TWI402008B - 電容／電阻裝置，併有該裝置之有機介電層壓物及印刷線路板，及其製造方法 - Google Patents

電容／電阻裝置，併有該裝置之有機介電層壓物及印刷線路板，及其製造方法 Download PDF

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Publication number
TWI402008B
TWI402008B TW094134606A TW94134606A TWI402008B TW I402008 B TWI402008 B TW I402008B TW 094134606 A TW094134606 A TW 094134606A TW 94134606 A TW94134606 A TW 94134606A TW I402008 B TWI402008 B TW I402008B
Authority
TW
Taiwan
Prior art keywords
capacitor
metal foil
capacitor electrode
layer
resistor
Prior art date
Application number
TW094134606A
Other languages
English (en)
Chinese (zh)
Other versions
TW200635454A (en
Inventor
伯藍得 威廉Ｊ
席尼 寇克斯 Ｇ
羅斯 麥可葛瑞格 大衛
Original Assignee
Ｃｄａ管理有限責任公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ｃｄａ管理有限責任公司 filed Critical Ｃｄａ管理有限責任公司
Publication of TW200635454A publication Critical patent/TW200635454A/zh
Application granted granted Critical
Publication of TWI402008B publication Critical patent/TWI402008B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672—Superposed layout, i.e. in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09763—Printed component having superposed conductors, but integrated in one circuit layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y10T29/435—Solid dielectric type

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
TW094134606A 2004-10-18 2005-10-04 電容／電阻裝置，併有該裝置之有機介電層壓物及印刷線路板，及其製造方法 TWI402008B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/967,541 US7430128B2 (en) 2004-10-18 2004-10-18 Capacitive/resistive devices, organic dielectric laminates and printed wiring boards incorporating such devices, and methods of making thereof

Publications (2)

Publication Number Publication Date
TW200635454A TW200635454A (en) 2006-10-01
TWI402008B true TWI402008B (zh) 2013-07-11

Family

ID=35677559

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094134606A TWI402008B (zh) 2004-10-18 2005-10-04 電容／電阻裝置，併有該裝置之有機介電層壓物及印刷線路板，及其製造方法

Country Status (7)

Country Link
US (2) US7430128B2 (enExample)
EP (1) EP1651017B1 (enExample)
JP (1) JP2006121086A (enExample)
KR (1) KR100677787B1 (enExample)
CN (1) CN1783379A (enExample)
DE (1) DE602005001826T2 (enExample)
TW (1) TWI402008B (enExample)

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US7345889B1 (en) * 2004-09-28 2008-03-18 Avaya Technology Corp. Method and system for reducing radiated energy emissions in computational devices
US7596842B2 (en) 2005-02-22 2009-10-06 Oak-Mitsui Inc. Method of making multilayered construction for use in resistors and capacitors
JP2015233084A (ja) * 2014-06-10 2015-12-24 株式会社日立製作所 チップモジュールおよび情報処理機器
CN105047411A (zh) * 2015-08-12 2015-11-11 深圳市槟城电子有限公司 一种电阻和电容串连的组件及其制作方法
CN105047642B (zh) * 2015-08-12 2024-01-19 深圳市槟城电子股份有限公司 一种端口防护电路集成封装件
WO2017154167A1 (ja) * 2016-03-10 2017-09-14 三井金属鉱業株式会社 多層積層板及びこれを用いた多層プリント配線板の製造方法
TWI694752B (zh) * 2018-10-26 2020-05-21 鼎展電子股份有限公司 內嵌式被動元件結構
EP3761492B1 (en) * 2019-07-05 2023-01-04 Infineon Technologies AG Snubber circuit and power semiconductor module with snubber circuit
CN114695131A (zh) * 2022-03-24 2022-07-01 广东佛智芯微电子技术研究有限公司 一种扇出型封装基板结构及其制备方法
CN120051843A (zh) * 2022-10-21 2025-05-27 京瓷Avx元器件公司 单层电容器
US20240381537A1 (en) * 2023-05-10 2024-11-14 KYOCERA AVX Components Corporation Plateable Single Layer Capacitor

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US20020179329A1 (en) * 2001-06-05 2002-12-05 Dai Nippon Printing Co., Ltd. Method for fabricating wiring board provided wiht passive element, and wiring board provided with passive element
US20040128822A1 (en) * 2003-01-03 2004-07-08 I-Chung Tung Method for making a multilayer circuit board having embedded passive components

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Publication number Priority date Publication date Assignee Title
US5354695A (en) * 1992-04-08 1994-10-11 Leedy Glenn J Membrane dielectric isolation IC fabrication
US20020179329A1 (en) * 2001-06-05 2002-12-05 Dai Nippon Printing Co., Ltd. Method for fabricating wiring board provided wiht passive element, and wiring board provided with passive element
US20040128822A1 (en) * 2003-01-03 2004-07-08 I-Chung Tung Method for making a multilayer circuit board having embedded passive components

Also Published As

Publication number Publication date
EP1651017A2 (en) 2006-04-26
JP2006121086A (ja) 2006-05-11
CN1783379A (zh) 2006-06-07
DE602005001826T2 (de) 2008-04-24
TW200635454A (en) 2006-10-01
US20080297274A1 (en) 2008-12-04
EP1651017B1 (en) 2007-08-01
US7430128B2 (en) 2008-09-30
KR100677787B1 (ko) 2007-02-02
US7813141B2 (en) 2010-10-12
EP1651017A3 (en) 2006-05-03
US20060082980A1 (en) 2006-04-20
DE602005001826D1 (de) 2007-09-13
KR20060054031A (ko) 2006-05-22

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MM4A Annulment or lapse of patent due to non-payment of fees