KR101540474B1 - 연속 도금 처리 장치 - Google Patents

연속 도금 처리 장치 Download PDF

Info

Publication number
KR101540474B1
KR101540474B1 KR1020080107726A KR20080107726A KR101540474B1 KR 101540474 B1 KR101540474 B1 KR 101540474B1 KR 1020080107726 A KR1020080107726 A KR 1020080107726A KR 20080107726 A KR20080107726 A KR 20080107726A KR 101540474 B1 KR101540474 B1 KR 101540474B1
Authority
KR
South Korea
Prior art keywords
work
plating
power source
source units
workpiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020080107726A
Other languages
English (en)
Korean (ko)
Other versions
KR20090045119A (ko
Inventor
도모히로 노다
가쯔토시 아카마츠
Original Assignee
아루멕쿠스 피이 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 아루멕쿠스 피이 가부시키가이샤 filed Critical 아루멕쿠스 피이 가부시키가이샤
Publication of KR20090045119A publication Critical patent/KR20090045119A/ko
Application granted granted Critical
Publication of KR101540474B1 publication Critical patent/KR101540474B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/16—Apparatus for electrolytic coating of small objects in bulk
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/241—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Coating Apparatus (AREA)
KR1020080107726A 2007-11-01 2008-10-31 연속 도금 처리 장치 Expired - Fee Related KR101540474B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2007-284841 2007-11-01
JP2007284841 2007-11-01

Publications (2)

Publication Number Publication Date
KR20090045119A KR20090045119A (ko) 2009-05-07
KR101540474B1 true KR101540474B1 (ko) 2015-07-29

Family

ID=40514646

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020080107726A Expired - Fee Related KR101540474B1 (ko) 2007-11-01 2008-10-31 연속 도금 처리 장치

Country Status (6)

