CN101009210A - Substrate cooling device, substrate cooling method, control program and computer readable storage medium - Google Patents
Substrate cooling device, substrate cooling method, control program and computer readable storage medium Download PDFInfo
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- CN101009210A CN101009210A CNA2007100043562A CN200710004356A CN101009210A CN 101009210 A CN101009210 A CN 101009210A CN A2007100043562 A CNA2007100043562 A CN A2007100043562A CN 200710004356 A CN200710004356 A CN 200710004356A CN 101009210 A CN101009210 A CN 101009210A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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Abstract
The invention provides a substrate cooling device capable of improving productive capacity even aiming for large-scale substrate, while preventing deform and damage of the substrate. The substrate cooling device (25) includes a roll conveying mechanism (5) as a conveying path of direction conveying substrate (G) and a cooling mechanism (7) for cooling the substrate (G) conveyed by the roll conveying mechanism (5). The cooling mechanism (7) is in order arranged with a preparing cooling room (65a) and a main cooling room (65b) along the roll conveying mechanism (5) from upstream side of conveying direction, in the preparing cooling room (65a) the heated substrate (G) is cooled, heat of substrate (G) is removed roughly, then the substrate (G) is cold to stated temperature in the main cooling room (65b).
Description
Technical field
The present invention relates to be used for flat-panel monitor (FPD) but the storage medium that reads of substrates such as the glass substrate substrate cooling apparatus, substrate cooling method, control program and the computer that cool off.
Background technology
In the manufacturing of FPD,, adopt photoetching (photolithography) technology in order to form circuit pattern on glass substrate at FPD.Adopt photoetching technique to form circuit pattern, resist liquid is coated in forms resist film on the glass substrate successively, corresponding to circuit pattern, make the resist film exposure, and it is carried out development treatment.
Usually, photoetching technique for the purpose of the tack that improves resist film, is carried out heat treated to glass substrate before and after the formation of resist film or after the development treatment etc., and in the cooling of the laggard oozy glass substrate of heat treated.Use cooling device to carry out the cooling of glass substrate, this device comprises: support, accept and support glass substrate by carrying arm support and conveyance; Coldplate is arranged on the downside of this support, cooled glass substrate; And chamber, cover the substrate that is bearing on the support and also can carry out lifting (for example with reference to patent documentation 1).In order to realize the raising of production capacity, this cooling device constitutes, and is bearing in covering under the state of substrate of support, imports cooling fluid in chamber, makes the substrate chilling, then, chamber is risen, and utilizes the substrate of coldplate cooling support on support.
But in aforesaid existing cooling device, if the glass substrate after being heated is carried out chilling, then temperature distributing disproportionation is even in the face, exists glass substrate to produce the danger of distortion.
In addition, in recent years, FPD is tending towards maximizing, the above huge glass substrate of 2m appears reaching on one side, because maximization operability variation along with substrate, in the cooling device of above-mentioned prior art, if glass substrate maximizes, the impact when then existing owing to transmission between carrying arm and support causes damaged danger.
Patent documentation 1: Japanese kokai publication hei 10-229037 communique
Summary of the invention
The present invention finishes in view of the above problems, but its purpose is to provide a kind of substrate cooling apparatus, substrate cooling method, control program and computer to read storage medium, even at the substrate that maximizes, also production capacity can be improved, substrate deformation and breakage can be positively prevented simultaneously.
In order to address the above problem, the invention provides a kind of substrate cooling apparatus, the substrate after the cooling heating is characterized in that, comprising: carrying channel, the substrate after a direction conveyance heating; And cooling body, the substrate of cooling conveyance on above-mentioned carrying channel.And, the upstream side of above-mentioned cooling body along above-mentioned carrying channel from the conveyance direction disposes preparation cooling end and main cooling end successively, substrate after above-mentioned preparation cooling end cooling heating is removed the heat of substrate roughly, at above-mentioned main cooling end this substrate is cooled to the temperature of regulation then.
In addition, the invention provides a kind of substrate cooling apparatus, the substrate after the cooling heating is characterized in that, comprising: carrying channel, the substrate after a direction conveyance heating; Cooling body, the substrate of cooling conveyance on above-mentioned carrying channel; And controlling organization, control above-mentioned cooling body, make substrate reach set point of temperature.And, the upstream side of above-mentioned cooling body along above-mentioned carrying channel from the conveyance direction disposes preparation cooling end and main cooling end successively, substrate after above-mentioned preparation cooling end cooling heating, remove the heat of substrate roughly, utilize the control of above-mentioned controlling organization then, make the temperature that this substrate is cooled to regulation at above-mentioned main cooling end.
In the present invention, preferred above-mentioned controlling organization basis is arranged near the temperature detection signal of the temperature detecting part the above-mentioned carrying channel corresponding with above-mentioned main cooling end position, control the cooling in the above-mentioned main cooling end of above-mentioned cooling body, make substrate reach the temperature of regulation.In this case, preferred above-mentioned cooling body, in above-mentioned main cooling end, supply with cooling fluid to substrate, carry out the cooling of substrate, above-mentioned controlling organization is according to the temperature detection signal of said temperature test section, and control makes substrate reach the temperature of regulation from the flow of the cooling fluid of above-mentioned cooling body and at least one in the temperature.Preferred above-mentioned carrying channel utilization is at the rotation of a plurality of rolling members of a direction assortment, rolling conveyance substrate.At least a portion of the above-mentioned rolling member corresponding with above-mentioned main cooling end position is cooled from its inside, is bringing into play the effect as above-mentioned cooling body.Above-mentioned controlling organization is controlled the temperature of at least a portion of the above-mentioned rolling member corresponding with above-mentioned main cooling end position according to the temperature detection signal of said temperature test section, makes substrate reach the temperature of regulation.
