TWI347648B - - Google Patents

Info

Publication number
TWI347648B
TWI347648B TW094118820A TW94118820A TWI347648B TW I347648 B TWI347648 B TW I347648B TW 094118820 A TW094118820 A TW 094118820A TW 94118820 A TW94118820 A TW 94118820A TW I347648 B TWI347648 B TW I347648B
Authority
TW
Taiwan
Application number
TW094118820A
Other versions
TW200605261A (en
Inventor
Akihiro Hasegawa
Hiroshi Mimura
Original Assignee
Shinetsu Polymer Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Polymer Co filed Critical Shinetsu Polymer Co
Publication of TW200605261A publication Critical patent/TW200605261A/zh
Application granted granted Critical
Publication of TWI347648B publication Critical patent/TWI347648B/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735Closed carriers
    • H01L21/67369Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735Closed carriers
    • H01L21/67376Closed carriers characterised by sealing arrangements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735Closed carriers
    • H01L21/67383Closed carriers characterised by substrate supports

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Frangible Articles (AREA)
TW094118820A 2004-06-11 2005-06-07 Container of substrate TW200605261A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004174035A JP4667769B2 (ja) 2004-06-11 2004-06-11 基板収納容器

Publications (2)

Publication Number Publication Date
TW200605261A TW200605261A (en) 2006-02-01
TWI347648B true TWI347648B (zh) 2011-08-21

Family

ID=34941644

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094118820A TW200605261A (en) 2004-06-11 2005-06-07 Container of substrate

Country Status (5)

Country Link
US (1) US7344031B2 (zh)
EP (1) EP1605496B1 (zh)
JP (1) JP4667769B2 (zh)
KR (1) KR101008867B1 (zh)
TW (1) TW200605261A (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8857619B1 (en) 2013-09-30 2014-10-14 Taiwan Semiconductor Manufacturing Co., Ltd Mechanisms for wafer pod and pod door
US9184077B2 (en) 2013-09-30 2015-11-10 Taiwan Semiconductor Manufacturing Co., Ltd Wafer pod and wafer positioning mechanism thereof
TWI642604B (zh) * 2013-05-29 2018-12-01 未來兒股份有限公司 Substrate storage container

