200925231 九、發明說明： 【發明所屬之技術領域】 本發明係關於電路基板間之電性接續等所用之接著劑。 【先前技術】200925231 IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to an adhesive used for electrical connection between circuit boards and the like. [Prior Art]
自以往以來，作為含有導電粒子之接著劑，已知有各向 異性導電性接著劑或導電性接著劑。其中，各向異性導電 性接著劑，可藉由導電粒子接續作為目標之接續電極與被 接續電極。特別是，加熱、加壓下使導電粒子某種程度變 形接續電極間（接續電極與被接續電極），與此同時藉由使 分散導電粒子之接著劑硬化得到接合體。 作為使用各向異性導電性接著劑之接著劑，已知有使用 環氧樹脂或苯氧基樹脂、潛在性硬化劑所構成之接著劑 (比如專利文獻1及2) 對使用各向異性導電性接著劑時之接續電極與被接續電 極之接續方法進行說明。首先，具有接續電極之基板，比 如軟性基板或玻璃面板上，載置各向異性導電性接著劑， 載置具有被接續電極之基材’比如1C晶片或聚亞酿胺 FPC(軟性印刷電路板)，形成構造體 '然後，藉由該構造 體可既取得與Μ基板之電極間之接績，又與鄰近電極間 保持絕緣。 使用特定之軟性基材，比如稱為聚對苯二甲酸乙二醋 (PET)膜或聚碳酸醋（pc)之透明性高耐熱性低之膜基材之 情形，必須在低溫下接著。 但，在低溫下接著之情形，存在具有接續電極之基板或 133675.doc 200925231 具有被接續電極之基材之接著性下降之問題。 專利文獻1 :特開平8-3 15885號公報 專利文獻2 :特開平5-320610號公報 【發明内容】 發明所欲解決之問題 本發明之目的在於提供一種克服前述問題點，即使在 150°C以下之低溫加熱硬化，初期及信賴性試驗後之接著 性或導電性依然優良之接著劑。 [解決問題之技術手段] 本發明者們，為解決前述課題而積極研究之结果，發現 藉由使接著劑含有具有黏著特性之石夕_化合物、環氧樹 脂、苯氧基樹脂、及硬化劑作為成分，可得到適合前述目 的之接著劑，因而完成本發明。 即，本發明如下所述。 (1) 一種接著劑，其特徵為含有具有黏著特性之矽酮化 多合物、環氧樹脂、苯氧基樹脂、及硬化劑。 (2) 如（1)之接著劑，其中進而含有導電粒子。 (3) 如（1)或（2)之接著劑’其中前述環氧樹脂含有四曱 基雙酚型環氧樹脂。 (4) 如⑴至(3)任一項之接著劑’其中前述環氧樹脂含 有'一 $衣戍 稀型壤氧樹脂。 (5) 如⑴至⑷任一項之接著劑，其中前述矽酮化合物 之平均重量分子量在100萬以下。 (6) 如⑴至（5)任一項之接著劑，其中前述矽嗣化合物 133675.doc 200925231 之平均重量分子量在60萬以下。 (7) 如（1)至（6)任一項之接著劑，其中 m 再T則述矽酮化合物 非環氧變性石夕酮。 (8) 如（1)至任一項之接著劑 ^ 冉〒則述導電粒子係 平均粒子徑1至20 μηι之導電粒子。 (9) 如⑴至⑻任-項之接著劑，其中前述硬化劑係潛 在性硬化劑。 (10) 如⑴至⑼任-項之接著劑’其中含有導電粒子〇1 體積％以上未達30體積％，顯示各向異性導電性。 (11) 如（1)至（10)任一項之接著劑，其中含有導電粒子 30體積％以上8〇體積％以下。 (12) —種接合體之製造方法，其特徵在於將（1)至（11) 任一項之接著劑施配於具有導電電極之基板或導電電極 上，將電子部品加熱壓著。 (13) —種由（丨2)所記之製造方法所製造出之接合體。 發明之效果 本發明之接著劑，即使在150。(：以下之低溫加熱硬化， 仍具有初期及信賴性試驗後之接著力優良或又導電性優良 之效果。 【實施方式】 本發明之接著劑，至少含有具有黏著特性之矽酮化合 物 丨衣乳相'脂、苯氧基樹脂、及硬化劑。 作為具有點著特性之珍酮化合物’使用石夕酮黏著劑。該 黏著特性宜為150至1800 g/inch ^黏著特性之評價條件 133675.doc 200925231 係’於50 μιη厚之聚對苯二甲酸乙二酯膜（PET)上，塗佈矽 酮黏著劑使成硬化後為40 μιη厚做成黏著片，不銹鋼板與 黏著片之矽黏著劑所形成之層接著，23它下放置3〇分鐘 後’以0.3 m/min以160。剝離時之數值。 作為具有黏著特性之矽酮化合物，比如，附加反應型石夕 • 黏著劑、過氧化物硬化型矽黏著劑。附加反應型矽酮黏著 • 劑，係具有在8〇〜12〇。(：下1〜5分鐘硬化特性之矽酮黏著 ❹ 劑。其中，附加反應型矽酮黏著劑更為合適。作為附加反 應型矽黏著劑，比如，東麗道康寧公司製SD458〇、 SD4581、SD4584、SD4585、SD4586、SD4587、SD4590、 SD4592、SD4560、BY24-738、BY24-740。本發明中之具 有黏著特性之矽酮化合物較好為非環氧變性矽酮。矽酮黏 著劑之平均重量分子量較好在1〇〇萬以下，進而因6〇萬以 下可獲得適度之黏著性故而更佳。最好，平均重量分子量 係從1000至60萬。矽酮黏著劑之配合量，於接著劑中較好 ❹ 含有〇.01〜20體積％，進而0.1〜15體積。/。更佳。從展現接著 性之效果之觀點而言，較好在0.01體積％以上，從防止環 氧樹脂之硬化阻害觀點而言，較好在2〇體積％以下本發明 . 中矽酮黏著劑與環氧樹脂併用可同時滿足因導電粒子固定 化而確保導電性與優良接著力。 環氧樹脂係1分子中含有2個以上環氧基之化合物，具艎 而言，包含雙酚A型樹脂、雙酚F型樹脂、萘型樹脂、雙酚 S型樹脂、酚類酚醛型樹脂、甲酚酚醛型樹脂、脂環式型 樹知聯本型樹知、一環戊二烯型樹赌、縮水甘油胺型樹 133675.doc 200925231 脂、縮水甘油酯型樹脂等。 其中’含有雙盼A型樹脂、雙，型樹脂、三環戍二稀 型樹脂、四甲基雙紛型樹脂者，從高接著性、導電性之高 濕度信賴性試驗下之安定性觀點而言更佳。該等樹脂，較 好以複數種使用。 作為四甲基雙紛型環氧樹脂，舉例為例如γχ4〇〇〇Κ、 ΥΧ4000、、YL612H、YL664〇、yl6677 等作 為四甲基雙盼型環氧樹脂’較好為具有介以謎鍵結合兩個 聯苯構造之構造。四甲基㈣型環氧樹脂之配合量 著劑成分中較好為0.1體積％以上40體積％以下。 另，本發明之接著劑，較好含有二環戊二烯型環氧樹 脂。含有二環戊二稀型環氧樹脂，可防止高濕度下接静 賴性下降。另’作為各向異性導電性接著劑或導電性接著 劑使用之情形，亦可抑制吸濕所造成之導電性粒子之劣 化一環戊一稀型環氧樹脂之配合量，於接著劑中較好為 1〜40體積％。 本發明之接著劑含有苯氧基樹脂。作為苯氧基樹月旨，從 溶解性或操作性而言較好為含有分子量從胸U2〇〇_ =下者。具體而言’比如’雙紛A型苯氧基樹脂、雙紛F型 苯氧基樹脂、己内醯胺變性苯氧基樹脂、多元醇變性苯氧 基樹脂。S ’根據需要’亦可添加❹丙烯酸樹脂、環氧 變性丙稀酸樹脂等。苯氧基樹月旨之配合量，於接著劑成分 中較好為5〜70體積％。 本發明之接著劑利之硬㈣，只㈣可使前述環氧樹 133675.doc 200925231 脂硬化者即可。本發明之接箸劑進行加熱硬化時，鑒於使 用開始前之保存性，較好使用潛在性硬化劑。比如，較好 使用酸酐、聚胺、胺化合物、酚化合物、咪唑類，其中， 微囊化硬化劑更佳。 硬化劑之配合量’相對於環氧樹脂總量ι〇0體積％，較 好為5〜400體積％，5〜3〇〇體積％更佳。Conventionally, an anisotropic conductive adhesive or a conductive adhesive has been known as an adhesive containing conductive particles. Among them, the anisotropic conductive adhesive can be connected to the succeeding electrode and the connected electrode by the conductive particles. In particular, the conductive particles are deformed to some extent between the electrodes (the succeeding electrode and the connected electrode) under heat and pressure, and at the same time, the bonded body is obtained by hardening the adhesive for dispersing the conductive particles. An adhesive agent using an epoxy resin, a phenoxy resin, or a latent curing agent (for example, Patent Documents 1 and 2) is known as an adhesive agent using an anisotropic conductive adhesive. The method of connecting the succeeding electrode to the connected electrode at the time of the subsequent agent will be described. First, an anisotropic conductive adhesive is placed on a substrate having a bonding electrode, such as a flexible substrate or a glass panel, and a substrate having a connected electrode such as a 1C wafer or a poly-bristamine FPC (soft printed circuit board) is placed thereon. ), the structure is formed. Then, the structure can obtain both the connection with the electrodes of the germanium substrate and