In addition, the invention provides a kind of substrate cooling apparatus, the substrate after the cooling heating is characterized in that, comprising: carrying channel, the substrate after a direction conveyance heating; Housing is arranged to be housed in the substrate of conveyance on the above-mentioned carrying channel; And cooling body, cooling base in above-mentioned housing.And, the upstream side of above-mentioned cooling body along above-mentioned carrying channel from the conveyance direction disposes preparation cooling end and main cooling end successively, substrate after above-mentioned preparation cooling end cooling heating is removed the heat of substrate roughly, at above-mentioned main cooling end this substrate is cooled to the temperature of regulation then.
In addition, the invention provides a kind of substrate cooling apparatus, the substrate after the cooling heating is characterized in that, comprising: carrying channel, the substrate after a direction conveyance heating; Housing is arranged to be housed in the substrate of conveyance on the above-mentioned carrying channel; Cooling body, cooling base in above-mentioned housing; And controlling organization, control above-mentioned cooling body, make substrate reach set point of temperature.And, the upstream side of above-mentioned cooling body along above-mentioned carrying channel from the conveyance direction disposes preparation cooling end and main cooling end successively, substrate after above-mentioned preparation cooling end cooling heating, remove the heat of substrate roughly, utilize the control of above-mentioned controlling organization then, make the temperature that this substrate is cooled to regulation at above-mentioned main cooling end.
In the present invention, preferred above-mentioned controlling organization is according to the temperature detection signal that is arranged on the temperature detecting part in the above-mentioned housing corresponding with above-mentioned main cooling end position, control the cooling in the above-mentioned main cooling end of above-mentioned cooling body, make substrate reach the temperature of regulation.In this case, in the preferred above-mentioned housing, between above-mentioned preparation cooling end and above-mentioned main cooling end, be provided with the next door, this next door has the through port that the substrate of conveyance on above-mentioned carrying channel can pass through, and above-mentioned cooling body is supplied with cooling fluid to substrate in above-mentioned main cooling end, cooling base, above-mentioned controlling organization is according to the detection signal of said temperature test section, and control makes substrate reach the temperature of regulation from the flow of the cooling fluid of above-mentioned cooling body and at least one in the temperature.And in this case, preferred above-mentioned cooling body in above-mentioned preparation cooling end, by sucking the outer atmosphere gas of above-mentioned housing, and is supplied to substrate, cooling base with it.Further, in this case, preferred above-mentioned preparation cooling end has the fan that is arranged on above-mentioned housing wall portion, and above-mentioned cooling body in above-mentioned preparation cooling end, utilizes said fans to suck the outer atmosphere gas of above-mentioned housing, and it is supplied to substrate.
In addition, the invention provides a kind of substrate cooling method, it is characterized in that, the upstream side of utilization along above-mentioned carrying channel from the conveyance direction disposes the substrate cooling apparatus of preparation cooling end and main cooling end successively, cooling at above-mentioned preparation cooling end, is cooled off the substrate after heating along the substrate of carrying channel after the heating of a direction conveyance, remove the heat of substrate roughly, at above-mentioned main cooling end this substrate is cooled to the temperature of regulation then.
And, the invention provides a kind of control program, it is characterized in that, operation on computers, the control and treatment device makes and carries out the aforesaid substrate cooling means when carrying out on computers.
Further, but the storage medium that the present invention also provides a kind of computer to read stores the control program of operation on computers, it is characterized in that above-mentioned control program is the control and treatment device on computers, makes and carries out above-mentioned substrate cooling method when carrying out.
According to the present invention, utilize cooling body cooling substrate to a direction conveyance on carrying channel, can not apply because the big impulsive force that conveyance produces substrate, can carry out the conveyance and the cooling of substrate simultaneously, and, the structure of cooling body is, dispose preparation cooling end and main cooling end successively along carrying channel from conveyance direction upstream side, substrate after above-mentioned preparation cooling end cooling heating, the rough heat of removing substrate, then, at above-mentioned main cooling end this substrate is cooled to the temperature of regulation.So need not to make the substrate chilling after the heating, can realize comprising the reduction in processing timeization of conveyance.Therefore, even the substrate that maximizes also can improve production capacity, can positively prevent substrate deformation and breakage simultaneously.
Description of drawings
Fig. 1 is the substrate cooling apparatus that is equipped with one embodiment of the present invention, carries out the resist coating of the development treatment of the formation of resist film and the resist film after the exposure-processed, the floor map of developing system to FPD with glass substrate.
Fig. 2 is the sectional view of the in-plane of substrate cooling apparatus.
Fig. 3 is the sectional view of the side surface direction of substrate cooling apparatus.
Fig. 4 is arranged on the sectional view of the side surface direction of the spray nozzle part part on the substrate cooling apparatus.
Fig. 5 is the figure that is used to illustrate the type of cooling that is arranged on the rolling member on the substrate cooling apparatus.
Fig. 6 is the figure that is used for illustrating the substrate cooling processing of substrate cooling apparatus.
