TWI385489B - A workpiece table and an exposure apparatus using the work table - Google Patents
A workpiece table and an exposure apparatus using the work table Download PDFInfo
- Publication number
- TWI385489B TWI385489B TW098141001A TW98141001A TWI385489B TW I385489 B TWI385489 B TW I385489B TW 098141001 A TW098141001 A TW 098141001A TW 98141001 A TW98141001 A TW 98141001A TW I385489 B TWI385489 B TW I385489B
- Authority
- TW
- Taiwan
- Prior art keywords
- workpiece
- vacuum
- vacuum adsorption
- adsorption hole
- stage
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
- G03F7/70725—Stages control
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70841—Constructional issues related to vacuum environment, e.g. load-lock chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Health & Medical Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009021150A JP5126091B2 (ja) | 2009-02-02 | 2009-02-02 | ワークステージ及び該ワークステージを使用した露光装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201030476A TW201030476A (en) | 2010-08-16 |
TWI385489B true TWI385489B (zh) | 2013-02-11 |
Family
ID=42587313
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW098141001A TWI385489B (zh) | 2009-02-02 | 2009-12-01 | A workpiece table and an exposure apparatus using the work table |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5126091B2 (ja) |
KR (1) | KR101203356B1 (ja) |
CN (1) | CN101794726B (ja) |
TW (1) | TWI385489B (ja) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5810517B2 (ja) * | 2010-12-02 | 2015-11-11 | 富士電機株式会社 | 吸着装置および吸着方法 |
JP2012251763A (ja) * | 2011-05-12 | 2012-12-20 | Sharp Corp | 電極乾燥装置、及び電極乾燥方法 |
TWI505400B (zh) * | 2011-08-26 | 2015-10-21 | Lg Siltron Inc | 基座 |
CN103219259B (zh) * | 2012-01-19 | 2017-09-12 | 昆山思拓机器有限公司 | 一种晶圆加工治具 |
KR101334085B1 (ko) * | 2012-05-11 | 2013-12-02 | 쿠어스텍아시아 유한회사 | 웨이퍼 지지 유닛 |
JP2015220286A (ja) * | 2014-05-15 | 2015-12-07 | 住友電気工業株式会社 | 半導体素子のオン抵抗測定方法および半導体素子のオン抵抗測定装置 |
JP6727069B2 (ja) * | 2016-08-09 | 2020-07-22 | 東京エレクトロン株式会社 | 接合装置および接合システム |
CN106154769A (zh) * | 2016-08-25 | 2016-11-23 | 中国电子科技集团公司第十研究所 | 薄膜电路带孔瓷片光刻真空夹具 |
JP6949521B2 (ja) * | 2017-03-26 | 2021-10-13 | 株式会社アドテックエンジニアリング | 露光装置、露光装置の動作方法及び基板貼り付き防止フィルム |
CN108735586B (zh) * | 2017-06-30 | 2021-05-28 | 上海微电子装备(集团)股份有限公司 | 一种抽真空装置及抽真空方法 |
JP6952515B2 (ja) * | 2017-06-30 | 2021-10-20 | Towa株式会社 | ワーク搬送装置、電子部品の製造装置、ワーク搬送方法、および、電子部品の製造方法 |
KR102339079B1 (ko) * | 2017-09-28 | 2021-12-14 | 가부시키가이샤 신가와 | 흡착 스테이지 |
JP6986317B2 (ja) * | 2017-12-05 | 2021-12-22 | 株式会社アドテックエンジニアリング | マスクユニット及び露光装置 |
CN108364904A (zh) * | 2018-02-11 | 2018-08-03 | 武汉华星光电半导体显示技术有限公司 | 真空分立式吸附平台 |
CN110320758B (zh) * | 2018-03-30 | 2021-06-29 | 上海微电子装备(集团)股份有限公司 | 一种基底边缘保护装置、光刻设备及保护方法 |
KR102204884B1 (ko) * | 2018-09-27 | 2021-01-19 | 세메스 주식회사 | 기판 반송 로봇 및 기판 처리 설비 |
CN109856827A (zh) * | 2019-03-26 | 2019-06-07 | 深圳市华星光电技术有限公司 | 吸附式载台 |
JP2021019082A (ja) * | 2019-07-19 | 2021-02-15 | 株式会社ジャパンディスプレイ | 転写用基板 |
CN110703473B (zh) * | 2019-10-29 | 2022-05-31 | 武汉华星光电技术有限公司 | 一种真空吸附底座及显示面板绑定用设备 |
CN111653210A (zh) * | 2020-04-27 | 2020-09-11 | 深圳市创显光电有限公司 | 一种cob集成板的制备方法及其获得的灯板、显示模组 |
JP6861872B2 (ja) * | 2020-05-01 | 2021-04-21 | 東京エレクトロン株式会社 | 接合装置および接合システム |
CN112255897A (zh) * | 2020-11-26 | 2021-01-22 | 江苏上达电子有限公司 | 一种cof曝光机专用精密多功能工件台 |
CN112847015B (zh) * | 2021-01-11 | 2022-07-19 | 中国科学院西安光学精密机械研究所 | 多机器人协同加工光学元件的装置及方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07302832A (ja) * | 1994-03-09 | 1995-11-14 | Nippon Telegr & Teleph Corp <Ntt> | 真空吸着装置、真空吸着装置用シール具および真空吸着方法 |
JPH11240795A (ja) * | 1998-02-27 | 1999-09-07 | Super Silicon Kenkyusho:Kk | エピタキシャル成長装置 |
JP2004119573A (ja) * | 2002-09-25 | 2004-04-15 | Renesas Technology Corp | 半導体装置の製造方法およびフィルム貼付装置 |
JP2004221323A (ja) * | 2003-01-15 | 2004-08-05 | Nikon Corp | 基板保持装置、露光装置、及びデバイス製造方法 |
JP2005191338A (ja) * | 2003-12-26 | 2005-07-14 | Matsushita Electric Ind Co Ltd | 基板の保持装置および方法 |
JP2006310697A (ja) * | 2005-05-02 | 2006-11-09 | Dainippon Screen Mfg Co Ltd | 吸着チャック |
JP2007158190A (ja) * | 2005-12-07 | 2007-06-21 | Nikon Corp | 吸着装置、研磨装置、半導体デバイス製造方法およびこの方法により製造される半導体デバイス |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63139632A (ja) * | 1986-11-28 | 1988-06-11 | Hitachi Ltd | 真空吸着装置 |
JPH10128633A (ja) * | 1996-10-28 | 1998-05-19 | Nippon Telegr & Teleph Corp <Ntt> | 真空吸着装置 |
KR100292612B1 (ko) * | 1997-12-08 | 2001-08-07 | 윤종용 | 반도체 웨이퍼 정렬시스템 및 이를 이용하는 웨이퍼 정렬방법 |
CN100469948C (zh) * | 2000-10-03 | 2009-03-18 | 应用材料有限公司 | 一旦进入金属沉积用来倾斜基片的方法和相关设备 |
JP2002134597A (ja) * | 2000-10-27 | 2002-05-10 | Ushio Inc | ステージ装置 |
TWI236944B (en) * | 2001-12-17 | 2005-08-01 | Tokyo Electron Ltd | Film removal method and apparatus, and substrate processing system |
JP3769618B2 (ja) * | 2003-04-21 | 2006-04-26 | 防衛庁技術研究本部長 | 真空吸着装置 |
JP4459023B2 (ja) * | 2004-11-08 | 2010-04-28 | パナソニック株式会社 | 基板保持装置 |
KR101059914B1 (ko) * | 2006-01-10 | 2011-08-29 | 한미반도체 주식회사 | 반도체 제조공정용 테이블 |
CN100544889C (zh) * | 2006-09-06 | 2009-09-30 | 财团法人工业技术研究院 | 负压真空吸附装置及使用该装置的磨边装置 |
JP2008066607A (ja) * | 2006-09-11 | 2008-03-21 | Tokyo Ohka Kogyo Co Ltd | 真空吸着装置 |
-
2009
- 2009-02-02 JP JP2009021150A patent/JP5126091B2/ja not_active Expired - Fee Related
- 2009-12-01 TW TW098141001A patent/TWI385489B/zh not_active IP Right Cessation
- 2009-12-11 KR KR1020090123415A patent/KR101203356B1/ko active IP Right Grant
-
2010
- 2010-01-19 CN CN2010100054075A patent/CN101794726B/zh not_active Expired - Fee Related
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07302832A (ja) * | 1994-03-09 | 1995-11-14 | Nippon Telegr & Teleph Corp <Ntt> | 真空吸着装置、真空吸着装置用シール具および真空吸着方法 |
JPH11240795A (ja) * | 1998-02-27 | 1999-09-07 | Super Silicon Kenkyusho:Kk | エピタキシャル成長装置 |
JP2004119573A (ja) * | 2002-09-25 | 2004-04-15 | Renesas Technology Corp | 半導体装置の製造方法およびフィルム貼付装置 |
JP2004221323A (ja) * | 2003-01-15 | 2004-08-05 | Nikon Corp | 基板保持装置、露光装置、及びデバイス製造方法 |
JP2005191338A (ja) * | 2003-12-26 | 2005-07-14 | Matsushita Electric Ind Co Ltd | 基板の保持装置および方法 |
JP2006310697A (ja) * | 2005-05-02 | 2006-11-09 | Dainippon Screen Mfg Co Ltd | 吸着チャック |
JP2007158190A (ja) * | 2005-12-07 | 2007-06-21 | Nikon Corp | 吸着装置、研磨装置、半導体デバイス製造方法およびこの方法により製造される半導体デバイス |
Also Published As
Publication number | Publication date |
---|---|
KR101203356B1 (ko) | 2012-11-20 |
TW201030476A (en) | 2010-08-16 |
JP2010177607A (ja) | 2010-08-12 |
JP5126091B2 (ja) | 2013-01-23 |
CN101794726B (zh) | 2013-07-03 |
KR20100089016A (ko) | 2010-08-11 |
CN101794726A (zh) | 2010-08-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |