JP2003218502A - Circuit board manufacturing/processing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a circuit board manufacturing/processing device, which is capable of eliminating troubles caused by bubbles generated by chemicals used in a wet line of a developing unit, etc. <P>SOLUTION: A chemical tank (9) is provided in a developing unit (1) which develops and cleans a circuit board (3), and an antifoaming tank (13) which draws in bubbles (11) generated in the chemical tank (9) to eliminate them is provided. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a manufacturing processing apparatus using a chemical solution in manufacturing a printed circuit board or the like,
In particular, the present invention relates to a circuit board manufacturing / processing apparatus capable of eliminating problems caused by bubbles generated by a chemical solution used in a wet line of a developing device or the like.

[0002]

2. Description of the Related Art Generally, a production line for a printed circuit board or the like includes a wet line for a developing device or the like which uses a chemical solution such as an organic solvent or an alkaline aqueous solution.

In a conventional developing device, a developing solution (chemical solution) is sprayed on a circuit board for manufacturing to perform a developing and cleaning process like a spray chamber. However, the sprayed developing solution is sprayed in a spray chamber sprayer. The surface of the developing solution stored in the chemical bath provided in the above-mentioned developer was liable to generate bubbles.

[0004]

As described above, when bubbles continue to be generated on the surface of the developing solution, the bubbles reach the circuit board and hinder the developing and cleaning process. Therefore, a process for removing the bubbles is required, which deteriorates workability.

Therefore, in order to solve the above problem, as a first proposal, as shown in the plan view of FIG. 5, a spray portion and a chemical solution tank, which are installed in the same chamber in a conventional developing device, are provided. Spray chamber 101 and chemical tank 1
There is proposed a device which is divided into 03 and so that the sprayed developer does not directly contact the surface of the developer in the chemical bath.

However, according to the first proposal, although the sprayed developing solution does not directly contact the surface of the developing solution in the chemical solution tank, when the developing solution returns from the spray chamber 101 to the chemical solution tank 103. In addition, the surface of the developer in the chemical bath directly hits to generate bubbles.

On the other hand, as a second proposal, FIG.
As shown in the plan views and cross-sectional views of (a) and (b), the above spray is applied so that the developer does not directly contact the surface of the developer in the chemical bath 103 when returning from the spray chamber 101 to the chemical bath 103. Chemical chamber 1 from chamber 101
The return port 105 to 03 is located in the chemical solution in the chemical solution tank 103, that is, below the liquid level 107 normally managed.

However, according to the second proposal, the liquid level in the spray chamber 101 becomes the same level as the liquid level 107 normally managed by the chemical bath 103, and the sprayed developing solution is directly applied to the liquid level. There was a possibility of hitting and creating bubbles.

As a third proposal, a method has been proposed in which an antifoaming agent that suppresses foaming is added to the developer itself.

However, in the above third proposal, there is a possibility that the addition of the defoaming agent to the developer not only contaminates the printed circuit board, but also cannot sufficiently suppress the generation of bubbles. It was

The present invention has been made in view of the above problems, and an object of the present invention is to provide a manufacturing processing apparatus capable of solving a problem caused by bubbles generated by a chemical used in a wet line of a developing device or the like. To provide.

[0012]

A circuit board manufacturing / processing apparatus according to the present invention is a circuit board manufacturing / processing apparatus for manufacturing a circuit board, wherein bubbles generated by a chemical solution used in the circuit board manufacturing processing. Is provided with a defoaming means for drawing in and defoaming.

The circuit board manufacturing / processing apparatus according to the present invention has a developing device for developing and cleaning the circuit board with the chemical solution, and the defoaming means defoams bubbles generated in the developing device. Characterize.

In the circuit board manufacturing / processing apparatus according to the present invention, the developing device is provided outside the spray chamber for spraying a chemical solution onto the circuit board and for accumulating the chemical solution from the spray chamber. It is characterized in that it comprises a chemical solution tank, and the defoaming means comprises an antifoaming tank attached to the chemical solution tank so as to draw in and defoam the foam generated in the chemical solution tank.

In the circuit board manufacturing / processing apparatus according to the present invention, the defoaming tank has a hole communicating with the chemical solution tank for taking in the foam in the chemical solution tank, and the foam taken into the defoaming tank. It is characterized by having a plurality of pipes with small holes for defoaming by pouring water on it.

The circuit board manufacturing / processing apparatus according to the present invention is characterized in that the piping of the defoaming tank is connected to the drainage piping in the circuit board manufacturing / processing apparatus.

The circuit board manufacturing processing apparatus according to the present invention is characterized in that the defoaming tank has a suction means for sucking the bubbles in order to take in the bubbles in the chemical solution tank.

The circuit board manufacturing / processing apparatus according to the present invention is characterized in that the suction means is an exhaust device for exhausting the inside of the defoaming tank.

