TWI334966B - - Google Patents

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Publication number
TWI334966B
TWI334966B TW093105949A TW93105949A TWI334966B TW I334966 B TWI334966 B TW I334966B TW 093105949 A TW093105949 A TW 093105949A TW 93105949 A TW93105949 A TW 93105949A TW I334966 B TWI334966 B TW I334966B
Authority
TW
Taiwan
Prior art keywords
group
resin
photosensitive resin
resin composition
formula
Prior art date
Application number
TW093105949A
Other languages
English (en)
Chinese (zh)
Other versions
TW200428167A (en
Inventor
Hideyuki Takahashi
Kenji Ishizeki
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Publication of TW200428167A publication Critical patent/TW200428167A/zh
Application granted granted Critical
Publication of TWI334966B publication Critical patent/TWI334966B/zh

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031Organic compounds not covered by group G03F7/029
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00Chemical modification by after-treatment
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0046Photosensitive materials with perfluoro compounds, e.g. for dry lithography
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/075Silicon-containing compounds
    • G03F7/0757Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • G03F7/0758Macromolecular compounds containing Si-O, Si-C or Si-N bonds with silicon- containing groups in the side chains
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055Radiation sensitive composition or product or process of making
    • Y10S430/106Binder containing
    • Y10S430/108Polyolefin or halogen containing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055Radiation sensitive composition or product or process of making
    • Y10S430/114Initiator containing
    • Y10S430/117Free radical

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
TW093105949A 2003-03-07 2004-03-05 Photosensitive resin composition and cured coating film TW200428167A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003061813 2003-03-07
JP2003385222 2003-11-14

Publications (2)

Publication Number Publication Date
TW200428167A TW200428167A (en) 2004-12-16
TWI334966B true TWI334966B (https=) 2010-12-21

Family

ID=32964916

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093105949A TW200428167A (en) 2003-03-07 2004-03-05 Photosensitive resin composition and cured coating film

Country Status (5)

Country Link
US (1) US7232648B2 (https=)
JP (1) JP4404049B2 (https=)
KR (1) KR101011656B1 (https=)
TW (1) TW200428167A (https=)
WO (1) WO2004079454A1 (https=)

