MX9605243A - Cinta adhesiva, sensible a presion, antiestatica, resistente a alta temperatura. - Google Patents
Cinta adhesiva, sensible a presion, antiestatica, resistente a alta temperatura.Info
- Publication number
- MX9605243A MX9605243A MX9605243A MX9605243A MX9605243A MX 9605243 A MX9605243 A MX 9605243A MX 9605243 A MX9605243 A MX 9605243A MX 9605243 A MX9605243 A MX 9605243A MX 9605243 A MX9605243 A MX 9605243A
- Authority
- MX
- Mexico
- Prior art keywords
- adhesive tape
- sensitive adhesive
- high temperature
- temperature resistant
- antistatic pressure
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/125—Inorganic compounds, e.g. silver salt
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
- Y10T428/254—Polymeric or resinous material
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2843—Web or sheet containing structurally defined element or component and having an adhesive outermost layer including a primer layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/2857—Adhesive compositions including metal or compound thereof or natural rubber
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
- Y10T428/2991—Coated
- Y10T428/2998—Coated including synthetic resin or polymer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31855—Of addition polymer from unsaturated monomers
- Y10T428/31859—Next to an aldehyde or ketone condensation product
- Y10T428/31877—Phenol-aldehyde
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31855—Of addition polymer from unsaturated monomers
- Y10T428/31909—Next to second addition polymer from unsaturated monomers
- Y10T428/31928—Ester, halide or nitrile of addition polymer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
La presente invencion se refiere a una cinta adhesiva sensible a presion antiestática y termo resistente que comprende un substrato que tiene revestido un adhesivo de micropartículas con un diámetro promedio de al menos un micrometro, en donde las micropartículas tienen una superficie que contiene un material conductor ionico formado a partir de un polímero base electrolito de polímero y al menos una sal ionica seleccionada del grupo que consiste de sales de metales alcalinos y sales de metales alcalino térreos, al adhesivo se adhiere al substrato mediante una composicion imprimidora, el imprimidor o apresto comprende al menos una resina fenolica y al menos un compuesto ahulado, la cinta adhesiva es capaz de sobrevivir inmersion en soldadura fundida por al menos 5 segundos.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US23930994A | 1994-05-06 | 1994-05-06 | |
PCT/US1995/003381 WO1995030720A1 (en) | 1994-05-06 | 1995-03-16 | High temperature resistant antistatic pressure-sensitive adhesive tape |
Publications (1)
Publication Number | Publication Date |
---|---|
MX9605243A true MX9605243A (es) | 1997-10-31 |
Family
ID=22901605
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MX9605243A MX9605243A (es) | 1994-05-06 | 1995-03-16 | Cinta adhesiva, sensible a presion, antiestatica, resistente a alta temperatura. |
Country Status (9)
Country | Link |
---|---|
US (1) | US5631079A (es) |
EP (1) | EP0758366B1 (es) |
JP (1) | JP3473701B2 (es) |
KR (1) | KR970702906A (es) |
CN (1) | CN1147268A (es) |
DE (1) | DE69507609T2 (es) |
MX (1) | MX9605243A (es) |
MY (1) | MY113845A (es) |
WO (1) | WO1995030720A1 (es) |
Families Citing this family (35)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5914186A (en) * | 1994-05-06 | 1999-06-22 | Minnesota Mining And Manufacturing Company | High temperature resistant antistatic pressure-sensitive adhesive tape |
US5759431A (en) * | 1994-12-15 | 1998-06-02 | Minnesota Mining And Manufacturing Company | Stain resistant composition containing sulphonated surfactant |
US6294250B1 (en) * | 1996-08-28 | 2001-09-25 | 3M Innovative Properties Company | Adhesive film and method for producing the same |
US5958537A (en) * | 1997-09-25 | 1999-09-28 | Brady Usa, Inc. | Static dissipative label |
JP2002319316A (ja) * | 2001-02-15 | 2002-10-31 | Sumitomo Chem Co Ltd | 絶縁フィルム類 |
US20030109630A1 (en) * | 2001-10-23 | 2003-06-12 | Smith Dawn E. | Microsphere adhesive formulations |
TWI358426B (en) | 2004-03-08 | 2012-02-21 | Nitto Denko Corp | Pressure-sensitive adhesive composition, pressure- |
JP2005314579A (ja) * | 2004-04-30 | 2005-11-10 | Nitto Denko Corp | 粘着剤組成物、および粘着シート類 |
TW200617124A (en) | 2004-06-01 | 2006-06-01 | Nitto Denko Corp | Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheet and surface protecting film |
US20080166523A1 (en) * | 2007-01-04 | 2008-07-10 | Asahi Kasei Chemicals Corporation | Tab leader tape made of polyphenylene ether-based resin |
TWI387629B (zh) | 2004-07-26 | 2013-03-01 | Nitto Denko Corp | 壓感黏合劑組成物、壓感黏合片及表面保護膜 |
KR100694445B1 (ko) * | 2004-08-24 | 2007-03-12 | 주식회사 엘지화학 | 대전 방지 성능을 갖는 아크릴계 점착제 조성물 |
JP4917267B2 (ja) * | 2004-09-16 | 2012-04-18 | 日東電工株式会社 | 粘着剤組成物、粘着シート類、および表面保護フィルム |
JP4531628B2 (ja) | 2004-09-16 | 2010-08-25 | 日東電工株式会社 | 粘着剤組成物、粘着シート類、および表面保護フィルム |
JP4358190B2 (ja) * | 2005-03-16 | 2009-11-04 | 日東電工株式会社 | 粘着剤組成物、粘着シート類および表面保護フィルム |
DE602006018906D1 (de) * | 2005-05-20 | 2011-01-27 | Nitto Denko Corp | Haftklebemittel, haftklebefolie und oberflächenschutzfilm |
JP5259940B2 (ja) * | 2005-09-05 | 2013-08-07 | 日東電工株式会社 | 粘着剤組成物、粘着シートおよび表面保護フィルム |
EP1939263B1 (en) * | 2005-09-05 | 2012-08-01 | Nitto Denko Corporation | Adhesive composition, adhesive sheet, and surface protective film |
MXPA06010596A (es) * | 2005-12-23 | 2007-06-22 | 3M Innovative Properties Co | Pelicula adhesiva con resistencia a altas temperaturas y baja generacion de electrostatica, construida con un polimero de polieterimida. |
KR100831562B1 (ko) * | 2006-03-23 | 2008-05-21 | 주식회사 엘지화학 | 유연성 기판 반송용 점착제 조성물 |
KR101063710B1 (ko) * | 2006-09-26 | 2011-09-07 | 히다치 가세고교 가부시끼가이샤 | 이방 도전성 접착제 조성물, 이방 도전성 필름, 회로 부재의 접속 구조, 및 피복 입자의 제조 방법 |
KR101047925B1 (ko) * | 2007-04-19 | 2011-07-08 | 주식회사 엘지화학 | 아크릴계 점착제 조성물 및 이를 포함하는 편광판 |
CN101775259A (zh) | 2009-01-09 | 2010-07-14 | 3M创新有限公司 | 一种防静电的耐高温聚酰亚胺胶带 |
JP5623020B2 (ja) | 2009-02-27 | 2014-11-12 | 日東電工株式会社 | 粘着剤組成物、粘着剤層、及び、粘着シート |
US8986831B2 (en) | 2011-05-24 | 2015-03-24 | H. B. Fuller Company | Pressure sensitive adhesive tear tape |
CN102497170A (zh) * | 2011-12-06 | 2012-06-13 | 爱普科斯科技(无锡)有限公司 | 一种用于层压板表面图贴装和回流焊的载具 |
CN102952468B (zh) * | 2012-10-27 | 2013-11-13 | 蚌埠凤凰滤清器有限责任公司 | 一种滤清器用氯丁橡胶与溴化丁基橡胶混炼而得的粘合剂胶片 |
CN103614090B (zh) * | 2013-12-06 | 2015-06-17 | 苏州贤聚科技有限公司 | 一种防静电压敏胶保护膜及其制备方法 |
CN104893607B (zh) * | 2015-05-29 | 2017-09-12 | 张家港康得新光电材料有限公司 | 一种抗静电防爆保护膜 |
CA3003030C (en) * | 2015-10-26 | 2023-12-19 | University Of Wyoming | Methods of generating microparticles and porous hydrogels using microfluidics |
CN106281201A (zh) * | 2016-08-29 | 2017-01-04 | 无锡万能胶粘剂有限公司 | 一种厌氧胶 |
WO2019079414A1 (en) | 2017-10-17 | 2019-04-25 | University Of Wyoming | OPERATION OF OXYGEN-INHIBITED PHOTOPOLYMERIZATION IN EMULSION DROPLETS FOR THE MANUFACTURE OF MICROPARTICLES HAVING PERSONALIZABLE PROPERTIES |
CN108130003A (zh) * | 2017-12-19 | 2018-06-08 | 江苏斯瑞达新材料科技有限公司 | 电子元器件用防水耐热保护膜 |
CN110240875B (zh) * | 2019-06-11 | 2021-06-01 | 恩平市盈嘉丰胶粘制品有限公司 | 一种耐高温石棉纸胶带及其制备方法 |
CN113801601A (zh) * | 2021-09-27 | 2021-12-17 | 浙江福莱新材料股份有限公司 | 一种抗静电弹性防滑胶带及其制备方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3104985A (en) * | 1959-01-06 | 1963-09-24 | Cabot Corp | Conducting polymer compositions |
US3691140A (en) * | 1970-03-09 | 1972-09-12 | Spencer Ferguson Silver | Acrylate copolymer microspheres |
US3832598A (en) * | 1972-10-02 | 1974-08-27 | Minnesota Mining & Mfg | Electrically conductive tape device |
US4166152B1 (en) * | 1977-08-17 | 1999-05-18 | Minnesota Mining & Mfg | Tacky polymeric microspheres |
DE8434291U1 (de) * | 1984-11-23 | 1986-03-27 | Beiersdorf Ag, 2000 Hamburg | Klebeband |
GB2170427B (en) * | 1985-02-01 | 1989-06-07 | Sanyo Kokusaku Pulp Co | Pressure-sensitive adhesive tapes or sheets |
US4656218A (en) * | 1985-02-08 | 1987-04-07 | Sanyo Kokusaku Pulp Co., Ltd. | Adhesive copolymer microspheres-containing aqueous suspension and method for producing the same |
JPS6312681A (ja) * | 1986-07-02 | 1988-01-20 | Sekisui Chem Co Ltd | 帯電防止粘着テ−プもしくはシ−ト |
US5045569A (en) * | 1988-11-30 | 1991-09-03 | Minnesota Mining And Manufacturing Company | Hollow acrylate polymer microspheres |
IE67319B1 (en) * | 1989-10-11 | 1996-03-20 | Waterford Res & Dev Ltd | Antistatic adhesive tape |
US5378405A (en) * | 1993-07-28 | 1995-01-03 | Minnesota Mining And Manufacturing Company | Conductive microparticles and pressure-sensitive adhesive tapes made therefrom |
-
1995
- 1995-03-16 WO PCT/US1995/003381 patent/WO1995030720A1/en active IP Right Grant
- 1995-03-16 JP JP52634595A patent/JP3473701B2/ja not_active Expired - Fee Related
- 1995-03-16 MX MX9605243A patent/MX9605243A/es not_active IP Right Cessation
- 1995-03-16 EP EP95913753A patent/EP0758366B1/en not_active Expired - Lifetime
- 1995-03-16 DE DE69507609T patent/DE69507609T2/de not_active Expired - Lifetime
- 1995-03-16 CN CN95192921A patent/CN1147268A/zh active Pending
- 1995-04-27 MY MYPI95001104A patent/MY113845A/en unknown
- 1995-06-29 US US08/496,533 patent/US5631079A/en not_active Expired - Lifetime
-
1996
- 1996-11-04 KR KR1019960706208A patent/KR970702906A/ko not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
DE69507609D1 (de) | 1999-03-11 |
EP0758366A1 (en) | 1997-02-19 |
WO1995030720A1 (en) | 1995-11-16 |
US5631079A (en) | 1997-05-20 |
EP0758366B1 (en) | 1999-01-27 |
CN1147268A (zh) | 1997-04-09 |
MY113845A (en) | 2002-06-29 |
JP3473701B2 (ja) | 2003-12-08 |
JPH09512567A (ja) | 1997-12-16 |
DE69507609T2 (de) | 1999-09-30 |
KR970702906A (ko) | 1997-06-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG | Grant or registration | ||
MM | Annulment or lapse due to non-payment of fees |