Fig. 7 is arranged on the figure of the variation of preparation cooling end on the substrate cooling apparatus and main cooling end.
Symbol description
25,29,32: cooling unit (substrate cooling apparatus); 5: the rolling transport mechanism; 6: housing; 7: cooling body; 7a: preparation cooling end; 7b: main cooling end; 50a, 50b: rolling member; 63: through port; 64: the next door; 75a: fan; 104: cell controller (control part); 105: temperature sensor (temperature detecting part); G: substrate.
Embodiment
Below, with reference to accompanying drawing, embodiments of the present invention are specifically described.
Fig. 1 is the substrate cooling apparatus that is equipped with one embodiment of the present invention, carries out the resist coating of the development treatment of the formation of resist film and the resist film after the exposure-processed, the floor map of developing system to FPD with glass substrate (below abbreviate " substrate " as).
Resist coating, developing system 100 comprise: be equipped with the box body C that is used to accommodate a plurality of substrate G box body station (cassette station) 1, to substrate G implement to comprise coating and a series of processing of developing treating stations 2 and and substrate G implemented the interface station (interface station) 4 of carrying out the transmission of substrate G between the exposure device 9 of exposure-processed.Box body station 1 and interface station 4 are separately positioned on the both sides for the treatment of stations 2.In addition, among Fig. 1, the long side direction of resist coating, developing system 100 is made as directions X, vertical with directions X in the plane direction is made as the Y direction.
Box body station 1 comprises: can on the Y direction side by side the mounting table 12 of mounting box body C and and treating stations 2 between carry out the carrying device 11 that moving into of substrate G taken out of, between mounting table 12 and outside, carry out the conveyance of box body C.The carrying arm 11a that is arranged on carrying device 11 can move along the guide rail 10 that extends in the Y direction, also can move up and down, moves forward and backward and horizontally rotate simultaneously, carries out moving into of substrate G and take out of between box body C and treating stations 2.
Treating stations 2 has between box body station 1 and interface station 4 conveyance circuit A, the B of the two parallel row substrate G that extend along directions X.Conveyance circuit A forms by the structure of the mobile conveyance in so-called planes such as rolling conveyance or belt conveyance with substrate G 1 one side direction interface station 4 one side conveyances from the box body station, and conveyance circuit B forms by the structure of the mobile conveyance in so-called planes such as rolling conveyance or belt conveyance with substrate G 4 one side direction box body station 1 one side conveyances from the interface station.
On conveyance circuit A, from the box body station 1 one side direction interface stations, 4 one sides successively assortment have: Excimer uv illumination unit (e-UV) 21, shampooing (scrub) are cleaned unit (SCR) 22, preheating unit (PH) 23, are adhered to (adhesion) unit (AD) 24, cooling unit (COL) 25, resist coating element (CT) 26, drying under reduced pressure unit (DP) 27, heat treated unit (HT) 28 and cooling unit (COL) 29.
21 pairs of organic substances that are included on the substrate G of Excimer uv illumination unit (e-UV) are removed processing, and shampooing is cleaned the shampooing of carrying out substrate G in unit (SCR) 22 and cleaned processing and dried.Preheat the heat treated that unit (PH) 23 carries out substrate G, adhesion unit (AD) 24 is carried out the hydrophobization processing of substrate G, and 25 couples of substrate G of cooling unit described later (COL) cool off.Resist coating element (CT) 26 is supplied with resist liquid to substrate G and is formed resist film, and drying under reduced pressure unit (DP) 27 makes the volatile ingredient evaporation that is included on the substrate G in the resist film under reduced pressure, make the resist film drying.Heat treated unit (HT) 28 carries out the heat treated of substrate G, and cooling unit described later (COL) 29 and cooling unit (COL) 25 are the same to be cooled off substrate G.
On conveyance circuit B, from the interface station 4 one side direction box body stations, 1 one sides successively assortment have: developing cell (DEV) 30, heat treated unit (HT) 31 and cooling unit (COL) 32.In addition, be provided with testing fixture (IP) 35 between cooling unit (COL) 32 and box body station 1, this testing fixture comprises that to implementing the substrate G after resist coating and a series of processing of developing checks.
Developing cell (DEV) 30 carries out going up coating developer solution, the flushing processing of substrate G, the dried of substrate G to substrate G successively.Heat treated unit (HT) 31 and heat treated unit (HT) 28 are the same to carry out heat treated to substrate G, and cooling unit described later (COL) 32 and cooling unit (COL) 25,29 are the same to be cooled off substrate G.
Interface station 4 comprises: rotation (rotary) platform (RS) 44, dispose the buffer pocket that can accommodate substrate G, and be the transfer part of substrate G; With carrying arm 43, be received in the substrate G that conveyance circuit A goes up conveyance, with its conveyance to rotating platform (RS) 44.Carrying arm 43 can about, move forward and backward and horizontally rotate, can near with carrying arm 43 in abutting connection with the exposure device 9 and the external device (ED) block 90 that are provided with, external device (ED) block and carrying arm 43 and developing cell (DEV) 30 have peripheral exposure device (EE) and captions recording device (TITLER) in abutting connection with being provided with.
