WO2000064621A1 - Procede pour regler des conditions de traitement sur un appareil d'usinage laser, et support d'enregistrement lisible par ordinateur pour programme - Google Patents

Procede pour regler des conditions de traitement sur un appareil d'usinage laser, et support d'enregistrement lisible par ordinateur pour programme Download PDF

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Publication number
WO2000064621A1
WO2000064621A1 PCT/JP1999/002227 JP9902227W WO0064621A1 WO 2000064621 A1 WO2000064621 A1 WO 2000064621A1 JP 9902227 W JP9902227 W JP 9902227W WO 0064621 A1 WO0064621 A1 WO 0064621A1
Authority
WO
WIPO (PCT)
Prior art keywords
processing
laser
laser oscillator
conditions
load
Prior art date
Application number
PCT/JP1999/002227
Other languages
English (en)
Japanese (ja)
Inventor
Kouichi Indou
Masato Matsubara
Hideki Kimata
Original Assignee
Mitsubishi Denki Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Denki Kabushiki Kaisha filed Critical Mitsubishi Denki Kabushiki Kaisha
Priority to KR10-2001-7013669A priority Critical patent/KR100479642B1/ko
Priority to CN998165867A priority patent/CN1133130C/zh
Priority to US09/959,119 priority patent/US7050882B1/en
Priority to DE19983950T priority patent/DE19983950T1/de
Priority to JP2000613602A priority patent/JP4357749B2/ja
Priority to PCT/JP1999/002227 priority patent/WO2000064621A1/fr
Priority to TW088106896A priority patent/TW419409B/zh
Publication of WO2000064621A1 publication Critical patent/WO2000064621A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K1/00—Methods or arrangements for marking the record carrier in digital fashion
    • G06K1/12—Methods or arrangements for marking the record carrier in digital fashion otherwise than by punching
    • G06K1/126—Methods or arrangements for marking the record carrier in digital fashion otherwise than by punching by photographic or thermographic registration
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Definitions

  • the present invention relates to a processing condition control method for a laser processing machine, and a recording medium readable by a combination which stores a program for the method.
  • the processing conditions are set as the current value s of the drive current supplied to the laser oscillator, the pulse oscillation frequency T, the pulse width W, and the number of pulses ⁇ Is done.
  • the values of the current value S, the pulse oscillation frequency T, the pulse width 1 W, and the number of pulses ⁇ are variously changed and stored in the processing condition file as various processing conditions.
  • This processing condition file is recorded and stored on a computer-readable recording medium, for example, a magnetic tape, a floppy disk, a hard disk or a magneto-optical disk connected to the control unit of the laser processing machine.
  • FIG. 5 is a display example showing a setting screen of a processing condition setting device (not shown) in a conventional laser processing machine.
  • a list 9 of processing condition files as shown in Fig. 5 is displayed, and the operation of the laser processing machine is illustrated while looking at this chart.
  • Input the processing conditions by operating the input means that does not work.
  • the first machining condition is set to a current value, a frequency, a number of pulses and a number of pulses
  • the second machining condition is set to a current value S 2 , a frequency T 2 , No ,.
  • the pulse width W 2 and the pulse number N 2 are set, and the third machining condition is set to the current value S 3 , the frequency T 3 , the pulse width W 3 and the pulse number N 3 .
  • the current value S, frequency T, The pulse width W and pulse number N are set.
  • the control device reads a machining program from the recording medium connected to the control device or another recording medium that can be read by a combination, and executes the program. Then, the control device reads the corresponding machining condition from the machining condition file based on the machining condition number (the number in the No. column of the chart shown in FIG. 5) and the machining mode described in the machining program, and According to the processing conditions, a driving current having a current value S is supplied to the laser oscillator so that N laser pulses having a frequency T and a pulse width W are output. The laser oscillator oscillates with the supplied drive current and performs processing.
  • the current value S, the frequency T, the pulse width W, and the number of pulses ⁇ are always upper limits determined in advance by the processing condition setting device of the laser processing machine in any of the processing conditions of the numbers. Up to the current value S, frequency T, pulse width W, and number of pulses ⁇ ⁇ .
  • the load may exceed the allowable load range.
  • the laser oscillator may be operated beyond the allowable range of the load, or may be operated for a long time at the load even if the laser oscillator is within the allowable range, approaching its upper limit.
  • the parts constituting the laser oscillator are quickly worn out and deteriorated.
  • the present invention has been made in order to solve the above problems, and is a laser processing machine that can easily set processing conditions of laser processing so that a load acting on a laser oscillator falls within an appropriate range. For controlling machining conditions and program therefor It is intended to provide a computer-readable recording medium on which the RAM is recorded. Disclosure of the invention
  • the processing condition control method for a laser processing machine includes the steps of: inputting the processing conditions when setting the processing conditions for driving the laser oscillator of the laser processing machine; On the other hand, the method includes a step of obtaining an expected load of the laser oscillator on conditions under which the load can act on the laser oscillator, and a step of displaying the obtained expected load.
  • the expected load of the laser oscillator is obtained based on the input processing conditions, and the expected load is displayed on the display device. Is displayed.
  • the processing conditions include a current value for driving a laser oscillator, a frequency of a laser output, a pulse width, a pulse number, and a processing mode for defining an irradiation pattern of laser pulse light to one or more processing locations. It is characterized by including. According to the present invention, the processing conditions of the laser processing machine are determined based on the drive current value of the laser oscillator, the frequency of the laser output, the pulse width, the number of pulses, and the processing mode.
  • the invention is characterized in that the expected load is a function of the sum of the current value, the frequency, the pulse width; and the number of pulses.
  • the expected load of the laser oscillator is obtained based on the sum of the drive current value of the laser oscillator, the frequency of the laser output, the pulse width, and the number of pulses.
  • a computer-readable recording medium is a computer-readable recording medium in which a program for setting a processing condition for driving a laser oscillator of a laser beam machine is recorded.
  • the laser Recording a program including: a step of calculating an expected load of the oscillator; and a step of displaying the calculated expected load.
  • the control device of the laser beam machine reads out the program for setting the machining conditions from the recording medium and executes the program, whereby the expected load of the laser oscillator with respect to the machining conditions input by the operator is obtained, The expected load is not displayed on the display device.
  • the processing conditions include a current value for driving a laser oscillator, a frequency of a laser output, a pulse width, a number of pulses, and a processing defining an irradiation pattern of a laser pulse light to one or more processing positions. Including mode.
  • the processing conditions of the laser processing machine are determined based on the drive current value of the laser oscillator, the frequency of the laser output, the pulse width, the number of pulses, and the processing mode.
  • the expected load is a function of the sum of the current value, the frequency, the pulse width, and the number of pulses.
  • the expected load of the laser oscillator is obtained based on the sum of the drive current value of the laser oscillator, the frequency of the laser output, the pulse width, and the number of pulses.
  • FIG. 1 is a block diagram showing a schematic configuration of a laser processing machine to which the present invention is applied
  • FIG. 2 shows an example of a setting screen for setting processing conditions in the laser processing machine.
  • FIG. 3 is a schematic diagram
  • FIG. 3 is a flowchart in a case where a hole is drilled in a printed wiring board by a pulsed laser
  • FIG. 4 is a flowchart showing a flow of a process condition edit check process.
  • FIG. 5 is a schematic view showing a setting screen for setting processing conditions in a conventional laser beam machine. BEST MODE FOR CARRYING OUT THE INVENTION
  • FIGS. 1 to 4 BEST MODE FOR CARRYING OUT THE INVENTION
  • FIG. 1 is a block diagram showing a schematic configuration of a laser beam machine to which the present invention is applied.
  • This laser processing machine controls a laser oscillator 2, a display device 3 for displaying an index indicating a load factor of the laser oscillator 2 when setting processing conditions, and stores a processing condition file composed of the set processing conditions.
  • the configuration includes a first recording medium 4, a second recording medium 5 for storing a processing program, and an input device 6 for inputting processing conditions by operating an operating device.
  • the first recording medium 4 is a computer-readable recording medium such as a writable and readable nonvolatile semiconductor memory, a magnetic tape, a floppy disk, a hard disk, or a magneto-optical disk.
  • the second recording medium 5 is a computer-readable recording medium such as a nonvolatile semiconductor memory, a magnetic tape, a floppy disk, a hard disk, or a magneto-optical disk.
  • the control device 1 reads the machining condition number and the machining condition corresponding to the machining mode described in the machining program from the machining condition file, and outputs a driving current, a pulse width, and a timing pulse based on the machining condition. Controls the driving of the laser oscillator 2.
  • the timing pulse refers to the timing (frequency) when the laser oscillator actually outputs according to the set processing conditions.
  • FIG. 2 is a display example of a setting screen displayed on the display device 3 when setting processing conditions.
  • a processing condition file list 7 and a processing condition check bar 8 which is an index indicating the load factor of the laser oscillator 2 are displayed.
  • each processing condition includes a current value S, a frequency T, a pulse width W, a pulse number N, and a processing mode.
  • characters such as “M”, “C”, and “P” indicating the mode type are displayed in the machining mode column. “M” is continuous mode, “C” is cycle mode, and “P” is pulse-by-pulse mode. Each mode will be described later.
  • the first processing condition is the current value S!
  • the number ⁇ , pulse width, number of pulses and machining mode are set to “M”
  • the second machining condition is the current value S 2 , frequency T 2 , pulse width W 2 , number of pulses N 2 and machining mode Set to “C”
  • the third machining condition is: current value S 3 , frequency T 3, no. Loose width W 3 , pulse number N 3 and machining mode “P” are set.
  • the current value S, frequency T, pulse width W, number of pulses N, and processing mode are set for the fourth and subsequent processing conditions.
  • the processing condition check bar 8 is not particularly limited.
  • the processing condition check bar 8 is formed of a band-shaped display portion, and a part of the display portion has a length corresponding to the load factor of the laser oscillator 2.
  • the load factor of the laser oscillator 2 can be visually recognized by changing the value.
  • the processing condition check bar 8 can display up to a load factor equivalent to, for example, 200%, with the allowable maximum value of the load factor of the laser oscillator 2 being 100%.
  • FIG. 3 is a flowchart in a case where a boring process is performed on a printed wiring board using a pulsed laser.
  • the control device 1 first determines the machining mode, and performs, for example, three holes (hole 1, hole 2, and hole 3) according to the machining mode.
  • the continuous mode M is a pattern in which, after the drilling of the hole 1 is completed, the drilling of the hole 2 is performed, and the drilling of the hole 3 is performed after the drilling. In this pattern, it is necessary to perform processing while cooling in order to avoid applying an excessive load to the laser oscillator 2, and the pulse interval for cooling increases as holes 1, 2, and 3 are processed. It becomes.
  • Cycle mode C is a pattern in which the pulse width is constant and the hole is drilled by moving to hole 1, hole 2, and hole 3 every pulse. In this pattern, there is a moving time of the laser oscillator 2 after the laser oscillation of one pulse, and the laser oscillator 2 is cooled during the moving time. There is no need to increase the spacing.
  • the pulse-by-pulse mode P is a pattern in which the pulse width is changed for each pulse, the hole 1 is drilled, the hole 2 is drilled, and after that, the hole 3 is drilled. is there. In this pattern, the pulse width is varied By doing so, the laser oscillator 2 is cooled.
  • the operator sets the current value S, frequency T, pulse width W, pulse number N, and processing mode.
  • the controller 1 checks the processing conditions for each processing mode according to the flowchart shown in FIG.
  • FIG. 4 is a flowchart showing the flow of the processing for editing the processing conditions.
  • the editing check processing described below is realized by the control device 1 executing the editing check processing program recorded on the first or second recording medium 4, 5 or another recording medium that can be read by a computer. Is done.
  • the control device 1 determines whether or not the operator has designated a mode (step S1). If the processing mode is designated, it is determined whether or not the mode is such that a load can act on the laser oscillator (step S2). For example, in the above-described continuous mode M, cycle mode C, and pulse-by-pulse mode P, a load acts in the continuous mode M and the pulse-by-pulse mode P, and almost no load acts in the cycle mode C.
