TWI325168B - - Google Patents

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Publication number
TWI325168B
TWI325168B TW095147439A TW95147439A TWI325168B TW I325168 B TWI325168 B TW I325168B TW 095147439 A TW095147439 A TW 095147439A TW 95147439 A TW95147439 A TW 95147439A TW I325168 B TWI325168 B TW I325168B
Authority
TW
Taiwan
Prior art keywords
substrate
cooling
transport
temperature
unit
Prior art date
Application number
TW095147439A
Other languages
English (en)
Chinese (zh)
Other versions
TW200739843A (en
Inventor
Yasutaka Souma
Mitsuhiro Sakai
Norio Wada
Shunichi Yahiro
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200739843A publication Critical patent/TW200739843A/zh
Application granted granted Critical
Publication of TWI325168B publication Critical patent/TWI325168B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Tunnel Furnaces (AREA)
TW095147439A 2006-01-24 2006-12-18 Substrate cooling device, substrate cooling method, and computer readable storage medium TW200739843A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006015251A JP4537324B2 (ja) 2006-01-24 2006-01-24 基板冷却装置、基板冷却方法、制御プログラム、コンピュータ読取可能な記憶媒体

Publications (2)

Publication Number Publication Date
TW200739843A TW200739843A (en) 2007-10-16
TWI325168B true TWI325168B (ko) 2010-05-21

Family

ID=38455307

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095147439A TW200739843A (en) 2006-01-24 2006-12-18 Substrate cooling device, substrate cooling method, and computer readable storage medium

Country Status (4)

Country Link
JP (1) JP4537324B2 (ko)
KR (1) KR101299763B1 (ko)
CN (1) CN100521078C (ko)
TW (1) TW200739843A (ko)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4542577B2 (ja) * 2007-09-19 2010-09-15 東京エレクトロン株式会社 常圧乾燥装置及び基板処理装置及び基板処理方法
JP2009158792A (ja) * 2007-12-27 2009-07-16 Dainippon Screen Mfg Co Ltd 基板処理装置
KR100921523B1 (ko) * 2008-05-30 2009-10-12 세메스 주식회사 평판 디스플레이 제조에 사용되는 기판 처리 장치 및 방법
JP4675401B2 (ja) * 2008-08-29 2011-04-20 東京エレクトロン株式会社 基板搬送装置
JP5635378B2 (ja) * 2010-11-30 2014-12-03 日東電工株式会社 半導体ウエハ搬送方法および半導体ウエハ搬送装置
KR101105387B1 (ko) * 2010-12-13 2012-01-16 주식회사 에스아이이 기판 건조장치
CN102651303B (zh) * 2011-05-09 2014-12-10 京东方科技集团股份有限公司 基板温度管控系统及方法
JP2013098300A (ja) * 2011-10-31 2013-05-20 Tokyo Electron Ltd 熱処理装置および熱処理方法
JP6964005B2 (ja) * 2018-01-09 2021-11-10 東京エレクトロン株式会社 熱処理装置、熱板の冷却方法及びコンピュータ読み取り可能な記録媒体
CN108842143A (zh) * 2018-07-09 2018-11-20 上海新昇半导体科技有限公司 外延炉冷却系统及冷却方法
JP7302142B2 (ja) * 2019-01-17 2023-07-04 住友電工ウインテック株式会社 導体軟化処理装置及び導体軟化処理方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0715873B2 (ja) * 1983-11-30 1995-02-22 株式会社東芝 レジストパターン形成方法
JPS6119131A (ja) * 1984-07-06 1986-01-28 Toshiba Corp レジスト処理装置
JPS6428918A (en) * 1987-07-24 1989-01-31 Mitsubishi Electric Corp Resist baking device
JP3872535B2 (ja) * 1996-03-14 2007-01-24 株式会社オーク製作所 ワークの電荷の消去中和装置
DE19983950T1 (de) * 1999-04-27 2002-08-01 Mitsubishi Electric Corp Verfahren zum Steuern der Arbeitsbedingungen einer Laserarbeitsmaschine und ein computerlesbares Speichermedium
JP3416078B2 (ja) * 1999-06-09 2003-06-16 東京エレクトロン株式会社 基板処理装置
US6475279B1 (en) * 1999-07-19 2002-11-05 Tokyo Electron Limited Substrate processing apparatus and substrate processing method
JP4380966B2 (ja) * 2002-05-20 2009-12-09 富士フイルム株式会社 感光層転写方法および装置
JP2004299850A (ja) * 2003-03-31 2004-10-28 Dainippon Printing Co Ltd 処理方法及び処理装置

Also Published As

Publication number Publication date
JP2007200994A (ja) 2007-08-09
JP4537324B2 (ja) 2010-09-01
CN101009210A (zh) 2007-08-01
KR101299763B1 (ko) 2013-08-23
TW200739843A (en) 2007-10-16
KR20070077793A (ko) 2007-07-27
CN100521078C (zh) 2009-07-29

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Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees