TWI344482B - - Google Patents

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Publication number
TWI344482B
TWI344482B TW095132687A TW95132687A TWI344482B TW I344482 B TWI344482 B TW I344482B TW 095132687 A TW095132687 A TW 095132687A TW 95132687 A TW95132687 A TW 95132687A TW I344482 B TWI344482 B TW I344482B
Authority
TW
Taiwan
Prior art keywords
weight
adhesive
solution
group
parts
Prior art date
Application number
TW095132687A
Other languages
English (en)
Chinese (zh)
Other versions
TW200710190A (en
Inventor
Natsuki Ukei
Tatsumi Amano
Masahiko Ando
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of TW200710190A publication Critical patent/TW200710190A/zh
Application granted granted Critical
Publication of TWI344482B publication Critical patent/TWI344482B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C08K3/105—Compounds containing metals of Groups 1 to 3 or of Groups 11 to 13 of the Periodic Table
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2848—Three or more layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2857—Adhesive compositions including metal or compound thereof or natural rubber

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
TW095132687A 2005-09-05 2006-09-05 Adhesive composition, adhesive sheet, and surface-protective film TW200710190A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005256291 2005-09-05

Publications (2)

Publication Number Publication Date
TW200710190A TW200710190A (en) 2007-03-16
TWI344482B true TWI344482B (enExample) 2011-07-01

Family

ID=37835762

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095132687A TW200710190A (en) 2005-09-05 2006-09-05 Adhesive composition, adhesive sheet, and surface-protective film

Country Status (7)

Country Link
US (1) US20080311395A1 (enExample)
EP (1) EP1923444B1 (enExample)
JP (3) JP5259940B2 (enExample)
KR (2) KR101069486B1 (enExample)
CN (1) CN101243152B (enExample)
TW (1) TW200710190A (enExample)
WO (1) WO2007029644A1 (enExample)

Families Citing this family (48)

