TWI334966B - - Google Patents

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Publication number
TWI334966B
TWI334966B TW093105949A TW93105949A TWI334966B TW I334966 B TWI334966 B TW I334966B TW 093105949 A TW093105949 A TW 093105949A TW 93105949 A TW93105949 A TW 93105949A TW I334966 B TWI334966 B TW I334966B
Authority
TW
Taiwan
Prior art keywords
group
resin
photosensitive resin
resin composition
formula
Prior art date
Application number
TW093105949A
Other languages
English (en)
Chinese (zh)
Other versions
TW200428167A (en
Inventor
Hideyuki Takahashi
Kenji Ishizeki
Original Assignee
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Glass Co Ltd filed Critical Asahi Glass Co Ltd
Publication of TW200428167A publication Critical patent/TW200428167A/zh
Application granted granted Critical
Publication of TWI334966B publication Critical patent/TWI334966B/zh

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031Organic compounds not covered by group G03F7/029
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F8/00Chemical modification by after-treatment
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0046Photosensitive materials with perfluoro compounds, e.g. for dry lithography
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/075Silicon-containing compounds
    • G03F7/0757Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • G03F7/0758Macromolecular compounds containing Si-O, Si-C or Si-N bonds with silicon- containing groups in the side chains
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055Radiation sensitive composition or product or process of making
    • Y10S430/106Binder containing
    • Y10S430/108Polyolefin or halogen containing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055Radiation sensitive composition or product or process of making
    • Y10S430/114Initiator containing
    • Y10S430/117Free radical

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
TW093105949A 2003-03-07 2004-03-05 Photosensitive resin composition and cured coating film TW200428167A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003061813 2003-03-07
JP2003385222 2003-11-14

Publications (2)

Publication Number Publication Date
TW200428167A TW200428167A (en) 2004-12-16
TWI334966B true TWI334966B (enExample) 2010-12-21

Family

ID=32964916

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093105949A TW200428167A (en) 2003-03-07 2004-03-05 Photosensitive resin composition and cured coating film

Country Status (5)

Country Link
US (1) US7232648B2 (enExample)
JP (1) JP4404049B2 (enExample)
KR (1) KR101011656B1 (enExample)
TW (1) TW200428167A (enExample)
WO (1) WO2004079454A1 (enExample)

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DE602004024991D1 (de) * 2003-06-26 2010-02-25 Sekisui Chemical Co Ltd Bindemittel für beschichtungspaste
JP2006133378A (ja) * 2004-11-04 2006-05-25 Tokyo Ohka Kogyo Co Ltd 感光性樹脂組成物、およびこれを用いた感光性ドライフィルム
JP4611724B2 (ja) * 2004-12-03 2011-01-12 東京応化工業株式会社 遮光膜形成用感光性組成物、該遮光膜形成用感光性組成物で形成されたブラックマトリクス
US8052828B2 (en) 2005-01-21 2011-11-08 Tokyo Okha Kogyo Co., Ltd. Photosensitive laminate film for forming top plate portion of precision fine space and method of forming precision fine space
KR20080073302A (ko) * 2005-11-28 2008-08-08 아사히 가라스 가부시키가이샤 격벽, 컬러 필터, 유기 el의 제조 방법
JP5008300B2 (ja) * 2005-12-01 2012-08-22 富士フイルム株式会社 離画壁及びその製造方法、カラーフィルタ及びその製造方法並びに液晶表示装置
WO2007069703A1 (ja) * 2005-12-15 2007-06-21 Asahi Glass Company, Limited 含フッ素重合体、ネガ型感光性組成物及び隔壁
JP4692314B2 (ja) * 2006-02-14 2011-06-01 住友電気工業株式会社 半導体デバイスの製造方法
TW200804978A (en) * 2006-03-06 2008-01-16 Asahi Glass Co Ltd Treated substratum with hydrophilic region and water-repellent region and process for producing the same
US8349410B2 (en) 2006-08-17 2013-01-08 University of Pittsburgh—of the Commonwealth System of Higher Education Modification of surfaces with polymers
WO2008076736A2 (en) * 2006-12-13 2008-06-26 Novartis Ag Actinically curable silicone hydrogel copolymers and uses thereof
KR100894274B1 (ko) * 2006-12-13 2009-04-21 제일모직주식회사 저유전성 감광성 수지 조성물 및 이를 이용한 유기절연막
EP2103636B1 (en) 2006-12-15 2016-07-20 JNC Corporation Fluorine-containing polymer and resin composition
CN101568431A (zh) * 2006-12-26 2009-10-28 旭化成电子材料株式会社 光聚合性树脂层压体及带黑矩阵图案的基板的制造方法
US8168371B2 (en) * 2007-01-22 2012-05-01 Nissan Chemical Industries, Ltd. Positive photosensitive resin composition
JP4798021B2 (ja) * 2007-02-27 2011-10-19 Jnc株式会社 ポリシロキサンを用いた感光性組成物、それからなる樹脂膜、及びその樹脂膜を有する表示素子
KR101506535B1 (ko) * 2007-02-28 2015-03-27 제이엔씨 주식회사 포지티브형 감광성 수지 조성물
CN101622579B (zh) * 2007-03-01 2012-09-05 旭硝子株式会社 具有斥水性区域的图案的处理基材及其制造方法、以及形成有功能性材料的膜构成的图案的构件的制造方法
WO2008133312A1 (ja) * 2007-04-25 2008-11-06 Asahi Glass Company, Limited 感光性組成物、隔壁、ブラックマトリックス、カラーフィルタの製造方法
JP2008298859A (ja) * 2007-05-29 2008-12-11 Asahi Glass Co Ltd 感光性組成物、それを用いた隔壁、隔壁の製造方法、カラーフィルタの製造方法、有機el表示素子の製造方法および有機tftアレイの製造方法
JP5045747B2 (ja) 2007-05-29 2012-10-10 旭硝子株式会社 感光性組成物、隔壁、ブラックマトリックス
CN101680983A (zh) 2007-05-30 2010-03-24 旭硝子株式会社 形成有间隔壁和像素的基板的制造方法
JP2009053415A (ja) * 2007-08-27 2009-03-12 Nippon Steel Chem Co Ltd インクジェット印刷法によるカラーフィルターの製造方法及びカラーフィルター
US20090073356A1 (en) * 2007-09-19 2009-03-19 Seiko Epson Corporation Color filter ink, color filter, image display device, and electronic device
US20090073355A1 (en) * 2007-09-19 2009-03-19 Seiko Epson Corporation Color filter ink, color filter, image display device, and electronic device
JP2009128862A (ja) * 2007-11-28 2009-06-11 Seiko Epson Corp カラーフィルター用インク、カラーフィルター用インクセット、カラーフィルター、画像表示装置、および、電子機器
JP2009127027A (ja) * 2007-11-28 2009-06-11 Seiko Epson Corp カラーフィルター用インク、カラーフィルター用インクセット、カラーフィルター、画像表示装置、および、電子機器
JP4466725B2 (ja) * 2007-11-28 2010-05-26 セイコーエプソン株式会社 カラーフィルター用インク、カラーフィルター用インクセット、カラーフィルター、画像表示装置、および、電子機器
WO2009075233A1 (ja) 2007-12-10 2009-06-18 Kaneka Corporation アルカリ現像性を有する硬化性組成物およびそれを用いた絶縁性薄膜および薄膜トランジスタ
JP2009145643A (ja) * 2007-12-14 2009-07-02 Seiko Epson Corp カラーフィルター用インク、カラーフィルター用インクセット、カラーフィルター、画像表示装置、および、電子機器
JP2009144087A (ja) * 2007-12-17 2009-07-02 Seiko Epson Corp カラーフィルター用インク、カラーフィルター用インクセット、カラーフィルター、画像表示装置、および、電子機器
JP2009145722A (ja) * 2007-12-17 2009-07-02 Seiko Epson Corp カラーフィルター用インク、カラーフィルター、画像表示装置、および、電子機器
JP5212063B2 (ja) * 2007-12-27 2013-06-19 住友化学株式会社 感光性樹脂組成物
JP2009169214A (ja) * 2008-01-18 2009-07-30 Seiko Epson Corp カラーフィルター用インクセット、カラーフィルター、画像表示装置、および、電子機器
EP2309330A4 (en) * 2008-07-03 2012-01-18 Asahi Glass Co Ltd LIGHT-SENSITIVE COMPOSITION, DISTRIBUTION WALL, COLOR FILTER AND ORGANIC EL ARRANGEMENT
CN102112923B (zh) 2008-08-01 2013-06-05 旭硝子株式会社 负型感光性组合物、使用该组合物的光学元件用间隔壁及具有该间隔壁的光学元件
JP5121644B2 (ja) * 2008-09-24 2013-01-16 富士フイルム株式会社 感光性樹脂組成物、カラーフィルタ及びその製造方法、並びに、固体撮像素子
JP5617275B2 (ja) * 2009-02-26 2014-11-05 日本ゼオン株式会社 感放射線性樹脂組成物、樹脂膜、積層体及び電子部品
KR101225126B1 (ko) * 2009-03-19 2013-01-22 주식회사 엘지화학 머켑토 화합물을 포함하는 감광성 실리콘 수지 조성물 및 이를 이용한 반도체 소자 및 디스플레이 소자
CN102656517B (zh) * 2009-12-28 2014-05-14 旭硝子株式会社 感光性组合物、间隔壁、彩色滤光片及有机el元件
TW201144335A (en) * 2010-06-01 2011-12-16 Everlight Chem Ind Corp Photosensitive resin composition
JP2013539072A (ja) * 2010-09-16 2013-10-17 エルジー・ケム・リミテッド 感光性樹脂組成物、ドライフィルムソルダーレジスト及び回路基板
WO2012077770A1 (ja) * 2010-12-10 2012-06-14 旭硝子株式会社 ネガ型感光性樹脂組成物、光学素子用隔壁およびその製造方法、該隔壁を有する光学素子の製造方法、ならびに、撥インク剤溶液
TWI486259B (zh) 2010-12-27 2015-06-01 Au Optronics Corp 可撓式基板結構及其製作方法
JP5981167B2 (ja) * 2011-03-24 2016-08-31 東京応化工業株式会社 感光性樹脂組成物
CN102199263B (zh) * 2011-04-12 2013-04-10 中科院广州化学有限公司 一种双疏性含氟可交联嵌段共聚物及其制备方法与应用
WO2015152085A1 (ja) * 2014-03-31 2015-10-08 住友化学株式会社 隔壁付基板
TWI561325B (en) * 2014-08-01 2016-12-11 Au Optronics Corp Display module manufacturing method and display module
KR101949775B1 (ko) * 2015-02-09 2019-02-19 후지필름 가부시키가이샤 경화성 조성물, 차광막 부착 적외광 차단 필터, 및 고체 촬상 장치
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JP7108390B2 (ja) * 2017-09-30 2022-07-28 株式会社ネオス 硬化性樹脂組成物
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Also Published As

Publication number Publication date
US20060003256A1 (en) 2006-01-05
US7232648B2 (en) 2007-06-19
WO2004079454A1 (ja) 2004-09-16
JP4404049B2 (ja) 2010-01-27
TW200428167A (en) 2004-12-16
KR101011656B1 (ko) 2011-01-28
KR20050112097A (ko) 2005-11-29
JPWO2004079454A1 (ja) 2006-06-08

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