The circuit board manufacturing / processing apparatus according to the present invention is a circuit board manufacturing / processing apparatus having a developing device for developing and cleaning the circuit board, and is generated in the chemical solution tank for storing the chemical solution used for the development cleaning. It is characterized by comprising a defoaming tank for drawing in and defoaming bubbles.

According to the circuit board manufacturing / processing apparatus of the present invention, the bubbles generated by the chemical liquid used in the wet line of the developing device or the like are surely defoamed, so that the problem caused by the bubbles can be eliminated.

[0021]

BEST MODE FOR CARRYING OUT THE INVENTION A circuit board manufacturing / processing apparatus as a developing apparatus according to an embodiment of the present invention will be described in detail below with reference to FIGS.

FIG. 1 is a plan view showing the structure of a developing device according to an embodiment of the present invention, and FIG. 2 is a sectional view taken along the line AA 'of the spray chamber shown in FIG. ,
3 is a cross-sectional view taken along the line BB ′ of the chemical solution tank and the defoaming tank shown in FIG. 1, and FIG. 4 is a perspective view showing the internal structure of the defoaming tank shown in FIG. 1. .

As shown in FIGS. 1, 2, and 3, the developing device 1 of this embodiment has a circuit board 3 passing through the inside thereof.
Spray chamber 7 for developing and cleaning the circuit board 3 by spraying the developing solution 5 on it, and a chemical solution tank 9 provided outside the spray chamber 7 for storing the developing solution from the spray chamber 7. And a defoaming tank 13 connected to the side surface of the chemical solution tank 9 in order to pull in and eliminate the bubbles 11 in the chemical solution tank 9, and the spray chamber 7 and the chemical solution tank 9 are provided. Are connected via a chemical liquid return passage 15, and the chemical liquid tank 9 and the defoaming tank 13 are connected via a laterally long hole 17 which serves as a foam passage (see FIG. 4). Further, the chemical liquid tank 9 has an intake port 18 for performing intake.

Further, the chemical liquid return passage 15 and the horizontally long hole 1
7 and the intake port 18 are provided at a position higher than the liquid surface 20a of the chemical liquid 20 (normally managed liquid surface level).

The developer returned from the spray chamber 7 to the chemical bath 9 is again sent to the spray chamber 7 and sprayed.

Next, the defoaming tank 13 will be described in detail with reference to FIGS. 3 and 4.

The defoaming tank 13 is the foam 1 in the chemical solution tank 9.
In order to draw 1 in, it has a horizontally long hole 17 and an exhaust port 21 for exhausting so as to lower the air pressure in the defoaming tank 13 and breaks the foam 11a drawn inside the defoaming tank 13. In order to make the bubbles 11a disappear, the two pipes 19 having a plurality of small holes for causing the washing and draining of the bubbles 11a to the shower 23 and the drain port 25 for discharging the mixed liquid of water and bubbles generated by the shower 23 are discharged. And have.

If the shower 23 for washing and draining water from the pipe 19 is sprayed, the defoaming effect is more enhanced. That is, when a spray nozzle is attached to the hole portion of the pipe 19 to spray the washing and drainage, the spray range of the water is increased, the defoaming ability per unit time is improved, and the water particles to be sprayed on the foam are increased. The diameter is reduced, the flow rate is increased, and the bubble breaking ability is improved. The angle of the spray sprayed from the spray nozzle is 60
A full cone spray shape is desirable.

The exhaust port 21 is connected to an exhaust source (not shown) to form an exhaust device.

Further, the pipe 19 is connected to a flush drainage pipe (not shown) in the flush tank which is the latter stage.

Next, the operation of the defoaming tank 13 will be described.

First, by returning the chemical liquid to the chemical liquid tank 9 through the chemical liquid returning passage 15, the liquid surface 20 of the chemical liquid tank 9 is shown.
When the bubbles 11 directly hit a, the bubbles are exhausted from the exhaust port 21 in the defoaming tank 13 and the chemical solution tank 9 is discharged.
Since it is sucked from the suction port 18 at
The bubbles 11 therein are drawn into the defoaming tank 13 through the laterally elongated holes 17. Bubbles 1 drawn into the defoaming tank 13
The surface tension of 1a is lost by the shower 23 for washing and draining water from the pipe 19 and the bubbles are broken to form a mixed liquid of water and bubbles, which is discharged from the drain port 25.

By continuously performing the above operation, the bubbles 11 in the chemical solution tank 9 are naturally reduced, and the conventional problem that the bubbles are accumulated in the chemical solution tank 9 and the spray chamber 7 (developing solution If bubbles continue to be generated on the surface, the bubbles reach the circuit board and interfere with the developing and cleaning process).

