materials, Inc. Semiconductor substrate supports with embedded RF shield
US11062887B2 (en) 2018-09-17 2021-07-13 Applied Materials, Inc. High temperature RF heater pedestals
US11417534B2 (en) 2018-09-21 2022-08-16 Applied Materials, Inc. Selective material removal
US11682560B2 (en) 2018-10-11 2023-06-20 Applied Materials, Inc. Systems and methods for hafnium-containing film removal
US11121002B2 (en) 2018-10-24 2021-09-14 Applied Materials, Inc. Systems and methods for etching metals and metal derivatives
US11437242B2 (en) 2018-11-27 2022-09-06 Applied Materials, Inc. Selective removal of silicon-containing materials
US11721527B2 (en) 2019-01-07 2023-08-08 Applied Materials, Inc. Processing chamber mixing systems
US10920319B2 (en) 2019-01-11 2021-02-16 Applied Materials, Inc. Ceramic showerheads with conductive electrodes
CN110491876B (zh) * 2019-08-23 2024-04-05 福建省晋华集成电路有限公司 半导体存储元件的制造方法及该元件
CN114093766B (zh) * 2020-08-24 2024-09-13 联华电子股份有限公司 半导体装置及其制造方法
KR20220151819A (ko) * 2021-05-07 2022-11-15 에스케이하이닉스 주식회사 반도체 장치 및 그 제조 방법
CN116779611B (zh) * 2023-08-17 2023-11-28 合肥晶合集成电路股份有限公司 一种半导体结构及其制备方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3530026B2 (ja) * 1997-06-30 2004-05-24 株式会社東芝 半導体装置及びその製造方法
JP2000091562A (ja) * 1998-09-16 2000-03-31 Mitsubishi Electric Corp 半導体装置およびその製造方法
TW569319B (en) * 2002-06-06 2004-01-01 Winbond Electronics Corp Gate structure and method of manufacture
JP2004014875A (ja) * 2002-06-07 2004-01-15 Fujitsu Ltd 半導体装置及びその製造方法
US7029536B2 (en) * 2003-03-17 2006-04-18 Tokyo Electron Limited Processing system and method for treating a substrate
US7176041B2 (en) * 2003-07-01 2007-02-13 Samsung Electronics Co., Ltd. PAA-based etchant, methods of using same, and resultant structures
JP4546201B2 (ja) * 2004-03-17 2010-09-15 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP4118255B2 (ja) * 2004-06-18 2008-07-16 株式会社ルネサステクノロジ Mosトランジスタの製造方法
JP2006295071A (ja) * 2005-04-14 2006-10-26 Toshiba Corp 半導体装置の製造方法

Also Published As

Publication number Publication date
TW200849557A (en) 2008-12-16
JP2008288560A (ja) 2008-11-27
CN101335300B (zh) 2010-07-21
KR101457006B1 (ko) 2014-10-31
CN101335300A (zh) 2008-12-31
KR20080093911A (ko) 2008-10-22
JP5282419B2 (ja) 2013-09-04

Similar Documents

Publication Publication Date Title
TWI446522B (zh) 半導體裝置及其製造方法
US8350335B2 (en) Semiconductor device including off-set spacers formed as a portion of the sidewall
KR100519800B1 (ko) 란타늄 산화막의 제조방법 및 이를 이용한 모스 전계효과트랜지스터 및 캐패시터의 제조방법
EP1433196B1 (en) Apparatus to prevent lateral oxidation in a transistor utilizing an ultra thin oxygen-diffusion barrier
TWI421922B (zh) 閘極結構之製造方法
TWI345812B (en) Mehtod of manufacturing silicon nitride film, method of manufacturing semiconductor device, and semiconductor device
TWI497647B (zh) 使用矽化物電極和矽化物-鍺化物合金電極之cmos整合方案
JPH11224947A (ja) 半導体装置およびその製造方法
US8835213B2 (en) Semiconductor device and manufacturing method thereof
JP2001257208A (ja) 半導体装置のゲート絶縁膜形成方法
JP2007027680A (ja) 半導体装置の製造方法および半導体装置
JP2008515190A (ja) 金属ゲート電極半導体デバイス
US20150140838A1 (en) Two Step Deposition of High-k Gate Dielectric Materials
US8629508B2 (en) Semiconductor device and method of manufacture
US7544621B2 (en) Method of removing a metal silicide layer on a gate electrode in a semiconductor manufacturing process and etching method
JP4554446B2 (ja) 半導体装置の製造方法
JP2009033032A (ja) 半導体装置及び半導体装置の製造方法
JP3581354B2 (ja) 電界効果トランジスタ
JP2005064032A (ja) 半導体装置及びその製造方法
TW200949938A (en) Method of manufacturing semiconductor device
CN104851802B (zh) 一种半导体器件及其制作方法
KR100667633B1 (ko) 박막 제조 방법 및 이를 이용한 게이트 구조물,커패시터와 플래시 메모리 장치의 제조 방법
JP4781571B2 (ja) 半導体装置の製造方法
KR100715272B1 (ko) 게이트 구조물의 형성 방법 및 이를 이용한 반도체 장치의제조 방법
TW201248852A (en) Metal gate structure and manufacturing method thereof