TWI402900B - Apparatus for treating substrates and method of treating substrates - Google Patents
Apparatus for treating substrates and method of treating substrates Download PDFInfo
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- TWI402900B TWI402900B TW095113760A TW95113760A TWI402900B TW I402900 B TWI402900 B TW I402900B TW 095113760 A TW095113760 A TW 095113760A TW 95113760 A TW95113760 A TW 95113760A TW I402900 B TWI402900 B TW I402900B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1316—Methods for cleaning the liquid crystal cells, or components thereof, during manufacture: Materials therefor
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- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Nonlinear Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Liquid Crystal (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Nozzles (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Coating Apparatus (AREA)
- Weting (AREA)
Description
本發明係有關於一種沿與基板之搬送方向交叉之方向將處理液以直線狀供給至欲搬送之基板上面而予以處理之基板之處理裝置及處理方法。The present invention relates to a processing apparatus and a processing method for a substrate which is processed by linearly supplying a processing liquid to a substrate to be conveyed in a direction intersecting with a conveying direction of the substrate.
舉例言之，在液晶顯示裝置之製程中有於玻璃製基板形成電路圖形之步驟。當形成電路圖形時，於形成之基板塗佈光阻劑後使其曝光，曝光後，藉顯像液進行顯像處理，然後，以蝕刻液進行蝕刻處理，而於基板表面精密地形成電路圖形。For example, in the process of the liquid crystal display device, there is a step of forming a circuit pattern on a glass substrate. When the circuit pattern is formed, the formed substrate is coated with a photoresist and exposed to light. After exposure, the development process is performed by the developing solution, and then etching treatment is performed with an etching solution to form a circuit pattern on the surface of the substrate. .
於基板形成電路圖形後，藉剝離液去除附著殘留於該基板表面之光阻膜或光阻殘渣等有機物。藉剝離液去除有機物後，以洗淨液將該基板板面進行洗淨處理後，交接至下個步驟。After the circuit pattern is formed on the substrate, the organic material such as the photoresist film or the photoresist residue remaining on the surface of the substrate is removed by the stripping liquid. After the organic matter is removed by the stripping solution, the substrate surface is washed with the cleaning solution, and then transferred to the next step.
以顯像液、蝕刻液、剝離液及洗淨液等之處理液處理基板時，一面藉搬送機構將上述基板搬送至預定方向，一面將上述處理液沿與基板搬送方向交叉之方向以直線狀供給至該基板上面而進行處理。下述所示之專利文獻1揭示將處理液供給至欲搬送之基板之噴嘴體。When the substrate is treated with the treatment liquid such as the development liquid, the etching liquid, the stripping liquid, and the cleaning liquid, the processing liquid is transported to a predetermined direction by the transport mechanism, and the processing liquid is linearly arranged in a direction intersecting the substrate transport direction. It is supplied to the upper surface of the substrate for processing. Patent Document 1 shown below discloses a nozzle body that supplies a processing liquid to a substrate to be conveyed.
專利文獻1所示之噴嘴體於其下面沿長向以預定間隔形成複數吐出口。該噴嘴體具有使供給之處理液滯留之貯液室及一端連通上述吐出口，另一端連通上述貯液室而使滯留於貯液室之處理液流至吐出口後吐山之液吐出流路。The nozzle body shown in Patent Document 1 forms a plurality of discharge ports at predetermined intervals along the longitudinal direction thereof. The nozzle body has a liquid storage chamber in which the supply of the treatment liquid is retained, and a liquid discharge passage that communicates with the discharge port at one end and the treatment liquid that has accumulated in the liquid storage chamber to the discharge port after the other end communicates with the discharge chamber.
具上述結構之噴嘴體使長向沿與上述基板搬送方向交叉之方向而配置於欲搬送之上述基板上方。藉此，若從上述吐出口流出處理液時，可將該處理液沿與搬送方向交叉之方向以直線狀供給至搬送至預定方向之基板上面。The nozzle body having the above configuration is disposed above the substrate to be conveyed in a direction in which the longitudinal direction intersects with the substrate transport direction. Thereby, when the processing liquid flows out from the discharge port, the processing liquid can be supplied linearly in the direction intersecting the conveying direction to the upper surface of the substrate conveyed in the predetermined direction.
【專利文獻1】日本專利公開公報2003－170086號[Patent Document 1] Japanese Patent Laid-Open Publication No. 2003-170086
於上述噴嘴體之貯液室連接供給管，而從該供給管將處理液供給至貯液室。處理液滯留於該貯液室，並經由液吐出流路從形成於噴嘴體下面之吐出口流出。A supply pipe is connected to the reservoir of the nozzle body, and the treatment liquid is supplied from the supply pipe to the reservoir. The treatment liquid is retained in the liquid storage chamber, and flows out from the discharge port formed on the lower surface of the nozzle body via the liquid discharge flow path.
然而，根據此結構，當處理液從供給管供給至貯液室時，有處理液混入空氣之情形。若處理液混入空氣，空氣便成為氣泡而與處理液一同從吐出口供給至基板。However, according to this configuration, when the treatment liquid is supplied from the supply pipe to the liquid storage chamber, there is a case where the treatment liquid is mixed with the air. When the treatment liquid is mixed with air, the air becomes a bubble and is supplied to the substrate from the discharge port together with the treatment liquid.
供給至基板之氣泡有不破裂而殘留之情形，此時，呈基板之氣泡殘留之部份未附著處理液之狀態或附著量較其他部份少之狀態，而於處理液所作之基板處理產生不均。The bubble supplied to the substrate may remain without being broken. At this time, the state in which the remaining portion of the bubble of the substrate is not attached to the state of the treatment liquid or the amount of adhesion is less than that of the other portion, and the substrate treatment by the treatment liquid is generated. Uneven.
本發明在於提供一種當將處理液沿與搬送方向交叉之方向以直線狀供給至基板時，可供給不含氣泡之處理液之基板之處理裝置及處理方法。The present invention provides a processing apparatus and a processing method for supplying a substrate containing a processing liquid containing bubbles when a processing liquid is supplied to a substrate in a straight line in a direction intersecting the conveying direction.
本發明為一種基板之處理裝置，其係藉從處理液供給機構供給之處理液處理欲搬送之基板上面者，該處理液供給機構包含有：容器本體、分隔體、流出部及排出部，該分隔體係將該容器本體內部分為供給上述處理液之流入部及供給至該流入部之處理液溢出而流入之貯液部者；該流出部係形成於上述貯液部之底壁，以將從上述流入部流入而於該貯液部儲存預定高度之處理液供給至上述基板上面者；該排出部係形成於上述流入部側壁之上端部，以於供給至上述流入部之處理液液面上升至與上述分隔體上端幾乎相同高度時，使浮遊於該液面之氣泡不流入上述貯液部而流出至上述容器本體外部者。The present invention relates to a substrate processing apparatus that processes a substrate to be transported by a processing liquid supplied from a processing liquid supply mechanism, the processing liquid supply mechanism including a container body, a separator, an outflow portion, and a discharge portion. The partition system divides the inside of the container body into an inflow portion that supplies the treatment liquid and a liquid storage portion that overflows into the treatment liquid supplied to the inflow portion, and the inflow portion is formed on a bottom wall of the liquid storage portion to a processing liquid that flows in from the inflow portion and stores a predetermined height in the liquid storage portion is supplied to the upper surface of the substrate; the discharge portion is formed on an upper end portion of the side wall of the inflow portion to supply a liquid level to the processing portion of the inflow portion When rising to almost the same height as the upper end of the separator, air bubbles floating on the liquid surface do not flow into the liquid storage portion and flow out to the outside of the container body.
本發明為一種處理方法，其係將處理液供給至欲搬送之基板上面而予以處理者，其包含有：搬送上述基板之步驟、沿與該基板之搬送方向交叉之方向將上述處理液以直線狀供給至搬送至預定位置之基板上面之步驟及於將處理液供給至上述基板前，去除該處理液所含之氣泡之步驟。The present invention provides a processing method for supplying a processing liquid to a substrate to be transported and processing the same, comprising: transferring the substrate; and linearly flowing the processing liquid in a direction intersecting the conveying direction of the substrate The step of supplying the upper surface to the substrate transferred to the predetermined position and the step of removing the air bubbles contained in the processing liquid before supplying the processing liquid to the substrate.
根據本發明，即使處理液混入氣泡，仍可於處理液供給至基板前，去除氣泡，而可防止氣泡殘留於基板上而無法均一進行處理液之處理。According to the present invention, even if the treatment liquid is mixed with the bubbles, the bubbles can be removed before the treatment liquid is supplied to the substrate, and the bubbles can be prevented from remaining on the substrate, and the treatment liquid can not be uniformly processed.
第1圖係沿顯示本發明一實施形態之處理裝置寬度方向之縱截面圖。Fig. 1 is a longitudinal sectional view showing the width direction of a processing apparatus according to an embodiment of the present invention.
第2圖係設置於上述處理裝置內之處理液供給裝置之平面圖。Fig. 2 is a plan view showing a processing liquid supply device provided in the above processing apparatus.
第3圖係上述處理液供給裝置之下視圖。Fig. 3 is a bottom view of the above treatment liquid supply device.
第4圖係處理液供給裝置之縱截面圖。Fig. 4 is a longitudinal sectional view of the processing liquid supply device.
第5圖係形成於流入部之側壁上部之凹凸部之正面圖。Fig. 5 is a front view showing the uneven portion formed on the upper portion of the side wall of the inflow portion.
以下，參照圖式，說明本發明之一實施形態。第1圖係沿處理裝置之寬度方向之縱截面圖。此處理裝置具有室1。此室1以上面開口之本體部2及用以開關該本體部2之上面開口之蓋體部3構成。蓋體部3之寬度方向之一側藉鉸鏈4可旋動地連結於上述本體部2，寬度方向之另一側設置有圖中未示之把手。Hereinafter, an embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a longitudinal sectional view taken along the width direction of the processing apparatus. This treatment device has a chamber 1. The chamber 1 is constituted by a body portion 2 that is open at the top and a lid portion 3 that opens and closes the upper surface of the body portion 2. One side in the width direction of the lid portion 3 is rotatably coupled to the main body portion 2 by a hinge 4, and a handle (not shown) is provided on the other side in the width direction.
於上述室1之本體部2底部之寬度方向兩端部設置支撐構件11。已單位化之搬送裝置12可拆卸地設置於一對支撐構件11。此搬送裝置12具有載置於上述支撐構件11上面之一對基座構件13。一對基座構件13藉3根連結構件14(第1圖僅顯示1根)而連結。Support members 11 are provided at both end portions in the width direction of the bottom portion of the main body portion 2 of the chamber 1. The unitized conveying device 12 is detachably provided to the pair of supporting members 11. The conveying device 12 has a pair of base members 13 placed on the upper surface of the support member 11. The pair of base members 13 are connected by three connecting members 14 (only one is shown in the first drawing).
於各基座構件13沿長向設置支撐板15。於一對支撐板15之對應位置以預定間隔設置軸承16。搬送軸17之兩端部旋轉自如地支撐於對應之一對軸承16。即，於一對基座構件13相對於與腔室1之寬度方向垂直相交之長向以預定間隔設置複數搬送軸17。A support plate 15 is provided in each of the base members 13 in the longitudinal direction. The bearing 16 is disposed at a predetermined interval at a corresponding position of the pair of support plates 15. Both end portions of the conveying shaft 17 are rotatably supported by the corresponding one pair of bearings 16. In other words, the plurality of transport shafts 17 are provided at predetermined intervals in the longitudinal direction in which the pair of base members 13 intersect perpendicularly to the width direction of the chamber 1.
此外，雖圖中未示，於室1之長向之一側壁形成搬入口，另一側形成搬出口，而可從上述搬入口將用於液晶顯示裝置之玻璃製基板W供給至室內1。Further, although not shown, a carry-in port is formed in one side wall of the long direction of the chamber 1, and a transfer port is formed on the other side, and the glass substrate W for the liquid crystal display device can be supplied to the room 1 from the above-described carry-in port.
於各搬送軸17以預定間隔設置複數之搬送輥18。於上述連結構件14之兩端部設置引導輥19，其係用以引導從上述搬入口供給而藉上述搬送輥18如後述搬送之基板W之寬度方向兩端部。引導輥19防止藉搬送輥18搬送之基板W彎曲。A plurality of conveying rollers 18 are provided at predetermined intervals on the respective conveying shafts 17. Guide rollers 19 are provided at both end portions of the connecting member 14 for guiding both end portions in the width direction of the substrate W which is supplied from the transfer port and transported by the transfer roller 18 as will be described later. The guide roller 19 prevents the substrate W conveyed by the conveyance roller 18 from being bent.
上述搬送軸17藉驅動機構21而旋轉驅動。此驅動機構21具有驅動源22，於該驅動源22之輸出軸23嵌裝驅動齒輪24。此驅動齒輪24咬合嵌裝於安裝軸25之從動齒輪26。上述安裝軸25與上述搬送軸17之端部設置相互咬合之齒輪(圖中未示)。The conveyance shaft 17 is rotationally driven by the drive mechanism 21. The drive mechanism 21 has a drive source 22 to which the drive gear 24 is fitted. This drive gear 24 engages with the driven gear 26 that is fitted to the mounting shaft 25. The mounting shaft 25 and the end portion of the conveying shaft 17 are provided with gears (not shown) that are engaged with each other.
藉此，若上述驅動源22作動時，由於上述搬送軸17旋轉驅動，故供給至上述室1內之基板W為設置於上述搬送軸17之搬送輥18所支撐而搬送。When the drive source 22 is actuated, the transport shaft 17 is rotationally driven, so that the substrate W supplied into the chamber 1 is supported by the transport roller 18 provided on the transport shaft 17 and transported.
於上述室1內設置作為處理液供給機構之處理液供給裝置31，該處理液供給機構係將顯像液、蝕刻液、剝離液或洗淨液等處理液L沿與基板W之搬送方向垂直相交之寬度方向以直線狀供給至藉設置於上述搬送軸17之搬送輥18以水平狀態搬送之基板W上面。A processing liquid supply device 31 as a processing liquid supply mechanism that vertically treats the processing liquid L such as a developing liquid, an etching liquid, a peeling liquid, or a cleaning liquid in a direction perpendicular to the conveying direction of the substrate W is provided in the chamber 1 The width direction of the intersection is linearly supplied to the upper surface of the substrate W conveyed by the transport roller 18 provided on the transport shaft 17 in a horizontal state.
上述處理液供給裝置31如第2圖至第4圖所示具有容器本體32。此容器本體32沿上述基板W之寬度方向，亦即室1之寬度方向形成上面開口之箱形。此容器本體32之寬度尺寸設定為較上述基板W之寬度尺寸長，內部藉沿容器本體32之長向設置之分隔體33於與此長向垂直相交之方向分隔為流入部34及貯液部35。在此實施形態中，上述流入部34位於第4圖中以箭頭所示之基板W之搬送方向之上流側，貯液部35位於下流側。The processing liquid supply device 31 has a container body 32 as shown in Figs. 2 to 4 . The container body 32 has a box shape in which the upper surface is opened in the width direction of the substrate W, that is, in the width direction of the chamber 1. The width of the container body 32 is set to be longer than the width dimension of the substrate W, and the partition 33 disposed along the longitudinal direction of the container body 32 is partitioned into the inflow portion 34 and the liquid storage portion in a direction perpendicular to the longitudinal direction. 35. In this embodiment, the inflow portion 34 is located on the flow side in the transport direction of the substrate W indicated by the arrow in FIG. 4, and the liquid storage portion 35 is located on the downstream side.
於上述流入部34之側壁34a之下部沿此側壁34a之寬度方向而於長向等間隔設置複數給液口體36。於各給液口體36連接處理液之給液管37之一端。給液管37之另一端連通圖中未示之處理液之供給部。藉此，可從上述側壁34a之下部以預定壓力將處理液供給至上述容器本體32之流入部34。A plurality of liquid supply ports 36 are disposed at equal intervals in the longitudinal direction along the width direction of the side wall 34a at the lower portion of the side wall 34a of the inflow portion 34. One end of the liquid supply pipe 37 for connecting the treatment liquid to each of the liquid supply ports 36 is provided. The other end of the liquid supply pipe 37 is connected to a supply portion of the treatment liquid not shown. Thereby, the treatment liquid can be supplied to the inflow portion 34 of the container body 32 at a predetermined pressure from the lower portion of the side wall 34a.
上述流入部34橫亙容器本體32之長向全長而設置將該流入部34內分隔為位於上述給液口體36側之第1空間38a及位於上述貯液部35側之第2空間38b之撞擊壁39。The inflow portion 34 is provided so as to divide the inside of the inflow portion 34 into the first space 38a on the side of the liquid supply port 36 and the second space 38b on the side of the liquid storage portion 35, across the entire length of the container body 32. Wall 39.
上述撞擊壁39之高度設定為較上述分隔體33之高度低。藉此，從上述給液口體36供給至第1空間38a之處理液L撞擊撞擊壁39而減弱衝勢，且滯留於第1空間38a而使液面上升。然後，當液面上升至與撞擊壁39幾乎相同之高度時，如第4圖之箭頭所示，溢出該撞擊壁39而流入至第2空間32b。The height of the above-mentioned impact wall 39 is set to be lower than the height of the above-described separator 33. As a result, the treatment liquid L supplied from the liquid supply port body 36 to the first space 38a hits the collision wall 39 to weaken the momentum, and stays in the first space 38a to raise the liquid level. Then, when the liquid level rises to almost the same height as the impact wall 39, as shown by the arrow in Fig. 4, the collision wall 39 overflows and flows into the second space 32b.
處理液L從給液體口36強勁地流入第1空間38a，而混入空氣，此為氣泡產生之原因。然而，從給液口體36流入第1空間38a之處理液L在撞擊壁39撞擊而減弱衝勢，而溢出撞擊壁39而流入至第2空間32b。The treatment liquid L strongly flows into the first space 38a from the liquid supply port 36, and air is mixed therein, which is a cause of bubble generation. However, the treatment liquid L that has flowed into the first space 38a from the liquid supply port body 36 collides with the impact wall 39 to weaken the momentum, and overflows the collision wall 39 to flow into the second space 32b.
換言之，處理液L以流入第1空間38a時之衝勢而導致氣泡之產生，但於第2空間38b不產生亂流而平靜流入，故此時幾乎無氣泡之產生。In other words, the treatment liquid L causes the generation of air bubbles when it flows into the first space 38a. However, the second space 38b does not generate turbulent flow and flows quietly. Therefore, almost no bubble is generated at this time.
當處理液L溢流至第2空間38b，流入部34之液面與分隔體33之上端幾乎同高時，處理液L如第4圖之箭頭所示，溢出分隔體33而流入至貯液部35。此時，由於處理部L亦因溢出而不產生亂流而平靜地流入貯液部35，故不致產生亂流。When the treatment liquid L overflows to the second space 38b, and the liquid level of the inflow portion 34 is almost the same as the upper end of the separator 33, the treatment liquid L overflows the separator 33 and flows into the liquid storage as indicated by the arrow in Fig. 4 Part 35. At this time, since the treatment portion L does not cause turbulence due to overflow and smoothly flows into the reservoir portion 35, turbulence does not occur.
如第3圖所示，於上述貯液部35之底壁35a沿容器本體32之寬度方向以預定間隔形成一列形成流出部之複數噴嘴孔40。在此實施形態中，上述噴嘴孔40之孔徑為0.5mm，間距為0.7mm。As shown in Fig. 3, a plurality of nozzle holes 40 forming an outflow portion are formed at a predetermined interval in the width direction of the container body 32 at the bottom wall 35a of the liquid reservoir portion 35. In this embodiment, the nozzle hole 40 has a hole diameter of 0.5 mm and a pitch of 0.7 mm.
藉此，當貯液部35內處理液L以分隔體3之上端高度儲存時，因其高度造成之壓力，從以0.7mm之間距形成之相鄰噴嘴孔40流出之處理液連接而形成一直線而供給至基板W上面。換言之，即使以複數噴嘴孔40形成流出部，處理液L不致為各噴嘴孔40而分離而可沿基板W之寬度方向連成一直線而供給至基板W上面。Thereby, when the treatment liquid L in the liquid storage portion 35 is stored at the height of the upper end of the separator 3, the pressure due to the height thereof is connected from the treatment liquid flowing out from the adjacent nozzle holes 40 formed at a distance of 0.7 mm to form a straight line. It is supplied to the upper surface of the substrate W. In other words, even if the outflow portion is formed by the plurality of nozzle holes 40, the processing liquid L is not separated by the nozzle holes 40, and can be supplied to the upper surface of the substrate W in a line along the width direction of the substrate W.
在上述實施形態中，為使從複數噴嘴孔40流出之處理液L呈直線狀，而令相鄰之噴嘴孔40之間距為0.7mm，而若間距小於0.7mm時，可以將從複數噴嘴孔40流出之處理液L連成直線狀之狀態供給至基板W。In the above embodiment, the processing liquid L flowing out from the plurality of nozzle holes 40 is linear, so that the distance between the adjacent nozzle holes 40 is 0.7 mm, and if the pitch is less than 0.7 mm, the plural nozzle holes can be used. The processing liquid L flowing out of 40 is supplied to the substrate W in a state of being linear.
此外，從相鄰之噴嘴孔40流出之處理液連接之噴嘴孔40之間距依至從噴嘴孔40流出之處理液L增加之貯液部35的高度或處理液L之黏度而不同。根據實驗，確認了當為純水時，若令噴嘴孔40之間距為1.0mm時，從相鄰之噴嘴孔40流出之處理液L不相連而分離，為0.7mm時，則相連成直線狀。Further, the nozzle holes 40 to which the treatment liquid flowing out from the adjacent nozzle holes 40 are connected differ from the height of the liquid reservoir 35 which is increased by the treatment liquid L flowing out from the nozzle holes 40 or the viscosity of the treatment liquid L. According to the experiment, it was confirmed that when pure water is used, if the distance between the nozzle holes 40 is 1.0 mm, the treatment liquid L flowing out from the adjacent nozzle holes 40 is not connected and separated, and when it is 0.7 mm, it is connected in a straight line. .
因而，當處理液為純水時，若噴嘴孔40之間距小於0.7mm，可使從相鄰噴嘴孔40流出之處理液L不為各噴嘴孔分離，而可以連成直線狀之狀態供給。Therefore, when the treatment liquid is pure water, if the distance between the nozzle holes 40 is less than 0.7 mm, the treatment liquid L flowing out from the adjacent nozzle holes 40 can be separated from each nozzle hole, and can be supplied in a straight state.
於上述流入部34之側壁34a之上部如第5圖所示，設置交互形成凹部41a及凸部41b而作為山形排出部之凹凸部41。換言之，凹凸部41之凹部41a與凸部41b分別形成上下相反之三角形，凹部41a之谷之下端高度H設定為與上述分隔體33之上端高度幾乎相同。As shown in Fig. 5, the upper portion of the side wall 34a of the inflow portion 34 is provided with an uneven portion 41 which alternately forms the concave portion 41a and the convex portion 41b as a mountain-shaped discharge portion. In other words, the concave portion 41a and the convex portion 41b of the uneven portion 41 are formed in a vertically opposite triangle, and the height H of the lower end of the valley portion of the concave portion 41a is set to be almost the same as the height of the upper end of the partition 33.
因此，當從上述給液口體36供給至流入部34之處理液L之液面與分隔體33及凹部41a之下端幾乎同高時，浮遊於流入部34液面之氣泡不與處理液L一同流入上述貯液部35而經由上述凹部41a，流出至形成於上述流入部34之側壁34a外側之排液部42。Therefore, when the liquid level of the treatment liquid L supplied from the liquid supply port body 36 to the inflow portion 34 is almost the same as the lower end of the partition body 33 and the recessed portion 41a, the air bubbles floating on the liquid surface of the inflow portion 34 are not treated with the treatment liquid L. The water inflow portion 35 flows into the liquid discharge portion 35 and flows out through the concave portion 41a to the liquid discharge portion 42 formed outside the side wall 34a of the inflow portion 34.
換言之，由於上述凹凸部41之凹部41a呈倒三角形，故流經其谷之部份之處理液L的流速較溢出分隔體33上端之處理液L之流速快。因此，由於流入部34之處理液L之液面產生相較於朝向貯液部35反而易朝向排液部42之流動，故若氣泡於該液面浮遊時，氣泡便流至排液部42，而阻止流至貯液部35。In other words, since the concave portion 41a of the uneven portion 41 has an inverted triangle shape, the flow rate of the treatment liquid L flowing through the valley portion thereof is faster than the flow rate of the treatment liquid L at the upper end of the overflow separator 33. Therefore, since the liquid level of the treatment liquid L in the inflow portion 34 is more likely to flow toward the liquid discharge portion 42 than toward the liquid storage portion 35, when the bubble floats on the liquid surface, the bubble flows to the liquid discharge portion 42. And the flow to the liquid storage portion 35 is blocked.
於上述排液部42連接圖中未示之排液管。藉此，與氣泡一同流入至排液部42之處理液L經由上述排液管而排出至適當處。A drain pipe (not shown) is connected to the liquid discharge portion 42. Thereby, the treatment liquid L that has flowed into the liquid discharge unit 42 together with the air bubbles is discharged to the appropriate place via the liquid discharge tube.
此外，容器本體32之上面開口藉以網等形成之圖中未示之蓋構件覆蓋亦可。Further, the upper opening of the container body 32 may be covered by a cover member not shown in the drawings formed of a net or the like.
根據此種結構之處理裝置，從設置於流入部34之側壁34a下部之給液口體36以預定壓力供給至第1空間38a之處理液L因撞擊撞擊壁39，而可減弱衝勢。處理液L便強勁地 流入第1空間38a，產生亂流而混入空氣，故空氣包含於成為氣泡之處理液L。According to the processing apparatus of such a configuration, the treatment liquid L supplied to the first space 38a at a predetermined pressure from the liquid supply port body 36 provided at the lower portion of the side wall 34a of the inflow portion 34 can be weakened by the impact wall 39. The treatment liquid L is strong The air flows into the first space 38a, and turbulent flow occurs to mix the air. Therefore, the air is contained in the processing liquid L that becomes the air bubbles.
當流入至第1空間38a之處理液L之液面上升時，處理液L溢出撞擊壁39而流入至第2空間38b，流入部34之液面上升。供給至流入部34之處理液L藉撞擊壁39減弱衝勢，故當流入部34之液面上升時，不致產生亂流而混入空氣。When the liquid level of the treatment liquid L that has flowed into the first space 38a rises, the treatment liquid L overflows the collision wall 39 and flows into the second space 38b, and the liquid level of the inflow portion 34 rises. The treatment liquid L supplied to the inflow portion 34 is weakened by the impact wall 39. Therefore, when the liquid level of the inflow portion 34 rises, no turbulent flow occurs and air is mixed.
換言之，由於處理液L流入至流入部34之第1空間38a時，以預定之壓力流入，故導致氣泡之產生。然而，由於之後不致產生氣泡，故可抑制流入部34之氣泡之產生。In other words, when the processing liquid L flows into the first space 38a of the inflow portion 34, it flows in at a predetermined pressure, and thus bubbles are generated. However, since bubbles are not generated after that, generation of bubbles of the inflow portion 34 can be suppressed.
如此進行而供給至流入部34之處理液之液面上升至與分隔體33之上端及凹凸部41之凹部41a之下端幾乎相同高度時，流入部34之處理液L之液面產生經由上述凹部41a流至排液部42之流動及溢出分隔體33而流至貯液部35之流動。When the liquid level of the treatment liquid supplied to the inflow portion 34 is increased to almost the same height as the upper end of the partition 33 and the lower end of the concave portion 41a of the uneven portion 41, the liquid level of the treatment liquid L of the inflow portion 34 is generated through the concave portion. The flow of the 41a to the liquid discharge portion 42 and the overflow of the separator 33 flow to the liquid storage portion 35.