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US20060042998A1 (en) * 2004-08-24 2006-03-02 Haggard Clifton C Cushion for packing disks such as semiconductor wafers
JP4584023B2 (ja) * 2005-05-17 2010-11-17 信越ポリマー株式会社 基板収納容器及びその製造方法
US20070175792A1 (en) * 2006-02-02 2007-08-02 Barry Gregerson Magnetic seal for wafer containers
JP5025962B2 (ja) * 2006-02-15 2012-09-12 ミライアル株式会社 薄板収納容器
US8292081B2 (en) 2006-05-29 2012-10-23 Shin-Etsu Polymer Co., Ltd. Substrate storage container
JP5385130B2 (ja) * 2006-06-13 2014-01-08 インテグリス・インコーポレーテッド ウェハ収納容器用の再利用可能な弾性クッション
TWI303618B (en) * 2006-08-10 2008-12-01 Gudeng Prec Industral Co Ltd Metal photomask box
JP4800155B2 (ja) * 2006-09-04 2011-10-26 信越ポリマー株式会社 基板収納容器及び逆止弁
KR101472145B1 (ko) * 2006-11-07 2014-12-12 신에츠 폴리머 가부시키가이샤 기판 수납 용기
JP4920387B2 (ja) * 2006-12-01 2012-04-18 信越半導体株式会社 基板収納容器
DE202007003416U1 (de) * 2007-03-04 2007-05-31 Jonas & Redmann Automationstechnik Gmbh Automatisierungscarrier für Substrate, insbesondere für Wafer zur Herstellung siliziumbasierter Solarzellen
CN101855716B (zh) * 2007-11-09 2012-07-11 信越聚合物株式会社 保持器以及基板收纳容器
JP4764865B2 (ja) * 2007-11-13 2011-09-07 信越ポリマー株式会社 リテーナ及び基板収納容器
CN101981684B (zh) * 2008-01-13 2013-01-30 诚实公司 用于大直径晶片运输的方法和设备
JP4980252B2 (ja) * 2008-01-15 2012-07-18 信越ポリマー株式会社 基板収納容器及びそのシールガスケットの取り付け方法
JP5084573B2 (ja) * 2008-03-18 2012-11-28 信越ポリマー株式会社 基板収納容器
JP5184198B2 (ja) * 2008-05-01 2013-04-17 信越ポリマー株式会社 基板収納容器
TWI337162B (en) * 2008-07-31 2011-02-11 Gudeng Prec Industral Co Ltd A wafer container with constraints
US7971722B2 (en) * 2008-08-08 2011-07-05 Gudeng Precision Industral Co, Ltd Wafer container with restrainer
TWI400766B (zh) * 2008-08-27 2013-07-01 Gudeng Prec Industral Co Ltd 具一體成形晶圓限制件模組之前開式晶圓盒
TWI343353B (en) * 2008-11-04 2011-06-11 Gudeng Prec Industral Co Ltd A wafer container having the snap-fitting constraint module
KR101165613B1 (ko) * 2009-05-13 2012-07-16 미라이얼 가부시키가이샤 반도체 웨이퍼 수납용기
CN102939254A (zh) * 2010-02-19 2013-02-20 信越聚合物株式会社 基板收纳容器
MY159162A (en) 2010-03-11 2016-12-30 Entegris Inc Thin wafer shipper
KR101165611B1 (ko) * 2010-04-20 2012-07-16 미라이얼 가부시키가이샤 기판수납용기
KR101708087B1 (ko) * 2010-04-22 2017-02-17 신에츠 폴리머 가부시키가이샤 기판 수납 용기
KR101129486B1 (ko) * 2010-05-24 2012-03-29 미라이얼 가부시키가이샤 기판수납용기
JP5459787B2 (ja) * 2010-06-17 2014-04-02 信越ポリマー株式会社 基板収納容器
USD740031S1 (en) * 2010-10-19 2015-10-06 Entegris, Inc. Substrate container
USD668865S1 (en) * 2010-10-19 2012-10-16 Entegris, Inc. Substrate container
KR101899614B1 (ko) * 2010-10-20 2018-09-17 엔테그리스, 아이엔씨. 도어 가이드 및 밀봉부를 갖는 웨이퍼 컨테이너
JP5583058B2 (ja) * 2011-03-09 2014-09-03 信越ポリマー株式会社 基板収納容器
JP6214630B2 (ja) 2012-05-04 2017-10-18 インテグリス・インコーポレーテッド ウェーハを支える交換可能なバックストップ
EP2845224B1 (en) * 2012-05-04 2020-07-01 Entegris, Inc. Wafer container with door mounted shipping cushions
WO2014080454A1 (ja) * 2012-11-20 2014-05-30 ミライアル株式会社 基板収納容器
JP5988854B2 (ja) * 2012-12-11 2016-09-07 信越ポリマー株式会社 基板収納容器
KR102098306B1 (ko) * 2013-02-20 2020-04-08 삼성디스플레이 주식회사 기판 수납 장치
CN105993067B (zh) 2013-04-26 2019-04-16 恩特格里斯公司 用于大直径晶片的具有锁止机构的晶片容器
KR102113139B1 (ko) * 2013-09-11 2020-05-20 미라이얼 가부시키가이샤 기판수납용기
TWM491030U (zh) * 2014-03-14 2014-12-01 Gudeng Prec Ind Co Ltd 晶圓收納盒及其氣密構件
JP6326330B2 (ja) * 2014-09-05 2018-05-16 株式会社Screenホールディングス 基板収納容器、ロードポート装置および基板処理装置
WO2016046985A1 (ja) * 2014-09-26 2016-03-31 ミライアル株式会社 基板収納容器
JP6430195B2 (ja) * 2014-09-29 2018-11-28 株式会社Screenホールディングス 基板収納容器
US10566226B2 (en) * 2014-11-11 2020-02-18 Applied Materials, Inc. Multi-cassette carrying case
JP6413943B2 (ja) * 2015-06-15 2018-10-31 信越半導体株式会社 シリコンエピタキシャルウェーハの抵抗率測定方法
US10872795B2 (en) * 2016-02-05 2020-12-22 Entegris, Inc. Substrate cushion brace retainer
WO2018154779A1 (ja) * 2017-02-27 2018-08-30 ミライアル株式会社 基板収納容器
JP6854341B2 (ja) * 2017-04-05 2021-04-07 ミライアル株式会社 基板収納容器
WO2019030863A1 (ja) * 2017-08-09 2019-02-14 ミライアル株式会社 基板収納容器
JP6578551B1 (ja) * 2017-11-15 2019-09-25 信越ポリマー株式会社 基板収納容器
TWI641071B (zh) * 2018-01-08 2018-11-11 家登精密工業股份有限公司 容器門板抵持結構
US11756816B2 (en) * 2019-07-26 2023-09-12 Applied Materials, Inc. Carrier FOUP and a method of placing a carrier
TWI803860B (zh) * 2020-04-30 2023-06-01 美商恩特葛瑞斯股份有限公司 光罩盒密封
CN115605412A (zh) * 2020-05-19 2023-01-13 未来儿股份有限公司(Jp) 基板收纳容器

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CN1298595C (zh) * 2001-11-14 2007-02-07 诚实公司 晶片封闭件密封结构、密封部件以及晶片密封件
JP4153874B2 (ja) * 2001-11-14 2008-09-24 インテグリス・インコーポレーテッド ウエハ保持システムを備えたウエハ・キャリア
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI642604B (zh) * 2013-05-29 2018-12-01 未來兒股份有限公司 Substrate storage container
US8857619B1 (en) 2013-09-30 2014-10-14 Taiwan Semiconductor Manufacturing Co., Ltd Mechanisms for wafer pod and pod door
US9184077B2 (en) 2013-09-30 2015-11-10 Taiwan Semiconductor Manufacturing Co., Ltd Wafer pod and wafer positioning mechanism thereof

Also Published As

Publication number Publication date
US20050274645A1 (en) 2005-12-15
US7344031B2 (en) 2008-03-18
EP1605496B1 (en) 2018-12-26
KR101008867B1 (ko) 2011-01-20
JP2005353898A (ja) 2005-12-22
TW200605261A (en) 2006-02-01
EP1605496A2 (en) 2005-12-14
KR20060046409A (ko) 2006-05-17
JP4667769B2 (ja) 2011-04-13
EP1605496A3 (en) 2011-01-19

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