Resist coating, development processing apparatus 100 constitute, be connected with the process controller 101 that possesses CPU, and by its control.Be connected with user interface 102 and storage part 103 on the process controller 101.This user interface 102 is used to manage the each several part of resist coating, development processing apparatus 100 and each unit by the process management person and instructs the keyboard of input operation etc., the perhaps formations such as display of the ruuning situation of visualization display each several part and each unit.Storage part 103 stored records have the scheme of control program and treatment conditions data etc., and these control programs and treatment conditions data etc. are used to utilize the control of process controller 101 to realize the various processing that resist coating, development processing apparatus 100 are carried out.
And, as required,, in process controller 101, carry out by from storage part 103, accessing any scheme from the indication at user interface 102 etc., thus, under the control of process control portion 101, carry out treatment desired by resist coating development processing apparatus 100.In addition, schemes such as control program and treatment conditions data, utilization is in and is housed in the storage medium that can be read by computer, the scheme of the state in CD-ROM, hard disk, floppy disk, the flash memory etc. for example, perhaps can be from other devices by for example special circuit, at any time transmit, utilize in real time (on-line).
In the resist coating that so constitutes, development processing apparatus 100, at first, be positioned in the substrate G in the box body C on the mounting table 12 at box body station 1, carrying arm 11a by carrying device 11, conveyance is to the upstream-side-end of the conveyance circuit A for the treatment of stations 2, further conveyance on conveyance circuit A, the organic substance that utilizes 21 pairs of Excimer uv illumination units (e-UV) to be included in the substrate G is removed processing.To finish the substrate G that organic substance is removed processing at Excimer uv illumination unit (e-UV) 21, conveyance on conveyance circuit A is cleaned in the clean unit (SCR) 22 of shampooing and is handled and dried.
Clean substrate G conveyance on conveyance circuit A of finishing clean processing of shampooing and dried in the unit (SCR) 22 in shampooing, in preheating unit (PH) 23, carry out heat treated, make its dehydration.To in preheating unit (PH) 23, finish substrate G conveyance on conveyance circuit A of heat treated, and in adhesion unit (AD) 24, carry out hydrophobization and handle.To in adhesion unit (AD) 24, finish the substrate G conveyance on conveyance circuit A after hydrophobization is handled, in cooling unit (COL) 25, cool off.Utilize rolling transport mechanism 5 described later conveyance substrate G on conveyance circuit A on one side, Yi Bian carry out the cooling of substrate G.
To in resist coating element (CT) 26, form resist film in cooling unit (COL) 25 cooled substrate G conveyances on conveyance circuit A.One side conveyance substrate G on conveyance circuit A, by to substrate G go up supply resist liquid utilize resist coating element (CT) 26 form resist films on one side.
To in resist coating element (CT) 26, form the substrate G conveyance on conveyance circuit A behind the resist film,, carry out the dried of resist film by in drying under reduced pressure unit (DP) 27, being exposed in the decompression atmosphere gas.
To in drying under reduced pressure unit (DP) 27, implement the substrate G conveyance on conveyance circuit A after the dried of resist film, in heat treated unit (HT) 28, carry out heat treated, remove the solvent that is included in the resist film.Will be in the conveyance on conveyance circuit A of the substrate G after heat treated unit (HT) 28 finishes heat treated, cooling in cooling unit (COL) 29.Utilize rolling transport mechanism 5 described later conveyance substrate G on conveyance circuit A on one side, Yi Bian carry out the cooling of substrate G.
Will be in cooling unit (COL) 29 cooled substrate G conveyance is to end of downstream side on conveyance circuit A, then, carrying arm 43 conveyances that utilize interface station 4 are to rotating platform (RS) 44.Afterwards, utilize carrying arm 43, in peripheral exposure device (EE), be used to remove the exposure-processed of the outer part (unwanted part) of resist film the peripheral exposure device (EE) of substrate G conveyance to external device (ED) block 90.Then, utilize carrying arm 43 with substrate G conveyance to exposure device 9, resist film is implemented the exposure-processed of predetermined pattern.In addition, temporarily substrate G is housed in sometimes in the buffer pocket on the rotating platform (RS) 44, and then with its conveyance to exposure device 9.Utilize carrying arm 43 will finish substrate G conveyance after the exposure-processed to the captions recording device (TITLER) of external device (ED) block 90, by the information of captions recording device (TITLER) recording prescribed.
To record substrate G conveyance on conveyance circuit B of provisioning information in captions recording device (TITLER), the coating of implementing developer solution in developing cell (DEV) 30 is successively handled, flushing is handled and dried.The coating of developer solution is handled, flushing is handled and dried is for example carried out in the following order: conveyance substrate G on conveyance circuit B, simultaneously on substrate G, pile with developer solution, then, in case stop conveyance, the angle that substrate G will tilt to stipulate, developer solution flows down, and goes up to substrate G in this state and supplies with flushing liquor, and developer solution is washed off, then, substrate G recovers flat-hand position, Yi Bian carry out conveyance once more, Yi Bian blow out dry gas to substrate G.
The substrate G conveyance on conveyance circuit B after processing and the dried is handled, is washed in the coating that will finish developer solution in developing cell (DEV) 30, implements heat treated in heat treated unit (HT) 31, removes the solvent and the moisture that are included in the resist film.The i line UV illumination unit of the decolouring processing of carrying out developer solution also can be set between developing cell (DEV) 30 and heat treated unit (HT) 31 in addition.Substrate G conveyance on conveyance circuit B after will in heat treated unit (HT) 31, finishing heat treated, cooling in cooling unit (COL) 32.Utilize rolling transport mechanism 5 described later conveyance substrate G on conveyance circuit B on one side, Yi Bian carry out the cooling of substrate G.
To in cooling unit (COL) 32, finish cooled substrate G conveyance on conveyance circuit B, in inspection unit (IP) 35, check.The carrying arm 11a that utilization is arranged on the carrying device 11 on the box body station 1 will be housed in the box body C of the regulation that is positioned on the mounting table 12 by the substrate G after checking.
Below, be described in detail for cooling unit (COL) 25.In addition, cooling unit (COL) 29,32 all has identical structure with cooling unit (COL) 25.
Fig. 2 is the sectional view of the in-plane of expression cooling unit (COL) 25 (substrate cooling apparatus), and Fig. 3 is the sectional view of its side surface direction.
Cooling unit (COL) 25 comprises: rolling transport mechanism 5, to directions X one side conveyance substrate G; Housing 6 is set to center on or accommodates rolling transport mechanism 5 and the substrate G that utilizes 5 conveyances of rolling transport mechanism; With cooling body 7, in housing 6, the substrate G that utilizes transport mechanism 5 conveyances is cooled off.
Near the carrying channel of the substrate G of the rolling transport mechanism 5 in main cooling chamber 65b, be provided with temperature sensor (temperature detecting part) 105, the temperature of substrate G as requested, utilization receives the cell controller (controller) 104 from the instruction of the temperature detection signal of temperature sensor 105 and cyclelog 101, and control is from air mass flow and the temperature of tempering air supply source 73b.In addition, also can constitute and utilize cell controller 104 only to control from the air mass flow of tempering air supply source 73b and any one structure in the temperature, perhaps, also can constitute the structure of also utilizing cell controller 104 to control from the gas flow of gas supply source 73a.
Nozzle 71a, 71b are separately positioned on the preparation cooling chamber 65a side wall portion relative with the Y direction with main cooling chamber 65b, make and extend along the Y direction in preparation cooling chamber 65a and main cooling chamber 65b.In addition, nozzle 71a, 71b are separately positioned on the two sides side of the substrate G that utilizes 5 conveyances of rolling transport mechanism, and assortment has a plurality of on directions X.Be arranged on the rear side of the substrate G that utilizes 5 conveyances of rolling transport mechanism or nozzle 71a, the 71b of downside, be separately positioned on rolling member 50 each other, thus, can realize the slimming of housing 6.
(Fig. 4 is arranged on the sectional view of the side surface direction of spray nozzle part 71a, the 71b part on the substrate cooling apparatus) as shown in Figure 4, be arranged on nozzle 71a, the 71b of face side and the rear side of the substrate G that utilizes 5 conveyances of rolling transport mechanism, respectively below the side face and above be formed with supply port 72a, the 72b of cooling fluid, make and supply with surface from cooling fluid to substrate G and the back side (interarea), but more preferably the mode with 30～40 ° angle tilt forms supply port 72a, 72b at the side face of nozzle 71a, 71b, and it is tilted to the directions X upstream side.That is, nozzle 71a, 71b mode of intersecting with interarea from supply port 72a, 72b respectively and the opposite upstream side air supply of conveyance direction of substrate G towards directions X with substrate G.Thus, air from supply source 73a, 73b is contacted with substrate G effectively, the time that per unit amount air is contacted with substrate G suppresses shortlyer simultaneously, thus can suppress because air contacts and heating with substrate G, thus can carry out the cooling of substrate G effectively.In addition, supply port 72a, 72b also can form the incision-like of extending along the Y direction respectively, also can form a plurality of netted.
In addition, side face at nozzle 71a, 71b is formed with a plurality of supply port 72a, 72b respectively along Y direction devices spaced apart, and, directions X adjacent nozzles 71a each other, 71b each other, 71a and 71b each other, the modes different with the Y width position form.Thus, can roughly on whole, cool off the substrate G that utilizes 5 conveyances of rolling transport mechanism equably.
(Fig. 5 is the figure that is used to illustrate the type of cooling of the rolling member 50b that is arranged on the substrate cooling apparatus) as shown in Figure 5, be configured in the rolling member 50b in the main cooling chamber 65b, has the not shown stream that connects Y direction (direction of principal axis) respectively in inside, simultaneously, Y direction both ends are connected with the pipe arrangement 52 with cooler (chiller) 51 across swivel coupling, make cooling fluid in the pipe arrangement 52 that utilizes cooler 51 to be adjusted to set point of temperature, for example cooling water at internal circulation.Thus, rolling member 50b is cooled to the temperature of regulation respectively, performance is as the effect of the part of the cooling body 7 of cooling base G when contacting with substrate G.In addition, at the adjacent rolling member 50b of directions X each other, the circulating direction of cooling water becomes reverse (reference arrow direction), thus, can utilize whole evenly coolings of the substrate G of rolling transport mechanism 5 conveyances.In addition, the symbol among the figure 53,54 is respectively and is used to make the pump that cooling water circulates and is used to adjust the valve that is sent to the flow of the cooling water in the rolling member 50b in the pipe arrangement 52 in pipe arrangement 52 and rolling member 50b.The temperature of substrate G is as requested utilized the temperature of the cooling water of the flow of cooling water of cell controller 104 control pumps 53, valve 54 and cooler 51, i.e. the temperature of rolling member 50b.
Be configured in the preparation cooling chamber 65a rolling member 50a at least outer peripheral face form by low heat conductivity materials such as resins, substrate G is not caused thermal impact.
