TWI443175B - An anisotropic conductive material, a connecting structure, and a connecting structure - Google Patents

An anisotropic conductive material, a connecting structure, and a connecting structure Download PDF

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Publication number
TWI443175B
TWI443175B TW099128490A TW99128490A TWI443175B TW I443175 B TWI443175 B TW I443175B TW 099128490 A TW099128490 A TW 099128490A TW 99128490 A TW99128490 A TW 99128490A TW I443175 B TWI443175 B TW I443175B
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TW
Taiwan
Prior art keywords
anisotropic conductive
conductive material
compound
group
weight
Prior art date
Application number
TW099128490A
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English (en)
Chinese (zh)
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TW201120182A (en
Inventor
Shigeo Mahara
Takashi Kubota
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Sekisui Chemical Co Ltd
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Publication of TW201120182A publication Critical patent/TW201120182A/zh
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Publication of TWI443175B publication Critical patent/TWI443175B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
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    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
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    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW099128490A 2009-08-26 2010-08-25 An anisotropic conductive material, a connecting structure, and a connecting structure TWI443175B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009195432 2009-08-26
JP2009195431 2009-08-26
JP2009195430 2009-08-26

Publications (2)

Publication Number Publication Date
TW201120182A TW201120182A (en) 2011-06-16
TWI443175B true TWI443175B (zh) 2014-07-01

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ID=43627825

Family Applications (1)

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TW099128490A TWI443175B (zh) 2009-08-26 2010-08-25 An anisotropic conductive material, a connecting structure, and a connecting structure

Country Status (5)

Country Link
JP (1) JP5602743B2 (ko)
KR (1) KR101538834B1 (ko)
CN (1) CN102484326B (ko)
TW (1) TWI443175B (ko)
WO (1) WO2011024719A1 (ko)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5916423B2 (ja) * 2011-02-17 2016-05-11 積水化学工業株式会社 異方性導電材料のｂステージ化物、異方性導電材料のｂステージ化物の製造方法、接続構造体及び接続構造体の製造方法
JP2012212864A (ja) * 2011-03-18 2012-11-01 Sekisui Chem Co Ltd 接続構造体の製造方法及び接続構造体
JP2013016473A (ja) * 2011-06-10 2013-01-24 Sekisui Chem Co Ltd 異方性導電材料及び接続構造体
JP5721593B2 (ja) * 2011-09-12 2015-05-20 積水化学工業株式会社 接続構造体の製造方法
JP2013105636A (ja) * 2011-11-14 2013-05-30 Dexerials Corp 異方性導電フィルム、接続方法、及び接合体
TWI553089B (zh) * 2012-09-28 2016-10-11 長興材料工業股份有限公司 塗料組合物及其用途
JP6518100B2 (ja) * 2014-03-26 2019-05-22 積水化学工業株式会社 光硬化性導電材料、接続構造体及び接続構造体の製造方法
JP6518101B2 (ja) * 2014-03-26 2019-05-22 積水化学工業株式会社 光硬化性導電材料、接続構造体及び接続構造体の製造方法
KR102410173B1 (ko) * 2014-05-14 2022-06-20 세키스이가가쿠 고교가부시키가이샤 도전 페이스트, 도전 페이스트의 제조 방법, 접속 구조체 및 접속 구조체의 제조 방법
CN106463200B (zh) * 2014-09-18 2019-05-31 积水化学工业株式会社 导电糊剂、连接结构体及连接结构体的制造方法
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