TWI385489B - A workpiece table and an exposure apparatus using the work table - Google Patents

A workpiece table and an exposure apparatus using the work table Download PDF

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Publication number
TWI385489B
TWI385489B TW098141001A TW98141001A TWI385489B TW I385489 B TWI385489 B TW I385489B TW 098141001 A TW098141001 A TW 098141001A TW 98141001 A TW98141001 A TW 98141001A TW I385489 B TWI385489 B TW I385489B
Authority
TW
Taiwan
Prior art keywords
workpiece
vacuum
vacuum adsorption
adsorption hole
stage
Prior art date
Application number
TW098141001A
Other languages
English (en)
Chinese (zh)
Other versions
TW201030476A (en
Inventor
Takeshi Nakatani
Original Assignee
Ushio Electric Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ushio Electric Inc filed Critical Ushio Electric Inc
Publication of TW201030476A publication Critical patent/TW201030476A/zh
Application granted granted Critical
Publication of TWI385489B publication Critical patent/TWI385489B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G03F7/70725—Stages control
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70841—Constructional issues related to vacuum environment, e.g. load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW098141001A 2009-02-02 2009-12-01 A workpiece table and an exposure apparatus using the work table TWI385489B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009021150A JP5126091B2 (ja) 2009-02-02 2009-02-02 ワークステージ及び該ワークステージを使用した露光装置

Publications (2)

Publication Number Publication Date
TW201030476A TW201030476A (en) 2010-08-16
TWI385489B true TWI385489B (zh) 2013-02-11

Family

ID=42587313

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098141001A TWI385489B (zh) 2009-02-02 2009-12-01 A workpiece table and an exposure apparatus using the work table

Country Status (4)

Country Link
JP (1) JP5126091B2 (ja)
KR (1) KR101203356B1 (ja)
CN (1) CN101794726B (ja)
TW (1) TWI385489B (ja)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5810517B2 (ja) * 2010-12-02 2015-11-11 富士電機株式会社 吸着装置および吸着方法
JP2012251763A (ja) * 2011-05-12 2012-12-20 Sharp Corp 電極乾燥装置、及び電極乾燥方法
TWI505400B (zh) * 2011-08-26 2015-10-21 Lg Siltron Inc 基座
CN103219259B (zh) * 2012-01-19 2017-09-12 昆山思拓机器有限公司 一种晶圆加工治具
KR101334085B1 (ko) * 2012-05-11 2013-12-02 쿠어스텍아시아 유한회사 웨이퍼 지지 유닛
JP2015220286A (ja) * 2014-05-15 2015-12-07 住友電気工業株式会社 半導体素子のオン抵抗測定方法および半導体素子のオン抵抗測定装置
JP6727069B2 (ja) * 2016-08-09 2020-07-22 東京エレクトロン株式会社 接合装置および接合システム
CN106154769A (zh) * 2016-08-25 2016-11-23 中国电子科技集团公司第十研究所 薄膜电路带孔瓷片光刻真空夹具
JP6949521B2 (ja) * 2017-03-26 2021-10-13 株式会社アドテックエンジニアリング 露光装置、露光装置の動作方法及び基板貼り付き防止フィルム
CN108735586B (zh) * 2017-06-30 2021-05-28 上海微电子装备（集团）股份有限公司 一种抽真空装置及抽真空方法
JP6952515B2 (ja) * 2017-06-30 2021-10-20 Ｔｏｗａ株式会社 ワーク搬送装置、電子部品の製造装置、ワーク搬送方法、および、電子部品の製造方法
KR102339079B1 (ko) * 2017-09-28 2021-12-14 가부시키가이샤 신가와 흡착 스테이지
JP6986317B2 (ja) * 2017-12-05 2021-12-22 株式会社アドテックエンジニアリング マスクユニット及び露光装置
CN108364904A (zh) * 2018-02-11 2018-08-03 武汉华星光电半导体显示技术有限公司 真空分立式吸附平台
CN110320758B (zh) * 2018-03-30 2021-06-29 上海微电子装备（集团）股份有限公司 一种基底边缘保护装置、光刻设备及保护方法
KR102204884B1 (ko) * 2018-09-27 2021-01-19 세메스 주식회사 기판 반송 로봇 및 기판 처리 설비
CN109856827A (zh) * 2019-03-26 2019-06-07 深圳市华星光电技术有限公司 吸附式载台
JP2021019082A (ja) * 2019-07-19 2021-02-15 株式会社ジャパンディスプレイ 転写用基板
CN110703473B (zh) * 2019-10-29 2022-05-31 武汉华星光电技术有限公司 一种真空吸附底座及显示面板绑定用设备
CN111653210A (zh) * 2020-04-27 2020-09-11 深圳市创显光电有限公司 一种cob集成板的制备方法及其获得的灯板、显示模组
JP6861872B2 (ja) * 2020-05-01 2021-04-21 東京エレクトロン株式会社 接合装置および接合システム
CN112255897A (zh) * 2020-11-26 2021-01-22 江苏上达电子有限公司 一种cof曝光机专用精密多功能工件台
CN112847015B (zh) * 2021-01-11 2022-07-19 中国科学院西安光学精密机械研究所 多机器人协同加工光学元件的装置及方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07302832A (ja) * 1994-03-09 1995-11-14 Nippon Telegr & Teleph Corp <Ntt> 真空吸着装置、真空吸着装置用シール具および真空吸着方法
JPH11240795A (ja) * 1998-02-27 1999-09-07 Super Silicon Kenkyusho:Kk エピタキシャル成長装置
JP2004119573A (ja) * 2002-09-25 2004-04-15 Renesas Technology Corp 半導体装置の製造方法およびフィルム貼付装置
JP2004221323A (ja) * 2003-01-15 2004-08-05 Nikon Corp 基板保持装置、露光装置、及びデバイス製造方法
JP2005191338A (ja) * 2003-12-26 2005-07-14 Matsushita Electric Ind Co Ltd 基板の保持装置および方法
JP2006310697A (ja) * 2005-05-02 2006-11-09 Dainippon Screen Mfg Co Ltd 吸着チャック
JP2007158190A (ja) * 2005-12-07 2007-06-21 Nikon Corp 吸着装置、研磨装置、半導体デバイス製造方法およびこの方法により製造される半導体デバイス

