JP4481865B2 - Method and apparatus for removing scum in developing machine - Google Patents

Description

  The present invention relates to a scum removing method and an apparatus therefor, particularly in a developing machine for removing scum generated in a developing tank of a DSR developing machine.

  A substrate for making an electrical circuit of copper (Cu) on polyimide (PI) is obtained by laminating a DSR film on this substrate with a thermocompression bonding machine and performing an exposure process using a negative film in the exposure process. Next, a development process is performed in a development process, and then an etching process is performed in an etching process.

That is, the above-mentioned DSR is an abbreviation for dry film solder resist, and is used to insulate the surface of the printed circuit board after the circuit is formed, excluding a part on which a mounting component is placed and a terminal part for a product. . DSR has a characteristic that it hardens when irradiated with UV light, and it disappears when an alkaline chemical (generally Na ₂ CO ₃ ) is applied to a portion not irradiated with UV light. This process of irradiating with UV light is referred to as a DSR exposure process, and the process of dissolving and removing a portion not irradiated with UV light is referred to as a DSR development process. In order to insulate with DSR except for mounting parts and product terminal parts, the part is covered with a mask, and the substrate that has undergone the DSR exposure process that irradiates UV light to the part not covered with the mask is DSR developed. Come to the process.

  In the development step, means for spraying a developer from a plurality of jet nozzles onto the substrate subjected to the exposure process to dissolve and remove the dry solder resist not cured by ultraviolet rays from the substrate is applied.

  In a conventional developing machine, after a developing process is performed in a developing unit including a developing tank and a developer storage tank provided below the developing tank, a cleaning process is performed in a plurality of cleaning tanks, and a drying tank The drying process is performed.

  As shown in FIG. 6, the developing unit in the conventional developing machine includes a developing tank 101 and a developer storage tank 105 provided below the developing tank 101 via a communication pipe 103. Yes. A pair of delivery rollers 107 and 109 are provided at the left and right ends in FIG. A transport conveyor 111 made of, for example, a mesh or the like is sandwiched between the pair of delivery rollers 107 and 109, and the substrate K subjected to exposure processing is placed on the transport conveyor 111 to synchronize the pair of delivery rollers 107 and 109. By being rotated, the conveyor 111 is moved from right to left, for example, as indicated by arrows in FIG. Headers 117 and 119 each having a plurality of jet nozzles 113 and 115 are provided above and below the transporting conveyor 111 that runs in the developing tank 101.

On the other hand, a developer E such as sodium carbonate (Na ₂ CO ₃ ) is stored in the developer storage tank 105. A discharge tank 121 is provided on the left side wall of the developer storage tank 105 in FIG. The upper right portion of the discharge tank 121 and the left side wall of the developer storage tank 105 communicate with each other. A discharge port 123 is provided at, for example, the lower portion of the discharge tank 121.

  For example, in FIG. 6, one end of a pipe 125 is connected to the right side wall of the developer storage tank 105, and the other end of the pipe 125 is connected to the header 117. In addition, one end of the pipe 127 is branched from the middle of the pipe 125 and the other end of the pipe 127 is connected to the header 119. A pump 125 and an electromagnetic valve 131 are provided in this order from the developer storage tank 105 side in the pipe 125 before branching to the pipe 127.

  With the above configuration, the exposed substrate K is placed on the transport conveyor 111, and the pair of delivery rollers 107 and 109 are rotated synchronously and run as indicated by the arrows in FIG. The substrate K passes through the developing tank 101 from the right side to the left side in FIG. 6 at a constant speed.

  When the pump 129 is operated and the electromagnetic valve 131 is opened in this state, the developer E is sent from the developer storage tank 105 to the headers 117 and 119 via the pipes 125 and 127. Then, the developing solution E is sent from the headers 117 and 119 to the plurality of jet nozzles 113 and 115, and the developing solution E is constantly exposed from the plurality of jet nozzles 113 and 115 to both the front and back surfaces of the substrate K. The dry solder resist (DSR) that has not been UV-cured is dissolved from the substrate K that has been sprayed and exposed, and the scum S of the dry solder resist (DSR) contained in the dissolved liquid is communicated with the developing solution E. It flows through 103 and falls into the developer storage tank 105. As a result, a part of the scum S is stored as a precipitate T at the bottom of the developer storage tank 105 and adheres to the bubbles 133 floating on the surface of the developer E stored in the developer storage tank 105.