The movement of the bubbles 11 into the oblong holes 17 in the chemical solution tank 9 is not limited to the exhaust treatment from the exhaust port 21, and the chemical solution associated with the circulation of the liquid by the circulation pump in the chemical solution tank 9 is also moved. You may use together the forced movement by flow or an air blow.

Further, in the above embodiment, the defoaming tank is provided in the chemical solution tank of the developing device so that the foam in the chemical solution tank is defoamed. However, it can be applied to any object as long as the foam is generated. It goes without saying that you can do it.

[0036]

According to the circuit board manufacturing / processing apparatus of the present invention, since the chemical solution tank is provided with the defoaming tank for surely drawing in and defoaming the bubbles in the chemical solution tank, a problem caused by the foam generated by the chemical solution is provided. Can be reliably solved.

Further, according to the circuit board manufacturing / processing apparatus of the present invention, even if bubbles are generated in the chemical bath, the defoaming process is performed naturally, so that the operator is not bothered to remove the bubbles. .

Further, according to the circuit board manufacturing / processing apparatus of the present invention, it is sufficient to attach the defoaming tank to the conventional apparatus and connect the shower pipe, so that it can be achieved by a simple installation work.

Further, according to the circuit board manufacturing / processing apparatus of the present invention, since the water used for the shower in the defoaming tank is the water from the flush water overflow in the same equipment, it can be operated at a low running cost. be able to.

Furthermore, according to the circuit board manufacturing / processing apparatus of the present invention, there is no need to add an antifoaming agent, so there is no concern of contaminating the printed circuit board.

[Brief description of drawings]

FIG. 1 is a plan view showing a configuration of a developing device according to an embodiment of the present invention.

2 is a cross-sectional view of the spray chamber shown in FIG. 1, taken along the line AA ′.

FIG. 3 is a cross-sectional view taken along the line BB ′ of the chemical liquid tank and the defoaming tank shown in FIG.

FIG. 4 is a perspective view showing an internal configuration of the defoaming tank shown in FIG.

FIG. 5 is a plan view showing a configuration of a conventional developing device.

FIG. 6 is a plan view and a cross-sectional view showing the configuration of another example of a conventional developing device.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Developing device, 3 ... Circuit board, 5 ... Developer, 7, 101
... Spray chamber, 9, 103 ... Chemical liquid tank, 11 ...
Bubble, 13 ... Defoaming tank, 15, 105 ... Chemical liquid return passage, 17
... Horizontal holes, 18 ... Intake port, 20 ... Chemical solution, 21 ... Exhaust port, 23 ... Shower, 25 ... Drainage

Continued front page    (72) Inventor Hideo Tsubaki             227 Matsuhidai, Matsudo City, Chiba Prefecture Cameri Co., Ltd.             A F-term (reference) 2H096 AA26 GA02 GA21                 5E343 EE02 EE15 EE20 ER18 FF23                       FF30 GG11                 5F046 LA06 LA07

Claims (8)

[Claims] 1. A circuit board manufacturing processing apparatus for manufacturing a circuit board, comprising defoaming means for drawing in and defoaming bubbles generated by a chemical used in the circuit board manufacturing process. A circuit board manufacturing and processing apparatus characterized by the above. 2. The circuit board manufacturing and processing apparatus includes a developing device for developing and cleaning the circuit board with the chemical solution.
The circuit board manufacturing / processing apparatus according to claim 1, wherein the defoaming unit defoams bubbles generated in the developing device. 3. The developing device comprises a spray chamber for spraying a chemical solution onto the circuit board, and a chemical solution tank provided outside the spray chamber for accumulating the chemical solution from the spray chamber. But,
The circuit board manufacturing / processing apparatus according to claim 2, wherein the circuit board manufacturing / processing apparatus comprises a defoaming tank attached to the chemical solution tank so as to draw in and defoam bubbles generated in the chemical solution tank. 4. The defoaming tank has a hole communicating with the chemical solution tank for taking in the foam in the chemical solution tank, and the foam taken in the defoaming tank is defoamed by applying water thereto. 4. The circuit board manufacturing / processing apparatus according to claim 3, further comprising: a plurality of pipes having small holes. 5. The circuit board manufacturing / processing apparatus according to claim 4, wherein the defoaming tank piping is connected to drainage piping in the circuit board manufacturing / processing apparatus. 6. The circuit board manufacturing / processing apparatus according to claim 3, wherein the defoaming tank has a suction means for sucking the bubbles in order to take in the bubbles in the chemical liquid tank. 7. The circuit board manufacturing / processing apparatus according to claim 6, wherein the suction means is an exhaust device for exhausting the inside of the defoaming tank. 8. A circuit board manufacturing / processing apparatus having a developing device for developing and cleaning a circuit board, for drawing bubbles generated in a chemical liquid tank for storing the chemical liquid used for the development cleaning to eliminate the bubbles. A circuit board manufacturing / processing apparatus comprising a defoaming tank.