the insulation between the adjacent electrodes. The use of a specific soft substrate, such as a film substrate called polyethylene terephthalate (PET) film or polycarbonate (pc), which has high transparency and high heat resistance, must be followed at a low temperature. However, in the case of a low temperature, there is a problem that the substrate having the electrodes is connected or the adhesion of the substrate having the electrodes to be connected is lowered. [Problem to be Solved by the Invention] It is an object of the present invention to provide an overcoming of the above problems even at 150 ° C. The following low-temperature heat-hardening is an adhesive agent which is excellent in adhesion or conductivity after initial stage and reliability test. [Means for Solving the Problem] As a result of active research to solve the above problems, the present inventors have found that the adhesive contains a compound having an adhesive property, an epoxy resin, a phenoxy resin, and a hardener. As the component, an adhesive suitable for the above purpose can be obtained, and thus the present invention has been completed. That is, the present invention is as follows. (1) An adhesive comprising an oxime ketone compound having an adhesive property, an epoxy resin, a phenoxy resin, and a hardener. (2) The adhesive according to (1), which further contains conductive particles. (3) The adhesive of (1) or (2) wherein the epoxy resin contains a tetrakis-bisphenol type epoxy resin. (4) The adhesive agent according to any one of (1) to (3) wherein the aforementioned epoxy resin contains 'a 戍 稀 thin type lytic resin. (5) The adhesive according to any one of (1) to (4), wherein the anthrone compound has an average weight molecular weight of 1,000,000 or less. (6) The adhesive according to any one of (1) to (5), wherein the bismuth compound 133675.doc 200925231 has an average weight molecular weight of 600,000 or less. (7) The adhesive according to any one of (1) to (6), wherein m and T are oxime compounds, non-epoxy-denatured. (8) The conductive particles are conductive particles having an average particle diameter of 1 to 20 μηι as the adhesive of (1) to any one of them. (9) The adhesive according to any one of (1) to (8), wherein the hardener is a latent hardener. (10) The adhesive agent according to any one of (1) to (9), which contains conductive particles 〇1% by volume or more and less than 30% by volume, exhibits anisotropic conductivity. (11) The adhesive according to any one of (1) to (10), which contains 30% by volume or more and 8% by volume or less of the conductive particles. (12) A method of producing a bonded body, characterized in that the adhesive of any one of (1) to (11) is applied to a substrate or a conductive electrode having a conductive electrode, and the electronic component is heated and pressed. (13) A bonded body produced by the manufacturing method described in (丨2). EFFECT OF THE INVENTION The adhesive of the present invention is at 150. (The following low-temperature heat curing has the effect of excellent adhesion after initial and reliability test or excellent electrical conductivity. [Embodiment] The adhesive of the present invention contains at least an anthrone compound having a sticky property Phase 'fat, phenoxy resin, and hardener. Use as a ketone compound with point characteristics'. Use the linaloic acid adhesive. The adhesive property should be 150 to 1800 g/inch. Evaluation conditions of adhesion characteristics 133675.doc 200925231 is applied to a 50 μιη thick polyethylene terephthalate film (PET) coated with an anthrone adhesive to make a 40 μm thick adhesive sheet after hardening, and an adhesive for the stainless steel sheet and the adhesive sheet. The resulting layer is then placed underneath for 23 minutes, at a value of 0.3 m/min to 160. The value at the time of peeling. As an anthrone compound having adhesive properties, for example, an additional reactive type of zebra adhesive, peroxidation A hardening type bismuth adhesive. An additional reactive ketone adhesive has a ketone adhesive at 8 〇 to 12 〇. (: 1 to 5 minutes under hardening properties. Among them, an additional reactive ketone adhesive) more Suitable as an additional reaction type adhesive, for example, SD458〇, SD4581, SD4584, SD4585, SD4586, SD4587, SD4590, SD4592, SD4560, BY24-738, BY24-740 manufactured by Toray Dow Corning Co., Ltd. The anthrone compound is preferably a non-epoxy-denatured anthrone. The