KR100677787B1 - 용량성/저항성 디바이스, 이러한 디바이스를 통합하는 유기유전체 적층물 및 인쇄 배선 기판, 그리고 그 제작 방법 - Google Patents

용량성/저항성 디바이스, 이러한 디바이스를 통합하는 유기유전체 적층물 및 인쇄 배선 기판, 그리고 그 제작 방법 Download PDF

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KR100677787B1
KR100677787B1 KR1020050097350A KR20050097350A KR100677787B1 KR 100677787 B1 KR100677787 B1 KR 100677787B1 KR 1020050097350 A KR1020050097350 A KR 1020050097350A KR 20050097350 A KR20050097350 A KR 20050097350A KR 100677787 B1 KR100677787 B1 KR 100677787B1
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South Korea
Prior art keywords
dielectric
electrode
capacitive
resistive
thin film
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Expired - Fee Related
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KR1020050097350A
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English (en)
Korean (ko)
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KR20060054031A (ko
Inventor
윌리암 제이. 보랜드
지. 시드니 코스
데이비드 로스 맥그레고리
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이 아이 듀폰 디 네모아 앤드 캄파니
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Publication of KR20060054031A publication Critical patent/KR20060054031A/ko
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672—Superposed layout, i.e. in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09763—Printed component having superposed conductors, but integrated in one circuit layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y10T29/435—Solid dielectric type

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
KR1020050097350A 2004-10-18 2005-10-17 용량성/저항성 디바이스, 이러한 디바이스를 통합하는 유기유전체 적층물 및 인쇄 배선 기판, 그리고 그 제작 방법 Expired - Fee Related KR100677787B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/967,541 2004-10-18
US10/967,541 US7430128B2 (en) 2004-10-18 2004-10-18 Capacitive/resistive devices, organic dielectric laminates and printed wiring boards incorporating such devices, and methods of making thereof

Publications (2)

Publication Number Publication Date
KR20060054031A KR20060054031A (ko) 2006-05-22
KR100677787B1 true KR100677787B1 (ko) 2007-02-02

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050097350A Expired - Fee Related KR100677787B1 (ko) 2004-10-18 2005-10-17 용량성/저항성 디바이스, 이러한 디바이스를 통합하는 유기유전체 적층물 및 인쇄 배선 기판, 그리고 그 제작 방법

Country Status (7)

Country Link
US (2) US7430128B2 (enExample)
EP (1) EP1651017B1 (enExample)
JP (1) JP2006121086A (enExample)
KR (1) KR100677787B1 (enExample)
CN (1) CN1783379A (enExample)
DE (1) DE602005001826T2 (enExample)
TW (1) TWI402008B (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7345889B1 (en) * 2004-09-28 2008-03-18 Avaya Technology Corp. Method and system for reducing radiated energy emissions in computational devices
US7596842B2 (en) 2005-02-22 2009-10-06 Oak-Mitsui Inc. Method of making multilayered construction for use in resistors and capacitors
JP2015233084A (ja) * 2014-06-10 2015-12-24 株式会社日立製作所 チップモジュールおよび情報処理機器
CN105047642B (zh) * 2015-08-12 2024-01-19 深圳市槟城电子股份有限公司 一种端口防护电路集成封装件
CN105047411A (zh) * 2015-08-12 2015-11-11 深圳市槟城电子有限公司 一种电阻和电容串连的组件及其制作方法
WO2017154167A1 (ja) * 2016-03-10 2017-09-14 三井金属鉱業株式会社 多層積層板及びこれを用いた多層プリント配線板の製造方法
TWI694752B (zh) * 2018-10-26 2020-05-21 鼎展電子股份有限公司 內嵌式被動元件結構
EP3761492B1 (en) * 2019-07-05 2023-01-04 Infineon Technologies AG Snubber circuit and power semiconductor module with snubber circuit
CN114695131A (zh) * 2022-03-24 2022-07-01 广东佛智芯微电子技术研究有限公司 一种扇出型封装基板结构及其制备方法
DE112023004410T5 (de) * 2022-10-21 2025-08-14 KYOCERA AVX Components Corporation Einzelschichtkondensator

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010024642A (ko) * 1998-10-13 2001-03-26 이마이 기요스케 용량성 인쇄회로기판용 박막-적층형 패널 및 그 제조 방법
KR20040002664A (ko) * 2002-06-26 2004-01-07 가부시키가이샤 도판 엔이씨 서키트 솔루션즈 인쇄 배선판 및 그 제조방법 및 반도체 장치