* Cited by examiner, † Cited by third party
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JP2005314579A (ja) * 2004-04-30 2005-11-10 Nitto Denko Corp 粘着剤組成物、および粘着シート類
JP4562070B2 (ja) * 2004-05-14 2010-10-13 日東電工株式会社 粘着剤組成物、粘着シート類、および表面保護フィルム
JP4917267B2 (ja) * 2004-09-16 2012-04-18 日東電工株式会社 粘着剤組成物、粘着シート類、および表面保護フィルム
JP4531628B2 (ja) * 2004-09-16 2010-08-25 日東電工株式会社 粘着剤組成物、粘着シート類、および表面保護フィルム
WO2009002110A2 (en) * 2007-06-27 2008-12-31 Kwang Suck Suh Pressure sensitive adhesive composition with improved peeling characteristics and protection films using the same
JP5309714B2 (ja) * 2007-07-04 2013-10-09 信越化学工業株式会社 帯電防止性能を有するシリコーン粘着剤組成物およびシリコーン粘着テープ
JP2009073896A (ja) * 2007-09-19 2009-04-09 Nippon Carbide Ind Co Inc 粘着剤組成物及び光学フィルム
JP2009126929A (ja) * 2007-11-22 2009-06-11 Cheil Industries Inc 粘着剤組成物及び光学部材、表面保護シート
KR101082450B1 (ko) * 2008-01-14 2011-11-11 주식회사 엘지화학 아크릴계 점착제 조성물
JP5379168B2 (ja) * 2008-03-07 2013-12-25 スリーエム イノベイティブ プロパティズ カンパニー 帯電防止性ロックコポリマー感圧性接着剤及び物品
US20110014443A1 (en) * 2008-03-10 2011-01-20 The Furukawa Electric Co., Ltd Adhesive tape for electronic component fabrication
JP5361244B2 (ja) * 2008-05-15 2013-12-04 日本カーバイド工業株式会社 光学部材表面保護フィルム用粘着剤組成物及び光学部材表面保護フィルム
JP5518356B2 (ja) * 2008-05-19 2014-06-11 日東電工株式会社 水分散型粘着剤組成物、その製造方法および粘着シート
WO2010002197A2 (ko) * 2008-07-01 2010-01-07 (주)Lg화학 광학부재용 아크릴계 조성물, 광학부재용 보호필름, 편광판 및 액정표시장치
KR101240852B1 (ko) 2008-08-01 2013-03-07 주식회사 엘지화학 아크릴계 조성물, 광학부재용 보호 필름, 편광판 및 액정표시장치
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JP5623020B2 (ja) * 2009-02-27 2014-11-12 日東電工株式会社 粘着剤組成物、粘着剤層、及び、粘着シート
JP2011202161A (ja) * 2010-03-02 2011-10-13 Nitto Denko Corp 粘着剤組成物、粘着シート、及び、表面保護フィルム
JP5587645B2 (ja) * 2010-03-18 2014-09-10 リンテック株式会社 光学用粘着剤、光学用粘着シート及び粘着剤層付き光学部材
JP5888839B2 (ja) * 2010-07-21 2016-03-22 日本合成化学工業株式会社 アクリル系粘着剤の製造方法、粘着シートの製造方法
TWI457614B (zh) * 2010-10-05 2014-10-21 E Ink Holdings Inc 可撓性彩色濾光基板的製造方法
JP5843307B2 (ja) * 2010-10-28 2016-01-13 信越化学工業株式会社 帯電防止性粘着剤
JP5800260B2 (ja) * 2011-03-23 2015-10-28 エルジー・ケム・リミテッド 粘着剤組成物
CN103703095B (zh) * 2011-03-23 2016-06-01 Lg化学株式会社 压敏粘合剂组合物
JP5613108B2 (ja) * 2011-06-28 2014-10-22 リンテック株式会社 粘着性組成物、粘着剤および粘着シート
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JP6077922B2 (ja) * 2012-12-10 2017-02-08 日東電工株式会社 ダイシングテープ一体型接着シート、ダイシングテープ一体型接着シートを用いた半導体装置の製造方法、及び、半導体装置
KR101989869B1 (ko) * 2013-01-25 2019-06-17 도레이첨단소재 주식회사 유전 점착필름 및 전자종이용 디스플레이 소자
KR101550144B1 (ko) 2013-06-19 2015-09-03 주식회사 엘지화학 점착제 조성물
JP6021091B2 (ja) 2013-06-19 2016-11-02 エルジー・ケム・リミテッド 粘着剤組成物
JP6188595B2 (ja) * 2014-01-24 2017-08-30 日東電工株式会社 粘着剤組成物、粘着剤層、及び、粘着シート
KR20150125370A (ko) * 2014-04-30 2015-11-09 동우 화인켐 주식회사 점착제 조성물
KR20150142962A (ko) * 2014-06-12 2015-12-23 동우 화인켐 주식회사 점착제 조성물 및 이를 포함하는 편광판
JP6613027B2 (ja) * 2014-12-25 2019-11-27 日東電工株式会社 粘着シート、および、光学部材
JP6704671B2 (ja) * 2014-12-25 2020-06-03 日東電工株式会社 粘着シート、および、光学部材
JP6521896B2 (ja) 2016-04-25 2019-05-29 藤森工業株式会社 粘着剤組成物及び帯電防止表面保護フィルム
JP6333923B2 (ja) * 2016-11-10 2018-05-30 藤森工業株式会社 粘着剤組成物及び表面保護フィルム
CN108300336A (zh) * 2018-02-02 2018-07-20 苏州城邦达力材料科技有限公司 一种uv减粘组合物、uv减粘膜及其制备方法
CN108192524A (zh) * 2018-02-02 2018-06-22 苏州城邦达力材料科技有限公司 一种uv减粘膜及其制备方法
JP6480624B2 (ja) * 2018-04-24 2019-03-13 藤森工業株式会社 粘着剤組成物及び表面保護フィルム
JP7105633B2 (ja) * 2018-06-28 2022-07-25 日東電工株式会社 粘着剤組成物、粘着シート、及び、光学部材
JP6838090B2 (ja) * 2019-02-07 2021-03-03 藤森工業株式会社 粘着剤組成物及び表面保護フィルム
KR20210153109A (ko) * 2019-04-16 2021-12-16 신에쓰 가가꾸 고교 가부시끼가이샤 펠리클, 펠리클 부착 노광 원판, 반도체 장치의 제조 방법, 액정 표시판의 제조 방법, 노광 원판의 재생 방법 및 박리 잔사 저감 방법
JP7341970B2 (ja) * 2020-10-14 2023-09-11 信越化学工業株式会社 ペリクル用粘着剤、粘着剤層付ペリクルフレーム、ペリクル、ペリクル付露光原版、露光方法、半導体の製造方法及び液晶表示板の製造方法
JP7121096B2 (ja) * 2020-11-11 2022-08-17 藤森工業株式会社 表面保護フィルム
TW202311478A (zh) * 2021-06-17 2023-03-16 美商3M新設資產公司 抗靜電光學清透黏著劑
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KR100694445B1 (ko) * 2004-08-24 2007-03-12 주식회사 엘지화학 대전 방지 성능을 갖는 아크릴계 점착제 조성물
JP4531628B2 (ja) * 2004-09-16 2010-08-25 日東電工株式会社 粘着剤組成物、粘着シート類、および表面保護フィルム
JP4917267B2 (ja) * 2004-09-16 2012-04-18 日東電工株式会社 粘着剤組成物、粘着シート類、および表面保護フィルム
KR100784991B1 (ko) * 2005-06-10 2007-12-11 주식회사 엘지화학 아크릴계 점착제 조성물
CN101243153B (zh) * 2005-09-05 2010-10-06 日东电工株式会社 粘合剂组合物、粘合片以及表面保护薄膜
KR100830814B1 (ko) * 2005-10-14 2008-05-20 주식회사 엘지화학 아크릴계 점착제 조성물
JP4814000B2 (ja) * 2006-07-26 2011-11-09 リンテック株式会社 光学機能性フィルム貼合用粘着剤、光学機能性フィルム及びその製造方法

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JP2007092056A (ja) 2007-04-12
KR100890104B1 (ko) 2009-03-24
KR101069486B1 (ko) 2011-09-30
KR20070065309A (ko) 2007-06-22
JP2014185349A (ja) 2014-10-02
JP5770141B2 (ja) 2015-08-26
US20080311395A1 (en) 2008-12-18
KR20090007802A (ko) 2009-01-20
CN101243152A (zh) 2008-08-13
JP2012237004A (ja) 2012-12-06
JP5259940B2 (ja) 2013-08-07
CN101243152B (zh) 2010-09-22
WO2007029644A1 (ja) 2007-03-15
EP1923444A1 (en) 2008-05-21

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