average weight molecular weight of the anthrone adhesive is preferably less than 100,000, and further preferably is less than 60,000 to obtain a moderate adhesion. The average weight molecular weight is from 1,000 to 600,000. The amount of the anthrone adhesive is preferably ❹.01 to 20% by volume in the adhesive, and further 0.1 to 15% by volume. More preferably. From the viewpoint of the effect, it is preferably at least 0.01% by volume, and from the viewpoint of preventing curing of the epoxy resin, it is preferably at least 2 vol% by volume. The ninth ketone adhesive and the epoxy resin can be used simultaneously. It is satisfied that the conductive particles are immobilized to ensure conductivity and excellent adhesion. The epoxy resin is a compound containing two or more epoxy groups in one molecule, and contains a bisphenol A resin and a bisphenol F resin. Naphthalene tree Lipid, bisphenol S type resin, phenolic novolac type resin, cresol novolac type resin, alicyclic type tree, known type, tree, monocyclopentadiene type tree bet, glycidylamine type tree 133675.doc 200925231 , a glycidyl ester type resin, etc. Among them, 'containing a double-presence A type resin, a double type resin, a tricyclic bismuth type resin, and a tetramethyl double type resin, it is highly reliable from high adhesion and high humidity. It is preferable from the viewpoint of stability under the property test. These resins are preferably used in plural kinds. As the tetramethyl double-type epoxy resin, for example, γχ4〇〇〇Κ, ΥΧ4000, YL612H, YL664〇 are exemplified. , yl6677, etc. as a tetramethyl double-presence epoxy resin is preferably a structure having a structure in which two biphenyl structures are bonded by a puzzle bond. The amount of the tetramethyl (tetra) type epoxy resin is preferably from 0.1% by volume to 40% by volume in the composition of the coating agent. Further, the adhesive of the present invention preferably contains a dicyclopentadiene type epoxy resin. It contains a dicyclopentadiene epoxy resin to prevent a decrease in the stability of high humidity. In addition, when used as an anisotropic conductive adhesive or a conductive adhesive, it is also possible to suppress deterioration of conductive particles caused by moisture absorption, and the amount of the epoxy resin is preferably a good amount in the adhesive. It is 1 to 40% by volume. The adhesive of the present invention contains a phenoxy resin. As the phenoxy tree, it is preferred from the viewpoint of solubility or handleability that the molecular weight is from the chest U2 〇〇 _ = . Specifically, 'for example, 'double A-type phenoxy resin, double-type F-type phenoxy resin, caprolactam-modified phenoxy resin, and polyol-modified phenoxy resin. S ' may also be added with an acrylic resin, an epoxy-modified acrylic resin or the like as needed. The amount of the phenoxy group is preferably from 5 to 70% by volume based on the binder component. The adhesive of the present invention is hard (four), and only (4) can be used to cure the aforementioned epoxy tree 133675.doc 200925231. When the binder of the present invention is heat-cured, it is preferred to use a latent curing agent in view of preservability before use. For example, an acid anhydride, a polyamine, an amine compound, a phenol compound, or an imidazole is preferably used, and among them, a microencapsulated hardener is more preferable. The blending amount of the hardener is preferably from 5 to 400% by volume, more preferably from 5 to 3% by volume, based on the total amount of the epoxy resin.
❹ 另，根據需要，可使用公知之矽烷偶合劑或鈦偶合劑、 鋁偶合劑。作為矽烷耦合劑，可使用例如Kbm4〇3、 KBE403、KBE9103、KBM9103、KBM903、KBE903、 KBE573、KBM573等。作為偶合劑，對接著劑每1〇〇體積 ，較好為〇.〇1至10體積％。 另，本發明之接著劑係含有導電粒子者。作為導電粒 子其平均粒子徑較好為1〜20 μηι。另，從作為接著劑做 成膜狀時之操作性觀點而言，較好為2〇 μιη以下。從加熱 接續㈣收接續電極間之高度偏差，獲得充分電性接續觀 點而σ，平均粒子徑更好在〗以上1〇 以下。進而2 Mm以上U) μ喊下更佳。導電粒子之平均粒子徑，係使用 氣流式粒度分布計（獅QS SR)之雷射繞射所敎之體積 累計粒度分布之累計值5〇%之數值。 作為導電粒子，可使用公知之導電粒子。作為導電粒 子’可使用例如’塑料粒子上鍍有鎳或金、銅、銀之粒子 ==、銀、鎳、金、錫、焊錫、非鉛焊錫粉或於該等 ❹人鍍之粒子。其中，金屬粒子’特別是鋼、銀、銅 …之口金柔軟且具有非破壞性而更佳，因此，具有在 133675.doc 200925231 0-5 MPa以下之低壓下亦可接續，不會破壞軟性基材上ιτ〇 或ΙΖΟ電極之優點。 本發明之接著劑，接著劑中含有導電粒子〇1體積％以上 未達30體積％之情形’可作為顯示各向異性導電性之導電 性接著劑（以下稱為”各向異性導電性接著劑"）使用。導電 粒子之3有量，若為0.5〜15體積％則更佳。導電粒子之體 • ㈣’可先敎接著劑之質量，再從比重換算。另，各向 ❹ #丨生導電性接著劑可以糊狀或膜狀之任-形態使用。 以膜狀使用之情形，接著劑之厚度較好為1〇 以上5〇 μηι以下，以13 μηι以上3 5 以下更佳。 以糊狀使用之㈣，較好使用適當溶劑或反應性稀釋劑 調整至適當黏度後使用。作為稀釋劑，較好使用液狀之雙 酚Α型環氧樹脂或雙酚F型環氧樹脂或不影響硬化劑之溶 劑。作為溶劑，較好含有例如甲苯、醋酸乙酯、7 —丁内 酯等。溶劑等，不算入本發明之接著劑之裝料體積％。 