The upper wall portions and the bottom wall portion of housing 6 have double-wall structure, and this double wall comprises inwall 66 and the outer wall 67 that is spaced from each other the space setting.On inwall 66, be provided with a plurality of for example netted exhaust outlet 68a that extend along the Y direction along the directions X devices spaced apart; Simultaneously, on outer wall 67, be provided with exhaust outlet 68b; In the space between inwall 66 and outer wall 67, be provided with the exhaust line 68c that is communicated with a plurality of exhaust outlet 68a and exhaust outlet 68b.Exhaust outlet 68a, exhaust outlet 68b and exhaust line 68c are configured for discharging the exhaust portion of gas in the housing 6.In addition, in the time of only can obtaining sufficient exhaust effect, can exhaust portion be set yet,,, preferably be connected with exhaust source 68d such as ventilation fan in order to increase exhaust effect when when upper wall portions is provided with exhaust portion in upper wall portions by the exhaust portion that is located at bottom wall portion.
Below, describe at the cooling processing of the substrate G in the cooling unit (COL) 25 that constitutes as mentioned above.
Fig. 6 is the figure that is used for illustrating in the substrate cooling processing of substrate cooling apparatus.
In the cooling unit (COL) 25, in adhesion unit (AD) 24 (cooling unit) (COL) in 29,32, utilize substrate G after the heating of transport mechanism conveyance of heat treated unit (HT) 28,31 sides by moving into mouthfuls 61 respectively, will be passed to rolling transport mechanism 5, utilize rolling transport mechanism 5 to carry out conveyance on one side, housing 6 in utilize cooling body 7 to cool off on one side.Therefore, owing to carry out the conveyance and the cooling of substrate simultaneously, so can realize reduction in processing timeization.
At this moment, at first, substrate G is cooled to about normal temperature by supplying with gas at normal temperature from nozzle 71a in preparation cooling chamber 65a, removes heat (with reference to Fig. 6 (a)) roughly.Then, substrate G passes through port 63, in main cooling chamber 65b, because contacting with the air of supplying with ring 71c and with rolling member 50b from nozzle 71b of cell controller 104 control flows and temperature is cooled to the temperature (with reference to Fig. 6 (b)) of regulation.Therefore, can prevent that substrate G from deforming, carry out meticulous cooling simultaneously.In addition, cool off from the two sides side because substrate G, supplies with ring 71c and rolling member 50b by nozzle 71a, 71b, thereby can prevent bending.
In case the substrate G that utilizes 5 conveyances of rolling transport mechanism is by taking out of mouth 62, will be passed to resist coating element (CT) 26 (in cooling unit (COL) 29,32, be respectively interface station 4, inspection unit (IP) 35) transport mechanism of a side, utilize this transport mechanism to carry out conveyance on conveyance circuit A (B).Therefore, the conveyance with the substrate G that cools off front and back during cooling only is the so-called planar flows dynamic formula that utilizes rolling transport mechanism 5 grades, and is as safe as a house.
Below, describe for the variation of preparing cooling end 7a and main cooling end 7b.
Fig. 7 is the figure that expression is arranged on the variation of preparation cooling end 7a in the substrate cooling apparatus and main cooling end 7b.
Shown in Fig. 7 (a), preparation cooling end 7a also can constitute, and is provided with fan filter unit 75, replaces air supply source 73a and nozzle 71a, and this fan filter unit is located at the upper wall portions of preparation cooling chamber 65a, has fan 75a and filter 75b.Fan filter unit 75 sucks the air of for example normal temperature outside the housing 6 by the rotation of fan 75a, utilizes filter 75b to purify, and supplies with to the surface of the substrate G that utilizes 5 conveyances of rolling transport mechanism.Because fan filter unit 75 is generally slim, and does not need external air supply source 73a, therefore, can realize the slimming of housing 6, simultaneously, can control the whole pedestal area (footprint) of reduction means.For example, a plurality of fan filter units 75 are arranged, make in preparation cooling chamber 65a according to size assortment on directions X and Y direction of substrate G, can be to all surfaces air supply of substrate G.
Shown in Fig. 7 (b), main cooling end 7b also can constitute, and is provided with conduit 76, replaces nozzle 71b and supplies with ring 71c, and this conduit is connected with tempering air supply source 73b, is located at the upper wall portions of main cooling chamber 65b.The peristome 76a of conduit 76 forms the mode that diameter enlarges gradually, and making can be to all surfaces air supply of substrate G in main cooling chamber 65b.Further, in this case, conduit 76 preferably will have the diffuser plate 76b of a plurality of supply holes, or filter and fan filter unit (all not shown) etc. are arranged in the peristome 76a, make it possible to all surfaces of substrate G air supply equably.
In addition, the invention is not restricted to above-mentioned execution mode, can carry out various distortion.For example, nozzle 71a and fan filter element 75 can be set also, constitute preparation cooling chamber 65a; Nozzle 71b and conduit 76 also can be set, constitute main cooling chamber 65b.In addition, also can make the same structure that to cool off that constitutes of rolling member 50a with rolling member 50b.
Utilizability on the industry
According to the present invention, be applicable to the situation of glass substrate, particularly large substrate such as FPD, But be not limited to glass substrate, also can be widely used in the heating of other substrates such as semiconductor wafer Process.
