DE69507609D1 - Hochtemperaturbeständiges, antistatisches, druckempfindliches klebebeand - Google Patents

Hochtemperaturbeständiges, antistatisches, druckempfindliches klebebeand

Info

Publication number
DE69507609D1
DE69507609D1 DE69507609T DE69507609T DE69507609D1 DE 69507609 D1 DE69507609 D1 DE 69507609D1 DE 69507609 T DE69507609 T DE 69507609T DE 69507609 T DE69507609 T DE 69507609T DE 69507609 D1 DE69507609 D1 DE 69507609D1
Authority
DE
Germany
Prior art keywords
antistatic
resistant
temperature
pressure
sensitive adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69507609T
Other languages
English (en)
Other versions
DE69507609T2 (de
Inventor
Gustav Gutman
Steven Yau
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Co
Original Assignee
Minnesota Mining and Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining and Manufacturing Co filed Critical Minnesota Mining and Manufacturing Co
Publication of DE69507609D1 publication Critical patent/DE69507609D1/de
Application granted granted Critical
Publication of DE69507609T2 publication Critical patent/DE69507609T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0191—Using tape or non-metallic foil in a process, e.g. during filling of a hole with conductive paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/125—Inorganic compounds, e.g. silver salt
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/254—Polymeric or resinous material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2843—Web or sheet containing structurally defined element or component and having an adhesive outermost layer including a primer layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2857—Adhesive compositions including metal or compound thereof or natural rubber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2991—Coated
    • Y10T428/2998—Coated including synthetic resin or polymer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31855—Of addition polymer from unsaturated monomers
    • Y10T428/31859—Next to an aldehyde or ketone condensation product
    • Y10T428/31877—Phenol-aldehyde
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31855—Of addition polymer from unsaturated monomers
    • Y10T428/31909—Next to second addition polymer from unsaturated monomers
    • Y10T428/31928—Ester, halide or nitrile of addition polymer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
DE69507609T 1994-05-06 1995-03-16 Hochtemperaturbeständiges, antistatisches, druckempfindliches klebebeand Expired - Lifetime DE69507609T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US23930994A 1994-05-06 1994-05-06
PCT/US1995/003381 WO1995030720A1 (en) 1994-05-06 1995-03-16 High temperature resistant antistatic pressure-sensitive adhesive tape

Publications (2)

Publication Number Publication Date
DE69507609D1 true DE69507609D1 (de) 1999-03-11
DE69507609T2 DE69507609T2 (de) 1999-09-30

Family

ID=22901605

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69507609T Expired - Lifetime DE69507609T2 (de) 1994-05-06 1995-03-16 Hochtemperaturbeständiges, antistatisches, druckempfindliches klebebeand

Country Status (9)

Country Link
US (1) US5631079A (de)
EP (1) EP0758366B1 (de)
JP (1) JP3473701B2 (de)
KR (1) KR970702906A (de)
CN (1) CN1147268A (de)
DE (1) DE69507609T2 (de)
MX (1) MX9605243A (de)
MY (1) MY113845A (de)
WO (1) WO1995030720A1 (de)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5914186A (en) * 1994-05-06 1999-06-22 Minnesota Mining And Manufacturing Company High temperature resistant antistatic pressure-sensitive adhesive tape
US5759431A (en) * 1994-12-15 1998-06-02 Minnesota Mining And Manufacturing Company Stain resistant composition containing sulphonated surfactant
US6294250B1 (en) * 1996-08-28 2001-09-25 3M Innovative Properties Company Adhesive film and method for producing the same
US5958537A (en) * 1997-09-25 1999-09-28 Brady Usa, Inc. Static dissipative label
JP2002319316A (ja) * 2001-02-15 2002-10-31 Sumitomo Chem Co Ltd 絶縁フィルム類
US20030109630A1 (en) * 2001-10-23 2003-06-12 Smith Dawn E. Microsphere adhesive formulations
EP2246404A1 (de) 2004-03-08 2010-11-03 Nitto Denko Corporation Druckempfindliche Klebezusammensetzung, druckempfindliche Klebeblätter und Oberflächenschutzfolie
JP2005314579A (ja) * 2004-04-30 2005-11-10 Nitto Denko Corp 粘着剤組成物、および粘着シート類
TW200617124A (en) 2004-06-01 2006-06-01 Nitto Denko Corp Pressure-sensitive adhesive composition, pressure-sensitive adhesive sheet and surface protecting film
US20080166523A1 (en) * 2007-01-04 2008-07-10 Asahi Kasei Chemicals Corporation Tab leader tape made of polyphenylene ether-based resin
TWI387629B (zh) * 2004-07-26 2013-03-01 Nitto Denko Corp 壓感黏合劑組成物、壓感黏合片及表面保護膜
KR100694445B1 (ko) * 2004-08-24 2007-03-12 주식회사 엘지화학 대전 방지 성능을 갖는 아크릴계 점착제 조성물
JP4531628B2 (ja) 2004-09-16 2010-08-25 日東電工株式会社 粘着剤組成物、粘着シート類、および表面保護フィルム
JP4917267B2 (ja) * 2004-09-16 2012-04-18 日東電工株式会社 粘着剤組成物、粘着シート類、および表面保護フィルム
JP4358190B2 (ja) * 2005-03-16 2009-11-04 日東電工株式会社 粘着剤組成物、粘着シート類および表面保護フィルム
DE602006018906D1 (de) * 2005-05-20 2011-01-27 Nitto Denko Corp Haftklebemittel, haftklebefolie und oberflächenschutzfilm
JP5259940B2 (ja) * 2005-09-05 2013-08-07 日東電工株式会社 粘着剤組成物、粘着シートおよび表面保護フィルム
CN101243153B (zh) * 2005-09-05 2010-10-06 日东电工株式会社 粘合剂组合物、粘合片以及表面保护薄膜
MXPA06010596A (es) * 2005-12-23 2007-06-22 3M Innovative Properties Co Pelicula adhesiva con resistencia a altas temperaturas y baja generacion de electrostatica, construida con un polimero de polieterimida.
KR100831562B1 (ko) * 2006-03-23 2008-05-21 주식회사 엘지화학 유연성 기판 반송용 점착제 조성물
CN101517831B (zh) * 2006-09-26 2010-11-17 日立化成工业株式会社 各向异性导电性粘接剂组合物、各向异性导电性薄膜、电路构件的连接结构、以及被覆粒子的制造方法
KR101047925B1 (ko) * 2007-04-19 2011-07-08 주식회사 엘지화학 아크릴계 점착제 조성물 및 이를 포함하는 편광판
CN101775259A (zh) 2009-01-09 2010-07-14 3M创新有限公司 一种防静电的耐高温聚酰亚胺胶带
JP5623020B2 (ja) 2009-02-27 2014-11-12 日東電工株式会社 粘着剤組成物、粘着剤層、及び、粘着シート
US8986831B2 (en) 2011-05-24 2015-03-24 H. B. Fuller Company Pressure sensitive adhesive tear tape
CN102497170A (zh) * 2011-12-06 2012-06-13 爱普科斯科技（无锡）有限公司 一种用于层压板表面图贴装和回流焊的载具
CN102952468B (zh) * 2012-10-27 2013-11-13 蚌埠凤凰滤清器有限责任公司 一种滤清器用氯丁橡胶与溴化丁基橡胶混炼而得的粘合剂胶片
CN103614090B (zh) * 2013-12-06 2015-06-17 苏州贤聚科技有限公司 一种防静电压敏胶保护膜及其制备方法
CN104893607B (zh) * 2015-05-29 2017-09-12 张家港康得新光电材料有限公司 一种抗静电防爆保护膜
CA3003030C (en) * 2015-10-26 2023-12-19 University Of Wyoming Methods of generating microparticles and porous hydrogels using microfluidics
CN106281201A (zh) * 2016-08-29 2017-01-04 无锡万能胶粘剂有限公司 一种厌氧胶
WO2019079414A1 (en) 2017-10-17 2019-04-25 University Of Wyoming OPERATION OF OXYGEN-INHIBITED PHOTOPOLYMERIZATION IN EMULSION DROPLETS FOR THE MANUFACTURE OF MICROPARTICLES HAVING PERSONALIZABLE PROPERTIES
CN108130003A (zh) * 2017-12-19 2018-06-08 江苏斯瑞达新材料科技有限公司 电子元器件用防水耐热保护膜
CN110240875B (zh) * 2019-06-11 2021-06-01 恩平市盈嘉丰胶粘制品有限公司 一种耐高温石棉纸胶带及其制备方法
CN113801601A (zh) * 2021-09-27 2021-12-17 浙江福莱新材料股份有限公司 一种抗静电弹性防滑胶带及其制备方法

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US3104985A (en) * 1959-01-06 1963-09-24 Cabot Corp Conducting polymer compositions
US3691140A (en) * 1970-03-09 1972-09-12 Spencer Ferguson Silver Acrylate copolymer microspheres
US3832598A (en) * 1972-10-02 1974-08-27 Minnesota Mining & Mfg Electrically conductive tape device
US4166152B1 (en) * 1977-08-17 1999-05-18 Minnesota Mining & Mfg Tacky polymeric microspheres
DE8434291U1 (de) * 1984-11-23 1986-03-27 Beiersdorf Ag, 2000 Hamburg Klebeband
GB2170427B (en) * 1985-02-01 1989-06-07 Sanyo Kokusaku Pulp Co Pressure-sensitive adhesive tapes or sheets
US4656218A (en) * 1985-02-08 1987-04-07 Sanyo Kokusaku Pulp Co., Ltd. Adhesive copolymer microspheres-containing aqueous suspension and method for producing the same
JPS6312681A (ja) * 1986-07-02 1988-01-20 Sekisui Chem Co Ltd 帯電防止粘着テ−プもしくはシ−ト
US5045569A (en) * 1988-11-30 1991-09-03 Minnesota Mining And Manufacturing Company Hollow acrylate polymer microspheres
IE67319B1 (en) * 1989-10-11 1996-03-20 Waterford Res & Dev Ltd Antistatic adhesive tape
US5378405A (en) * 1993-07-28 1995-01-03 Minnesota Mining And Manufacturing Company Conductive microparticles and pressure-sensitive adhesive tapes made therefrom

Also Published As

Publication number Publication date
DE69507609T2 (de) 1999-09-30
WO1995030720A1 (en) 1995-11-16
JP3473701B2 (ja) 2003-12-08
MY113845A (en) 2002-06-29
EP0758366B1 (de) 1999-01-27
US5631079A (en) 1997-05-20
JPH09512567A (ja) 1997-12-16
KR970702906A (ko) 1997-06-10
EP0758366A1 (de) 1997-02-19
MX9605243A (es) 1997-10-31
CN1147268A (zh) 1997-04-09

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8328 Change in the person/name/address of the agent

Representative=s name: PAE REINHARD, SKUHRA, WEISE & PARTNER GBR, 80801 M