KR101011656B1 - 감광성 수지 조성물 및 그 도막 경화물 - Google Patents

감광성 수지 조성물 및 그 도막 경화물 Download PDF

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Publication number
KR101011656B1
KR101011656B1 KR1020057016711A KR20057016711A KR101011656B1 KR 101011656 B1 KR101011656 B1 KR 101011656B1 KR 1020057016711 A KR1020057016711 A KR 1020057016711A KR 20057016711 A KR20057016711 A KR 20057016711A KR 101011656 B1 KR101011656 B1 KR 101011656B1
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KR
South Korea
Prior art keywords
group
resin
photosensitive resin
represented
resin composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020057016711A
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English (en)
Korean (ko)
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KR20050112097A (ko
Inventor
히데유키 다카하시
겐지 이시제키
Original Assignee
아사히 가라스 가부시키가이샤
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Publication of KR20050112097A publication Critical patent/KR20050112097A/ko
Application granted granted Critical
Publication of KR101011656B1 publication Critical patent/KR101011656B1/ko
Anticipated expiration legal-status Critical
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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00—Chemical modification by after-treatment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • G03F7/0758—Macromolecular compounds containing Si-O, Si-C or Si-N bonds with silicon- containing groups in the side chains
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing
    • Y10S430/108—Polyolefin or halogen containing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing
    • Y10S430/117—Free radical

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
KR1020057016711A 2003-03-07 2004-03-04 감광성 수지 조성물 및 그 도막 경화물 Expired - Fee Related KR101011656B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2003-00061813 2003-03-07
JP2003061813 2003-03-07
JPJP-P-2003-00385222 2003-11-14
JP2003385222 2003-11-14

Publications (2)

Publication Number Publication Date
KR20050112097A KR20050112097A (ko) 2005-11-29
KR101011656B1 true KR101011656B1 (ko) 2011-01-28

Family

ID=32964916

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020057016711A Expired - Fee Related KR101011656B1 (ko) 2003-03-07 2004-03-04 감광성 수지 조성물 및 그 도막 경화물

Country Status (5)

Country Link
US (1) US7232648B2 (https=)
JP (1) JP4404049B2 (https=)
KR (1) KR101011656B1 (https=)
TW (1) TW200428167A (https=)
WO (1) WO2004079454A1 (https=)