  • step S2 if the processing mode is the continuous mode M or the pulse-by-pulse mode P, the process proceeds to step S3, and the load factor of the laser oscillator 2 is checked against the set conditions of the operation. On the other hand, when the machining mode is the cycle mode C, the load factor is not checked. In addition to the above three processing modes, if another laser beam or a turn is added, or if a load may act on the laser oscillator 2, the load factor of the laser oscillator 2 is checked and the load is checked. If does not work, do not check the load factor.
  • step S3 the controller 1 calculates the sum ⁇ S of the current values S according to the following equation (1), the sum ⁇ ⁇ T of the frequency T according to the equation (2), the sum ⁇ ⁇ ⁇ W of the pulse width W according to the equation (3), According to equation (4), the total sum ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ of the number of pulses N is calculated and obtained. Then, the control device 1 calculates a function represented by a predetermined equation (5) based on each sum S, ⁇ T, ⁇ W, and ⁇ of the current value S, the frequency T, the pulse width W, and the number of pulses ⁇ . To Thus, the laser output that is expected to be output by the laser oscillator when the processing is actually performed is calculated and obtained.
  • the control device 1 calculates the ratio of to the predetermined reference value ⁇ , that is, the laser oscillator 2 Calculate and find the load factor.
  • the value of is a value that allows for a predetermined safety factor for the allowable load of the laser oscillator 2.
  • the control device 1 controls the display of the processing condition check bar 8 according to the obtained load factor. As a result, a display corresponding to the expected load factor of the laser oscillator 2 is made on the processing condition check bar 8 of the display device 3.
  • step S4 If the display of 8 exceeds 100%, change one or more of the current S, frequency T, pulse width W, and pulse number D in the processing conditions, or change two or more. Adjust so that the display of condition check bar 8 is 100% or less.
  • the control device 1 writes the setting conditions at that time as a processing condition file in the first recording medium 4 (step S4), and ends the processing. .
  • the expected load factor of the laser oscillator 2 is obtained based on the input processing conditions, and the load factor is calculated.
  • the processing condition check bar 8 is displayed on the display device 3. Therefore, the operator can adjust the processing conditions while watching the processing condition check bar 8 so that the load factor of the laser oscillator 2 falls within a predetermined range. To prevent overloading. As much as possible, the operator can easily and quickly find the appropriate processing conditions.
  • the continuous mode M, the cycle mode C, and the pulse-by-pulse mode P are described.
  • the present invention is not limited to this, and processing conditions can be similarly controlled for other processing patterns.
  • the load factor of the laser oscillator 2 is displayed using the processing condition checker 18.
  • the present invention is not limited to this. If the operator can confirm the load factor of the laser oscillator 2, Any display mode may be used, or the load factor may be notified by voice using voice synthesis means or the like.
  • the processing condition control method for a laser processing machine when setting the processing conditions for the laser processing machine, when the operator inputs the processing conditions, The expected load of the laser oscillator is calculated based on the estimated load, and the estimated load is displayed on the display device.
  • the operator while watching the display of the expected load, views the processing conditions so that the load of the laser oscillator falls within a predetermined range. Can be adjusted. Therefore, it is possible to prevent an excessive load from being applied to the laser oscillator at the time of actual processing, and it is possible to suppress wear and deterioration of the components of the laser oscillator. Also, the operator can easily and quickly find appropriate processing conditions.
  • the processing conditions of the laser processing machine are determined based on the drive current value of the laser oscillator, the frequency of the laser output, the pulse width, the number of pulses, and the processing mode.
  • the expected load of the laser oscillator can be obtained based on the processing conditions.
  • the expected load of the laser oscillator is obtained based on the sum of the driving current value of the laser oscillator, the frequency of the laser output, the pulse width, and the number of pulses. The operator can easily determine appropriate processing conditions.
  • the control device of the laser processing machine reads out a program for setting the processing conditions from the recording medium and executes the program, whereby the processing conditions input by the operator are obtained.
  • the expected load of the laser oscillator is calculated and the expected load is displayed on the display device, so the operator looks at the display of the expected load and adjusts the processing conditions so that the load of the laser oscillator falls within the specified range. Can be adjusted. Therefore, it is possible to prevent an excessive load from being applied to the laser oscillator at the time of actual processing, and it is possible to suppress wear and deterioration of the components of the laser oscillator. Also, the operator can easily and quickly find appropriate processing conditions.
  • the processing conditions of the laser processing machine are determined based on the drive current value of the laser oscillator, the frequency of the laser output, the pulse width, the number of pulses, and the processing mode. Before actual operation, the expected load of the laser oscillator can be obtained based on the processing conditions.
  • the expected load of the laser oscillator is based on the sum of the drive current value of the laser oscillator, the frequency of the laser output, the pulse width, and the number of pulses. Since the required load can be obtained accurately, the operator can easily determine the appropriate processing conditions. Industrial applicability
  • the method for controlling the processing conditions of the laser processing machine according to the present invention and the computer-readable recording medium on which the program for the processing is recorded include, as the processing conditions, the current value of the drive current supplied to the laser oscillator. S, pulse oscillation frequency T, pulse width "W, and pulse number N are set. C suitable for Les one The processing machine such as performing drilling by the oscillation, single THE

