TWI374924B - - Google Patents

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Publication number
TWI374924B
TWI374924B TW97130122A TW97130122A TWI374924B TW I374924 B TWI374924 B TW I374924B TW 97130122 A TW97130122 A TW 97130122A TW 97130122 A TW97130122 A TW 97130122A TW I374924 B TWI374924 B TW I374924B
Authority
TW
Taiwan
Prior art keywords
adhesive
substrate
conductive
volume
epoxy resin
Prior art date
Application number
TW97130122A
Other languages
English (en)
Chinese (zh)
Other versions
TW200925231A (en
Inventor
Akinori Yokoyama
Original Assignee
Asahi Kasei Emd Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei Emd Corp filed Critical Asahi Kasei Emd Corp
Publication of TW200925231A publication Critical patent/TW200925231A/zh
Application granted granted Critical
Publication of TWI374924B publication Critical patent/TWI374924B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0162—Silicon containing polymer, e.g. silicone

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Wire Bonding (AREA)
TW97130122A 2007-08-10 2008-08-07 Adhesive and bonded body TW200925231A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007209320 2007-08-10
JP2007209319 2007-08-10

Publications (2)

Publication Number Publication Date
TW200925231A TW200925231A (en) 2009-06-16
TWI374924B true TWI374924B (ja) 2012-10-21

Family

ID=40350628

Family Applications (1)

Application Number Title Priority Date Filing Date
TW97130122A TW200925231A (en) 2007-08-10 2008-08-07 Adhesive and bonded body

Country Status (5)

Country Link
JP (1) JP5337034B2 (ja)
KR (1) KR101139749B1 (ja)
CN (1) CN101755025B (ja)
TW (1) TW200925231A (ja)
WO (1) WO2009022574A1 (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008041657A1 (de) * 2008-08-28 2010-03-04 Robert Bosch Gmbh Verfahren zum Verkleben von Bauteilen unter Ausbildung einer temperaturbeständigen Klebstoffschicht
JP2011057793A (ja) * 2009-09-08 2011-03-24 Shin-Etsu Chemical Co Ltd 接着剤組成物およびそれを用いた半導体保護膜形成用シート
JP5651625B2 (ja) * 2012-03-21 2015-01-14 京都エレックス株式会社 加熱硬化型導電性ペースト組成物
SG11201606126RA (en) * 2014-08-29 2016-09-29 Furukawa Electric Co Ltd Conductive adhesive film
JP2016108461A (ja) * 2014-12-08 2016-06-20 信越化学工業株式会社 接着剤、該接着剤からなるダイボンド材、該接着剤を用いた導電接続方法、及び該方法によって得られた光半導体装置
JP6352374B2 (ja) * 2016-12-01 2018-07-04 ダウ・コーニング・タイワン・インコーポレイテッドＤｏｗ Ｃｏｒｎｉｎｇ Ｔａｉｗａｎ Ｉｎｃ 感圧性接着剤シート及びこれらの製造方法
JP6800129B2 (ja) 2017-11-07 2020-12-16 古河電気工業株式会社 フィルム状接着剤、フィルム状接着剤を用いた半導体パッケージの製造方法
US20220177748A1 (en) * 2019-03-18 2022-06-09 Threebond Co., Ltd. Adhesive composition, cured product, and composite
WO2021019932A1 (ja) * 2019-07-29 2021-02-04 株式会社村田製作所 水晶振動子、電子部品及び電子装置
KR20230100416A (ko) * 2021-12-28 2023-07-05 주식회사 노피온 플렉서블 회로기판용 이방성 도전접착제

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0517729A (ja) * 1991-07-11 1993-01-26 Nitto Denko Corp 粘着テープ
JPH06220413A (ja) * 1993-01-21 1994-08-09 Murata Mfg Co Ltd 導電性接着剤およびそれを用いた赤外線検出器
TW392179B (en) * 1996-02-08 2000-06-01 Asahi Chemical Ind Anisotropic conductive composition
JP3417354B2 (ja) * 1999-08-19 2003-06-16 ソニーケミカル株式会社 接着材料及び回路接続方法
JP4433564B2 (ja) * 2000-05-17 2010-03-17 日立化成工業株式会社 回路接続用接着剤
JP2003147287A (ja) * 2001-11-14 2003-05-21 Hitachi Chem Co Ltd 回路接続用接着フィルム
JP2004018720A (ja) * 2002-06-18 2004-01-22 Mitsui Chemicals Inc 半導体装置用接着剤
JP2004196991A (ja) * 2002-12-19 2004-07-15 Shin Etsu Polymer Co Ltd 光学表示体用透明シリコーン粘着部材及び透明積層体
JP4565821B2 (ja) * 2003-07-08 2010-10-20 日本化薬株式会社 接着剤組成物
US20070175579A1 (en) * 2003-12-04 2007-08-02 Asahi Kasei Emd Corporation Anisotropic conductive adhesive sheet and connecting structure
JP2006028521A (ja) * 2005-08-19 2006-02-02 Hitachi Chem Co Ltd 回路接続用接着剤
JP4626495B2 (ja) * 2005-11-16 2011-02-09 日立化成工業株式会社 回路接続用接着剤

Also Published As

Publication number Publication date
JPWO2009022574A1 (ja) 2010-11-11
TW200925231A (en) 2009-06-16
WO2009022574A1 (ja) 2009-02-19
KR20100037124A (ko) 2010-04-08
KR101139749B1 (ko) 2012-04-26
CN101755025A (zh) 2010-06-23
CN101755025B (zh) 2014-03-12
JP5337034B2 (ja) 2013-11-06

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees