TWI347648B - - Google Patents
Info
- Publication number
- TWI347648B TWI347648B TW094118820A TW94118820A TWI347648B TW I347648 B TWI347648 B TW I347648B TW 094118820 A TW094118820 A TW 094118820A TW 94118820 A TW94118820 A TW 94118820A TW I347648 B TWI347648 B TW I347648B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67376—Closed carriers characterised by sealing arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67383—Closed carriers characterised by substrate supports
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004174035A JP4667769B2 (ja) | 2004-06-11 | 2004-06-11 | 基板収納容器 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200605261A TW200605261A (en) | 2006-02-01 |
TWI347648B true TWI347648B (zh) | 2011-08-21 |
Family
ID=34941644
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094118820A TW200605261A (en) | 2004-06-11 | 2005-06-07 | Container of substrate |
Country Status (5)
Country | Link |
---|---|
US (1) | US7344031B2 (zh) |
EP (1) | EP1605496B1 (zh) |
JP (1) | JP4667769B2 (zh) |
KR (1) | KR101008867B1 (zh) |
TW (1) | TW200605261A (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8857619B1 (en) | 2013-09-30 | 2014-10-14 | Taiwan Semiconductor Manufacturing Co., Ltd | Mechanisms for wafer pod and pod door |
US9184077B2 (en) | 2013-09-30 | 2015-11-10 | Taiwan Semiconductor Manufacturing Co., Ltd | Wafer pod and wafer positioning mechanism thereof |
TWI642604B (zh) * | 2013-05-29 | 2018-12-01 | 未來兒股份有限公司 | Substrate storage container |
Families Citing this family (54)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060042998A1 (en) * | 2004-08-24 | 2006-03-02 | Haggard Clifton C | Cushion for packing disks such as semiconductor wafers |
JP4584023B2 (ja) * | 2005-05-17 | 2010-11-17 | 信越ポリマー株式会社 | 基板収納容器及びその製造方法 |
US20070175792A1 (en) * | 2006-02-02 | 2007-08-02 | Barry Gregerson | Magnetic seal for wafer containers |
JP5025962B2 (ja) * | 2006-02-15 | 2012-09-12 | ミライアル株式会社 | 薄板収納容器 |
US8292081B2 (en) | 2006-05-29 | 2012-10-23 | Shin-Etsu Polymer Co., Ltd. | Substrate storage container |
JP5385130B2 (ja) * | 2006-06-13 | 2014-01-08 | インテグリス・インコーポレーテッド | ウェハ収納容器用の再利用可能な弾性クッション |
TWI303618B (en) * | 2006-08-10 | 2008-12-01 | Gudeng Prec Industral Co Ltd | Metal photomask box |
JP4800155B2 (ja) * | 2006-09-04 | 2011-10-26 | 信越ポリマー株式会社 | 基板収納容器及び逆止弁 |
KR101472145B1 (ko) * | 2006-11-07 | 2014-12-12 | 신에츠 폴리머 가부시키가이샤 | 기판 수납 용기 |
JP4920387B2 (ja) * | 2006-12-01 | 2012-04-18 | 信越半導体株式会社 | 基板収納容器 |