〇 具有第—導電電極之基材，例如FPC，或f子構件例如 以1C晶片為代表之電子構件使用各向異性導電性接著劑接 續於具有第二導電電極之基材上之情形，具有第二導電電 ' 極之基材上使用佈膠器或注射器將各向異性導電性接著劑 . 適量塗佈，具有第一導電電極之基材或電子構件，與具有 第二導電電極之基材之對向電極對位後自I有第一導電電 極之基材或電子構件側加熱使之硬化之方法較佳。另，藉 由該方法，可得到具有第一導電電極之基材與具有第二導 電電極之基材之接合體。 133675.doc 200925231 具有各向異性導電性 樣，於且有 者劑以臈狀使用之情形亦同 :、有第二導電電極之基材上貼膜’藉由ιι〇〜⑼。c =〇.2;lMPa之加錢之硬化之方法較佳。另，藉 電電極之其：到具有第一導電電極之基材與具有第二導 罨電極之基材之接合體。 具有第—導電電極之基材、電子構件、及具有第二導電 4之基材上所設之電極，較好為含有從助、銅、金、 ❹Further, a known decane coupling agent, a titanium coupling agent, or an aluminum coupling agent can be used as needed. As the decane coupling agent, for example, Kbm4〇3, KBE403, KBE9103, KBM9103, KBM903, KBE903, KBE573, KBM573, or the like can be used. As the coupling agent, it is preferably from 〇1 to 10% by volume per 1 volume of the adhesive. Further, the adhesive of the present invention contains conductive particles. The average particle diameter of the conductive particles is preferably from 1 to 20 μη. Further, from the viewpoint of workability when the film is formed as an adhesive, it is preferably 2 μm or less. From the heating connection (4), the height deviation between the electrodes is obtained, and a sufficient electrical connection point is obtained, and σ, the average particle diameter is better than 〖1 以上 or less. Further, 2 Mm or more U) μ is better. The average particle diameter of the conductive particles is a numerical value of the cumulative value of the cumulative particle size distribution of 5 〇% by the laser diffraction of the air flow type particle size distribution meter (Lion QS SR). As the conductive particles, known conductive particles can be used. As the conductive particles, for example, 'plastic particles are plated with nickel or gold, copper, silver particles ==, silver, nickel, gold, tin, solder, non-lead solder powder or particles coated with such a person. Among them, the metal particles 'especially steel, silver, copper...the mouth gold is soft and non-destructive and more preferably, so it can be connected at a low pressure below 133675.doc 200925231 0-5 MPa without breaking the soft base. The advantages of the material on the material. In the adhesive of the present invention, when the conductive particles contain 1% by volume or more of the conductive particles 未 less than 30% by volume, the conductive adhesive can be used as an anisotropic conductive adhesive (hereinafter referred to as "anisotropic conductive adhesive" ") Use. The amount of conductive particles is preferably 0.5 to 15% by volume. The body of conductive particles • (4) 'The mass of the adhesive can be used first, and then converted from specific gravity. The raw conductive adhesive may be used in the form of a paste or a film. When used in the form of a film, the thickness of the adhesive is preferably 1 Å or more and 5 〇 μη or less, and more preferably 13 μηη or more and 3 5 or less. It is used in the form of a paste (4), and it is preferably used after adjusting to an appropriate viscosity with a suitable solvent or a reactive diluent. As a diluent, a liquid bisphenol quinone type epoxy resin or a bisphenol F type epoxy resin is preferably used or not. The solvent which affects a hardening agent. The solvent preferably contains, for example, toluene, ethyl acetate, 7-butyrolactone, etc. The solvent and the like do not count as the charge volume % of the adhesive of the present invention. Material, such as FPC, or f The sub-member, for example, an electronic component typified by a 1C wafer is connected to the substrate having the second conductive electrode using an anisotropic conductive adhesive, and a cloth coater or a syringe is used on the substrate having the second conductive electric electrode. An anisotropic conductive adhesive is applied in an appropriate amount to a substrate or an electronic member having a first conductive electrode, and a base of the first conductive electrode from I after aligning with a counter electrode of the substrate having the second conductive electrode Preferably, the method of hardening the material or the electronic component side to harden it is obtained. Further, by this method, a bonded body of the substrate having the first conductive electrode and the substrate having the second conductive electrode can be obtained. 133675.doc 200925231 The opposite polarity is conductive, and the same is used in the form of a crucible: the film is coated on the substrate with the second conductive electrode 'by ιι〇~(9).c=〇.2; lMPa Preferably, the hardening method is: a bonding body of the substrate having the first conductive electrode and the substrate having the second conductive electrode; the substrate having the first conductive electrode, the electronic component, and a base having a second conductivity 4 The upper electrode is provided, preferably containing from promoter, copper, gold, ❹ The
