KR100677787B1 - 용량성/저항성 디바이스, 이러한 디바이스를 통합하는 유기유전체 적층물 및 인쇄 배선 기판, 그리고 그 제작 방법 - Google Patents

용량성/저항성 디바이스, 이러한 디바이스를 통합하는 유기유전체 적층물 및 인쇄 배선 기판, 그리고 그 제작 방법 Download PDF

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Publication number
KR100677787B1
KR100677787B1 KR1020050097350A KR20050097350A KR100677787B1 KR 100677787 B1 KR100677787 B1 KR 100677787B1 KR 1020050097350 A KR1020050097350 A KR 1020050097350A KR 20050097350 A KR20050097350 A KR 20050097350A KR 100677787 B1 KR100677787 B1 KR 100677787B1
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South Korea
Prior art keywords
dielectric
electrode
capacitive
resistive
thin film
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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KR1020050097350A
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English (en)
Korean (ko)
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KR20060054031A (ko
Inventor
윌리암 제이. 보랜드
지. 시드니 코스
데이비드 로스 맥그레고리
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이 아이 듀폰 디 네모아 앤드 캄파니
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Publication of KR20060054031A publication Critical patent/KR20060054031A/ko
Application granted granted Critical
Publication of KR100677787B1 publication Critical patent/KR100677787B1/ko
Assigned to 씨디에이 프로세싱 리미티드 라이어빌리티 컴퍼니 reassignment 씨디에이 프로세싱 리미티드 라이어빌리티 컴퍼니 권리의 전부이전등록 Assignors: 이 아이 듀폰 디 네모아 앤드 캄파니
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Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672—Superposed layout, i.e. in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09763—Printed component having superposed conductors, but integrated in one circuit layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0361—Stripping a part of an upper metal layer to expose a lower metal layer, e.g. by etching or using a laser
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/43—Electric condenser making
    • Y10T29/435—Solid dielectric type

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
KR1020050097350A 2004-10-18 2005-10-17 용량성/저항성 디바이스, 이러한 디바이스를 통합하는 유기유전체 적층물 및 인쇄 배선 기판, 그리고 그 제작 방법 Expired - Fee Related KR100677787B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/967,541 2004-10-18
US10/967,541 US7430128B2 (en) 2004-10-18 2004-10-18 Capacitive/resistive devices, organic dielectric laminates and printed wiring boards incorporating such devices, and methods of making thereof

Publications (2)

Publication Number Publication Date
KR20060054031A KR20060054031A (ko) 2006-05-22
KR100677787B1 true KR100677787B1 (ko) 2007-02-02

Family

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KR1020050097350A Expired - Fee Related KR100677787B1 (ko) 2004-10-18 2005-10-17 용량성/저항성 디바이스, 이러한 디바이스를 통합하는 유기유전체 적층물 및 인쇄 배선 기판, 그리고 그 제작 방법

Country Status (7)

Country Link
US (2) US7430128B2 (enExample)
EP (1) EP1651017B1 (enExample)
JP (1) JP2006121086A (enExample)
KR (1) KR100677787B1 (enExample)
CN (1) CN1783379A (enExample)
DE (1) DE602005001826T2 (enExample)
TW (1) TWI402008B (enExample)

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US7345889B1 (en) * 2004-09-28 2008-03-18 Avaya Technology Corp. Method and system for reducing radiated energy emissions in computational devices
US7596842B2 (en) 2005-02-22 2009-10-06 Oak-Mitsui Inc. Method of making multilayered construction for use in resistors and capacitors
JP2015233084A (ja) * 2014-06-10 2015-12-24 株式会社日立製作所 チップモジュールおよび情報処理機器
CN105047411A (zh) * 2015-08-12 2015-11-11 深圳市槟城电子有限公司 一种电阻和电容串连的组件及其制作方法
CN105047642B (zh) * 2015-08-12 2024-01-19 深圳市槟城电子股份有限公司 一种端口防护电路集成封装件
WO2017154167A1 (ja) * 2016-03-10 2017-09-14 三井金属鉱業株式会社 多層積層板及びこれを用いた多層プリント配線板の製造方法
TWI694752B (zh) * 2018-10-26 2020-05-21 鼎展電子股份有限公司 內嵌式被動元件結構
EP3761492B1 (en) * 2019-07-05 2023-01-04 Infineon Technologies AG Snubber circuit and power semiconductor module with snubber circuit
CN114695131A (zh) * 2022-03-24 2022-07-01 广东佛智芯微电子技术研究有限公司 一种扇出型封装基板结构及其制备方法
CN120051843A (zh) * 2022-10-21 2025-05-27 京瓷Avx元器件公司 单层电容器
US20240381537A1 (en) * 2023-05-10 2024-11-14 KYOCERA AVX Components Corporation Plateable Single Layer Capacitor

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KR20040002664A (ko) * 2002-06-26 2004-01-07 가부시키가이샤 도판 엔이씨 서키트 솔루션즈 인쇄 배선판 및 그 제조방법 및 반도체 장치

Also Published As

Publication number Publication date
EP1651017A2 (en) 2006-04-26
JP2006121086A (ja) 2006-05-11
CN1783379A (zh) 2006-06-07
DE602005001826T2 (de) 2008-04-24
TW200635454A (en) 2006-10-01
US20080297274A1 (en) 2008-12-04
TWI402008B (zh) 2013-07-11
EP1651017B1 (en) 2007-08-01
US7430128B2 (en) 2008-09-30
US7813141B2 (en) 2010-10-12
EP1651017A3 (en) 2006-05-03
US20060082980A1 (en) 2006-04-20
DE602005001826D1 (de) 2007-09-13
KR20060054031A (ko) 2006-05-22

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