TWI379925B - - Google Patents

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Publication number
TWI379925B
TWI379925B TW093124933A TW93124933A TWI379925B TW I379925 B TWI379925 B TW I379925B TW 093124933 A TW093124933 A TW 093124933A TW 93124933 A TW93124933 A TW 93124933A TW I379925 B TWI379925 B TW I379925B
Authority
TW
Taiwan
Prior art keywords
copper
copper foil
ultra
carrier
thin
Prior art date
Application number
TW093124933A
Other languages
English (en)
Chinese (zh)
Other versions
TW200526819A (en
Inventor
Suzuki Yuuji
Matsuda Akira
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of TW200526819A publication Critical patent/TW200526819A/zh
Application granted granted Critical
Publication of TWI379925B publication Critical patent/TWI379925B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0723—Shielding provided by an inner layer of PCB
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12014—All metal or with adjacent metals having metal particles
    • Y10T428/12028—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12472—Microscopic interfacial wave or roughness
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/125—Deflectable by temperature change [e.g., thermostat element]
    • Y10T428/12514—One component Cu-based
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12778—Alternative base metals from diverse categories
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12806—Refractory [Group IVB, VB, or VIB] metal-base component

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
TW093124933A 2003-09-01 2004-08-19 Method of producing ultra-thin copper foil with carrier, ultra-thin copper foil with carrier produced by the same, printed circuit board, multilayer printed circuit board and chip on film circuit board TW200526819A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003308820A JP3977790B2 (ja) 2003-09-01 2003-09-01 キャリア付き極薄銅箔の製造方法、及び該製造方法で製造された極薄銅箔、該極薄銅箔を使用したプリント配線板、多層プリント配線板、チップオンフィルム用配線基板

Publications (2)

Publication Number Publication Date
TW200526819A TW200526819A (en) 2005-08-16
TWI379925B true TWI379925B (ko) 2012-12-21

Family

ID=34101285

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093124933A TW200526819A (en) 2003-09-01 2004-08-19 Method of producing ultra-thin copper foil with carrier, ultra-thin copper foil with carrier produced by the same, printed circuit board, multilayer printed circuit board and chip on film circuit board

Country Status (6)

Country Link
US (1) US7223481B2 (ko)
EP (1) EP1511366A3 (ko)
JP (1) JP3977790B2 (ko)
KR (1) KR101056692B1 (ko)
CN (2) CN101662892B (ko)
TW (1) TW200526819A (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI562885B (ko) * 2013-03-04 2016-12-21 Jx Nippon Mining & Metals Corp

Families Citing this family (81)