m錫、烊mIZ0中選出！種以上之成 分所構成之電極。該情形，第一導電電極與第二導電電極 可為相同亦可不相同。 此外，本發明之各向異性導電性接著劑中，具有第一導 電電極之基材、及具有第二導電電極之基材中至少一方可 使用缺乏耐熱性之軟性純。缺乏耐隸之軟性基材係無 法承受16(TC以上加熱之基材，例如pET膜、1>(：膜。 另，本發明之接著齊！，使接著劑中含有_電粒子30〜80 體積％ ’可作為導電性接著劑使用。導電粒子之含有量， 更好為40體積。/。〜60體積〇/〇。 具有第一導電電極之基材，例如Fpc，或電子構件例如 以1C晶片為代表之電子構件，使用導電性接著劑接續於具 有第二導電電極之基材上之情形’可使用將導電性接著劑 藉由塗佈或印刷於具有第一導電電極之基材或電子構件或 具有第二導電電極之基材之電極上而附著，在i 1〇〜丨5〇乞 下加熱硬化之方法。此時，根據需要可以〇 2〜3 加 壓。另，藉由該方法，可得到具有第一導電電極之基材、 133675.doc •12· 200925231 具有第二導電電極之基材’及接著劑之接合體。 例如，對於使用缺乏对熱性之膜之軟性基材上之^〇電 極接續，即使在1501以下之低溫接續時，亦可得到接著 性優良之接合體。 特別是’作為具有接續電極之基板，使用具有於聚亞醯 錢脂層積層銅箱構成之2層聚亞酿胺軟性基板，作為具 有被接續電極之基材，使用稱為聚對苯二甲酸乙二酉旨 ❹ （PET)膜或聚碳酸醋㈣、聚蔡二甲酸乙二醋（PEN)、聚乙 硫醚(PES)之透明性高耐熱性低之臈基材(特別是，ρΕτ、 PC膜）之基材之間適宜使用本發明之接著劑進行接合。 以下’對本發明之㈣態樣之具體例基於實施例進行說 明。 實施例及比較例所用之接著劑之原料成分如下所述。 雙盼A型環氧樹脂（旭化成化學（株）製、aer26〇〇) 雙酚F型環氧樹脂（日本化藥（株）製1^_3〇3§) 〇 萘型環氧樹脂（大曰本油墨（株）製HP-4〇32D) 四甲基雙酚型環氧樹脂（日本環氧樹脂公司製γχ4〇〇〇κ) 一環戊二烯型環氧樹脂（大曰本油墨（株）製HP7200) 雙齡Α型環氧樹脂（INCHEM(株）製PKHC、PKFE、ΡΚΗΒ) ' 多元醇變性苯氧基樹脂（INCHEM(株）製PKHM301) '曰在^硬化劑（旭化成化學（株）製HX3932HP微囊型咪唑（潛 在性硬化劑）） # 劑越化學（株）製 KBM403、KBM903) 石嗣黏者劑（東麗道康寧社製SD4580、SD4560) 133675.doc -13- 200925231 (平均重量分子量20至50萬） KMP594石夕綱橡膠粒子（信越化學社製）（平均重量分子量 >100 萬） 環氧變性矽酮樹脂（東麗道康寧社製BY i 6_855) 丙烯酸樹脂（三菱嫘縈公司製Dianal) (導電粒子） 銀銅合金粉平均3μπι 鑛金塑料粒子平均8 μηι 鑛金/錄銅粒子平均10 μηι <實施例1〜6> 以[表1 ]所示之比例將組成1、2、3、4、5、6使用醋酸乙酿 溶劑塗佈於厚50 μ之PET上，於60°C空氣中乾燥10分鐘， 醋酸乙酯之溶劑揮發。如此，做成35 μΓη厚之各向異性導 電性接著劑。 另’作為試驗接續基材，使用下述基材。 (具有第一導電電極之基材） 附著銅箔之聚亞醯胺軟性基板（2層型）(200 μ間距銅箔配線 上實施表面鍍鎳金者） (具有第二導電電極之基材） PET膜上設ΙΤΟ電極之基材（300 Ω薄膜電阻V實施例1 PET膜上設ITO電極之基材（300 Ω薄膜電阻）/實施例2 PC膜上設IZO電極之基材（300 Ω薄膜電阻V實施例3 PC膜上設IZO電極之基材（300 Ω薄膜電阻V實施例4 PC膜上設IZO電極之基材（300 Ω薄膜電阻V實施例5 133675.doc •14· 200925231 PC膜上設ΙΖΟ電極之基材（扇叫膜電阻實施例6 將前述具有第-導電電極之基材與具有第二導電電極之基 材使用各向異性導電性接著劑接合。 接合Μ具有第二㈣電極之基材上貼著膜狀各向異性 導電性接著劑，從作為具有第一導電電極之基材之前述軟 性基材側以戰、3〇秒、_前部加熱加壓 進行。 對如此得到之接合體進行初期接續電阻值及接續信賴性 測試後濕度85% 2〇〇小時放置後）之電阻值進行評 價。 接績電阻使用日置9455型萬用表以4端子法測定。測定 係對聚亞酿胺側之-對銅落之電阻進行續測定求出平均 值。結果如[表2]所示。 對於初期接續電阻值，50 Ω以下之情形為"良好"，超過 50 Ω之情形為"不良"。 ❹ 對於接續信賴性測試後之電阻值’接續電阻值超過_ =::Γ信賴性為"不良"，100Ω以下鄭 仏賴性為"良好"。 =著：試驗’初期接著性及前述接續信 用島津製作所所製之萬能材料試驗機AGS-50以 拉伸速度_ mm/min，9G度剝離條件進行測I 期接著性在0.5 kgf/Cm以上之情形為，·良好” 測試後之接著性在o.4kgf/cm以上之情形為”良:續信賴性 <比較例1、2> 133675.doc 200925231 以[表1]所示之比例製作組成7、8’使用棒狀塗佈器塗 佈於厚50 _之而膜上，於_乾燥1()分鐘得⑽卿厚 之膜狀各向異性導電性接著劑。 作為試驗接續基材，使用下述基材。 (具有第一導電電極之基材） 附著銅箱之聚亞醯胺軟性基板（於2〇〇 μηι間距之銅羯上 實施表面鍍鎳金者） ❹M tin, 烊mIZ0 selected! An electrode composed of the above components. In this case, the first conductive electrode and the second conductive electrode may be the same or different. Further, in the anisotropic conductive adhesive of the present invention, at least one of the substrate having the first conductive electrode and the substrate having the second conductive electrode may be softly pure in which heat resistance is lacking. A substrate that lacks resistance to softness cannot withstand 16 (the substrate heated by TC or higher, such as pET film, 1> (: film. In addition, the present invention is completed!, the adhesive contains _ electric particles 30 to 80 volumes) % ' can be used as a conductive adhesive. The content of the conductive particles is more preferably 40 vol. / 60 vol / 〇. A substrate having a first conductive electrode, such as Fpc, or an electronic member such as a 1C wafer. For the electronic component represented, the use of a conductive adhesive is continued on the substrate having the second conductive electrode. A conductive adhesive can be used by coating or printing on a substrate or an electronic component having the first conductive electrode. Or a method of adhering to the electrode of the substrate having the second conductive electrode and heating and hardening under i 1 〇 to 丨 5 。. At this time, 〇 2 to 3 may be pressurized as needed. A substrate having a first conductive electrode, a substrate of 133675.doc • 12·200925231 having a second conductive electrode and an adhesive can be obtained. For example, for a soft substrate using a film lacking heat, ^ 〇 electrode connection, ie When the temperature is 1501 or less, it is possible to obtain a bonded body having excellent adhesion. In particular, 'as a substrate having a continuous electrode, a two-layer poly-branched amine soft substrate having a copper layer laminated with a poly-aluminum layer is