TW200739843A - Substrate cooling device, substrate cooling method, and computer readable storage medium - Google Patents

Substrate cooling device, substrate cooling method, and computer readable storage medium

Info

Publication number
TW200739843A
TW200739843A TW095147439A TW95147439A TW200739843A TW 200739843 A TW200739843 A TW 200739843A TW 095147439 A TW095147439 A TW 095147439A TW 95147439 A TW95147439 A TW 95147439A TW 200739843 A TW200739843 A TW 200739843A
Authority
TW
Taiwan
Prior art keywords
substrate cooling
substrate
storage medium
computer readable
readable storage
Prior art date
Application number
TW095147439A
Other languages
Chinese (zh)
Other versions
TWI325168B (en
Inventor
Yasutaka Souma
Mitsuhiro Sakai
Norio Wada
Shunichi Yahiro
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200739843A publication Critical patent/TW200739843A/en
Application granted granted Critical
Publication of TWI325168B publication Critical patent/TWI325168B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Tunnel Furnaces (AREA)

Abstract

Substrate cooling device 25 has a roller transportation mechanism 5 as transportation road where the heated substrate G is transported to one direction and a cooling mechanism 7 that cools the substrate G transported with the roller transportation mechanism 5. Preliminary cooling chamber 65a and main cooling chamber 65b are sequentially arranged from the transportation direction upstream side according to roller transportation mechanism 5 in the cooling mechanism 7. The cooling mechanism 7 cools the Substrate G at a prescribed temperature in main cooling chamber 65b.
TW095147439A 2006-01-24 2006-12-18 Substrate cooling device, substrate cooling method, and computer readable storage medium TW200739843A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006015251A JP4537324B2 (en) 2006-01-24 2006-01-24 Substrate cooling device, substrate cooling method, control program, computer-readable storage medium

Publications (2)

Publication Number Publication Date
TW200739843A true TW200739843A (en) 2007-10-16
TWI325168B TWI325168B (en) 2010-05-21

Family

ID=38455307

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095147439A TW200739843A (en) 2006-01-24 2006-12-18 Substrate cooling device, substrate cooling method, and computer readable storage medium

Country Status (4)

Country Link
JP (1) JP4537324B2 (en)
KR (1) KR101299763B1 (en)
CN (1) CN100521078C (en)
TW (1) TW200739843A (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4542577B2 (en) * 2007-09-19 2010-09-15 東京エレクトロン株式会社 Normal pressure drying apparatus, substrate processing apparatus, and substrate processing method
JP2009158792A (en) * 2007-12-27 2009-07-16 Dainippon Screen Mfg Co Ltd Substrate processing apparatus
KR100921523B1 (en) * 2008-05-30 2009-10-12 세메스 주식회사 Method and apparatus for fabricating substrates used in manufacturing flat panel display
JP4675401B2 (en) * 2008-08-29 2011-04-20 東京エレクトロン株式会社 Substrate transfer device
JP5635378B2 (en) * 2010-11-30 2014-12-03 日東電工株式会社 Semiconductor wafer transfer method and semiconductor wafer transfer apparatus
KR101105387B1 (en) * 2010-12-13 2012-01-16 주식회사 에스아이이 Substrate drying apparatus
CN102651303B (en) * 2011-05-09 2014-12-10 京东方科技集团股份有限公司 Base plate temperature management and control system and method
JP2013098300A (en) * 2011-10-31 2013-05-20 Tokyo Electron Ltd Thermal treatment apparatus and thermal treatment method
CN108842143A (en) * 2018-07-09 2018-11-20 上海新昇半导体科技有限公司 Epitaxial furnace cooling system and cooling means
WO2020148877A1 (en) * 2019-01-17 2020-07-23 住友電工ウインテック株式会社 Conductor softening processing device and conductor softening processing method

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0715873B2 (en) * 1983-11-30 1995-02-22 株式会社東芝 Resist pattern formation method
JPS6119131A (en) * 1984-07-06 1986-01-28 Toshiba Corp Resist processor
JPS6428918A (en) * 1987-07-24 1989-01-31 Mitsubishi Electric Corp Resist baking device
JP3872535B2 (en) * 1996-03-14 2007-01-24 株式会社オーク製作所 Work charge erasing neutralization device
CN1133130C (en) * 1999-04-27 2003-12-31 三菱电机株式会社 Method of controlling process conditions on laser machining apparatus, and computer-readable recording medium for program
JP3416078B2 (en) * 1999-06-09 2003-06-16 東京エレクトロン株式会社 Substrate processing equipment
KR100704749B1 (en) * 1999-07-19 2007-04-09 동경 엘렉트론 주식회사 Substrate processing apparatus and substrate processing method
JP4380966B2 (en) * 2002-05-20 2009-12-09 富士フイルム株式会社 Photosensitive layer transfer method and apparatus
JP2004299850A (en) * 2003-03-31 2004-10-28 Dainippon Printing Co Ltd Processing method and processing device

Also Published As

Publication number Publication date
KR20070077793A (en) 2007-07-27
CN100521078C (en) 2009-07-29
CN101009210A (en) 2007-08-01
TWI325168B (en) 2010-05-21
KR101299763B1 (en) 2013-08-23
JP4537324B2 (en) 2010-09-01
JP2007200994A (en) 2007-08-09

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees