TWI437048B - 倍半矽氧烷樹脂 - Google Patents

倍半矽氧烷樹脂 Download PDF

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Publication number
TWI437048B
TWI437048B TW97146971A TW97146971A TWI437048B TW I437048 B TWI437048 B TW I437048B TW 97146971 A TW97146971 A TW 97146971A TW 97146971 A TW97146971 A TW 97146971A TW I437048 B TWI437048 B TW I437048B
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TW
Taiwan
Prior art keywords
value
group
composition
resin
solvent
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Application number
TW97146971A
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English (en)
Chinese (zh)
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TW200932835A (en
Inventor
Peng-Fei Fu
Eric Scott Moyer
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Dow Corning
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Publication of TW200932835A publication Critical patent/TW200932835A/zh
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Publication of TWI437048B publication Critical patent/TWI437048B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/045—Polysiloxanes containing less than 25 silicon atoms
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/11—Anti-reflection coatings
    • G02B1/111—Anti-reflection coatings using layers comprising organic materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0752—Silicon-containing compounds in non photosensitive layers or as additives, e.g. for dry lithography
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/091—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Optics & Photonics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Silicon Polymers (AREA)
  • Paints Or Removers (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
TW97146971A 2008-01-15 2008-12-03 倍半矽氧烷樹脂 TWI437048B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US2109708P 2008-01-15 2008-01-15

Publications (2)

Publication Number Publication Date
TW200932835A TW200932835A (en) 2009-08-01
TWI437048B true TWI437048B (zh) 2014-05-11

Family

ID=40885585

Family Applications (1)

Application Number Title Priority Date Filing Date
TW97146971A TWI437048B (zh) 2008-01-15 2008-12-03 倍半矽氧烷樹脂

Country Status (7)

Country Link
US (1) US9023433B2 (enExample)
EP (1) EP2238198A4 (enExample)
JP (1) JP2011510133A (enExample)
KR (1) KR20100114075A (enExample)
CN (1) CN101910253B (enExample)
TW (1) TWI437048B (enExample)
WO (1) WO2009091440A1 (enExample)

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CN101970540B (zh) * 2008-03-05 2014-07-23 陶氏康宁公司 倍半硅氧烷树脂
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CN101891893B (zh) * 2010-07-23 2012-01-04 深圳市安品有机硅材料有限公司 Led封装用苯基氢基硅树脂的制备方法
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US20140178698A1 (en) 2012-12-21 2014-06-26 3M Innovative Properties Company Curable silsesquioxane polymers, compositions, articles, and methods
JP2016507613A (ja) * 2012-12-21 2016-03-10 スリーエム イノベイティブ プロパティズ カンパニー 硬化性シルセスキオキサンポリマー、組成物、物品、及び方法
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KR101665308B1 (ko) * 2014-06-05 2016-10-13 한국과학기술연구원 양이온 경화성을 갖는 폴리에폭시계실세스퀴옥산 및 이를 이용한 고강도 필름
CN104356392B (zh) * 2014-11-07 2017-04-19 广州市白云化工实业有限公司 笼型枝状有机硅树脂及其制备方法和应用
TWI742160B (zh) 2016-09-30 2021-10-11 美商道康寧公司 橋接聚矽氧樹脂、膜、電子裝置及相關方法
TWI747956B (zh) 2016-09-30 2021-12-01 美商道康寧公司 橋接聚矽氧樹脂、膜、電子裝置及相關方法
KR20200037295A (ko) * 2017-07-28 2020-04-08 다우 실리콘즈 코포레이션 포지티브 포토레지스트 특징과 네거티브 포토레지스트 특징 둘 모두를 갖는 실세스퀴옥산 조성물
WO2019235072A1 (ja) * 2018-06-06 2019-12-12 富士フイルム株式会社 組成物、ハードコートフィルム、ハードコートフィルムを備えた物品、及び画像表示装置
WO2020021931A1 (ja) * 2018-07-27 2020-01-30 富士フイルム株式会社 ハードコートフィルム、ハードコートフィルムを備えた物品、及び画像表示装置
JP7119997B2 (ja) * 2018-12-28 2022-08-17 信越化学工業株式会社 感光性樹脂組成物、積層体、及びパターン形成方法
CN110452384B (zh) * 2019-08-30 2020-10-23 北京理工大学 一种笼型结构环氧基苯基硅倍半氧烷及其制备方法
CN111100463A (zh) * 2019-12-26 2020-05-05 广东盈骅新材料科技有限公司 环氧改性硅树脂组合物及其应用
CN115485350B (zh) 2020-05-07 2025-04-22 美国陶氏有机硅公司 有机硅混合压敏粘合剂及其制备方法和在不均匀表面上的用途
CN115516056B (zh) 2020-05-07 2025-04-25 美国陶氏有机硅公司 有机硅混合压敏粘合剂及其制备方法和在用于（光）电子装置制造的保护性膜中使用的方法
KR20230070489A (ko) 2020-09-22 2023-05-23 다우 실리콘즈 코포레이션 경화성 실리콘-(메트)아크릴레이트 조성물 및 이의 제조 및 사용 방법

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EP2238198A4 (en) 2011-11-16
CN101910253A (zh) 2010-12-08
WO2009091440A1 (en) 2009-07-23
KR20100114075A (ko) 2010-10-22
EP2238198A1 (en) 2010-10-13
US9023433B2 (en) 2015-05-05
US20100279025A1 (en) 2010-11-04
JP2011510133A (ja) 2011-03-31
CN101910253B (zh) 2013-04-10

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