The scum S adhering to the bubbles 133 is discharged into the discharge tank 121 together with the bubbles 133 when the developing solution E overflows.
JP 2000-221893 A JP 2003-218502 A

  By the way, in the conventional method for removing the scum S, when the development of DSR is continued, the scum S floats in the developer E. The scum S is initially light enough to be placed on the bubble 133. When the scum S becomes a lump on or above the bubble 133, the scum S sinks into the developing tank 101 as a lump. Since the developer E after the development processing overflows and is discarded, the upper part of the developer E is discarded, but the bubbles 133 remain without being discarded, so that the scum S adhering to the bubbles 133 can be removed. I can't do it, it becomes a lump.

  When the scum S that has become a lump is sucked up by the pump 129, the scum S is sprayed together with the developer E by the spray nozzles 113 and 115, and once the scum S adheres to the substrate K, it is washed with water. Even if it passes, it is difficult to remove, and a product with the scum S attached is produced, which causes a defect. In addition, since the scum S adheres to the inner wall of the developer storage tank 105, there is a problem that the inside of the developer storage tank 105 is difficult to clean.

  The present invention has been made to solve the above-described problems.

  In order to achieve the problem to be solved by the above invention, the scum removing method in the developing machine of the present invention is such that the developer from the developer storage tank is supplied to the substrate subjected to the exposure process by the plurality of first injection nozzles in the developing tank. When the dry solder resist that has not been UV cured is dissolved and removed from the substrate by spraying, the scum of the dry solder resist is discharged together with the developer into the developer storage tank provided below the developer tank, and the development The bubbles adhering to the scum floating on the surface of the developer stored in the liquid storage tank are sprayed from a plurality of second spray nozzles, removed from the developer storage tank, and discharged. It is what.

  A scum removing device in a developing machine according to the present invention is for spraying a developing solution to a substrate subjected to an exposure process by a plurality of first spray nozzles to dissolve and remove a dry solder resist not cured by ultraviolet rays from the substrate. A developer tank, a developer storage tank provided below the developer tank for discharging the scum of the dry solder resist together with the developer, and the surface of the developer stored in the developer storage tank And a plurality of second spray nozzles for spraying the developer onto the bubbles to which the scum is attached, removing the developer from the developer storage tank, and discharging the developer.

  In the scum removing device in the developing machine according to the present invention, in the scum removing device in the developing machine, the plurality of second injection nozzles are provided in a foam guide cover provided downward on the upper wall of the developer storage tank. It is preferable to be provided.

  In the scum removing device in the developing machine according to the present invention, in the scum removing device in the developing machine, the plurality of second injection nozzles are operated when the developer stored in the developer storage tank overflows. It is preferable.

  As can be understood from the description of the means for solving the problems as described above, according to the scum removing method and apparatus in the developing machine of the present invention, the surface of the developer stored in the developer storage tank floats. Since the developer is sprayed from the plurality of second injection nozzles to the bubbles to which the scum is attached and removed from the developer storage tank and discharged, the scum does not stay in the developer storage tank. Accumulation on the side wall of the tank is eliminated, scum can be easily processed, and cleaning of the developer storage tank is facilitated. In addition, since the scum does not stay in the developer storage tank, the scum is not sucked up and sprayed onto the substrate. As a result, no scum adheres to the substrate, so that product defects can be reduced.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  In the developing machine according to the present invention, after a developing process is performed in a developing unit including a developing tank and a developer storage tank provided below the developing tank, a cleaning process is performed in a plurality of cleaning tanks, and further drying is performed. Drying is performed in the tank.

  As shown in FIG. 5, the developing unit in the developing machine includes a developing tank 1 and a developer storage tank 5 provided below the developing tank 1 via a communication pipe 3. . A pair of delivery rollers 7 and 9 are provided at the left and right ends in FIG. A transport conveyor 11 made of, for example, a mesh or the like is sandwiched between the pair of delivery rollers 7 and 9, and an exposed substrate K is placed on the transport conveyor 11 to synchronize the pair of delivery rollers 7 and 9. By being rotated, the conveyor 1 is driven from right to left, for example, as indicated by arrows in FIG. Headers 17 and 19 having a plurality of first injection nozzles 13 and 15 are provided above and below the transporting conveyor 1 that runs in the developing tank 1.

On the other hand, a developer E such as sodium carbonate (Na ₂ CO ₃ ) is stored in the developer storage tank 5.

  For example, in FIG. 5, one end of a pipe 21 is connected to the right side wall of the developer storage tank 5 and the other end of the pipe 21 is connected to the header 17. Moreover, one end of the pipe 23 is branched from the middle of the pipe 21 and the other end of the pipe 23 is connected to the header 119. A pump 21 and an electromagnetic valve 27 are provided in this order from the side of the developer storage tank 5 in the pipe 21 before branching to the pipe 21.

  With the above configuration, the substrate K subjected to the exposure process is placed on the transport conveyor 11, and the pair of delivery rollers 7 and 9 are rotated synchronously and run as indicated by the arrows in FIG. The substrate K passes through the developing tank 1 at a constant speed from the right side to the left side in FIG.

  When the pump 25 is operated and the electromagnetic valve 27 is opened in this state, the developer E is sent from the developer storage tank 5 to the headers 17 and 19 through the pipes 21 and 23. Then, the developer E is sent from the headers 17 and 19 to the plurality of first injection nozzles 13 and 15, and the surface of the substrate K on which the developer E is constantly exposed from the plurality of first injection nozzles 13 and 15, The dry solder resist (DSR) that has not been UV-cured is dissolved from the substrate K that has been sprayed on both sides of the back and exposed to exposure, and the scum S of the dry solder resist (DSR) contained in the dissolved liquid is developed into the developer. E flows through the communication pipe 3 together with E and falls into the developer storage tank 5. A part of the scum S is accumulated as a precipitate T at the bottom of the developer storage tank 5.

  As shown in FIGS. 1, 2 and 3, the developer storage tank 5 has a rectangular shape, for example, and includes a front wall 5F, a rear wall 5B, a left wall 5L, a right wall 5R and a bottom wall 5S. It is comprised and the upper part is opened. Moreover, an opening 29 is formed at a position slightly higher than the center of the left wall 5L in the height direction. An upper opening adjustment plate 31 is attached to the upper portion of the left wall 5L so as to be adjustable in the vertical direction, and a lower opening adjustment plate 33 is attached to the lower portion of the left wall 5L so as to be adjustable in the vertical direction. Yes. Therefore, the opening of the opening 29 can be adjusted by adjusting the upper opening adjusting plate 31 and the lower opening adjusting plate 33 in the vertical direction.

  A foam overflow tank 35 is provided on the left side of the left wall 5L in FIG. A support plate 37 is provided in the lower part of the bubble overflow tank 35, and an overflow drain 39 is provided on the support plate 37 in a direction perpendicular to the paper surface in FIG. An injection nozzle 40 is provided above the bubble overflow tank 35. The injection nozzle 40 plays a role of hitting bubbles in order to drop the bubbles into the overflow drain 39. As shown in FIG. 3, for example, in FIG. 3, in the developer storage tank 5 in the rear wall 5 </ b> B, a water level sensor 43 for detecting a reference water surface 41 is attached to the upper part of the developer storage tank 5 and It hangs down.

  Referring also to FIG. 4, above the reference water surface 41 of the right wall 5R of the developer storage tank 5, the developer used for development from the developer tank 1 through the communication pipe 3 is the developer storage tank. A return communication pipe 45 returning to 5 is attached. As shown well in FIG. 4, the return communication pipe 45 has a rectangular first pipe 47 with a space inside, and an inclined surface 49K in which a lower part integrated with the pipe 47 is inclined downward to the left. And a rectangular second tube 49 having a space inside. Moreover, the used developer returned by the inclined surface 49K is easily stored in the developer storage tank 5.

  A support frame 51 having an inverted U shape is attached to the left wall 5L of the developer storage tank 5. Between the support frame 51 and the return communication pipe 45, a bubble guide cover 53 having an inverted U shape is provided. In addition, the right end portion of the foam guide cover 53 is placed on the left end portion of the second pipe 49 in the return communication pipe 45 and the left end portion of the foam guide cover 53 is placed on the right end portion of the support frame 51.

  For example, a U-shaped cutout groove 55 extending in the front-rear direction is formed slightly to the right of the left and right central portions of the foam guide cover 53. A header 57 extending in the vertical direction in FIG. 2 is provided in the notch groove 55, and the left end of the pipe 61 is connected to the upper end in FIG. Is connected to a pipe (not shown) branched from the pump 25. An electromagnetic valve is provided in the middle of this pipe. In the front-rear direction of the header 57, as shown in FIG. 2, a plurality of second injection nozzles 63 are connected at appropriate intervals.