由於上述凹部41a形成倒山形，故流經凹部41a之處理液L之流速較溢出分隔體33之處理液L之流速快。因而，當氣泡於流入部34之處理液L之液面浮遊時，氣泡流至流速快之凹凸部41之凹部41a，而不致溢出分隔體33，故氣泡不致流入貯液部35。Since the concave portion 41a is formed in an inverted mountain shape, the flow rate of the treatment liquid L flowing through the concave portion 41a is faster than the flow rate of the treatment liquid L overflowing the separator 33. Therefore, when the bubble floats on the liquid surface of the treatment liquid L of the inflow portion 34, the bubble flows to the concave portion 41a of the uneven portion 41 having a fast flow velocity without overflowing the separator 33, so that the bubble does not flow into the liquid reservoir portion 35.
溢出分隔體33之處理液L以預定之高度儲存於上述貯液部35內，而以該高度產生之壓力從形成於貯液部35之底壁35a之複數噴嘴孔40流出。由於供給至基板W之處理液L不含氣泡，故可防止氣泡附著於基板W上而產生處理不均。The treatment liquid L of the overflow separator 33 is stored in the liquid storage portion 35 at a predetermined height, and the pressure generated at the height flows out from the plurality of nozzle holes 40 formed in the bottom wall 35a of the liquid storage portion 35. Since the processing liquid L supplied to the substrate W does not contain air bubbles, it is possible to prevent air bubbles from adhering to the substrate W and to cause processing unevenness.
由於將相鄰之噴嘴孔40之間距形成從相鄰之噴嘴孔0流出之處理液連接之間隔，故處理液沿與基板W之搬送方向垂直相交之寬度方向呈一直線而流出。Since the distance between the adjacent nozzle holes 40 is such that the processing liquid flowing out from the adjacent nozzle holes 0 is formed, the processing liquid flows out in a line in a direction perpendicular to the direction in which the substrate W is conveyed.
因此，由於可將處理液均等地供給至搬送至預定方向之基板W之寬度方向全長，故藉此亦可使基板W上面全體不致產生不均而可均一地處理。Therefore, since the processing liquid can be uniformly supplied to the entire length in the width direction of the substrate W conveyed in the predetermined direction, the entire surface of the substrate W can be uniformly processed without unevenness.
藉複數噴嘴孔40之間距與孔徑，可將從相鄰之噴嘴孔40流出之處理液L相對於基板W之寬度方向以直線狀供給。換言之，即使不於供給至貯液部35之處理液L施加壓力，亦可以其液面高度產生之壓力以直線狀供給處理液L。By the distance between the plurality of nozzle holes 40 and the aperture, the processing liquid L flowing out from the adjacent nozzle holes 40 can be supplied linearly with respect to the width direction of the substrate W. In other words, even if the pressure is not applied to the treatment liquid L supplied to the liquid reservoir 35, the treatment liquid L can be supplied linearly at the pressure at which the liquid level is generated.
因此，相較於於處理液施加壓力，可減少處理液L之使用量，而可減低成本。貯液部35之液面高度依處理液L之供給量、噴嘴孔40之孔徑及數量設定，通常將供給量設定為稍多於噴嘴孔40之流出量。藉此，由於可將貯液部35之液面設定為與分隔體33之上端幾乎相同，故可以根據其高度之壓力使處理液L從噴嘴孔40流出。Therefore, the amount of the treatment liquid L can be reduced as compared with the pressure applied to the treatment liquid, and the cost can be reduced. The liquid level of the liquid reservoir 35 is set according to the supply amount of the treatment liquid L and the aperture and number of the nozzle holes 40, and the supply amount is usually set to be slightly larger than the discharge amount of the nozzle holes 40. Thereby, since the liquid level of the liquid storage part 35 can be set almost the same as the upper end of the separator 33, the processing liquid L can flow out from the nozzle hole 40 according to the pressure of the height.
此外，在上述一實施形態中，於貯液部之底壁以預定間隔形成複數噴嘴孔作為供給部，亦可於上述底壁形成縫隙取代噴嘴孔。Further, in the above-described embodiment, a plurality of nozzle holes are formed as a supply portion at a predetermined interval on the bottom wall of the liquid reservoir, and a slit may be formed in the bottom wall instead of the nozzle hole.