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JP2006133378A (ja) * 2004-11-04 2006-05-25 Tokyo Ohka Kogyo Co Ltd 感光性樹脂組成物、およびこれを用いた感光性ドライフィルム
JP4611724B2 (ja) * 2004-12-03 2011-01-12 東京応化工業株式会社 遮光膜形成用感光性組成物、該遮光膜形成用感光性組成物で形成されたブラックマトリクス
JP4593309B2 (ja) 2005-01-21 2010-12-08 東京応化工業株式会社 精密微細空間の天板部形成方法
WO2007061115A1 (ja) * 2005-11-28 2007-05-31 Asahi Glass Company, Limited 隔壁、カラーフィルタ、有機elの製造方法
JP5008300B2 (ja) * 2005-12-01 2012-08-22 富士フイルム株式会社 離画壁及びその製造方法、カラーフィルタ及びその製造方法並びに液晶表示装置
JP5266760B2 (ja) * 2005-12-15 2013-08-21 旭硝子株式会社 含フッ素重合体、ネガ型感光性組成物及び隔壁
JP4692314B2 (ja) * 2006-02-14 2011-06-01 住友電気工業株式会社 半導体デバイスの製造方法
WO2007102487A1 (ja) * 2006-03-06 2007-09-13 Asahi Glass Company, Limited 親水性領域と撥水性領域を有する処理基材およびその製造方法
US8349410B2 (en) 2006-08-17 2013-01-08 University of Pittsburgh—of the Commonwealth System of Higher Education Modification of surfaces with polymers
KR100894274B1 (ko) * 2006-12-13 2009-04-21 제일모직주식회사 저유전성 감광성 수지 조성물 및 이를 이용한 유기절연막
JP5669396B2 (ja) * 2006-12-13 2015-02-12 ノバルティス アーゲー 化学線硬化性シリコーンヒドロゲルコポリマーおよびその使用
US7868112B2 (en) 2006-12-15 2011-01-11 Chisso Corporation Fluorine-containing polymer and resin composition
JPWO2008078707A1 (ja) * 2006-12-26 2010-04-22 旭化成イーマテリアルズ株式会社 光重合性樹脂積層体及びブラックマトリックスパターン付き基板の製造方法
US8168371B2 (en) * 2007-01-22 2012-05-01 Nissan Chemical Industries, Ltd. Positive photosensitive resin composition
JP4798021B2 (ja) * 2007-02-27 2011-10-19 Jnc株式会社 ポリシロキサンを用いた感光性組成物、それからなる樹脂膜、及びその樹脂膜を有する表示素子
KR101506535B1 (ko) * 2007-02-28 2015-03-27 제이엔씨 주식회사 포지티브형 감광성 수지 조성물
WO2008105503A1 (ja) * 2007-03-01 2008-09-04 Asahi Glass Company, Limited 撥水性領域のパターンを有する処理基材、その製造方法、および機能性材料の膜からなるパターンが形成された部材の製造方法
JP5126222B2 (ja) * 2007-04-25 2013-01-23 旭硝子株式会社 感光性組成物、隔壁、ブラックマトリックス、カラーフィルタの製造方法
WO2008146855A1 (ja) 2007-05-29 2008-12-04 Asahi Glass Company, Limited 感光性組成物、隔壁、ブラックマトリックス
JP2008298859A (ja) * 2007-05-29 2008-12-11 Asahi Glass Co Ltd 感光性組成物、それを用いた隔壁、隔壁の製造方法、カラーフィルタの製造方法、有機el表示素子の製造方法および有機tftアレイの製造方法
WO2008149776A1 (ja) * 2007-05-30 2008-12-11 Asahi Glass Company, Limited 隔壁と画素が形成された基板を製造する方法
JP2009053415A (ja) * 2007-08-27 2009-03-12 Nippon Steel Chem Co Ltd インクジェット印刷法によるカラーフィルターの製造方法及びカラーフィルター
US20090073356A1 (en) * 2007-09-19 2009-03-19 Seiko Epson Corporation Color filter ink, color filter, image display device, and electronic device
US20090073355A1 (en) * 2007-09-19 2009-03-19 Seiko Epson Corporation Color filter ink, color filter, image display device, and electronic device
JP2009128862A (ja) * 2007-11-28 2009-06-11 Seiko Epson Corp カラーフィルター用インク、カラーフィルター用インクセット、カラーフィルター、画像表示装置、および、電子機器
JP2009127027A (ja) * 2007-11-28 2009-06-11 Seiko Epson Corp カラーフィルター用インク、カラーフィルター用インクセット、カラーフィルター、画像表示装置、および、電子機器
JP4466725B2 (ja) * 2007-11-28 2010-05-26 セイコーエプソン株式会社 カラーフィルター用インク、カラーフィルター用インクセット、カラーフィルター、画像表示装置、および、電子機器
CN101896537B (zh) 2007-12-10 2012-10-24 株式会社钟化 具有碱显影性的固化性组合物、使用该组合物的绝缘性薄膜以及薄膜晶体管
JP2009145643A (ja) * 2007-12-14 2009-07-02 Seiko Epson Corp カラーフィルター用インク、カラーフィルター用インクセット、カラーフィルター、画像表示装置、および、電子機器
JP2009145722A (ja) * 2007-12-17 2009-07-02 Seiko Epson Corp カラーフィルター用インク、カラーフィルター、画像表示装置、および、電子機器
JP2009144087A (ja) * 2007-12-17 2009-07-02 Seiko Epson Corp カラーフィルター用インク、カラーフィルター用インクセット、カラーフィルター、画像表示装置、および、電子機器
JP5212063B2 (ja) * 2007-12-27 2013-06-19 住友化学株式会社 感光性樹脂組成物
JP2009169214A (ja) * 2008-01-18 2009-07-30 Seiko Epson Corp カラーフィルター用インクセット、カラーフィルター、画像表示装置、および、電子機器
KR101627381B1 (ko) * 2008-07-03 2016-06-03 아사히 가라스 가부시키가이샤 감광성 조성물, 격벽, 컬러 필터 및 유기 el 소자
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JP5617275B2 (ja) * 2009-02-26 2014-11-05 日本ゼオン株式会社 感放射線性樹脂組成物、樹脂膜、積層体及び電子部品
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JP5682573B2 (ja) * 2009-12-28 2015-03-11 旭硝子株式会社 感光性組成物、隔壁、カラーフィルタおよび有機el素子
TW201144335A (en) * 2010-06-01 2011-12-16 Everlight Chem Ind Corp Photosensitive resin composition
WO2012036477A2 (ko) * 2010-09-16 2012-03-22 주식회사 엘지화학 감광성 수지 조성물, 드라이 필름 솔더 레지스트 및 회로 기판
JP5803938B2 (ja) 2010-12-10 2015-11-04 旭硝子株式会社 ネガ型感光性樹脂組成物、光学素子用隔壁およびその製造方法、ならびに、該隔壁を有する光学素子の製造方法
TWI486259B (zh) 2010-12-27 2015-06-01 Au Optronics Corp 可撓式基板結構及其製作方法
JP5981167B2 (ja) * 2011-03-24 2016-08-31 東京応化工業株式会社 感光性樹脂組成物
CN102199263B (zh) * 2011-04-12 2013-04-10 中科院广州化学有限公司 一种双疏性含氟可交联嵌段共聚物及其制备方法与应用
KR20160138058A (ko) * 2014-03-31 2016-12-02 스미또모 가가꾸 가부시키가이샤 격벽을 갖는 기판
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JP7108390B2 (ja) * 2017-09-30 2022-07-28 株式会社ネオス 硬化性樹脂組成物
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Also Published As

Publication number Publication date
KR20050112097A (ko) 2005-11-29
KR101011656B1 (ko) 2011-01-28
JP4404049B2 (ja) 2010-01-27
US7232648B2 (en) 2007-06-19
US20060003256A1 (en) 2006-01-05
JPWO2004079454A1 (ja) 2006-06-08
TW200428167A (en) 2004-12-16
WO2004079454A1 (ja) 2004-09-16

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