used. As a substrate having a connected electrode, a film called polyethylene terephthalate (PET) film or polycarbonate (4), polychlorinated diacetate (PEN), polyethyl sulfide (PES) is used. The base material of the base material (particularly, ρΕτ, PC film) having high transparency and high heat resistance is preferably joined by using the adhesive of the present invention. The following is a specific example of the (four) aspect of the present invention based on the examples. The raw material components of the adhesives used in the examples and the comparative examples are as follows. The double-prepared A-type epoxy resin (aer26〇〇, manufactured by Asahi Kasei Chemicals Co., Ltd.) bisphenol F-type epoxy resin (Nippon Chemicals ( ^ 型 § § § § § § § § § § § § § § § § § § § § § § § § § HP HP HP HP HP HP HP HP HP HP HP HP HP HP HP HP HP HP HP 〇κ) A cyclopentadiene type epoxy resin (HP720 manufactured by Otsuka Ink Co., Ltd.) 0) Double-aged epoxy resin (PKHC, PKFE, ΡΚΗΒ made by INCHEM Co., Ltd.) 'Polyol-denatured phenoxy resin (PKHM301, manufactured by INCHEM Co., Ltd.) HX3932HP microcapsule-type imidazole (potential sclerosing agent) # 越 化学 化学 KB KB KB KB KB KB KB KB KB KB KB KB KB KB KB 403 133 133 133 133 133 133 133 133 133 133 133 133 133 133 133 133 133 133 133 133 133 133 133 133 133 133 133 133 133 133 133 133 133 133 133 133 133 133 133 133 133 133 133 133 200 to 500,000) KMP594 Shishigang rubber particles (manufactured by Shin-Etsu Chemical Co., Ltd.) (average weight molecular weight > 1 million) Epoxy-modified fluorenone resin (BY i 6_855, manufactured by Toray Dow Corning Co., Ltd.) Acrylic resin (Mitsubishi Corporation) Dianal) (conductive particles) silver-copper alloy powder average 3μπι mineral gold plastic particles average 8 μηι mine gold / recorded copper particles average 10 μηι <Examples 1 to 6> The composition shown in [Table 1] will be composed 1, 2 3, 4, 5, and 6 were coated on a 50 μ thick PET using an acetic acid solvent, and dried in air at 60 ° C for 10 minutes, and the solvent of ethyl acetate was evaporated. Thus, an anisotropic conductive adhesive of 35 μΓ thick was formed. Further, as a test splicing substrate, the following substrate was used. (Substrate having a first conductive electrode) Polyimide soft substrate (two-layer type) to which a copper foil is attached (a nickel-plated surface is applied to a 200 μ pitch copper foil wiring) (a substrate having a second conductive electrode) A substrate with a ruthenium electrode on the PET film (300 Ω film resistance V Example 1 A substrate with an ITO electrode on the PET film (300 Ω film resistance) / Example 2 A substrate with an IZO electrode on the PC film (300 Ω film) Resistor V Example 3 Substrate with IZO electrode on PC film (300 Ω thin film resistor V Example 4 Substrate with IZO electrode on PC film (300 Ω thin film resistor V Example 5 133675.doc •14· 200925231 PC film Substrate having a ruthenium electrode (fan-film resistance Example 6) The substrate having the first conductive electrode and the substrate having the second conductive electrode are bonded using an anisotropic conductive adhesive. The bonding Μ has a second (four) A film-shaped anisotropic conductive adhesive is applied to the substrate of the electrode, and the soft substrate side of the substrate having the first conductive electrode is heated and pressurized in a warp, 3 sec, and _ front portion. The obtained bonded body is subjected to initial connection resistance value and continuity reliability test The resistance value of 85% of the humidity was measured after 2 hours of storage. The electrical resistance of the resistor was measured by the 4-terminal method using a Nitte 9455-type multimeter. The measurement was performed on the side of the poly-branched amine to determine the resistance of the copper drop. The average value is shown in [Table 2]. For the initial connection resistance value, the case of 50 Ω or less is "good", and the case of more than 50 Ω is "bad". ❹ For the subsequent reliability test The resistance value 'connected resistance value exceeds _ =:: Γ reliability is "bad", 100 Ω or less Zheng Zheng Lai is "good". =: test 'initial adhesion and the above-mentioned continuation of credit Shimadzu Manufacturing Co., Ltd. The universal material testing machine AGS-50 is measured at a tensile speed of _ mm/min and a 9G peeling condition. The first-stage adhesion is above 0.5 kgf/cm, and the goodness is after the test. The adhesion is at o.4kgf/ The case of cm or more is "good: continuous reliability"; Comparative Example 1, 2 > 133675.doc 200925231 Compositions 7 and 8' are produced at a ratio shown in [Table 1] using a bar coater applied to a thickness of 50 _ On the film, _ dry 1 () minutes to obtain (10) thick filmy anisotropic guide Electrical adhesive. As a test substrate, the following substrate was used: (Substrate with first conductive electrode) Polyimide soft substrate to which a copper box was attached (surface was applied on a copper crucible with a pitch of 2 μm Nickel-plated gold) ❹
