CN101350323A - 形成焊料凸点的方法 - Google Patents

形成焊料凸点的方法 Download PDF

Info

Publication number
CN101350323A
CN101350323A CNA2008101307670A CN200810130767A CN101350323A CN 101350323 A CN101350323 A CN 101350323A CN A2008101307670 A CNA2008101307670 A CN A2008101307670A CN 200810130767 A CN200810130767 A CN 200810130767A CN 101350323 A CN101350323 A CN 101350323A
Authority
CN
China
Prior art keywords
metal film
film
pad
solder bump
conductive ball
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2008101307670A
Other languages
English (en)
Chinese (zh)
Inventor
今藤桂
中泽昌夫
真田昌树
织田祥子
小平正司
永田欣司
山崎胜
榎建次郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Co Ltd
Original Assignee
Shinko Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Co Ltd filed Critical Shinko Electric Co Ltd
Publication of CN101350323A publication Critical patent/CN101350323A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CNA2008101307670A 2007-07-17 2008-07-17 形成焊料凸点的方法 Pending CN101350323A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007186020 2007-07-17
JP2007186020 2007-07-17
JP2008125761 2008-05-13

Publications (1)

Publication Number Publication Date
CN101350323A true CN101350323A (zh) 2009-01-21

Family

ID=40269039

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2008101307670A Pending CN101350323A (zh) 2007-07-17 2008-07-17 形成焊料凸点的方法

Country Status (4)

Country Link
JP (1) JP5297083B2 (https=)
KR (1) KR20090008146A (https=)
CN (1) CN101350323A (https=)
TW (1) TWI427720B (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101122140B1 (ko) 2010-05-11 2012-03-16 엘지이노텍 주식회사 단일층 인쇄회로기판 및 그 제조방법
TW201233280A (en) * 2011-01-25 2012-08-01 Taiwan Uyemura Co Ltd Chemical palladium-gold plating film method
TW201233279A (en) * 2011-01-25 2012-08-01 Taiwan Uyemura Co Ltd Copper or palladium-copper wire package process and structure thereof
TWI464929B (zh) * 2011-03-16 2014-12-11 Lextar Electronics Corp 提昇散熱效率之光源模組及其嵌入式封裝結構
TWI555452B (zh) * 2014-08-12 2016-10-21 南亞電路板股份有限公司 電路板及其製造方法
CN108513433A (zh) * 2018-04-24 2018-09-07 苏州维信电子有限公司 一种隔锡的柔性线路板pad及其制造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3838672B2 (ja) * 1993-06-07 2006-10-25 昭和電工株式会社 はんだ回路基板の形成方法
JPH11121495A (ja) * 1997-10-16 1999-04-30 Ricoh Co Ltd 半導体装置製造方法
WO1999034654A1 (en) * 1997-12-29 1999-07-08 Ibiden Co., Ltd. Multilayer printed wiring board
JP2001267731A (ja) * 2000-01-13 2001-09-28 Hitachi Ltd バンプ付き電子部品の製造方法および電子部品の製造方法
EP1601017A4 (en) * 2003-02-26 2009-04-29 Ibiden Co Ltd MULTILAYER PRINTED PCB
JP4409990B2 (ja) * 2003-02-28 2010-02-03 昭和電工株式会社 ハンダ回路基板の製造方法。
JP2005117035A (ja) * 2003-09-19 2005-04-28 Showa Denko Kk フリップチップ型窒化ガリウム系半導体発光素子およびその製造方法
US7224056B2 (en) * 2003-09-26 2007-05-29 Tessera, Inc. Back-face and edge interconnects for lidded package
US7626829B2 (en) * 2004-10-27 2009-12-01 Ibiden Co., Ltd. Multilayer printed wiring board and manufacturing method of the multilayer printed wiring board

Also Published As

Publication number Publication date
JP2009044128A (ja) 2009-02-26
KR20090008146A (ko) 2009-01-21
TWI427720B (zh) 2014-02-21
JP5297083B2 (ja) 2013-09-25
TW200908180A (en) 2009-02-16

Similar Documents

Publication Publication Date Title
US8378471B2 (en) Semiconductor chip bump connection apparatus and method
JP5001542B2 (ja) 電子装置用基板およびその製造方法、ならびに電子装置の製造方法
CN102810522B (zh) 封装结构和方法
US7851345B2 (en) Semiconductor device and method of forming oxide layer on signal traces for electrical isolation in fine pitch bonding
US8952271B2 (en) Circuit board, semiconductor device, and method of manufacturing semiconductor device
US8039307B2 (en) Mounted body and method for manufacturing the same
US20080257595A1 (en) Packaging substrate and method for manufacturing the same
US20080036079A1 (en) Conductive connection structure formed on the surface of circuit board and manufacturing method thereof
US20080122081A1 (en) Method of fabricating electronic device having sacrificial anode, and electronic device fabricated by the same
TW200938020A (en) Part built-in wiring board, and manufacturing method for the part built-in wiring board
US20170186677A1 (en) Wiring substrate and semiconductor device
US20090302468A1 (en) Printed circuit board comprising semiconductor chip and method of manufacturing the same
CN101350323A (zh) 形成焊料凸点的方法
JP2009004454A (ja) 電極構造体及びその形成方法と電子部品及び実装基板
KR101184108B1 (ko) 배선 기판 및 그 제조 방법, 전자 장치의 제조 방법
US8486760B2 (en) Method of manufacturing substrate for flip chip and substrate for flip chip manufactured using the same
KR101492805B1 (ko) 코어리스 기판 형성 방법 및 코어리스 기판용 어셈블리
JP7826421B2 (ja) 端子構造の製造方法
US7807560B2 (en) Solder bump forming method
JP2009277838A (ja) 半導体装置の製造方法、基板トレイ、及び基板収納装置
US20030159282A1 (en) Wiring board and method of fabricating the same, semiconductor device, and electronic instrument
JP2001237338A (ja) フリップチップボールグリッドアレイ基板及びその製造法
JP2002246510A (ja) 配線基板及びテープキャリア並びにこれを用いた半導体装置
JP2014127696A (ja) 半導体素子搭載用プリント配線板
KR100348322B1 (ko) 반도체 패키지 제조용 회로기판 구조

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Open date: 20090121