Family Cites Families (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3934119A (en) * 1974-09-17 1976-01-20 Texas Instruments Incorporated Electrical resistance heaters
US4377652A (en) * 1978-02-17 1983-03-22 Asahi Kasei Kogyo Kabushiki Kaisha Polyamide-imide compositions and articles for electrical use prepared therefrom
US4410867A (en) * 1978-12-28 1983-10-18 Western Electric Company, Inc. Alpha tantalum thin film circuit device
DE2903025C2 (de) * 1979-01-26 1983-05-05 Siemens AG, 1000 Berlin und 8000 München RC-Netzwerk
US4407883A (en) * 1982-03-03 1983-10-04 Uop Inc. Laminates for printed circuit boards
JPS58190091A (ja) * 1982-04-30 1983-11-05 宇部興産株式会社 フレキシブル配線基板の製造方法
JPS59144162A (ja) 1983-02-08 1984-08-18 Nec Corp 薄膜回路の製造方法
JPS60113993A (ja) * 1983-11-25 1985-06-20 三菱電機株式会社 多層回路基板の製造方法
US5354695A (en) * 1992-04-08 1994-10-11 Leedy Glenn J Membrane dielectric isolation IC fabrication
US5093036A (en) * 1988-09-20 1992-03-03 Raychem Corporation Conductive polymer composition
JP2764745B2 (ja) 1989-07-21 1998-06-11 オムロン株式会社 混成回路基板およびその製造方法
JP2802173B2 (ja) * 1990-02-06 1998-09-24 松下電工株式会社 複合誘電体
JPH04211191A (ja) * 1990-02-09 1992-08-03 Hitachi Ltd 実装構造体
JP3019541B2 (ja) 1990-11-22 2000-03-13 株式会社村田製作所 コンデンサ内蔵型配線基板およびその製造方法
JPH0565456A (ja) * 1991-09-09 1993-03-19 Sumitomo Bakelite Co Ltd 気密封止用樹脂ペースト
DE69305942T2 (de) * 1992-09-15 1997-03-13 Du Pont Zusammensetzung für einen Polymer-Dickschichtwiderstand
US6111005A (en) * 1993-07-30 2000-08-29 Diemat, Inc. Polymeric adhesive paste
US6140402A (en) * 1993-07-30 2000-10-31 Diemat, Inc. Polymeric adhesive paste
JPH07161578A (ja) * 1993-12-06 1995-06-23 Rubikon Denshi Kk フィルムコンデンサの製造方法
JPH07226334A (ja) * 1994-02-09 1995-08-22 Matsushita Electric Ind Co Ltd 薄膜コンデンサ及びその製造方法
JP3117175B2 (ja) 1994-02-09 2000-12-11 アルプス電気株式会社 抵抗体
TW301843B (en) * 1994-11-15 1997-04-01 Ibm Electrically conductive paste and composite and their use as an electrically conductive connector
JP3684239B2 (ja) * 1995-01-10 2005-08-17 株式会社 日立製作所 低ｅｍｉ電子機器
TW367621B (en) * 1995-02-27 1999-08-21 Nxp Bv Electronic component comprising a thin-film structure with passive elements
US5874770A (en) * 1996-10-10 1999-02-23 General Electric Company Flexible interconnect film including resistor and capacitor layers
US5993698A (en) 1997-11-06 1999-11-30 Acheson Industries, Inc. Electrical device containing positive temperature coefficient resistor composition and method of manufacturing the device
JP2000269079A (ja) * 1999-03-19 2000-09-29 Dainippon Printing Co Ltd 共振回路及びその製造方法
US6030553A (en) * 1999-04-01 2000-02-29 Industrial Technology Research Institute Polymer thick film resistor pastes
US6285542B1 (en) * 1999-04-16 2001-09-04 Avx Corporation Ultra-small resistor-capacitor thin film network for inverted mounting to a surface
US6356455B1 (en) * 1999-09-23 2002-03-12 Morton International, Inc. Thin integral resistor/capacitor/inductor package, method of manufacture
JP2001310911A (ja) * 2000-04-28 2001-11-06 Sumitomo Seika Chem Co Ltd 誘電体形成物質及び誘電体フィルム
US6278356B1 (en) * 2000-05-17 2001-08-21 Compeq Manufacturing Company Limited Flat, built-in resistors and capacitors for a printed circuit board
JP4224190B2 (ja) * 2000-06-20 2009-02-12 パナソニック電工株式会社 プリント配線板の製造方法及びプリント配線板
US6541137B1 (en) * 2000-07-31 2003-04-01 Motorola, Inc. Multi-layer conductor-dielectric oxide structure
JP2002252297A (ja) * 2001-02-23 2002-09-06 Hitachi Ltd 多層回路基板を用いた電子回路装置
EP1265466A3 (en) * 2001-06-05 2004-07-21 Dai Nippon Printing Co., Ltd. Method for fabrication wiring board provided with passive element and wiring board provided with passive element
JP2003142590A (ja) * 2001-11-06 2003-05-16 Matsushita Electric Ind Co Ltd 容量素子
US6600645B1 (en) * 2002-09-27 2003-07-29 Ut-Battelle, Llc Dielectric composite materials and method for preparing
JP2004214586A (ja) * 2002-11-14 2004-07-29 Kyocera Corp 多層配線基板
JP2004193411A (ja) * 2002-12-12 2004-07-08 Fujikura Ltd 高誘電率電気・電子部品の製造方法と部品
US6910264B2 (en) * 2003-01-03 2005-06-28 Phoenix Precision Technology Corp. Method for making a multilayer circuit board having embedded passive components
JP2004214573A (ja) 2003-01-09 2004-07-29 Murata Mfg Co Ltd セラミック多層基板の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010024642A (ko) * 1998-10-13 2001-03-26 이마이 기요스케 용량성 인쇄회로기판용 박막-적층형 패널 및 그 제조 방법
KR20040002664A (ko) * 2002-06-26 2004-01-07 가부시키가이샤 도판 엔이씨 서키트 솔루션즈 인쇄 배선판 및 그 제조방법 및 반도체 장치

Also Published As

Publication number Publication date
TWI402008B (zh) 2013-07-11
DE602005001826T2 (de) 2008-04-24
US7813141B2 (en) 2010-10-12
EP1651017A2 (en) 2006-04-26
KR20060054031A (ko) 2006-05-22
US20080297274A1 (en) 2008-12-04
DE602005001826D1 (de) 2007-09-13
US20060082980A1 (en) 2006-04-20
EP1651017B1 (en) 2007-08-01
JP2006121086A (ja) 2006-05-11
EP1651017A3 (en) 2006-05-03
TW200635454A (en) 2006-10-01
US7430128B2 (en) 2008-09-30
CN1783379A (zh) 2006-06-07

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