CN100521078C - 基板冷却装置、基板冷却方法 - Google Patents

基板冷却装置、基板冷却方法 Download PDF

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Publication number
CN100521078C
CN100521078C CNB2007100043562A CN200710004356A CN100521078C CN 100521078 C CN100521078 C CN 100521078C CN B2007100043562 A CNB2007100043562 A CN B2007100043562A CN 200710004356 A CN200710004356 A CN 200710004356A CN 100521078 C CN100521078 C CN 100521078C
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CN
China
Prior art keywords
substrate
cooling
conveyance
temperature
cooling end
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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CNB2007100043562A
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English (en)
Chinese (zh)
Other versions
CN101009210A (zh
Inventor
相马康孝
坂井光广
和田宪雄
八寻俊一
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Publication of CN101009210A publication Critical patent/CN101009210A/zh
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Publication of CN100521078C publication Critical patent/CN100521078C/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Tunnel Furnaces (AREA)
CNB2007100043562A 2006-01-24 2007-01-24 基板冷却装置、基板冷却方法 Expired - Fee Related CN100521078C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006015251A JP4537324B2 (ja) 2006-01-24 2006-01-24 基板冷却装置、基板冷却方法、制御プログラム、コンピュータ読取可能な記憶媒体
JP2006015251 2006-01-24

Publications (2)

Publication Number Publication Date
CN101009210A CN101009210A (zh) 2007-08-01
CN100521078C true CN100521078C (zh) 2009-07-29

Family

ID=38455307

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2007100043562A Expired - Fee Related CN100521078C (zh) 2006-01-24 2007-01-24 基板冷却装置、基板冷却方法

Country Status (4)

Country Link
JP (1) JP4537324B2 (ko)
KR (1) KR101299763B1 (ko)
CN (1) CN100521078C (ko)
TW (1) TW200739843A (ko)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4542577B2 (ja) * 2007-09-19 2010-09-15 東京エレクトロン株式会社 常圧乾燥装置及び基板処理装置及び基板処理方法
JP2009158792A (ja) * 2007-12-27 2009-07-16 Dainippon Screen Mfg Co Ltd 基板処理装置
KR100921523B1 (ko) * 2008-05-30 2009-10-12 세메스 주식회사 평판 디스플레이 제조에 사용되는 기판 처리 장치 및 방법
JP4675401B2 (ja) * 2008-08-29 2011-04-20 東京エレクトロン株式会社 基板搬送装置
JP5635378B2 (ja) * 2010-11-30 2014-12-03 日東電工株式会社 半導体ウエハ搬送方法および半導体ウエハ搬送装置
KR101105387B1 (ko) * 2010-12-13 2012-01-16 주식회사 에스아이이 기판 건조장치
CN102651303B (zh) * 2011-05-09 2014-12-10 京东方科技集团股份有限公司 基板温度管控系统及方法
JP2013098300A (ja) * 2011-10-31 2013-05-20 Tokyo Electron Ltd 熱処理装置および熱処理方法
JP6964005B2 (ja) * 2018-01-09 2021-11-10 東京エレクトロン株式会社 熱処理装置、熱板の冷却方法及びコンピュータ読み取り可能な記録媒体
CN108842143A (zh) * 2018-07-09 2018-11-20 上海新昇半导体科技有限公司 外延炉冷却系统及冷却方法
JP7302142B2 (ja) * 2019-01-17 2023-07-04 住友電工ウインテック株式会社 導体軟化処理装置及び導体軟化処理方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0715873B2 (ja) * 1983-11-30 1995-02-22 株式会社東芝 レジストパターン形成方法
JPS6119131A (ja) * 1984-07-06 1986-01-28 Toshiba Corp レジスト処理装置
JPS6428918A (en) * 1987-07-24 1989-01-31 Mitsubishi Electric Corp Resist baking device
JP3872535B2 (ja) * 1996-03-14 2007-01-24 株式会社オーク製作所 ワークの電荷の消去中和装置
DE19983950T1 (de) * 1999-04-27 2002-08-01 Mitsubishi Electric Corp Verfahren zum Steuern der Arbeitsbedingungen einer Laserarbeitsmaschine und ein computerlesbares Speichermedium
JP3416078B2 (ja) * 1999-06-09 2003-06-16 東京エレクトロン株式会社 基板処理装置
US6475279B1 (en) * 1999-07-19 2002-11-05 Tokyo Electron Limited Substrate processing apparatus and substrate processing method
JP4380966B2 (ja) * 2002-05-20 2009-12-09 富士フイルム株式会社 感光層転写方法および装置
JP2004299850A (ja) * 2003-03-31 2004-10-28 Dainippon Printing Co Ltd 処理方法及び処理装置

Also Published As

Publication number Publication date
TWI325168B (ko) 2010-05-21
JP2007200994A (ja) 2007-08-09
JP4537324B2 (ja) 2010-09-01
CN101009210A (zh) 2007-08-01
KR101299763B1 (ko) 2013-08-23
TW200739843A (en) 2007-10-16
KR20070077793A (ko) 2007-07-27

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