Country Link
US (1) US8940137B2 (https=)
JP (2) JP5457010B2 (https=)
KR (1) KR101540474B1 (https=)
CN (1) CN101423969B (https=)
DE (1) DE102008053965B4 (https=)
TW (1) TWI415977B (https=)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010144509A2 (en) 2009-06-08 2010-12-16 Modumetal Llc Electrodeposited, nanolaminate coatings and claddings for corrosion protection
JP2012046783A (ja) * 2010-08-25 2012-03-08 Almex Pe Inc 表面処理装置
JP5613499B2 (ja) * 2010-08-25 2014-10-22 アルメックスＰｅ株式会社 表面処理装置
JP5602553B2 (ja) * 2010-09-17 2014-10-08 アルメックスＰｅ株式会社 表面処理装置
JP5833355B2 (ja) * 2011-06-30 2015-12-16 アルメックスＰｅ株式会社 表面処理装置
DE102012012990B4 (de) * 2011-06-30 2014-09-04 Almex Pe Inc. Oberflächenbehandlungssystem und Werkstückhaltestütze
JP5795514B2 (ja) 2011-09-29 2015-10-14 アルメックスＰｅ株式会社 連続メッキ装置
JP6129497B2 (ja) * 2011-09-29 2017-05-17 アルメックスＰｅ株式会社 連続メッキ装置
JP5766091B2 (ja) * 2011-10-24 2015-08-19 京セラサーキットソリューションズ株式会社 めっき装置
CN102677134A (zh) * 2012-05-31 2012-09-19 无锡市喷特环保工程有限公司 连续镀槽
CN103590079A (zh) * 2012-08-14 2014-02-19 亚洲电镀器材有限公司 一种电镀方法
EA201500948A1 (ru) 2013-03-15 2016-03-31 Модьюметл, Инк. Способ изготовления изделия и изделие, изготовленное вышеуказанным способом
EA201500949A1 (ru) 2013-03-15 2016-02-29 Модьюметл, Инк. Способ формирования многослойного покрытия, покрытие, сформированное вышеуказанным способом, и многослойное покрытие
HK1220742A1 (zh) 2013-03-15 2017-05-12 Modumetal, Inc. 用於连续施加纳米层压金属涂层的方法和装置
BR112015022235A2 (pt) 2013-03-15 2017-07-18 Modumetal Inc revestimentos nanolaminados
EP3194642A4 (en) * 2014-09-18 2018-07-04 Modumetal, Inc. A method and apparatus for continuously applying nanolaminate metal coatings
BR112017005534A2 (pt) 2014-09-18 2017-12-05 Modumetal Inc métodos de preparação de artigos por processos de eletrodeposição e fabricação aditiva
CN104313657A (zh) * 2014-11-10 2015-01-28 临安振有电子有限公司 Hdi印制线路板通孔的电沉积装置
CN106149039B (zh) * 2015-04-08 2017-11-24 亚硕企业股份有限公司 电镀设备
CN104862768B (zh) * 2015-05-27 2017-09-22 广州杰赛科技股份有限公司 一种电路板的电镀方法及装置
KR102579796B1 (ko) * 2015-10-20 2023-09-15 프로세스 오토메이션 인터내셔날 리미티드 전기도금 머신 및 전기도금 방법
TWI698554B (zh) * 2015-10-20 2020-07-11 香港商亞洲電鍍器材有限公司 電鍍機器及電鍍方法
JP6117891B2 (ja) * 2015-10-29 2017-04-19 アルメックスＰｅ株式会社 表面処理装置
US11365488B2 (en) 2016-09-08 2022-06-21 Modumetal, Inc. Processes for providing laminated coatings on workpieces, and articles made therefrom
TW201821649A (zh) 2016-09-09 2018-06-16 美商馬杜合金股份有限公司 層合物與奈米層合物材料於工具及模製方法之應用
EP3512987A1 (en) 2016-09-14 2019-07-24 Modumetal, Inc. System for reliable, high throughput, complex electric field generation, and method for producing coatings therefrom
JP6793966B2 (ja) * 2016-09-29 2020-12-02 株式会社アルメックステクノロジーズ ワーク保持治具及び表面処理装置
US12076965B2 (en) 2016-11-02 2024-09-03 Modumetal, Inc. Topology optimized high interface packing structures
EP3612669A1 (en) 2017-04-21 2020-02-26 Modumetal, Inc. Tubular articles with electrodeposited coatings, and systems and methods for producing the same
KR20200014262A (ko) 2017-05-30 2020-02-10 아루멕쿠스 피이 가부시키가이샤 표면처리장치 및 반송 지그
CN107119309A (zh) * 2017-06-15 2017-09-01 临安金奥科技有限公司 一种对板材表面进行单面连续处理的装置
WO2019078064A1 (ja) * 2017-10-20 2019-04-25 アルメックスＰｅ株式会社 表面処理装置
CN112272717B (zh) 2018-04-27 2024-01-05 莫杜美拓有限公司 用于使用旋转生产具有纳米层压物涂层的多个制品的设备、系统和方法
CN109468677A (zh) * 2018-12-05 2019-03-15 珠海杰赛科技有限公司 一种垂直连续电镀方法
CN215925133U (zh) * 2021-06-30 2022-03-01 厦门海辰新能源科技有限公司 一种用于镀膜机的阳极板及镀膜机
CN114775023A (zh) * 2022-05-26 2022-07-22 枣庄睿诺光电信息有限公司 一种电镀装置
CN115505996B (zh) * 2022-11-04 2023-03-10 昆山东威科技股份有限公司 一种电镀装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06346289A (ja) * 1993-06-14 1994-12-20 Fujikura Ltd 陽極酸化処理装置および陽極酸化処理方法
JP2005507463A (ja) * 2001-10-27 2005-03-17 アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング 被処理物を電解処理するための方法およびコンベヤ式システム