DE202007003416U1 (de) * | 2007-03-04 | 2007-05-31 | Jonas & Redmann Automationstechnik Gmbh | Automatisierungscarrier für Substrate, insbesondere für Wafer zur Herstellung siliziumbasierter Solarzellen |
CN101855716B (zh) * | 2007-11-09 | 2012-07-11 | 信越聚合物株式会社 | 保持器以及基板收纳容器 |
JP4764865B2 (ja) * | 2007-11-13 | 2011-09-07 | 信越ポリマー株式会社 | リテーナ及び基板収納容器 |
CN101981684B (zh) * | 2008-01-13 | 2013-01-30 | 诚实公司 | 用于大直径晶片运输的方法和设备 |
JP4980252B2 (ja) * | 2008-01-15 | 2012-07-18 | 信越ポリマー株式会社 | 基板収納容器及びそのシールガスケットの取り付け方法 |
JP5084573B2 (ja) * | 2008-03-18 | 2012-11-28 | 信越ポリマー株式会社 | 基板収納容器 |
JP5184198B2 (ja) * | 2008-05-01 | 2013-04-17 | 信越ポリマー株式会社 | 基板収納容器 |
TWI337162B (en) * | 2008-07-31 | 2011-02-11 | Gudeng Prec Industral Co Ltd | A wafer container with constraints |
US7971722B2 (en) * | 2008-08-08 | 2011-07-05 | Gudeng Precision Industral Co, Ltd | Wafer container with restrainer |
TWI400766B (zh) * | 2008-08-27 | 2013-07-01 | Gudeng Prec Industral Co Ltd | 具一體成形晶圓限制件模組之前開式晶圓盒 |
TWI343353B (en) * | 2008-11-04 | 2011-06-11 | Gudeng Prec Industral Co Ltd | A wafer container having the snap-fitting constraint module |
KR101165613B1 (ko) * | 2009-05-13 | 2012-07-16 | 미라이얼 가부시키가이샤 | 반도체 웨이퍼 수납용기 |
CN102939254A (zh) * | 2010-02-19 | 2013-02-20 | 信越聚合物株式会社 | 基板收纳容器 |
MY159162A (en) | 2010-03-11 | 2016-12-30 | Entegris Inc | Thin wafer shipper |
KR101165611B1 (ko) * | 2010-04-20 | 2012-07-16 | 미라이얼 가부시키가이샤 | 기판수납용기 |
KR101708087B1 (ko) * | 2010-04-22 | 2017-02-17 | 신에츠 폴리머 가부시키가이샤 | 기판 수납 용기 |
KR101129486B1 (ko) * | 2010-05-24 | 2012-03-29 | 미라이얼 가부시키가이샤 | 기판수납용기 |
JP5459787B2 (ja) * | 2010-06-17 | 2014-04-02 | 信越ポリマー株式会社 | 基板収納容器 |
USD740031S1 (en) * | 2010-10-19 | 2015-10-06 | Entegris, Inc. | Substrate container |
USD668865S1 (en) * | 2010-10-19 | 2012-10-16 | Entegris, Inc. | Substrate container |
KR101899614B1 (ko) * | 2010-10-20 | 2018-09-17 | 엔테그리스, 아이엔씨. | 도어 가이드 및 밀봉부를 갖는 웨이퍼 컨테이너 |
JP5583058B2 (ja) * | 2011-03-09 | 2014-09-03 | 信越ポリマー株式会社 | 基板収納容器 |
JP6214630B2 (ja) | 2012-05-04 | 2017-10-18 | インテグリス・インコーポレーテッド | ウェーハを支える交換可能なバックストップ |
EP2845224B1 (en) * | 2012-05-04 | 2020-07-01 | Entegris, Inc. | Wafer container with door mounted shipping cushions |
WO2014080454A1 (ja) * | 2012-11-20 | 2014-05-30 | ミライアル株式会社 | 基板収納容器 |
JP5988854B2 (ja) * | 2012-12-11 | 2016-09-07 | 信越ポリマー株式会社 | 基板収納容器 |
KR102098306B1 (ko) * | 2013-02-20 | 2020-04-08 | 삼성디스플레이 주식회사 | 기판 수납 장치 |
CN105993067B (zh) | 2013-04-26 | 2019-04-16 | 恩特格里斯公司 | 用于大直径晶片的具有锁止机构的晶片容器 |
KR102113139B1 (ko) * | 2013-09-11 | 2020-05-20 | 미라이얼 가부시키가이샤 | 기판수납용기 |