Claims (14)
1. a substrate cooling apparatus cools off the substrate after heating, and it is characterized in that:
Comprise: carrying channel, the substrate after a direction conveyance heating; With
Cooling body, the substrate of cooling conveyance on described carrying channel,
And the upstream side of described cooling body along described carrying channel from the conveyance direction disposes preparation cooling end and main cooling end successively,
Substrate after described preparation cooling end cooling heating is removed the heat of substrate roughly, at described main cooling end this substrate is cooled to the temperature of regulation then.
2. a substrate cooling apparatus cools off the substrate after heating, and it is characterized in that:
Comprise: carrying channel, the substrate after a direction conveyance heating;
Cooling body, the substrate of cooling conveyance on described carrying channel; With
Controlling organization is controlled described cooling body, makes substrate reach set point of temperature,
And the upstream side of described cooling body along described carrying channel from the conveyance direction disposes preparation cooling end and main cooling end successively,
Substrate after described preparation cooling end cooling heating is removed the heat of substrate roughly, utilizes the control of described controlling organization then, makes the temperature that this substrate is cooled to regulation at described main cooling end.
3. substrate cooling apparatus as claimed in claim 2 is characterized in that:
Described controlling organization is according to the temperature detection signal that is arranged near the temperature detecting part the described carrying channel corresponding with described main cooling end position, controls the cooling in the described main cooling end of described cooling body, makes substrate reach the temperature of regulation.
4. substrate cooling apparatus as claimed in claim 3 is characterized in that:
Described cooling body in described main cooling end, is supplied with cooling fluid to substrate, carries out the cooling of substrate,
Described controlling organization, according to the temperature detection signal of described temperature detecting part, control makes substrate reach the temperature of regulation from the flow of the cooling fluid of described cooling body and at least one in the temperature.
5. as claim 3 or 4 described substrate cooling apparatus, it is characterized in that:
Described carrying channel utilization is in the rotation of a plurality of rolling members of a direction assortment, rolling conveyance substrate,
At least a portion of the described rolling member corresponding with described main cooling end position is cooled from its inside, is bringing into play the effect as described cooling body,
Described controlling organization is controlled the temperature of at least a portion of the described rolling member corresponding with described main cooling end position according to the temperature detection signal of described temperature detecting part, makes substrate reach the temperature of regulation.
6. a substrate cooling apparatus cools off the substrate after heating, and it is characterized in that:
Comprise: carrying channel, the substrate after a direction conveyance heating;
Housing is arranged to be housed in the substrate of conveyance on the described carrying channel; With
Cooling body, cooling base in described housing,
And the upstream side of described cooling body along described carrying channel from the conveyance direction disposes preparation cooling end and main cooling end successively,
Substrate after described preparation cooling end cooling heating is removed the heat of substrate roughly, at described main cooling end this substrate is cooled to the temperature of regulation then.
7. a substrate cooling apparatus cools off the substrate after heating, and it is characterized in that:
Comprise: carrying channel, the substrate after a direction conveyance heating;
Housing is arranged to be housed in the substrate of conveyance on the described carrying channel;
Cooling body, cooling base in described housing; With
Controlling organization is controlled described cooling body, makes substrate reach set point of temperature,
And the upstream side of described cooling body along described carrying channel from the conveyance direction disposes preparation cooling end and main cooling end successively,
Substrate after described preparation cooling end cooling heating is removed the heat of substrate roughly, utilizes the control of described controlling organization then, makes the temperature that this substrate is cooled to regulation at described main cooling end.
8. substrate cooling apparatus as claimed in claim 7 is characterized in that:
Described controlling organization is according to the temperature detection signal that is arranged on the temperature detecting part in the described housing corresponding with described main cooling end position, controls the cooling in the described main cooling end of described cooling body, makes substrate reach the temperature of regulation.
9. substrate cooling apparatus as claimed in claim 8 is characterized in that:
In the described housing, be provided with the next door between described preparation cooling end and described main cooling end, this next door has the through port that the substrate of conveyance on described carrying channel can pass through,
Described cooling body is supplied with cooling fluid to substrate in described main cooling end, cooling base,
Described controlling organization is according to the detection signal of described temperature detecting part, and control makes substrate reach the temperature of regulation from the flow of the cooling fluid of described cooling body and at least one in the temperature.
10. substrate cooling apparatus as claimed in claim 9 is characterized in that:
Described cooling body in described preparation cooling end, by sucking the outer atmosphere gas of described housing, and is supplied to substrate, cooling base with it.
11. substrate cooling apparatus as claimed in claim 10 is characterized in that:
Described preparation cooling end has the fan that is arranged on described housing wall portion,
Described cooling body in described preparation cooling end, utilizes described fan to suck the outer atmosphere gas of described housing, and it is supplied to substrate.
12. a substrate cooling method is characterized in that:
The upstream side of utilization along described carrying channel from the conveyance direction disposes the substrate cooling apparatus of preparation cooling end and main cooling end successively, cool off along the substrate of carrying channel after the heating of a direction conveyance,
At described preparation cooling end, cool off the substrate after heating, remove the heat of substrate roughly, at described main cooling end this substrate is cooled to the temperature of regulation then.
13. a control program is characterized in that:
Operation on computers, the control and treatment device makes and carries out the described substrate cooling method of claim 12 when carrying out on computers.