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2724690A (en) * 1951-06-13 1955-11-22 Western Electric Co Apparatus for electroplating articles
US2724691A (en) * 1951-06-13 1955-11-22 Western Electric Co Apparatus for electroplating articles
US2935989A (en) * 1957-12-04 1960-05-10 Hanson Van Winkle Munning Co Processing apparatus
US3455809A (en) * 1966-11-25 1969-07-15 Baker Bros Inc Adjustable electrode transporter for lateral electrode spacing during electroplating
GB1557017A (en) * 1976-07-20 1979-12-05 Heritage Silversmiths Ltd Electropolishing of stainless steel
JPS5321048A (en) * 1976-08-10 1978-02-27 Nippon Electric Co Constant current density plating device
US4184927A (en) * 1976-12-30 1980-01-22 Riken Keikinzoku Kogyo Kabushiki Kaisha Process and apparatus for effecting surface treatment of workpieces
FR2390517A1 (fr) * 1977-05-10 1978-12-08 Coppertron Sa Installation pour l'electro-production de cuivre en feuilles destinees a etre appliquees en particulier sur des materiaux dielectriques
US4189360A (en) * 1979-03-12 1980-02-19 Woods Craig P Process for continuous anodizing of aluminum
US4263122A (en) * 1979-12-03 1981-04-21 Programmed Coating Systems, Inc. Electrocoating equipment
DE2951708A1 (de) * 1979-12-19 1981-07-02 Schering Ag Berlin Und Bergkamen, 1000 Berlin Verfahren und vorrichtung zur automatischen regelung von teilstromstaerken eines gleichrichters
US4337134A (en) * 1980-02-27 1982-06-29 Elfab Corporation Continuous truck mounted printed circuit board plating system
US4401522A (en) * 1980-09-29 1983-08-30 Micro-Plate, Inc. Plating method and apparatus
US4378281A (en) * 1981-06-25 1983-03-29 Napco, Inc. High speed plating of flat planar workpieces
US4534843A (en) * 1983-01-28 1985-08-13 Technic, Inc. Apparatus for electroplating and chemically treating contact elements of encapsulated electronic components and their like
JPS61133400A (ja) * 1984-12-03 1986-06-20 Kosaku:Kk 電気めつき装置
US4775046A (en) * 1986-01-17 1988-10-04 Future Automation, Inc. Transport belt for production parts
DE3929728A1 (de) * 1989-09-07 1991-03-14 Werner M Kraemer Anlage zur herstellung von leiterplatten und verfahren zum betreiben der anlage
DE3939681A1 (de) * 1989-12-01 1991-06-06 Schering Ag Verfahren zur steuerung des ablaufes von galvanischen anlagen, sowie zur durchfuehrung des verfahrens dienender anordnung
JPH0774479B2 (ja) * 1990-03-22 1995-08-09 三菱電機株式会社 電気めっき装置
CN1116449C (zh) * 1994-05-11 2003-07-30 比利时西门子公司 电路板的处理设备
DE19539868C1 (de) * 1995-10-26 1997-02-20 Lea Ronal Gmbh Transportvorrichtung und Transportsystem zur vertikalen Führung von plattenähnlichen Gegenständen zur chemischen oder elektrolytischen Oberflächenbehandlung
DE19717510C1 (de) * 1997-04-25 1998-10-01 Atotech Deutschland Gmbh Vorrichtung zur Abblendung von Galvanisiergut in Durchlaufanlagen
TW373034B (en) * 1997-10-30 1999-11-01 Kazuo Ohba Automatic plating method and apparatus thereof
TW438906B (en) * 1998-06-11 2001-06-07 Kazuo Ohba Continuous plating apparatus
US6471846B1 (en) * 1998-09-25 2002-10-29 Kazuo Ohba Electric feeding method and apparatus for a continuous plating apparatus
JP3025254B1 (ja) * 1999-02-05 2000-03-27 藤本電気商事有限会社 めっき装置およびめっき方法
JP3754262B2 (ja) * 2000-02-16 2006-03-08 株式会社アルメックス 表面処理装置
US6793792B2 (en) * 2001-01-12 2004-09-21 Unitive International Limited Curaco Electroplating methods including maintaining a determined electroplating voltage and related systems
JP4157308B2 (ja) * 2001-06-27 2008-10-01 シャープ株式会社 めっき膜の形成方法及び該方法によりめっき膜が形成された電子部品
US20060141157A1 (en) * 2003-05-27 2006-06-29 Masahiko Sekimoto Plating apparatus and plating method
KR100539239B1 (ko) * 2003-06-25 2005-12-27 삼성전자주식회사 도금 중단에 의해 불량이 발생되는 것을 방지하는 도금방법 및 이에 이용되는 도금 장비
JP2005097721A (ja) * 2003-08-27 2005-04-14 Yamaha Corp 両面メッキ装置および両面メッキ方法
JP4707941B2 (ja) * 2003-09-02 2011-06-22 アルメックスＰｅ株式会社 めっき処理装置およびめっき処理方法
JP2006037134A (ja) * 2004-07-23 2006-02-09 Chuo Seisakusho Ltd 連続搬送式めっき装置の電流制御方法
US20060213778A1 (en) * 2005-03-23 2006-09-28 Taiwan Semiconductor Manufacturing Co., Ltd. Method for electrochemical plating on semiconductor wafers
JP4937154B2 (ja) * 2008-02-06 2012-05-23 デュポン神東・オートモティブ・システムズ株式会社 電着膜厚自動制御方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06346289A (ja) * 1993-06-14 1994-12-20 Fujikura Ltd 陽極酸化処理装置および陽極酸化処理方法
JP2005507463A (ja) * 2001-10-27 2005-03-17 アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング 被処理物を電解処理するための方法およびコンベヤ式システム