  The developer E and the scum S used in the developer tank 3 pass through the communication pipe 3, return through the communication pipe 45, and are stored in the developer storage tank 5. In the developer storage tank 5, the developer E is stored in addition to the already stored developer E. At this time, since the foam guide cover 53 is provided in the developer storage tank 5, the returned developer E is stored in the developer storage tank 5, and bubbles 65 are generated in the foam guide cover 53 on the surface. To do. Scum S is attached to the bubbles 65.

  When the water level sensor 43 detects that the developing solution E in the developing solution storage tank 5 has reached the reference water surface 41, an electromagnetic valve (not shown) is turned on, and the developing solution E passes through the pipe 61 and the header 57. Sent to. The developer E sent to the header 57 is sent to the plurality of second jet nozzles 63 and jetted from the second jet nozzles 63 toward the bubbles 65 generated on the surface.

  As a result, the developer 65 to which the bubbles 65 are jetted is blown to the left in FIG. 1 and discharged into the bubble overflow tank 35. The bubbles 65 and the scum S discharged into the bubble overflow tank 35 can be blown off by the air from the injection nozzle 40, and the overflow 65 can be discharged outside through the overflow drain 39.

  Therefore, it is possible to eliminate the occurrence of sticking to the lower opening adjusting plate 33 attached to the left wall 5L in FIG. As a result, there is no work to remove the accumulated scum S, the work can be improved, the scum S can be easily processed, and the developer storage tank 5 is easily cleaned. be able to. In addition, since the scum S does not stay in the developer storage tank 5, the scum S is not sucked up and sprayed onto the substrate K. As a result, the scum S does not adhere to the substrate K, so that product defects can be reduced.

  When the developing solution E in the developing solution storage tank 5 is reduced, it can be replenished sequentially from a developing solution supply tank (not shown).

  Since the plurality of second injection nozzles 63 are provided not on the entire width of the developer storage tank 5 but on the bubble guide cover 53 provided downward on the upper wall of the developer storage tank 5, The injection ability of the liquid E can be increased.

  Since the plurality of second injection nozzles 63 are activated when the developer E stored in the developer storage tank 5 overflows, the bubbles 65 and the scum S are efficiently removed. be able to.

It is a front view of the developing solution storage tank of the principal part of this invention. It is a top view in FIG. It is a side view in FIG. FIG. 2 is a perspective view showing a return communication pipe, a support frame, and a foam guide cover in FIG. 1. It is the front view which showed the developing tank and the developing solution storage tank of the developing machine of this invention. It is the front view which showed the developing tank and developing solution storage tank of the conventional developing machine.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Developing tank 3 Communication pipe 5 Developer storage tank 7, 9 Delivery roller 11 Conveyor 13, 15 1st injection nozzle 17, 19 Header 21, 23 Piping 25 Pump 27 Electromagnetic valve 29 Opening part 31 Upper opening adjustment plate 33 Lower opening Adjustment plate 35 Foam overflow tank 37 Support plate 39 Overflow drain 41 Reference water surface 43 Water level sensor 45 Return communication pipe 47 First pipe 49 Second pipe 51 Support frame 53 Foam guide cover 55 Notch groove 57 Header 59 Joint 61 Piping 63 Second Spray nozzle 65 Foam K Substrate E Electrolyte S Scum

Claims (4)

  When the developer from the development reservoir layer is sprayed to the exposed substrate by a plurality of first spray nozzles in the developing tank to dissolve and remove the dry solder resist that is not UV cured from the substrate, the developing tank The scum of the dry solder resist is discharged together with the developer into the developer storage tank provided below, and the bubbles adhering to the surface of the developer stored in the developer storage tank are attached to the bubbles. A scum removing method in a developing machine, characterized in that a developer is sprayed from a plurality of second jet nozzles, removed from the developer storage tank and discharged.   A developer tank is sprayed from a plurality of first spray nozzles on the exposed substrate to dissolve and remove the dry solder resist that has not been UV cured from the substrate, and the dry solder resist together with the developer is removed. A developing solution storage tank provided below the developing tank for discharging the scum, and a developing solution on the bubbles attached to the scum floating on the surface of the developing solution stored in the developing solution storage tank And a plurality of second injection nozzles for discharging and discharging the developer from the developer storage tank, and a scum removing device in a developing machine.   3. The scum removing device in a developing device according to claim 2, wherein the plurality of second spray nozzles are provided in a foam guide cover provided downward on an upper wall of the developer storage tank. . 4. The scum removing device in the developing device according to claim 2, wherein the plurality of second ejection nozzles are operated when the developer stored in the developer storage tank overflows.

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