DE19983950T1 - Verfahren zum Steuern der Arbeitsbedingungen einer Laserarbeitsmaschine und ein computerlesbares Speichermedium - Google Patents

Verfahren zum Steuern der Arbeitsbedingungen einer Laserarbeitsmaschine und ein computerlesbares Speichermedium

Info

Publication number
DE19983950T1
DE19983950T1 DE19983950T DE19983950T DE19983950T1 DE 19983950 T1 DE19983950 T1 DE 19983950T1 DE 19983950 T DE19983950 T DE 19983950T DE 19983950 T DE19983950 T DE 19983950T DE 19983950 T1 DE19983950 T1 DE 19983950T1
Authority
DE
Germany
Prior art keywords
computer
controlling
storage medium
readable storage
working machine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19983950T
Other languages
English (en)
Inventor
Kouichi Indou
Masato Matsubara
Hideki Kimata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of DE19983950T1 publication Critical patent/DE19983950T1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K1/00—Methods or arrangements for marking the record carrier in digital fashion
    • G06K1/12—Methods or arrangements for marking the record carrier in digital fashion otherwise than by punching
    • G06K1/126—Methods or arrangements for marking the record carrier in digital fashion otherwise than by punching by photographic or thermographic registration
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Laser Beam Processing (AREA)
DE19983950T 1999-04-27 1999-04-27 Verfahren zum Steuern der Arbeitsbedingungen einer Laserarbeitsmaschine und ein computerlesbares Speichermedium Withdrawn DE19983950T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP1999/002227 WO2000064621A1 (fr) 1999-04-27 1999-04-27 Procede pour regler des conditions de traitement sur un appareil d'usinage laser, et support d'enregistrement lisible par ordinateur pour programme

Publications (1)

Publication Number Publication Date
DE19983950T1 true DE19983950T1 (de) 2002-08-01

Family

ID=14235569

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19983950T Withdrawn DE19983950T1 (de) 1999-04-27 1999-04-27 Verfahren zum Steuern der Arbeitsbedingungen einer Laserarbeitsmaschine und ein computerlesbares Speichermedium

Country Status (7)

Country Link
US (1) US7050882B1 (de)
JP (1) JP4357749B2 (de)
KR (1) KR100479642B1 (de)
CN (1) CN1133130C (de)
DE (1) DE19983950T1 (de)
TW (1) TW419409B (de)
WO (1) WO2000064621A1 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4537324B2 (ja) * 2006-01-24 2010-09-01 東京エレクトロン株式会社 基板冷却装置、基板冷却方法、制御プログラム、コンピュータ読取可能な記憶媒体
JP4917382B2 (ja) * 2006-08-09 2012-04-18 株式会社ディスコ レーザー光線照射装置およびレーザー加工機
TWI330563B (en) 2007-11-28 2010-09-21 Ind Tech Res Inst Programmable laser device and method for controlling the same
JP5158700B2 (ja) * 2008-03-05 2013-03-06 日本アビオニクス株式会社 半導体レーザ溶着装置
US8933374B2 (en) * 2009-08-03 2015-01-13 Toshiba Kikai Kabushiki Kaisha Pulse laser machining apparatus and pulse laser machining method
JP5460420B2 (ja) * 2010-03-30 2014-04-02 三菱電機株式会社 加工制御装置およびレーザ加工装置
CN105705289B (zh) * 2013-11-15 2018-06-22 松下知识产权经营株式会社 激光焊接条件确定方法以及激光焊接装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60255295A (ja) 1984-05-30 1985-12-16 Mitsubishi Electric Corp 自動レ−ザ加工機
JPS6277687A (ja) 1985-09-30 1987-04-09 Yokogawa Electric Corp ラン・デ−タによるラベル付け回路
JPS63196904A (ja) 1987-02-12 1988-08-15 Mitsubishi Electric Corp 数値制御装置
JPS63235086A (ja) 1987-03-20 1988-09-30 Fanuc Ltd レ−ザ発振器制御方法
JPH0417986A (ja) * 1990-05-14 1992-01-22 Toshiba Corp レーザ加工システム
JPH0452091A (ja) * 1990-06-15 1992-02-20 Toshiba Corp レーザ加工システム
JP2566686B2 (ja) * 1991-03-18 1996-12-25 富士通株式会社 数値制御データ作成装置
JP2917642B2 (ja) * 1992-01-24 1999-07-12 三菱電機株式会社 レーザ出力制御装置
JP3399590B2 (ja) * 1993-08-04 2003-04-21 富士通株式会社 配線の切断装置
KR19980702629A (ko) * 1995-09-27 1998-08-05 안자끼 사토루 레이저장치
JP3094918B2 (ja) * 1996-09-27 2000-10-03 日本電気株式会社 レーザ装置
JPH10109185A (ja) 1996-10-05 1998-04-28 Miyachi Technos Corp レーザマーキング装置
US5960405A (en) * 1997-02-05 1999-09-28 Fox Enterprises, Inc. Worldwide marketing logistics network including strategically located centers for frequency programming crystal oscillators to customer specification
JPH1119786A (ja) * 1997-07-03 1999-01-26 Nikon Corp レーザ加工装置及びレーザ加工装置用制御プログラムを記憶した媒体

Also Published As

Publication number Publication date
US7050882B1 (en) 2006-05-23
KR100479642B1 (ko) 2005-03-30
CN1133130C (zh) 2003-12-31
WO2000064621A1 (fr) 2000-11-02
KR20010112463A (ko) 2001-12-20
TW419409B (en) 2001-01-21
CN1348402A (zh) 2002-05-08
JP4357749B2 (ja) 2009-11-04

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8125 Change of the main classification

Ipc: B23K 26/42

8139 Disposal/non-payment of the annual fee