TWM491030U (zh) * | 2014-03-14 | 2014-12-01 | Gudeng Prec Ind Co Ltd | 晶圓收納盒及其氣密構件 |
JP6326330B2 (ja) * | 2014-09-05 | 2018-05-16 | 株式会社Screenホールディングス | 基板収納容器、ロードポート装置および基板処理装置 |
WO2016046985A1 (ja) * | 2014-09-26 | 2016-03-31 | ミライアル株式会社 | 基板収納容器 |
JP6430195B2 (ja) * | 2014-09-29 | 2018-11-28 | 株式会社Screenホールディングス | 基板収納容器 |
US10566226B2 (en) * | 2014-11-11 | 2020-02-18 | Applied Materials, Inc. | Multi-cassette carrying case |
JP6413943B2 (ja) * | 2015-06-15 | 2018-10-31 | 信越半導体株式会社 | シリコンエピタキシャルウェーハの抵抗率測定方法 |
US10872795B2 (en) * | 2016-02-05 | 2020-12-22 | Entegris, Inc. | Substrate cushion brace retainer |
WO2018154779A1 (ja) * | 2017-02-27 | 2018-08-30 | ミライアル株式会社 | 基板収納容器 |
JP6854341B2 (ja) * | 2017-04-05 | 2021-04-07 | ミライアル株式会社 | 基板収納容器 |
WO2019030863A1 (ja) * | 2017-08-09 | 2019-02-14 | ミライアル株式会社 | 基板収納容器 |
JP6578551B1 (ja) * | 2017-11-15 | 2019-09-25 | 信越ポリマー株式会社 | 基板収納容器 |
TWI641071B (zh) * | 2018-01-08 | 2018-11-11 | 家登精密工業股份有限公司 | 容器門板抵持結構 |
US11756816B2 (en) * | 2019-07-26 | 2023-09-12 | Applied Materials, Inc. | Carrier FOUP and a method of placing a carrier |
TWI803860B (zh) * | 2020-04-30 | 2023-06-01 | 美商恩特葛瑞斯股份有限公司 | 光罩盒密封 |
CN115605412A (zh) * | 2020-05-19 | 2023-01-13 | 未来儿股份有限公司(Jp) | 基板收纳容器 |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5207324A (en) * | 1991-03-08 | 1993-05-04 | Fluoroware, Inc. | Wafer cushion for shippers |
US5253755A (en) * | 1991-03-20 | 1993-10-19 | Fluoroware, Inc. | Cushioned cover for disk container |
US5273159A (en) * | 1992-05-26 | 1993-12-28 | Empak, Inc. | Wafer suspension box |
US5476176A (en) * | 1994-05-23 | 1995-12-19 | Empak, Inc. | Reinforced semiconductor wafer holder |
KR0135049B1 (ko) * | 1994-05-31 | 1998-04-20 | 양승택 | 반도체 제조장비의 웨이퍼 장착 카세트 |
JP2908985B2 (ja) * | 1994-07-19 | 1999-06-23 | 信越ポリマー株式会社 | ウェーハ収納容器のウェーハ抑え |
JP2779143B2 (ja) * | 1995-03-17 | 1998-07-23 | 信越ポリマー株式会社 | 半導体ウェーハ収納容器 |
US5725101A (en) * | 1995-06-26 | 1998-03-10 | Kakizaki Manufacturing Co., Ltd. | Thin-plate supporting container |
JPH09107026A (ja) * | 1995-10-12 | 1997-04-22 | Shin Etsu Polymer Co Ltd | ウェーハ収納容器のウェーハカセット |
US5874767A (en) * | 1996-05-14 | 1999-02-23 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device including a lateral power device |
US6267245B1 (en) * | 1998-07-10 | 2001-07-31 | Fluoroware, Inc. | Cushioned wafer container |
JP3556480B2 (ja) | 1998-08-17 | 2004-08-18 | 信越ポリマー株式会社 | 精密基板収納容器 |
JP3998354B2 (ja) * | 1998-11-24 | 2007-10-24 | 信越ポリマー株式会社 | 輸送容器及びその蓋体の開閉方法並びにその蓋体の開閉装置 |