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Laser Beam Processing (AREA)

Abstract

Lorsqu'un opérateur fixe certaines conditions de traitement, une commande (1) estime le facteur de charge d'un oscillateur laser (2) sur la base de ces conditions fixées, puis fait en sorte que ce facteur de charge vienne s'afficher sur un dispositif d'affichage (3) sous la forme d'une barre de contrôle (8). L'opérateur peut alors, tout en surveillant cette barre de contrôle (8), régler lesdites conditions de traitement de sorte que le facteur de charge de l'oscillateur laser (2) se situe dans une gamme prédéterminée. L'oscillateur laser (2) est ainsi protégé de toute charge excessive pendant le traitement.
PCT/JP1999/002227 1999-04-27 1999-04-27 Procede pour regler des conditions de traitement sur un appareil d'usinage laser, et support d'enregistrement lisible par ordinateur pour programme WO2000064621A1 (fr)

Priority Applications (7)

Application Number Priority Date Filing Date Title
KR10-2001-7013669A KR100479642B1 (ko) 1999-04-27 1999-04-27 레이저가공기의 가공조건 제어방법 및 이를 위한프로그램을 기록한 컴퓨터 판독가능한 기록매체
CN998165867A CN1133130C (zh) 1999-04-27 1999-04-27 激光加工机加工条件控制方法
US09/959,119 US7050882B1 (en) 1999-04-27 1999-04-27 Method of controlling working conditions of a laser working machine and a computer-readable storage medium
DE19983950T DE19983950T1 (de) 1999-04-27 1999-04-27 Verfahren zum Steuern der Arbeitsbedingungen einer Laserarbeitsmaschine und ein computerlesbares Speichermedium
JP2000613602A JP4357749B2 (ja) 1999-04-27 1999-04-27 レーザ加工機の加工条件設定装置
PCT/JP1999/002227 WO2000064621A1 (fr) 1999-04-27 1999-04-27 Procede pour regler des conditions de traitement sur un appareil d'usinage laser, et support d'enregistrement lisible par ordinateur pour programme
TW088106896A TW419409B (en) 1999-04-27 1999-04-29 Method for controlling the processing conditions for a laser manufacturing machine, and a computer readable recording media with a program for such method stored therein

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP1999/002227 WO2000064621A1 (fr) 1999-04-27 1999-04-27 Procede pour regler des conditions de traitement sur un appareil d'usinage laser, et support d'enregistrement lisible par ordinateur pour programme

Publications (1)

Publication Number Publication Date
WO2000064621A1 true WO2000064621A1 (fr) 2000-11-02

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PCT/JP1999/002227 WO2000064621A1 (fr) 1999-04-27 1999-04-27 Procede pour regler des conditions de traitement sur un appareil d'usinage laser, et support d'enregistrement lisible par ordinateur pour programme

Country Status (7)

Country Link
US (1) US7050882B1 (fr)
JP (1) JP4357749B2 (fr)
KR (1) KR100479642B1 (fr)
CN (1) CN1133130C (fr)
DE (1) DE19983950T1 (fr)
TW (1) TW419409B (fr)
WO (1) WO2000064621A1 (fr)

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JP2009208126A (ja) * 2008-03-05 2009-09-17 Nippon Avionics Co Ltd 半導体レーザ溶着装置
US8487208B2 (en) * 2006-08-09 2013-07-16 Disco Corporation Laser beam irradiation apparatus and laser working machine
WO2015072107A1 (fr) * 2013-11-15 2015-05-21 パナソニックＩｐマネジメント株式会社 Procédé de détermination de condition de soudage au laser et dispositif de soudage au laser

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JP4537324B2 (ja) * 2006-01-24 2010-09-01 東京エレクトロン株式会社 基板冷却装置、基板冷却方法、制御プログラム、コンピュータ読取可能な記憶媒体
TWI330563B (en) 2007-11-28 2010-09-21 Ind Tech Res Inst Programmable laser device and method for controlling the same
WO2011016176A1 (fr) * 2009-08-03 2011-02-10 東芝機械株式会社 Appareil d'usinage à laser pulsé et procédé d'usinage au laser pulsé
JP5460420B2 (ja) * 2010-03-30 2014-04-02 三菱電機株式会社 加工制御装置およびレーザ加工装置

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CN1133130C (zh) 2003-12-31
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TW419409B (en) 2001-01-21
US7050882B1 (en) 2006-05-23
CN1348402A (zh) 2002-05-08
JP4357749B2 (ja) 2009-11-04
KR100479642B1 (ko) 2005-03-30

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