(具有第二導電電極之基材） PC膜上設ΙΖ0電極之基材（300 Ω薄膜電阻比較例i PC臈上設IZO電極之基材（300 Ω薄膜電阻）/比較例2 與實施例1相同，前述之具有第一導電電極之基材與具 有第一導電電極之基材接合，對所得到之接合體之初期接 續電阻值及接續信賴性測試後之電阻值進行評價^結果如 [表2]所示。 <實施例7、8> 以[表3 ]所示之比例製作組成9、1 〇，得到導電性接著 劑。 作為試驗接續基材，使用下述基材。 (具有第一導電電極之基材） 片狀電容器/實施例7 IC(金凸塊）/實施例8 (具有第二導電電極之基材） PET膜上設ITO電極之基材（300 Ω薄膜電阻）/實施例7 PET膜上設ITO電極之基材（300 Ω薄膜電阻）/實施例8 I33675.doc -16· 200925231 接σ係藉由於具有第二導電電極之基材上塗佈導電性接 著劑&具有第—導電電極之基材之前述軟性基材側以 6 〇 %/'、〇 · 5 MPa、ι·5 mm前部加熱加壓進行。 對如此侍到之接合體進行與實施例1相同之初期接續電 阻值及L賴性測試後之電阻值評價。結果如[表4]所示。同 樣地’使用組成7之實驗結果如[表4]之比較例3所示。 料導電性接著_價基準，對於初期接續電阻值，i ❹ ⑽下之情形為"良好·•，超…Ω之情形V，不良"。對於接 續信賴性測試後（85°C濕度85% 200小時放置後）之電阻 值，接續電阻值超過10 Ω之情形，接續信賴性為"不”， 接續電阻值在1〇Ω以下之情形，接續信賴性為"良好/ 對於接著性試驗，初期接著性及前述接續信賴性 接著性㈣島津製作㈣製之萬崎料料機他伽 拉伸速度100 mm/min，90度剝離條件進行測定。此 期接著性在1 kgf/cm以上之情形為"良好" 時初 ❹ 試後之接著性在0.5 kgf/cm以上之情形為"良好"。員1'生測 133675.doc 200925231(Substrate having second conductive electrode) Substrate with ΙΖ0 electrode on PC film (300 Ω thin film resistor Comparative Example i Substrate with IZO electrode on PC ( (300 Ω thin film resistor) / Comparative Example 2 and Example 1 Similarly, the substrate having the first conductive electrode is bonded to the substrate having the first conductive electrode, and the initial connection resistance value of the obtained bonded body and the resistance value after the continuity reliability test are evaluated. 2]. Examples 7 and 8> Compositions 9 and 1 were prepared at a ratio shown in [Table 3] to obtain a conductive adhesive. The following substrate was used as a test-bonding substrate. Substrate of a conductive electrode) Chip capacitor / Example 7 IC (gold bump) / Example 8 (Substrate with second conductive electrode) Substrate with ITO electrode on PET film (300 Ω thin film resistor) / Example 7 Substrate with ITO electrode on PET film (300 Ω thin film resistor) / Example 8 I33675.doc -16· 200925231 σ is based on coating a conductive adhesive & on a substrate having a second conductive electrode The soft substrate side of the substrate having the first conductive electrode is 6 〇%/', 5 MPa, ι·5 mm was heated and pressurized in the front. The joined body thus obtained was subjected to the same initial resistance value as in Example 1 and the resistance value after the L-dependent test. The results are as shown in [Table 4]. Similarly, the experimental results using composition 7 are as shown in Comparative Example 3 of [Table 4]. The conductivity of the material is then based on the valence value, and for the initial splicing resistance value, the case under i ❹ (10) is "good·• , super... Ω situation V, bad ". For the resistance value after the continuity test (85 °C humidity 85% 200 hours after placement), the connection resistance value exceeds 10 Ω, the connection reliability is " ", the connection resistance value is less than 1 〇 Ω, and the reliability is "good" / for the adhesion test, the initial adhesion and the continuation of the reliability follow-up (4) Shimadzu production (four) system of the Makizaki material feeder Tamar The elongation speed is 100 mm/min and the 90-degree peeling condition is measured. In the case where the adhesion is above 1 kgf/cm, the condition is "good". The initial adhesion after the test is 0.5 kgf/cm or more. ;Good ". 1' live test 133675.doc 200925231
