TWI415977B - 連續電鍍處理裝置 - Google Patents

連續電鍍處理裝置 Download PDF

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Publication number
TWI415977B
TWI415977B TW097142278A TW97142278A TWI415977B TW I415977 B TWI415977 B TW I415977B TW 097142278 A TW097142278 A TW 097142278A TW 97142278 A TW97142278 A TW 97142278A TW I415977 B TWI415977 B TW I415977B
Authority
TW
Taiwan
Prior art keywords
workpiece
power supply
plating
plating tank
power
Prior art date
Application number
TW097142278A
Other languages
English (en)
Chinese (zh)
Other versions
TW200930845A (en
Inventor
Tomohiro Noda
Kazutoshi Akamatsu
Original Assignee
Almex Pe Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Almex Pe Inc filed Critical Almex Pe Inc
Publication of TW200930845A publication Critical patent/TW200930845A/zh
Application granted granted Critical
Publication of TWI415977B publication Critical patent/TWI415977B/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06Suspending or supporting devices for articles to be coated
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10Electrodes, e.g. composition, counter electrode
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02Tanks; Installations therefor
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10Electrodes, e.g. composition, counter electrode
    • C25D17/12Shape or form
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16Apparatus for electrolytic coating of small objects in bulk
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00Processes for servicing or operating cells for electrolytic coating
    • C25D21/12Process control or regulation
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/24Reinforcing of the conductive pattern
    • H05K3/241Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Coating Apparatus (AREA)
TW097142278A 2007-11-01 2008-10-31 連續電鍍處理裝置 TWI415977B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007284841 2007-11-01

Publications (2)

Publication Number Publication Date
TW200930845A TW200930845A (en) 2009-07-16
TWI415977B true TWI415977B (zh) 2013-11-21

Family

ID=40514646

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097142278A TWI415977B (zh) 2007-11-01 2008-10-31 連續電鍍處理裝置

Country Status (6)

Country Link
US (1) US8940137B2 (https=)
JP (2) JP5457010B2 (https=)
KR (1) KR101540474B1 (https=)
CN (1) CN101423969B (https=)
DE (1) DE102008053965B4 (https=)
TW (1) TWI415977B (https=)

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BRPI1010877B1 (pt) 2009-06-08 2020-09-15 Modumetal, Inc Revestimento de multicamadas resistente à corrosão e método de eletrodeposição
JP5613499B2 (ja) * 2010-08-25 2014-10-22 アルメックスPe株式会社 表面処理装置
JP2012046783A (ja) * 2010-08-25 2012-03-08 Almex Pe Inc 表面処理装置
JP5602553B2 (ja) * 2010-09-17 2014-10-08 アルメックスPe株式会社 表面処理装置
JP5833355B2 (ja) * 2011-06-30 2015-12-16 アルメックスPe株式会社 表面処理装置
DE102012012990B4 (de) 2011-06-30 2014-09-04 Almex Pe Inc. Oberflächenbehandlungssystem und Werkstückhaltestütze
JP5795514B2 (ja) 2011-09-29 2015-10-14 アルメックスPe株式会社 連続メッキ装置
JP6129497B2 (ja) * 2011-09-29 2017-05-17 アルメックスPe株式会社 連続メッキ装置
JP5766091B2 (ja) * 2011-10-24 2015-08-19 京セラサーキットソリューションズ株式会社 めっき装置
CN102677134A (zh) * 2012-05-31 2012-09-19 无锡市喷特环保工程有限公司 连续镀槽
CN103590079A (zh) * 2012-08-14 2014-02-19 亚洲电镀器材有限公司 一种电镀方法
EA201500948A1 (ru) 2013-03-15 2016-03-31 Модьюметл, Инк. Способ изготовления изделия и изделие, изготовленное вышеуказанным способом
CA2905548C (en) 2013-03-15 2022-04-26 Modumetal, Inc. Nanolaminate coatings
BR112015022020A8 (pt) 2013-03-15 2019-12-10 Modumetal Inc objeto ou revestimento e seu processo de fabricação
WO2014146117A2 (en) 2013-03-15 2014-09-18 Modumetal, Inc. A method and apparatus for continuously applying nanolaminate metal coatings
EP3194642A4 (en) * 2014-09-18 2018-07-04 Modumetal, Inc. A method and apparatus for continuously applying nanolaminate metal coatings
BR112017005534A2 (pt) 2014-09-18 2017-12-05 Modumetal Inc métodos de preparação de artigos por processos de eletrodeposição e fabricação aditiva
CN104313657A (zh) * 2014-11-10 2015-01-28 临安振有电子有限公司 Hdi印制线路板通孔的电沉积装置
CN106149039B (zh) * 2015-04-08 2017-11-24 亚硕企业股份有限公司 电镀设备
CN104862768B (zh) * 2015-05-27 2017-09-22 广州杰赛科技股份有限公司 一种电路板的电镀方法及装置
KR102579796B1 (ko) * 2015-10-20 2023-09-15 프로세스 오토메이션 인터내셔날 리미티드 전기도금 머신 및 전기도금 방법
TWI698554B (zh) * 2015-10-20 2020-07-11 香港商亞洲電鍍器材有限公司 電鍍機器及電鍍方法
JP6117891B2 (ja) * 2015-10-29 2017-04-19 アルメックスPe株式会社 表面処理装置
US11365488B2 (en) 2016-09-08 2022-06-21 Modumetal, Inc. Processes for providing laminated coatings on workpieces, and articles made therefrom
TW201821649A (zh) 2016-09-09 2018-06-16 美商馬杜合金股份有限公司 層合物與奈米層合物材料於工具及模製方法之應用
WO2018053158A1 (en) 2016-09-14 2018-03-22 Modumetal, Inc. System for reliable, high throughput, complex electric field generation, and method for producing coatings therefrom
JP6793966B2 (ja) * 2016-09-29 2020-12-02 株式会社アルメックステクノロジーズ ワーク保持治具及び表面処理装置
EP3535118A1 (en) 2016-11-02 2019-09-11 Modumetal, Inc. Topology optimized high interface packing structures
CA3060619A1 (en) 2017-04-21 2018-10-25 Modumetal, Inc. Tubular articles with electrodeposited coatings, and systems and methods for producing the same
CN110709538B (zh) 2017-05-30 2022-04-12 Almex 科技株式会社 表面处理装置和搬送治具
CN107119309A (zh) * 2017-06-15 2017-09-01 临安金奥科技有限公司 一种对板材表面进行单面连续处理的装置
WO2019078064A1 (ja) * 2017-10-20 2019-04-25 アルメックスPe株式会社 表面処理装置
EP3784823A1 (en) 2018-04-27 2021-03-03 Modumetal, Inc. Apparatuses, systems, and methods for producing a plurality of articles with nanolaminated coatings using rotation
CN109468677A (zh) * 2018-12-05 2019-03-15 珠海杰赛科技有限公司 一种垂直连续电镀方法
CN215925133U (zh) * 2021-06-30 2022-03-01 厦门海辰新能源科技有限公司 一种用于镀膜机的阳极板及镀膜机
CN114775023A (zh) * 2022-05-26 2022-07-22 枣庄睿诺光电信息有限公司 一种电镀装置
CN115505996B (zh) * 2022-11-04 2023-03-10 昆山东威科技股份有限公司 一种电镀装置

Citations (4)

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US4337134A (en) * 1980-02-27 1982-06-29 Elfab Corporation Continuous truck mounted printed circuit board plating system
DE3929728A1 (de) * 1989-09-07 1991-03-14 Werner M Kraemer Anlage zur herstellung von leiterplatten und verfahren zum betreiben der anlage
JP2000226697A (ja) * 1999-02-05 2000-08-15 Fujimoto Denki Shoji Kk めっき装置およびめっき方法

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Publication number Priority date Publication date Assignee Title
US2724691A (en) * 1951-06-13 1955-11-22 Western Electric Co Apparatus for electroplating articles
US4337134A (en) * 1980-02-27 1982-06-29 Elfab Corporation Continuous truck mounted printed circuit board plating system
DE3929728A1 (de) * 1989-09-07 1991-03-14 Werner M Kraemer Anlage zur herstellung von leiterplatten und verfahren zum betreiben der anlage
JP2000226697A (ja) * 1999-02-05 2000-08-15 Fujimoto Denki Shoji Kk めっき装置およびめっき方法

Also Published As

Publication number Publication date
TW200930845A (en) 2009-07-16
KR101540474B1 (ko) 2015-07-29
DE102008053965A1 (de) 2009-05-07
JP5740014B2 (ja) 2015-06-24
US20090114530A1 (en) 2009-05-07
CN101423969A (zh) 2009-05-06
JP5457010B2 (ja) 2014-04-02
CN101423969B (zh) 2013-08-07
JP2014074237A (ja) 2014-04-24
US8940137B2 (en) 2015-01-27
JP2009132999A (ja) 2009-06-18
DE102008053965B4 (de) 2021-03-25
KR20090045119A (ko) 2009-05-07

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