14. but the storage medium that computer reads stores the control program of operation on computers, it is characterized in that:
Described control program is the control and treatment device on computers, makes to carry out the described substrate cooling method of claim 12 when carrying out.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006015251A JP4537324B2 (en) | 2006-01-24 | 2006-01-24 | Substrate cooling device, substrate cooling method, control program, computer-readable storage medium |
| JP2006015251 | 2006-01-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101009210A true CN101009210A (en) | 2007-08-01 |
| CN100521078C CN100521078C (en) | 2009-07-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2007100043562A Expired - Fee Related CN100521078C (en) | 2006-01-24 | 2007-01-24 | Substrate cooling device and substrate cooling method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4537324B2 (en) |
| KR (1) | KR101299763B1 (en) |
| CN (1) | CN100521078C (en) |
| TW (1) | TW200739843A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102479735A (en) * | 2010-11-30 | 2012-05-30 | 日东电工株式会社 | Semiconductor wafer transport method and semiconductor wafer transport apparatus |
| CN101661222B (en) * | 2008-08-29 | 2012-05-30 | 东京毅力科创株式会社 | Substrate conveying device |
| CN102651303A (en) * | 2011-05-09 | 2012-08-29 | 京东方科技集团股份有限公司 | Base plate temperature management and control system and method |
| CN108842143A (en) * | 2018-07-09 | 2018-11-20 | 上海新昇半导体科技有限公司 | Epitaxial furnace cooling system and cooling means |
| CN110021540A (en) * | 2018-01-09 | 2019-07-16 | 东京毅力科创株式会社 | Annealing device, hot plate cooling means and computer-readable recording medium |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4542577B2 (en) * | 2007-09-19 | 2010-09-15 | 東京エレクトロン株式会社 | Normal pressure drying apparatus, substrate processing apparatus, and substrate processing method |
| JP2009158792A (en) * | 2007-12-27 | 2009-07-16 | Dainippon Screen Mfg Co Ltd | Substrate processing apparatus |
| KR100921523B1 (en) * | 2008-05-30 | 2009-10-12 | 세메스 주식회사 | Method and apparatus for fabricating substrates used in manufacturing flat panel display |
| KR101105387B1 (en) * | 2010-12-13 | 2012-01-16 | 주식회사 에스아이이 | Substrate drying apparatus |
| JP2013098300A (en) * | 2011-10-31 | 2013-05-20 | Tokyo Electron Ltd | Thermal treatment apparatus and thermal treatment method |
| JP7302142B2 (en) * | 2019-01-17 | 2023-07-04 | 住友電工ウインテック株式会社 | Conductor softening device and conductor softening method |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0715873B2 (en) * | 1983-11-30 | 1995-02-22 | 株式会社東芝 | Resist pattern formation method |
| JPS6119131A (en) * | 1984-07-06 | 1986-01-28 | Toshiba Corp | Resist processor |
| JPS6428918A (en) * | 1987-07-24 | 1989-01-31 | Mitsubishi Electric Corp | Resist baking device |
| JP3872535B2 (en) * | 1996-03-14 | 2007-01-24 | 株式会社オーク製作所 | Work charge erasing neutralization device |
| CN1133130C (en) * | 1999-04-27 | 2003-12-31 | 三菱电机株式会社 | Method of controlling process conditions on laser machining apparatus, and computer-readable recording medium for program |
| JP3416078B2 (en) * | 1999-06-09 | 2003-06-16 | 東京エレクトロン株式会社 | Substrate processing equipment |
| KR100704749B1 (en) * | 1999-07-19 | 2007-04-09 | 동경 엘렉트론 주식회사 | Substrate processing apparatus and substrate processing method |
| JP4380966B2 (en) * | 2002-05-20 | 2009-12-09 | 富士フイルム株式会社 | Photosensitive layer transfer method and apparatus |
| JP2004299850A (en) * | 2003-03-31 | 2004-10-28 | Dainippon Printing Co Ltd | Processing method and processing device |
-
2006
- 2006-01-24 JP JP2006015251A patent/JP4537324B2/en not_active Expired - Fee Related
- 2006-12-18 TW TW095147439A patent/TW200739843A/en not_active IP Right Cessation
-
2007
- 2007-01-24 KR KR1020070007599A patent/KR101299763B1/en active IP Right Grant
- 2007-01-24 CN CNB2007100043562A patent/CN100521078C/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101661222B (en) * | 2008-08-29 | 2012-05-30 | 东京毅力科创株式会社 | Substrate conveying device |
| CN102479735A (en) * | 2010-11-30 | 2012-05-30 | 日东电工株式会社 | Semiconductor wafer transport method and semiconductor wafer transport apparatus |
| CN102651303A (en) * | 2011-05-09 | 2012-08-29 | 京东方科技集团股份有限公司 | Base plate temperature management and control system and method |
| CN110021540A (en) * | 2018-01-09 | 2019-07-16 | 东京毅力科创株式会社 | Annealing device, hot plate cooling means and computer-readable recording medium |
| CN108842143A (en) * | 2018-07-09 | 2018-11-20 | 上海新昇半导体科技有限公司 | Epitaxial furnace cooling system and cooling means |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20070077793A (en) | 2007-07-27 |
| JP2007200994A (en) | 2007-08-09 |
| KR101299763B1 (en) | 2013-08-23 |
| TWI325168B (en) | 2010-05-21 |
| TW200739843A (en) | 2007-10-16 |
| CN100521078C (en) | 2009-07-29 |
| JP4537324B2 (en) | 2010-09-01 |
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