oG hi 其他 (體積％) KBM903 0.60% KBM403 0.10% KBM903 0.03% KBM903 0.40% KBM903 0.40% KBM903 0.40% KBM903 0.40% KBM903 0.40% 1 導電粒子 (體積％) 鍍金塑料粒子 0.20% 鍍金鎳銅粒子 6.50% 銅銀合金粉末 1.90% 銅銀合金粉末 1.70% 銅銀合金粉末 1.70% 銅銀合金粉末 1.70% 銅銀合金粉末 1.70% 銅銀合金粉末 1.70% 硬化劑 (體積％) HX3932 33% HX3932 37% HX3932 28% HX3932 35% HX3932 35% HX3932 35% HX3932 34% HX3932 35% 苯氧基樹脂 (體積％) PKFE 33% PKHB 12% PKHC 13% PKHC 36% PKHM301 13% PKHC 29% PKHM301 8.60% PKHC 33% PKHM301 8.60% 1 PKHC 33% PKHM301 8.60% PKHC 36% PKHM301 11.60% PKHC 29% PKHM301 8.60% 環氧樹脂 (體積％) sp 0s Λ ©Ν Ο On — »—< CS w白§ ώ 〇H pL] 2 ffi < —ON Ο 〇 Ui § s § Ms g A葵 〇 »—· 〇 ^ § § 8 <d ^ ffi 0 ^ ^ —CN — 〇 o 〇 sgg ω >< ein < ffi 0 ^ ^ 一 rs 一 〇 | § 8 tu >< P-. <> X 0 ^ ^ ^ o o 弇q 1 —CN — 〇 § § g sgg ⑪s 0 ^ ^ 以2 T—t CS r-H 〇 § § § W >< &H <> K 0 ^ ^ ^ o o —(N — 〇 O 〇 ¢-¾ o § 矽酮黏著劑 (體積％) SD4580 0.10% SD4560 9% 1 1 SD4560 10% SD4580 5% KMP594 5% BY16-855 5% m DIANAL* 5% 1 組成1 組成2 組成3 組成4 組成5 組成6 組成7 組成8 aw4vrol^，-e^4-«)#^^w#^^I^¥^^0^-#^^^^^^TVNVIa* 133675.doc •18- 200925231oG hi Other (% by volume) KBM903 0.60% KBM403 0.10% KBM903 0.03% KBM903 0.40% KBM903 0.40% KBM903 0.40% KBM903 0.40% KBM903 0.40% 1 Conductive particles (% by volume) Gold-plated plastic particles 0.20% Gold-plated nickel-copper particles 6.50% Copper Silver alloy powder 1.90% Copper-silver alloy powder 1.70% Copper-silver alloy powder 1.70% Copper-silver alloy powder 1.70% Copper-silver alloy powder 1.70% Copper-silver alloy powder 1.70% Hardener (% by volume) HX3932 33% HX3932 37% HX3932 28% HX3932 35% HX3932 35% HX3932 35% HX3932 34% HX3932 35% Phenoxy resin (% by volume) PKFE 33% PKHB 12% PKHC 13% PKHC 36% PKHM301 13% PKHC 29% PKHM301 8.60% PKHC 33% PKHM301 8.60% 1 PKHC 33% PKHM301 8.60% PKHC 36% PKHM301 11.60% PKHC 29% PKHM301 8.60% Epoxy resin (% by volume) sp 0s Λ ©Ν Ο On — »—< CS w white § ώ 〇H pL] 2 ffi < ; —ON Ο 〇Ui § s § Ms g A 〇 —»—· 〇^ § § 8 <d ^ ffi 0 ^ ^ —CN — 〇o 〇sgg ω >< ein < ffi 0 ^ ^ Rs 〇 〇 § 8 tu >< P-. <> X 0 ^ ^ ^ oo 弇q 1 —CN — 〇§ § g sgg 11s 0 ^ ^ to 2 T —t CS rH 〇§ § § W ><&H<> K 0 ^ ^ ^ oo —(N — 〇O 〇¢-3⁄4 o § ketone adhesive (% by volume) SD4580 0.10% SD4560 9% 1 1 SD4560 10% SD4580 5% KMP594 5% BY16-855 5% m DIANAL* 5% 1 Composition 1 Composition 2 Composition 3 Composition 4 Composition 5 Composition 6 Composition 7 Composition 8 aw4vrol^, -e^4-«) #^^w#^^I^¥^^0^-#^^^^^^TVNVIa* 133675.doc •18- 200925231
133675.doc rj % B ε a S a Β B S m Si 癍 ο ¢5 CJ) g r> 00 00 ο5 寸 »-Η 寸 r^ ^) 00 r-H Μ ^ S1 岽 索 本 岽 索 jnU % j^l Jtti>{ ^L AiV^ κ- K- 璁 B B B s B B 6 s 濰 本〇 索1 ^ 〇〇 象4° 索<N .00 〇 eg κ- ^ *33 绒 Μ 岽 岽 岽 岽 泶 e坶 雄茛 AiV^ J^i K- ¥ 8βί Vpi 球 璁 琢 岽 索 來 岽 岽 本 岽 岽 j^d #ί jni>j CA m 寸 yn VO 卜 00 钟？ 球 鹿 崩 崩 $ ® ? ® ® ϊ il«fnT tp〇r ㈣ 輕 #P 辆）槊 5 S 5 5 5 愚 ^ *r 鍩 淫 鸽 锘 鸽 m $ 嫿 瘤 嫿 键 饍 嫿 饍 饍 你：i KH ΚΗ «Η 鉍 鉍 鉍 鉍 龄 龄 核 ㈣ Ί 妹 S W璁 g\ Η Η gs § Η N N gv N N Ν ojc ω CL, W Ph U Ph U Ph υ ο-. U (¾ U PL, υ Dh 军 (S 系 m 寸 军 in τ·^ <N 诺 省 鸯 鸯 辑 省 齡 餘 赛Βζ IK λ3 -19- 200925231 [表3] 碎黏著劑 (體積％) 環氧樹脂 (體積％) 苯氧基樹脂 (體積％) 硬化劑 (體積％) 導電粒子 (體積％) 其他 (體積％) 組成9 SD4580 5% AER2600 10% HP3042D 3% YX4000K 3% PKHB 14% HX3932 5% 銅銀粉末 60% 醋酸乙酯 組成10 SD4560 1% RE-303S 16% AER2600 5% HP7200 2% PKHB 6% HX3932 15% 鍍金塑料粒 子 55% 醋酸乙酯133 675 133 m m m m m m m m Jtti>{ ^L AiV^ κ- K- 璁BBB s BB 6 s 〇本〇索 1 ^ 4 4° cable<N .00 〇eg κ- ^ *33 velvet 岽岽岽岽泶e坶雄茛AiV^ J^i K- ¥ 8βί Vpi ball 璁琢岽 岽岽 岽岽 岽岽 j^d #ί jni>j CA m inch yn VO 00 00 clock? Ball deer collapse $ ® ® ® ® ϊ il«fnT tp〇r (4) Light #P 槊5 S 5 5 5 愚^ *r 鍩 锘 锘 m $ $ $ m m m m m m m m m m m m : : : : : : : : : KH ΚΗ «Η 铋铋铋铋 龄 核 (4) 璁 璁 SW璁g\ Η Η gs § Η NN gv NN Ν ojc ω CL, W Ph U Ph U Ph υ ο-. U (3⁄4 U PL, υ Dh Army (S series m inch army in τ·^ <N Nobel province 省 省 省 IK IK λ3 -19- 200925231 [Table 3] broken adhesive (% by volume) epoxy resin (% by volume) phenoxy Resin (% by volume) Hardener (% by volume) Conductive particles (% by volume) Others (% by volume) Composition 9 SD4580 5% AER2600 10% HP3042D 3% YX4000K 3% PKHB 14% HX3932 5% Copper silver powder 60% ethyl acetate Composition 10 SD4560 1% RE-303S 16% AER2600 5% HP7200 2% PKHB 6% HX3932 15% gold-plated plastic particles 55% ethyl acetate
[表4] 具有第二導 電電極之基 材(接續電極） 具有第一導 電電極之基 材(接續電 極） 接著劑 接合體試驗 接著性試驗 初期 接續 性 接續信 賴性測 試後 初期接 著性 接續信賴 性測試後 接著性 實施例7 PET(ITO) 鍍錫電極 組成9 良好 良好 良好 2kgf 良好 1.3 kgf 實施例8 PET(ITO) 金凸塊 組成10 良好 良好 良好 3 kgf/cm 良好 2.1 gf 比較例3 PET(ITO) 金凸塊 組成7 良好 不良 不良 550 gf 不良 <100 gf 產業上之利用可能性 本發明之接著劑，可用於電子紙、耐磨式顯示器、有機 EL或液晶之軟性顯示器、電子構件於軟性基材上之安裝 等。 133675.doc 20-[Table 4] Substrate having a second conductive electrode (splicing electrode) Substrate having a first conductive electrode (splicing electrode) Substitute bonded body test Adhesion test Initial continuity continuation reliability test Test followed by Example 7 PET (ITO) Tin-plated electrode composition 9 Good good good 2 kgf Good 1.3 kgf Example 8 PET (ITO) Gold bump composition 10 Good good good 3 kgf/cm Good 2.1 gf Comparative Example 3 PET ( ITO) Gold bump composition 7 Good defect 550 gf Poor <100 gf Industrial use possibility The adhesive of the present invention can be used for electronic paper, wear-resistant display, organic EL or liquid crystal flexible display, electronic component Installation on a soft substrate, etc. 133675.doc 20-