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63139632A (ja) * 1986-11-28 1988-06-11 Hitachi Ltd 真空吸着装置
JPH10128633A (ja) * 1996-10-28 1998-05-19 Nippon Telegr & Teleph Corp <Ntt> 真空吸着装置
KR100292612B1 (ko) * 1997-12-08 2001-08-07 윤종용 반도체 웨이퍼 정렬시스템 및 이를 이용하는 웨이퍼 정렬방법
CN100469948C (zh) * 2000-10-03 2009-03-18 应用材料有限公司 一旦进入金属沉积用来倾斜基片的方法和相关设备
JP2002134597A (ja) * 2000-10-27 2002-05-10 Ushio Inc ステージ装置
TWI236944B (en) * 2001-12-17 2005-08-01 Tokyo Electron Ltd Film removal method and apparatus, and substrate processing system
JP3769618B2 (ja) * 2003-04-21 2006-04-26 防衛庁技術研究本部長 真空吸着装置
JP4459023B2 (ja) * 2004-11-08 2010-04-28 パナソニック株式会社 基板保持装置
KR101059914B1 (ko) * 2006-01-10 2011-08-29 한미반도체 주식회사 반도체 제조공정용 테이블
CN100544889C (zh) * 2006-09-06 2009-09-30 财团法人工业技术研究院 负压真空吸附装置及使用该装置的磨边装置
JP2008066607A (ja) * 2006-09-11 2008-03-21 Tokyo Ohka Kogyo Co Ltd 真空吸着装置

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07302832A (ja) * 1994-03-09 1995-11-14 Nippon Telegr & Teleph Corp <Ntt> 真空吸着装置、真空吸着装置用シール具および真空吸着方法
JPH11240795A (ja) * 1998-02-27 1999-09-07 Super Silicon Kenkyusho:Kk エピタキシャル成長装置
JP2004119573A (ja) * 2002-09-25 2004-04-15 Renesas Technology Corp 半導体装置の製造方法およびフィルム貼付装置
JP2004221323A (ja) * 2003-01-15 2004-08-05 Nikon Corp 基板保持装置、露光装置、及びデバイス製造方法
JP2005191338A (ja) * 2003-12-26 2005-07-14 Matsushita Electric Ind Co Ltd 基板の保持装置および方法
JP2006310697A (ja) * 2005-05-02 2006-11-09 Dainippon Screen Mfg Co Ltd 吸着チャック
JP2007158190A (ja) * 2005-12-07 2007-06-21 Nikon Corp 吸着装置、研磨装置、半導体デバイス製造方法およびこの方法により製造される半導体デバイス

Also Published As

Publication number Publication date
KR101203356B1 (ko) 2012-11-20
TW201030476A (en) 2010-08-16
JP2010177607A (ja) 2010-08-12
JP5126091B2 (ja) 2013-01-23
CN101794726B (zh) 2013-07-03
KR20100089016A (ko) 2010-08-11
CN101794726A (zh) 2010-08-04

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