Also Published As

Publication number Publication date
DE102008053965A1 (de) 2009-05-07
TW200930845A (en) 2009-07-16
JP5740014B2 (ja) 2015-06-24
JP5457010B2 (ja) 2014-04-02
CN101423969B (zh) 2013-08-07
US20090114530A1 (en) 2009-05-07
CN101423969A (zh) 2009-05-06
KR20090045119A (ko) 2009-05-07
JP2014074237A (ja) 2014-04-24
DE102008053965B4 (de) 2021-03-25
TWI415977B (zh) 2013-11-21
JP2009132999A (ja) 2009-06-18
US8940137B2 (en) 2015-01-27

Similar Documents

Publication Publication Date Title
KR101540474B1 (ko) 연속 도금 처리 장치
JP4268874B2 (ja) 被処理物を電解処理するための方法およびコンベヤ式システム
JP4257203B2 (ja) 電解処理システム用のセグメント化した対向電極
KR20010107985A (ko) 인라인 도금 장치
US20050076837A1 (en) Conveyorized horizontal processing line and method of wet-processing a workpiece
KR101074314B1 (ko) 적어도 표면에서는 전도성을 띠는 작업물을 전해 처리하는장치 및 방법
JP2014198909A (ja) 表面処理装置及びワーク保持治具
JP2015063717A (ja) ワーク保持枠体及びこれを用いためっき処理装置
JP3170766U (ja) クランプ搬送による薄板状被処理物の水平連続メッキ処理装置
JP6909526B2 (ja) ワーク保持治具及び表面処理装置
JP6342538B2 (ja) 表面処理装置
JP2018044249A (ja) 表面処理装置及びワーク保持治具
HK1127097A (en) Continuous plating apparatus
JP5014248B2 (ja) メッキ槽内の投入部に於けるメッキ処理方法
JP3072103B1 (ja) アノ―ド自動挿入装置および方法
JP3891593B2 (ja) 送り設備において導体プレートや導体箔に金属層を精密に電解析出し、あるいはエッチングするための方法と装置
JP2006037134A (ja) 連続搬送式めっき装置の電流制御方法
JPH10291129A (ja) 電解加工装置および電解加工方法
JP2008138252A (ja) 半導体装置用テープキャリアの電気めっき方法及び半導体装置用テープキャリアの電気めっき装置
JP2004176145A (ja) 連続式めっきの電流制御方法
JP4072966B2 (ja) めっき装置のワーク搬入順序設定方法
TW202033842A (zh) 工件保持治具及表面處理裝置
JP2020070483A (ja) ワーク保持枠体及びそれを用いためっき処理装置
JPH02232400A (ja) 電解処理装置
JPH059795A (ja) 電着塗装方法および装置

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E90F Notification of reason for final refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

FPAY Annual fee payment

Payment date: 20180712

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20190722

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20220724

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20220724