* Cited by examiner, † Cited by third party
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DE112004000245T5 (de) * 2003-02-04 2005-12-29 Furukawa Circuit Foil Co., Ltd. Verbund-Kupferfolie, Verfahren zu deren Herstellung und Hochfrequenz-Übertragungsschaltung unter Verwendung einer Verbundkupferfolie
EP1531656A3 (en) * 2003-11-11 2007-10-03 Furukawa Circuit Foil Co., Ltd. Ultra-thin copper foil with carrier and printed wiring board using ultra-thin copper foil with carrier
JP3963907B2 (ja) * 2004-05-26 2007-08-22 三井金属鉱業株式会社 純銅被覆銅箔及びその製造方法、並びにｔａｂテープ及びその製造方法
JP2006310574A (ja) * 2005-04-28 2006-11-09 Nippon Kayaku Co Ltd 両面フレキシブルプリント基板の製造法及び両面フレキシブルプリント基板。
CN101208373B (zh) 2005-07-21 2010-12-01 日本化药株式会社 聚酰胺树脂，环氧树脂组合物及其固化物
US7976956B2 (en) * 2005-08-01 2011-07-12 Furukawa Circuit Foil., Ltd. Laminated circuit board
KR101312369B1 (ko) * 2005-10-31 2013-09-27 니폰 가야꾸 가부시끼가이샤 고무 변성 폴리아미드 수지, 에폭시 수지　조성물　및 그경화물
JP4927503B2 (ja) 2005-12-15 2012-05-09 古河電気工業株式会社 キャリア付き極薄銅箔及びプリント配線基板
JP4934409B2 (ja) 2005-12-15 2012-05-16 古河電気工業株式会社 キャリア付き極薄銅箔及びプリント配線基板
JP5138185B2 (ja) * 2006-06-30 2013-02-06 信越ポリマー株式会社 プリント配線基板
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JP4891037B2 (ja) * 2006-11-22 2012-03-07 日本電解株式会社 複合銅箔およびその製造方法、ならびに該複合銅箔を用いたプリント配線板の製造方法
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KR101351928B1 (ko) 2007-12-28 2014-01-21 일진머티리얼즈 주식회사 캐리어박 부착 극박 동박, 그 제조 방법 및 이를 채용한프린트 배선 기판
JP4973519B2 (ja) * 2008-01-18 2012-07-11 住友ベークライト株式会社 積層板、積層板の製造方法、多層プリント配線板および半導体装置
TWI398350B (zh) * 2008-02-05 2013-06-11 Du Pont 高黏著性聚醯亞胺銅箔積層板及其製造方法
JP2009214308A (ja) * 2008-03-07 2009-09-24 Furukawa Electric Co Ltd:The キャリア付き銅箔
JP5255349B2 (ja) * 2008-07-11 2013-08-07 三井金属鉱業株式会社 表面処理銅箔
KR101426038B1 (ko) * 2008-11-13 2014-08-01 주식회사 엠디에스 인쇄회로기판 및 그 제조방법
JP5505828B2 (ja) * 2009-03-04 2014-05-28 福田金属箔粉工業株式会社 複合金属箔及びその製造方法
KR101298999B1 (ko) * 2009-09-01 2013-08-23 일진머티리얼즈 주식회사 미세회로 형성을 위한 임베디드용 동박
JP6219034B2 (ja) * 2010-10-06 2017-10-25 古河電気工業株式会社 銅箔及びその製造方法、キャリア付き銅箔及びその製造方法、プリント配線板、多層プリント配線板
CN102152528B (zh) * 2010-10-21 2015-03-11 江西理工大学 稀土改性剥离强度的载体超薄铜箔及其制备方法
CN102452197B (zh) * 2010-10-21 2014-08-20 财团法人工业技术研究院 附载箔铜箔及其制造方法
KR101218356B1 (ko) * 2010-11-11 2013-01-03 삼성테크윈 주식회사 다단 동박 적층판, 이의 제조방법 및 이를 이용한 인쇄회로기판의 제조방법
JP2012112009A (ja) * 2010-11-26 2012-06-14 Hitachi Cable Ltd 銅箔、及び銅箔の製造方法
KR20120084441A (ko) * 2011-01-20 2012-07-30 이미연 알루미늄 재질의 캐리어층을 갖는 동박 적층판 제조용 동박 필름 및 이를 구비하는 동박 적층판
US8980414B2 (en) * 2011-08-31 2015-03-17 Jx Nippon Mining & Metals Corporation Carrier-attached copper foil
JP5902931B2 (ja) * 2011-12-06 2016-04-13 新光電気工業株式会社 配線基板の製造方法、及び、配線基板製造用の支持体
WO2013118416A1 (ja) * 2012-02-06 2013-08-15 Jx日鉱日石金属株式会社 キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板、プリント回路板及び銅張積層板
JP5854872B2 (ja) * 2012-02-15 2016-02-09 Jx日鉱日石金属株式会社 キャリア付銅箔、キャリア付銅箔の製造方法、積層体及びプリント配線板の製造方法
JP5922227B2 (ja) * 2012-04-24 2016-05-24 Ｊｘ金属株式会社 キャリア付銅箔、キャリア付銅箔の製造方法及びプリント配線板の製造方法
TWI551436B (zh) * 2012-09-24 2016-10-01 Jx Nippon Mining & Metals Corp A carrier metal foil, a laminate made of a resin-made plate-like carrier and a metal foil, and the like
EP2719544B1 (en) * 2012-10-10 2015-12-16 Artio Sarl Method of manufacturing rotogravure cylinders
KR20150086541A (ko) * 2012-11-20 2015-07-28 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 캐리어 부착 동박
JP5298252B1 (ja) * 2013-02-14 2013-09-25 Ｊｘ日鉱日石金属株式会社 キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板、プリント回路板、銅張積層板、及び、プリント配線板の製造方法
JP6271134B2 (ja) * 2013-03-05 2018-01-31 Ｊｘ金属株式会社 キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板、プリント回路板、銅張積層板、及び、プリント配線板の製造方法
JP6140481B2 (ja) * 2013-03-05 2017-05-31 Ｊｘ金属株式会社 キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板、プリント回路板、銅張積層板、及び、プリント配線板の製造方法
JP6140480B2 (ja) * 2013-03-05 2017-05-31 Ｊｘ金属株式会社 キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板、プリント回路板、銅張積層板、及び、プリント配線板の製造方法
JP6274736B2 (ja) * 2013-03-06 2018-02-07 Ｊｘ金属株式会社 キャリア付銅箔、プリント配線板、プリント回路板、銅張積層板、及びプリント配線板の製造方法
JP6425399B2 (ja) * 2013-03-28 2018-11-21 Ｊｘ金属株式会社 キャリア付銅箔、プリント配線板、プリント回路板、銅張積層板及びプリント配線板の製造方法
JP6438208B2 (ja) * 2013-04-03 2018-12-12 Ｊｘ金属株式会社 キャリア付銅箔、それを用いた銅張積層板、プリント配線板、電子機器及びプリント配線板の製造方法
KR102302011B1 (ko) 2013-05-29 2021-09-13 타츠타 전선 주식회사 전자파 실드 필름의 제조 방법
US20150004329A1 (en) * 2013-06-28 2015-01-01 King Abdulaziz City For Science And Technology Short-time growth of large-grain hexagonal graphene and methods of manufacture
WO2015012327A1 (ja) * 2013-07-23 2015-01-29 Jx日鉱日石金属株式会社 表面処理銅箔、キャリア付銅箔、基材、樹脂基材、プリント配線板、銅張積層板及びプリント配線板の製造方法
KR101517553B1 (ko) * 2013-10-14 2015-05-04 한국생산기술연구원 회로기판의 제조방법
TWI573500B (zh) * 2013-12-10 2017-03-01 Jx Nippon Mining & Metals Corp Manufacturing method of surface-treated copper foil, copper-clad laminate, printed wiring board, electronic machine and printed wiring board
JP5819569B1 (ja) * 2013-12-10 2015-11-24 Jx日鉱日石金属株式会社 表面処理銅箔、銅張積層板、プリント配線板、電子機器及びプリント配線板の製造方法
JP6039540B2 (ja) * 2013-12-13 2016-12-07 三井金属鉱業株式会社 電解銅箔及びその製造方法
TWI621381B (zh) * 2014-04-02 2018-04-11 Jx Nippon Mining & Metals Corp Laminated body with metal foil with carrier
JP6149016B2 (ja) * 2014-05-09 2017-06-14 Ｊｘ金属株式会社 キャリア付銅箔、銅張積層板の製造方法、電子機器の製造方法、キャリア付銅箔の製造方法、及び、プリント配線板の製造方法
JP5877282B1 (ja) * 2014-09-09 2016-03-02 古河電気工業株式会社 プリント配線板用銅箔及び銅張積層板
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