TWI380130B - Photosensitive composition and laminated body thereof - Google Patents
Photosensitive composition and laminated body thereof Download PDFInfo
- Publication number
- TWI380130B TWI380130B TW97131356A TW97131356A TWI380130B TW I380130 B TWI380130 B TW I380130B TW 97131356 A TW97131356 A TW 97131356A TW 97131356 A TW97131356 A TW 97131356A TW I380130 B TWI380130 B TW I380130B
- Authority
- TW
- Taiwan
- Prior art keywords
- photosensitive resin
- substrate
- mass
- group
- resin composition
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials For Photolithography (AREA)
- Polymerisation Methods In General (AREA)
- Graft Or Block Polymers (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007211622 | 2007-08-15 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200921275A TW200921275A (en) | 2009-05-16 |
TWI380130B true TWI380130B (en) | 2012-12-21 |
Family
ID=40350777
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW97131356A TWI380130B (en) | 2007-08-15 | 2008-08-15 | Photosensitive composition and laminated body thereof |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5221543B2 (ja) |
KR (1) | KR101167537B1 (ja) |
CN (1) | CN101779165B (ja) |
TW (1) | TWI380130B (ja) |
WO (1) | WO2009022724A1 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5707420B2 (ja) * | 2010-12-24 | 2015-04-30 | 旭化成イーマテリアルズ株式会社 | 感光性樹脂組成物 |
JP6019902B2 (ja) * | 2011-09-06 | 2016-11-02 | 日立化成株式会社 | 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法、及びプリント配線板の製造方法 |
JP5826006B2 (ja) * | 2011-12-01 | 2015-12-02 | 旭化成イーマテリアルズ株式会社 | 感光性樹脂組成物 |
CN103064253B (zh) * | 2012-12-05 | 2015-04-08 | 北京化工大学常州先进材料研究院 | 一种含有吖啶类氧化物的感光性组合物 |
JP6486672B2 (ja) * | 2013-12-20 | 2019-03-20 | 旭化成株式会社 | 感光性エレメント、及びその製造方法 |
KR102097261B1 (ko) | 2015-08-25 | 2020-04-06 | 아사히 가세이 가부시키가이샤 | 감광성 수지 조성물 |
JP6514346B2 (ja) | 2015-09-11 | 2019-05-15 | 旭化成株式会社 | 感光性樹脂組成物 |
WO2018225748A1 (ja) * | 2017-06-08 | 2018-12-13 | Jsr株式会社 | 組成物、硬化膜の製造方法及び電子部品 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4519356B2 (ja) * | 2001-04-26 | 2010-08-04 | 旭化成イーマテリアルズ株式会社 | 感光性樹脂積層体 |
US20070269738A1 (en) * | 2004-07-30 | 2007-11-22 | Hitachi Chemical Company, Ltd. | Photosensitive Film, Photosensitive Film Laminate and Photosensitive Film Roll |
JP2006208734A (ja) * | 2005-01-27 | 2006-08-10 | Fuji Photo Film Co Ltd | パターン形成方法 |
JP4761909B2 (ja) * | 2005-10-05 | 2011-08-31 | 旭化成イーマテリアルズ株式会社 | 感光性樹脂組成物及び積層体 |
JP4752650B2 (ja) * | 2006-04-13 | 2011-08-17 | 日立化成工業株式会社 | 感光性樹脂組成物 |
JP5188391B2 (ja) * | 2006-05-09 | 2013-04-24 | 旭化成イーマテリアルズ株式会社 | 感光性樹脂組成物 |
JP2008020629A (ja) * | 2006-07-12 | 2008-01-31 | Fujifilm Corp | パターン形成材料、並びに、パターン形成装置及びパターン形成方法 |
KR101059408B1 (ko) * | 2006-08-03 | 2011-08-29 | 아사히 가세이 일렉트로닉스 가부시끼가이샤 | 감광성 수지 조성물 및 적층체 |
-
2008
- 2008-08-14 JP JP2009528148A patent/JP5221543B2/ja active Active
- 2008-08-14 KR KR1020107002027A patent/KR101167537B1/ko active IP Right Grant
- 2008-08-14 CN CN200880102779.0A patent/CN101779165B/zh active Active
- 2008-08-14 WO PCT/JP2008/064585 patent/WO2009022724A1/ja active Application Filing
- 2008-08-15 TW TW97131356A patent/TWI380130B/zh active
Also Published As
Publication number | Publication date |
---|---|
TW200921275A (en) | 2009-05-16 |
KR20100027240A (ko) | 2010-03-10 |
CN101779165B (zh) | 2014-09-24 |
CN101779165A (zh) | 2010-07-14 |
JPWO2009022724A1 (ja) | 2010-11-18 |
JP5221543B2 (ja) | 2013-06-26 |
WO2009022724A1 (ja) | 2009-02-19 |
KR101167537B1 (ko) | 2012-07-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI380130B (en) | Photosensitive composition and laminated body thereof | |
TWI530757B (zh) | A photosensitive resin composition | |
JP5051299B2 (ja) | 感光性樹脂組成物、感光性エレメント、レジストパターンの製造方法、及びプリント配線板の製造方法 | |
JP4847582B2 (ja) | 感光性樹脂組成物および積層体 | |
JP5215473B2 (ja) | レジスト材料用感光性樹脂組成物及び感光性樹脂積層体 | |
WO2007010614A1 (ja) | 感光性樹脂組成物及び積層体 | |
JP6229256B2 (ja) | 感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 | |
WO2010103918A1 (ja) | 感光性樹脂組成物、並びにこれを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 | |
JPWO2017043544A1 (ja) | 感光性樹脂組成物 | |
WO2007049519A1 (ja) | 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 | |
TWI240149B (en) | Photosensitive resin composition, photosensitive element comprising the same, process for producing resist pattern, and process for producing printed circuit board | |
TWI376573B (ja) | ||
TW200949433A (en) | Layered photosensitive-resin product | |
JP5878040B2 (ja) | 感光性樹脂組成物、これを用いたフォトレジストフィルム、レジストパターンの形成方法及び導体パターンの形成方法 | |
WO2001022165A1 (fr) | Compositions a base de resine photosensibles, element photosensible contenant ces compositions, procede de production d'un motif de reserve et procede de production de carte a circuit imprime | |
TW201001065A (en) | Photosensitive resin composition and layered object obtained therewith | |
TWI356972B (ja) | ||
JP2009069465A (ja) | 感光性樹脂組成物 | |
CN108375874A (zh) | 感光性树脂组合物、感光性树脂层叠体、形成有抗蚀图案的基板和电路基板的制造方法 | |
WO2013125429A1 (ja) | 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 | |
TW201019047A (en) | Photosensitive resin composition, photosensitive resin laminate, method for forming resist pattern, conductive pattern, printed wiring board, lead frame, base, and method for manufacturing semiconductor package | |
JP2010181813A (ja) | 感光性樹脂積層体 | |
JP2003050459A (ja) | 感光性樹脂組成物、感光性エレメント、レジストパターンの製造法およびプリント配線板の製造法 | |
JP4172209B2 (ja) | 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの製造方法及びプリント配線板の製造方法 | |
JP6064480B2 (ja) | 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 |