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JP4611724B2 (ja) * 2004-12-03 2011-01-12 東京応化工業株式会社 遮光膜形成用感光性組成物、該遮光膜形成用感光性組成物で形成されたブラックマトリクス
US8052828B2 (en) 2005-01-21 2011-11-08 Tokyo Okha Kogyo Co., Ltd. Photosensitive laminate film for forming top plate portion of precision fine space and method of forming precision fine space
JP4930378B2 (ja) * 2005-11-28 2012-05-16 旭硝子株式会社 隔壁、カラーフィルタ、有機ｅｌの製造方法
JP5008300B2 (ja) * 2005-12-01 2012-08-22 富士フイルム株式会社 離画壁及びその製造方法、カラーフィルタ及びその製造方法並びに液晶表示装置
KR20080078645A (ko) * 2005-12-15 2008-08-27 아사히 가라스 가부시키가이샤 함불소 중합체, 네거티브형 감광성 조성물 및 격벽
JP4692314B2 (ja) * 2006-02-14 2011-06-01 住友電気工業株式会社 半導体デバイスの製造方法
KR20080104292A (ko) * 2006-03-06 2008-12-02 아사히 가라스 가부시키가이샤 친수성 영역과 발수성 영역을 갖는 처리 기재 및 그 제조 방법
WO2008021500A2 (en) 2006-08-17 2008-02-21 University Of Pittsburgh-Of The Commonwealth System Of Higher Education Modification of surfaces with polymers
JP5669396B2 (ja) * 2006-12-13 2015-02-12 ノバルティス アーゲー 化学線硬化性シリコーンヒドロゲルコポリマーおよびその使用
KR100894274B1 (ko) * 2006-12-13 2009-04-21 제일모직주식회사 저유전성 감광성 수지 조성물 및 이를 이용한 유기절연막
JP5375100B2 (ja) * 2006-12-15 2013-12-25 Ｊｎｃ株式会社 フッ素系重合体および樹脂組成物
JPWO2008078707A1 (ja) * 2006-12-26 2010-04-22 旭化成イーマテリアルズ株式会社 光重合性樹脂積層体及びブラックマトリックスパターン付き基板の製造方法
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JP4798021B2 (ja) * 2007-02-27 2011-10-19 Ｊｎｃ株式会社 ポリシロキサンを用いた感光性組成物、それからなる樹脂膜、及びその樹脂膜を有する表示素子
KR101506535B1 (ko) * 2007-02-28 2015-03-27 제이엔씨 주식회사 포지티브형 감광성 수지 조성물
WO2008105503A1 (ja) * 2007-03-01 2008-09-04 Asahi Glass Company, Limited 撥水性領域のパターンを有する処理基材、その製造方法、および機能性材料の膜からなるパターンが形成された部材の製造方法
WO2008133312A1 (ja) * 2007-04-25 2008-11-06 Asahi Glass Company, Limited 感光性組成物、隔壁、ブラックマトリックス、カラーフィルタの製造方法
WO2008146855A1 (ja) 2007-05-29 2008-12-04 Asahi Glass Company, Limited 感光性組成物、隔壁、ブラックマトリックス
JP2008298859A (ja) * 2007-05-29 2008-12-11 Asahi Glass Co Ltd 感光性組成物、それを用いた隔壁、隔壁の製造方法、カラーフィルタの製造方法、有機ｅｌ表示素子の製造方法および有機ｔｆｔアレイの製造方法
WO2008149776A1 (ja) 2007-05-30 2008-12-11 Asahi Glass Company, Limited 隔壁と画素が形成された基板を製造する方法
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JP4466725B2 (ja) * 2007-11-28 2010-05-26 セイコーエプソン株式会社 カラーフィルター用インク、カラーフィルター用インクセット、カラーフィルター、画像表示装置、および、電子機器
JP2009127027A (ja) * 2007-11-28 2009-06-11 Seiko Epson Corp カラーフィルター用インク、カラーフィルター用インクセット、カラーフィルター、画像表示装置、および、電子機器
KR101800015B1 (ko) 2007-12-10 2017-11-21 카네카 코포레이션 알칼리 현상성을 갖는 경화성 조성물 및 그것을 사용한 절연성 박막 및 박막 트랜지스터
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JP5212063B2 (ja) * 2007-12-27 2013-06-19 住友化学株式会社 感光性樹脂組成物
JP2009169214A (ja) * 2008-01-18 2009-07-30 Seiko Epson Corp カラーフィルター用インクセット、カラーフィルター、画像表示装置、および、電子機器
KR101627381B1 (ko) * 2008-07-03 2016-06-03 아사히 가라스 가부시키가이샤 감광성 조성물, 격벽, 컬러 필터 및 유기 ｅｌ 소자
WO2010013816A1 (ja) 2008-08-01 2010-02-04 旭硝子株式会社 ネガ型感光性組成物、それを用いた光学素子用隔壁および該隔壁を有する光学素子
JP5121644B2 (ja) * 2008-09-24 2013-01-16 富士フイルム株式会社 感光性樹脂組成物、カラーフィルタ及びその製造方法、並びに、固体撮像素子
JP5617275B2 (ja) * 2009-02-26 2014-11-05 日本ゼオン株式会社 感放射線性樹脂組成物、樹脂膜、積層体及び電子部品
KR101225126B1 (ko) * 2009-03-19 2013-01-22 주식회사 엘지화학 머켑토 화합물을 포함하는 감광성 실리콘 수지 조성물 및 이를 이용한 반도체 소자 및 디스플레이 소자
CN102656517B (zh) * 2009-12-28 2014-05-14 旭硝子株式会社 感光性组合物、间隔壁、彩色滤光片及有机el元件
TW201144335A (en) * 2010-06-01 2011-12-16 Everlight Chem Ind Corp Photosensitive resin composition
JP2013539072A (ja) * 2010-09-16 2013-10-17 エルジー・ケム・リミテッド 感光性樹脂組成物、ドライフィルムソルダーレジスト及び回路基板
CN103238111B (zh) * 2010-12-10 2016-12-07 旭硝子株式会社 负型感光性树脂组合物、光学元件用间隔壁及其制造方法、具有该间隔壁的光学元件的制造方法以及拒油墨剂溶液
TWI486259B (zh) 2010-12-27 2015-06-01 Au Optronics Corp 可撓式基板結構及其製作方法
JP5981167B2 (ja) * 2011-03-24 2016-08-31 東京応化工業株式会社 感光性樹脂組成物
CN102199263B (zh) * 2011-04-12 2013-04-10 中科院广州化学有限公司 一种双疏性含氟可交联嵌段共聚物及其制备方法与应用
JP6557216B2 (ja) * 2014-03-31 2019-08-07 住友化学株式会社 隔壁付基板
TWI561325B (en) * 2014-08-01 2016-12-11 Au Optronics Corp Display module manufacturing method and display module
WO2016129324A1 (ja) * 2015-02-09 2016-08-18 富士フイルム株式会社 硬化性組成物、遮光膜付き赤外光カットフィルタ、及び、固体撮像装置
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JP7108390B2 (ja) * 2017-09-30 2022-07-28 株式会社ネオス 硬化性樹脂組成物
JP7532855B2 (ja) * 2020-03-31 2024-08-14 三菱ケミカル株式会社 活性エネルギー線硬化性組成物、その硬化物、及び積層体

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JPH11279243A (ja) 1998-03-31 1999-10-12 Goo Chem Ind Co Ltd 紫外線硬化性樹脂及び紫外線硬化性樹脂組成物並びにフォトソルダーレジストインク
JPH11281815A (ja) 1998-03-31 1999-10-15 Jsr Corp カラーフィルタ隔壁形成用感放射線性樹脂組成物
JP2001288216A (ja) 2000-04-06 2001-10-16 Kanto Denka Kogyo Co Ltd 二重結合を含有する含フッ素共重合体とその製造方法

Also Published As

Publication number Publication date
US20060003256A1 (en) 2006-01-05
TW200428167A (en) 2004-12-16
JPWO2004079454A1 (ja) 2006-06-08
WO2004079454A1 (ja) 2004-09-16
KR20050112097A (ko) 2005-11-29
TWI334966B (https=) 2010-12-21
US7232648B2 (en) 2007-06-19
JP4404049B2 (ja) 2010-01-27

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