KR101457006B1 - 반도체 디바이스 및 그 제조 방법 - Google Patents
반도체 디바이스 및 그 제조 방법 Download PDFInfo
- Publication number
- KR101457006B1 KR101457006B1 KR1020080035540A KR20080035540A KR101457006B1 KR 101457006 B1 KR101457006 B1 KR 101457006B1 KR 1020080035540 A KR1020080035540 A KR 1020080035540A KR 20080035540 A KR20080035540 A KR 20080035540A KR 101457006 B1 KR101457006 B1 KR 101457006B1
- Authority
- KR
- South Korea
- Prior art keywords
- gate electrode
- insulating film
- film
- silicon nitride
- dummy gate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/01—Manufacture or treatment
- H10D64/021—Manufacture or treatment using multiple gate spacer layers, e.g. bilayered sidewall spacers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/0223—Manufacture or treatment of FETs having insulated gates [IGFET] having source and drain regions or source and drain extensions self-aligned to sides of the gate
- H10D30/0227—Manufacture or treatment of FETs having insulated gates [IGFET] having source and drain regions or source and drain extensions self-aligned to sides of the gate having both lightly-doped source and drain extensions and source and drain regions self-aligned to the sides of the gate, e.g. lightly-doped drain [LDD] MOSFET or double-diffused drain [DDD] MOSFET
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/601—Insulated-gate field-effect transistors [IGFET] having lightly-doped drain or source extensions, e.g. LDD IGFETs or DDD IGFETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/01—Manufacture or treatment
- H10D64/017—Manufacture or treatment using dummy gates in processes wherein at least parts of the final gates are self-aligned to the dummy gates, i.e. replacement gate processes
Landscapes
- Insulated Gate Type Field-Effect Transistor (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2007-00108953 | 2007-04-18 | ||
| JP2007108953 | 2007-04-18 | ||
| JPJP-P-2008-00060164 | 2008-03-10 | ||
| JP2008060164A JP5282419B2 (ja) | 2007-04-18 | 2008-03-10 | 半導体装置及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20080093911A KR20080093911A (ko) | 2008-10-22 |
| KR101457006B1 true KR101457006B1 (ko) | 2014-10-31 |
Family
ID=40147954
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020080035540A Expired - Fee Related KR101457006B1 (ko) | 2007-04-18 | 2008-04-17 | 반도체 디바이스 및 그 제조 방법 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP5282419B2 (enExample) |
| KR (1) | KR101457006B1 (enExample) |
| CN (1) | CN101335300B (enExample) |
| TW (1) | TWI446522B (enExample) |
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| KR20220151819A (ko) * | 2021-05-07 | 2022-11-15 | 에스케이하이닉스 주식회사 | 반도체 장치 및 그 제조 방법 |
| CN116779611B (zh) * | 2023-08-17 | 2023-11-28 | 合肥晶合集成电路股份有限公司 | 一种半导体结构及其制备方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004015045A (ja) * | 2002-06-06 | 2004-01-15 | Huabang Electronic Co Ltd | ゲート構造とその製造方法 |
| US20050169096A1 (en) * | 2003-07-01 | 2005-08-04 | Lee Hyo-San | PAA- based etchant, methods of using same, and resultant structures |
| US20050205940A1 (en) * | 2004-03-17 | 2005-09-22 | Semiconductor Leading Edge Technologies, Inc. | Semiconductor device and method for manufacturing the same |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3530026B2 (ja) * | 1997-06-30 | 2004-05-24 | 株式会社東芝 | 半導体装置及びその製造方法 |
| JP2000091562A (ja) * | 1998-09-16 | 2000-03-31 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
| JP2004014875A (ja) * | 2002-06-07 | 2004-01-15 | Fujitsu Ltd | 半導体装置及びその製造方法 |
| US7029536B2 (en) * | 2003-03-17 | 2006-04-18 | Tokyo Electron Limited | Processing system and method for treating a substrate |
| JP4118255B2 (ja) * | 2004-06-18 | 2008-07-16 | 株式会社ルネサステクノロジ | Mosトランジスタの製造方法 |
| JP2006295071A (ja) * | 2005-04-14 | 2006-10-26 | Toshiba Corp | 半導体装置の製造方法 |
-
2008
- 2008-03-10 JP JP2008060164A patent/JP5282419B2/ja not_active Expired - Fee Related
- 2008-04-09 TW TW097112894A patent/TWI446522B/zh active
- 2008-04-17 KR KR1020080035540A patent/KR101457006B1/ko not_active Expired - Fee Related
- 2008-04-18 CN CN2008102103134A patent/CN101335300B/zh not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004015045A (ja) * | 2002-06-06 | 2004-01-15 | Huabang Electronic Co Ltd | ゲート構造とその製造方法 |
| US20050169096A1 (en) * | 2003-07-01 | 2005-08-04 | Lee Hyo-San | PAA- based etchant, methods of using same, and resultant structures |
| US20050205940A1 (en) * | 2004-03-17 | 2005-09-22 | Semiconductor Leading Edge Technologies, Inc. | Semiconductor device and method for manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2008288560A (ja) | 2008-11-27 |
| JP5282419B2 (ja) | 2013-09-04 |
| CN101335300B (zh) | 2010-07-21 |
| CN101335300A (zh) | 2008-12-31 |
| KR20080093911A (ko) | 2008-10-22 |
| TWI446522B (zh) | 2014-07-21 |
| TW200849557A (en) | 2008-12-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
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