TWI402900B - 基板之處理裝置及處理方法 - Google Patents

基板之處理裝置及處理方法 Download PDF

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Publication number
TWI402900B
TWI402900B TW095113760A TW95113760A TWI402900B TW I402900 B TWI402900 B TW I402900B TW 095113760 A TW095113760 A TW 095113760A TW 95113760 A TW95113760 A TW 95113760A TW I402900 B TWI402900 B TW I402900B
Authority
TW
Taiwan
Prior art keywords
liquid
substrate
processing
supplied
inflow
Prior art date
Application number
TW095113760A
Other languages
English (en)
Chinese (zh)
Other versions
TW200727350A (en
Inventor
Yuichi Imaoka
Akinori Iso
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Publication of TW200727350A publication Critical patent/TW200727350A/zh
Application granted granted Critical
Publication of TWI402900B publication Critical patent/TWI402900B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1316—Methods for cleaning the liquid crystal cells, or components thereof, during manufacture: Materials therefor

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Liquid Crystal (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Coating Apparatus (AREA)
  • Weting (AREA)
  • Nozzles (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
TW095113760A 2005-04-20 2006-04-18 基板之處理裝置及處理方法 TWI402900B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005122464A JP4627681B2 (ja) 2005-04-20 2005-04-20 基板の処理装置及び処理方法

Publications (2)

Publication Number Publication Date
TW200727350A TW200727350A (en) 2007-07-16
TWI402900B true TWI402900B (zh) 2013-07-21

Family

ID=37194432

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095113760A TWI402900B (zh) 2005-04-20 2006-04-18 基板之處理裝置及處理方法

Country Status (4)

Country Link
JP (1) JP4627681B2 (ja)
KR (1) KR101205821B1 (ja)
CN (1) CN1853799B (ja)
TW (1) TWI402900B (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5060835B2 (ja) * 2006-07-26 2012-10-31 芝浦メカトロニクス株式会社 基板の処理装置
CN101251721B (zh) * 2008-04-14 2010-09-01 友达光电股份有限公司 显影喷嘴结构及喷涂显影液的方法
CN103163002A (zh) * 2013-04-11 2013-06-19 王刚平 一种免疫组化湿盒
TWI585842B (zh) * 2014-09-30 2017-06-01 Shibaura Mechatronics Corp Substrate processing device
KR102355116B1 (ko) * 2017-04-03 2022-01-26 주식회사 케이씨텍 슬러리 노즐 및 이를 구비하는 기판 연마 장치
CN108447805A (zh) * 2018-03-30 2018-08-24 无锡尚德太阳能电力有限公司 湿法链式刻蚀槽进液结构
KR102420868B1 (ko) 2021-08-26 2022-07-14 실드 주식회사 가요성 흡음벽

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3488926A (en) * 1968-03-08 1970-01-13 Harrworth Inc Separator for removing gas bubbles from flowing liquids
US4390351A (en) * 1979-08-16 1983-06-28 Ishikawajima-Harima Jukogyo Kabushiki Kaisha Gas-liquid separator
TW200301509A (en) * 2001-12-28 2003-07-01 Koganei Ltd Chemical supplying device and chemical supplying method
TW200407052A (en) * 2002-10-31 2004-05-01 Ritdisplay Corp Color ink bubble removal device in OLED ink printing process and method thereof
TW200507038A (en) * 2003-07-18 2005-02-16 Shibaura Mechatronics Corp Apparatus for treating substrate and method of treating substrate

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0556285U (ja) * 1992-01-07 1993-07-27 株式会社カイジョー 超音波洗浄装置
JPH06304535A (ja) * 1993-04-22 1994-11-01 Shimada Phys & Chem Ind Co Ltd 処理槽における液面揺れ制御装置
JPH08323106A (ja) * 1995-06-02 1996-12-10 Hitachi Ltd 薬液供給装置及び薬液供給方法
JP2887114B2 (ja) * 1996-08-30 1999-04-26 芝浦メカトロニクス株式会社 超音波洗浄装置
JP2002346486A (ja) * 2001-05-24 2002-12-03 Heiwa Corp ペレット研磨材洗浄装置
JP2003170086A (ja) * 2001-12-11 2003-06-17 Sumitomo Precision Prod Co Ltd ノズル装置及びこれを備えた基板処理装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3488926A (en) * 1968-03-08 1970-01-13 Harrworth Inc Separator for removing gas bubbles from flowing liquids
US4390351A (en) * 1979-08-16 1983-06-28 Ishikawajima-Harima Jukogyo Kabushiki Kaisha Gas-liquid separator
TW200301509A (en) * 2001-12-28 2003-07-01 Koganei Ltd Chemical supplying device and chemical supplying method
TW200407052A (en) * 2002-10-31 2004-05-01 Ritdisplay Corp Color ink bubble removal device in OLED ink printing process and method thereof
TW200507038A (en) * 2003-07-18 2005-02-16 Shibaura Mechatronics Corp Apparatus for treating substrate and method of treating substrate

Also Published As

Publication number Publication date
CN1853799B (zh) 2013-02-06
JP4627681B2 (ja) 2011-02-09
KR101205821B1 (ko) 2012-11-28
JP2006297274A (ja) 2006-11-02
KR20060110789A (ko) 2006-10-25
TW200727350A (en) 2007-07-16
CN1853799A (zh) 2006-11-01

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