1．．．室1. . . room
2．．．本體部2. . . Body part
3．．．蓋體部3. . . Cover body
4．．．鉸鏈4. . . Hinge
11．．．支撐構件11. . . Support member
12．．．搬送裝置12. . . Transport device
13．．．基座構件13. . . Base member
14．．．連結構件14. . . Connecting member
15．．．支撐板15. . . Support plate
16．．．軸承16. . . Bearing
17．．．搬送軸17. . . Transport shaft
18．．．搬送輥18. . . Transfer roller
19．．．引導輥19. . . Guide roller
21．．．驅動機構twenty one. . . Drive mechanism
22．．．驅動源twenty two. . . Drive source
23．．．輸出軸twenty three. . . Output shaft
24．．．驅動齒輪twenty four. . . Drive gear
25．．．安裝軸25. . . Mounting shaft
26．．．從動齒輪26. . . Driven gear
31．．．處理液供給裝置31. . . Treatment liquid supply device
32．．．容器本體32. . . Container body
33．．．分隔體33. . . Separator
34．．．流入部34. . . Inflow
34a．．．側壁34a. . . Side wall
35．．．貯液部35. . . Liquid storage
36．．．給液口體36. . . Liquid supply body
37．．．給液管37. . . Liquid supply tube
38a．．．第1空間38a. . . First space
38b．．．第2空間38b. . . Second space
39．．．撞擊壁39. . . Impact wall
40．．．噴嘴孔40. . . Nozzle hole
41．．．凹凸部41. . . Concave part
41a．．．凹部41a. . . Concave
41b．．．凸部41b. . . Convex
42．．．排液部42. . . Drainage department
W．．．基板W. . . Substrate
L．．．處理液L. . . Treatment fluid
第1圖係沿顯示本發明一實施形態之處理裝置寬度方向之縱截面圖。Fig. 1 is a longitudinal sectional view showing the width direction of a processing apparatus according to an embodiment of the present invention.
第2圖係設置於上述處理裝置內之處理液供給裝置之平面圖。Fig. 2 is a plan view showing a processing liquid supply device provided in the above processing apparatus.
第3圖係上述處理液供給裝置之下視圖。Fig. 3 is a bottom view of the above treatment liquid supply device.
第4圖係處理液供給裝置之縱截面圖。Fig. 4 is a longitudinal sectional view of the processing liquid supply device.
第5圖係形成於流入部之側壁上部之凹凸部之正面圖。Fig. 5 is a front view showing the uneven portion formed on the upper portion of the side wall of the inflow portion.
17．．．搬送軸17. . . Transport shaft
18．．．搬送輥18. . . Transfer roller
31．．．處理液供給裝置31. . . Treatment liquid supply device
32．．．容器本體32. . . Container body
33．．．分隔體33. . . Separator
34．．．流入部34. . . Inflow
34a．．．側壁34a. . . Side wall
35．．．貯液部35. . . Liquid storage
36．．．給液口體36. . . Liquid supply body
37．．．給液管37. . . Liquid supply tube
38a．．．第1空間38a. . . First space
38b．．．第2空間38b. . . Second space
39．．．撞擊壁39. . . Impact wall
40．．．噴嘴孔40. . . Nozzle hole
41．．．凹凸部41. . . Concave part
42．．．排液部42. . . Drainage department
W．．．基板W. . . Substrate
L．．．處理液L. . . Treatment fluid
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| JP5060835B2 (en) * | 2006-07-26 | 2012-10-31 | 芝浦メカトロニクス株式会社 | Substrate processing equipment |
| CN101251721B (en) * | 2008-04-14 | 2010-09-01 | 友达光电股份有限公司 | Developing spray nozzle structure and method for spraying developing solution |
| CN103163002A (en) * | 2013-04-11 | 2013-06-19 | 王刚平 | Immunohistochemical wet box |
| CN106716605B (en) * | 2014-09-30 | 2021-06-08 | 芝浦机械电子株式会社 | Substrate processing apparatus |
| KR102355116B1 (en) * | 2017-04-03 | 2022-01-26 | 주식회사 케이씨텍 | Slurry dispensing nozzle and apparatus for polishing substrate having the nozzle |
| CN108447805A (en) * | 2018-03-30 | 2018-08-24 | 无锡尚德太阳能电力有限公司 | Wet method chain type etching groove feed liquor structure |
| KR102420868B1 (en) | 2021-08-26 | 2022-07-14 | 실드 주식회사 | Flexible sound absorbent barrier |
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- 2006-04-18 KR KR1020060034996A patent/KR101205821B1/en active IP Right Grant
- 2006-04-18 TW TW095113760A patent/TWI402900B/en active
- 2006-04-20 CN CN2006100746243A patent/CN1853799B/en active Active
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| US3488926A (en) * | 1968-03-08 | 1970-01-13 | Harrworth Inc | Separator for removing gas bubbles from flowing liquids |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN1853799B (en) | 2013-02-06 |
| JP2006297274A (en) | 2006-11-02 |
| TW200727350A (en) | 2007-07-16 |
| CN1853799A (en) | 2006-11-01 |
| KR101205821B1 (en) | 2012-11-28 |
| KR20060110789A (en) | 2006-10-25 |
| JP4627681B2 (en) | 2011-02-09 |
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