US6082540A (en) | 1999-01-06 | 2000-07-04 | Fluoroware, Inc. | Cushion system for wafer carriers |
JP3916342B2 (ja) | 1999-04-20 | 2007-05-16 | 信越ポリマー株式会社 | 基板収納容器 |
JP3556519B2 (ja) * | 1999-04-30 | 2004-08-18 | 信越ポリマー株式会社 | 基板収納容器の識別構造及び基板収納容器の識別方法 |
US6544477B1 (en) * | 2000-08-01 | 2003-04-08 | Regents Of The University Of Minnesota | Apparatus for generating a temperature gradient |
US6591162B1 (en) * | 2000-08-15 | 2003-07-08 | Asyst Technologies, Inc. | Smart load port with integrated carrier monitoring and fab-wide carrier management system |
JP4334123B2 (ja) * | 2000-09-27 | 2009-09-30 | 信越ポリマー株式会社 | 精密基板収納容器 |
JP3938293B2 (ja) | 2001-05-30 | 2007-06-27 | 信越ポリマー株式会社 | 精密基板収納容器及びその押さえ部材 |
TW511649U (en) | 2001-09-12 | 2002-11-21 | Ind Tech Res Inst | Wafer retainer |
CN1298595C (zh) * | 2001-11-14 | 2007-02-07 | 诚实公司 | 晶片封闭件密封结构、密封部件以及晶片密封件 |
JP4153874B2 (ja) * | 2001-11-14 | 2008-09-24 | インテグリス・インコーポレーテッド | ウエハ保持システムを備えたウエハ・キャリア |
JP4073206B2 (ja) | 2001-12-05 | 2008-04-09 | 信越ポリマー株式会社 | 収納容器の蓋体 |
US6644477B2 (en) | 2002-02-26 | 2003-11-11 | Entegris, Inc. | Wafer container cushion system |
JP4218260B2 (ja) * | 2002-06-06 | 2009-02-04 | 東京エレクトロン株式会社 | 被処理体の収納容器体及びこれを用いた処理システム |
KR100929471B1 (ko) * | 2005-02-03 | 2009-12-02 | 신에츠 폴리머 가부시키가이샤 | 고정 캐리어, 고정 캐리어의 제조 방법, 고정 캐리어의 사용 방법, 및 기판 수납 용기 |
-
2004
- 2004-06-11 JP JP2004174035A patent/JP4667769B2/ja not_active Expired - Lifetime
-
2005
- 2005-06-07 TW TW094118820A patent/TW200605261A/zh unknown
- 2005-06-08 US US11/148,147 patent/US7344031B2/en active Active
- 2005-06-10 KR KR1020050049668A patent/KR101008867B1/ko active IP Right Grant
- 2005-06-10 EP EP05253594.5A patent/EP1605496B1/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI642604B (zh) * | 2013-05-29 | 2018-12-01 | 未來兒股份有限公司 | Substrate storage container |
US8857619B1 (en) | 2013-09-30 | 2014-10-14 | Taiwan Semiconductor Manufacturing Co., Ltd | Mechanisms for wafer pod and pod door |
US9184077B2 (en) | 2013-09-30 | 2015-11-10 | Taiwan Semiconductor Manufacturing Co., Ltd | Wafer pod and wafer positioning mechanism thereof |
Also Published As
Publication number | Publication date |
---|---|
US20050274645A1 (en) | 2005-12-15 |
US7344031B2 (en) | 2008-03-18 |
EP1605496B1 (en) | 2018-12-26 |
KR101008867B1 (ko) | 2011-01-20 |
JP2005353898A (ja) | 2005-12-22 |
TW200605261A (en) | 2006-02-01 |
EP1605496A2 (en) | 2005-12-14 |
KR20060046409A (ko) | 2006-05-17 |
JP4667769B2 (ja) | 2011-04-13 |
EP1605496A3 (en) | 2011-01-19 |
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