TWI427720B - 焊料凸塊形成方法 - Google Patents

焊料凸塊形成方法 Download PDF

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Publication number
TWI427720B
TWI427720B TW097127081A TW97127081A TWI427720B TW I427720 B TWI427720 B TW I427720B TW 097127081 A TW097127081 A TW 097127081A TW 97127081 A TW97127081 A TW 97127081A TW I427720 B TWI427720 B TW I427720B
Authority
TW
Taiwan
Prior art keywords
metal film
film
pads
solder bump
forming
Prior art date
Application number
TW097127081A
Other languages
English (en)
Chinese (zh)
Other versions
TW200908180A (en
Inventor
今藤桂
中澤昌夫
真田昌樹
織田祥子
小平正司
永田欣司
山崎勝
榎建次郎
Original Assignee
新光電氣工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 新光電氣工業股份有限公司 filed Critical 新光電氣工業股份有限公司
Publication of TW200908180A publication Critical patent/TW200908180A/zh
Application granted granted Critical
Publication of TWI427720B publication Critical patent/TWI427720B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
TW097127081A 2007-07-17 2008-07-17 焊料凸塊形成方法 TWI427720B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007186020 2007-07-17
JP2008125761A JP5297083B2 (ja) 2007-07-17 2008-05-13 はんだバンプ形成方法

Publications (2)

Publication Number Publication Date
TW200908180A TW200908180A (en) 2009-02-16
TWI427720B true TWI427720B (zh) 2014-02-21

Family

ID=40269039

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097127081A TWI427720B (zh) 2007-07-17 2008-07-17 焊料凸塊形成方法

Country Status (4)

Country Link
JP (1) JP5297083B2 (https=)
KR (1) KR20090008146A (https=)
CN (1) CN101350323A (https=)
TW (1) TWI427720B (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101122140B1 (ko) 2010-05-11 2012-03-16 엘지이노텍 주식회사 단일층 인쇄회로기판 및 그 제조방법
TW201233280A (en) * 2011-01-25 2012-08-01 Taiwan Uyemura Co Ltd Chemical palladium-gold plating film method
TW201233279A (en) * 2011-01-25 2012-08-01 Taiwan Uyemura Co Ltd Copper or palladium-copper wire package process and structure thereof
TWI464929B (zh) * 2011-03-16 2014-12-11 Lextar Electronics Corp 提昇散熱效率之光源模組及其嵌入式封裝結構
TWI555452B (zh) * 2014-08-12 2016-10-21 南亞電路板股份有限公司 電路板及其製造方法
CN108513433A (zh) * 2018-04-24 2018-09-07 苏州维信电子有限公司 一种隔锡的柔性线路板pad及其制造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6365843B1 (en) * 1997-12-29 2002-04-02 Ibiden Co., Ltd. Multilayer printed wiring board
US20060237225A1 (en) * 2003-02-26 2006-10-26 Takashi Kariya Multilayer printed wiring board
US7224056B2 (en) * 2003-09-26 2007-05-29 Tessera, Inc. Back-face and edge interconnects for lidded package
US7626829B2 (en) * 2004-10-27 2009-12-01 Ibiden Co., Ltd. Multilayer printed wiring board and manufacturing method of the multilayer printed wiring board

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3838672B2 (ja) * 1993-06-07 2006-10-25 昭和電工株式会社 はんだ回路基板の形成方法
JPH11121495A (ja) * 1997-10-16 1999-04-30 Ricoh Co Ltd 半導体装置製造方法
JP2001267731A (ja) * 2000-01-13 2001-09-28 Hitachi Ltd バンプ付き電子部品の製造方法および電子部品の製造方法
JP4409990B2 (ja) * 2003-02-28 2010-02-03 昭和電工株式会社 ハンダ回路基板の製造方法。
JP2005117035A (ja) * 2003-09-19 2005-04-28 Showa Denko Kk フリップチップ型窒化ガリウム系半導体発光素子およびその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6365843B1 (en) * 1997-12-29 2002-04-02 Ibiden Co., Ltd. Multilayer printed wiring board
US20060237225A1 (en) * 2003-02-26 2006-10-26 Takashi Kariya Multilayer printed wiring board
US7224056B2 (en) * 2003-09-26 2007-05-29 Tessera, Inc. Back-face and edge interconnects for lidded package
US7298030B2 (en) * 2003-09-26 2007-11-20 Tessera, Inc. Structure and method of making sealed capped chips
US7626829B2 (en) * 2004-10-27 2009-12-01 Ibiden Co., Ltd. Multilayer printed wiring board and manufacturing method of the multilayer printed wiring board

Also Published As

Publication number Publication date
JP2009044128A (ja) 2009-02-26
KR20090008146A (ko) 2009-01-21
JP5297083B2 (ja) 2013-09-25
TW200908180A (en) 2009-02-16
CN101350323A (zh) 2009-01-21

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