KR101299763B1 - Substrate cooling device and substrate cooling method - Google Patents

Abstract

The present invention provides a substrate cooling apparatus capable of reliably preventing warpage and breakage of a substrate while improving throughput, even when the substrate is large.

The board | substrate cooling apparatus 25 cools the roller conveyance mechanism 5 as a conveyance path which conveys the board | substrate G after a heating in one direction, and the board | substrate G conveyed by the roller conveyance mechanism 5. (7), the precooling chamber (65a) and the main cooling chamber (65b) are arranged in order from the upstream side in the conveying direction along the roller conveying mechanism (5), and the substrate after heating ( After cooling G) in the preliminary cooling chamber 65a and removing the heat of the board | substrate G, this board | substrate G is cooled to predetermined temperature in the main cooling chamber 65b.

Description

Substrate Cooling Device and Substrate Cooling Method {SUBSTRATE COOLING DEVICE AND SUBSTRATE COOLING METHOD}

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic plan view of a resist coating / development processing system in which a resist film is formed on a glass substrate for FPD and a development process of a resist film after exposure processing, on which a substrate cooling apparatus according to one embodiment of the present invention is mounted. .

2 is a cross-sectional view in a planar direction of the substrate cooling device.

3 is a cross-sectional view of the side direction of the substrate cooling device.

4 is a cross-sectional view in a lateral direction of a nozzle portion provided in a substrate cooling device.

5 is a view for explaining a cooling state of the roller member provided in the substrate cooling device.

6 is a diagram for explaining a cooling process of a substrate in the substrate cooling device.

7 is a view showing a modification of the preliminary cooling unit and the main cooling unit installed in the substrate cooling device.

<Explanation of symbols for the main parts of the drawings>

25, 29, 32: cooling unit (substrate cooling device)

5: roller conveying mechanism

6: casing

7: cooling mechanism

7a: precooling unit

7b: Main cooling part

50a, 50b: roller member

63: through hole

64: bulkhead

75a: fan

104: unit controller (control unit)

105: temperature sensor (temperature detector)

G: Substrate

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate cooling device for cooling a substrate such as a glass substrate used in a flat panel display (FPD), a substrate cooling method, a control program, and a computer readable storage medium.

In the manufacture of FPDs, photolithography techniques are used to form circuit patterns on glass substrates for FPDs. Formation of the circuit pattern by photolithography is performed in order of forming a resist film by apply | coating a resist liquid on a glass substrate, exposing a resist film so that it may correspond to a circuit pattern, and developing this.

In the photolithography technique, heat treatment is generally performed on a glass substrate for the purpose of improving the fixability of the resist film before and after the formation of the resist film, after the development treatment, and the like, and the glass substrate is cooled after the heat treatment. Cooling of a glass substrate is provided with the support part which receives and supports the glass substrate gripped and conveyed by the conveyance arm, the cooling plate which cools the glass substrate provided under this support part, and the lifting chamber which covers the board | substrate supported by the support part. One cooling apparatus is used (for example, refer patent document 1). In order to improve the yield, the cooling apparatus introduces a cooling fluid into the chamber while covering the substrate supported by the support portion and rapidly cools the substrate, and then raises the chamber to cool the substrate supported by the support portion by the cooling plate. It is composed.

However, if the glass substrate heated like the conventional cooling apparatus mentioned above is quenched, in-plane temperature distribution will become nonuniform and there exists a possibility that a distortion may arise in a glass substrate.

In addition, in recent years, as the size of the FPD is directed and the glass substrate with the side of 2 m or more appears, the glass substrate becomes poor in handling with the enlargement of the size of the glass substrate. There is also a risk of being damaged by the impact during transmission between the transfer arm and the support.

    [Patent Document 1] Japanese Patent Application Laid-Open No. 10-229037

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and even if the substrate is large, a substrate cooling apparatus, a substrate cooling method, a control program, and a computer-readable storage capable of reliably preventing warpage and damage of the substrate while improving throughput. For the purpose of providing the medium.

MEANS TO SOLVE THE PROBLEM In order to solve the said subject, this invention is a board | substrate cooling apparatus which cools the board | substrate after heating, Comprising: The conveyance path which conveys the board | substrate after heating to one direction, and the cooling mechanism which cools the board | substrate conveyed by the said conveyance path are provided, After the said cooling mechanism arranges a precooling part and a main cooling part sequentially from the conveyance direction upstream along the said conveyance path, and cools the board | substrate after heating in the said precooling part, and removes the heat of a board | substrate, Provided is a substrate cooling apparatus, wherein the substrate is cooled to a predetermined temperature in the main cooling unit.

Moreover, this invention is a board | substrate cooling apparatus which cools the board | substrate after heating, The conveyance path which conveys the board | substrate after heating to one direction, the cooling mechanism which cools the board | substrate conveyed by the said conveyance path, and a board | substrate have predetermined temperature. The control mechanism which controls the said cooling mechanism so that it may be provided, The said cooling mechanism arranges a precooling part and a main cooling part sequentially from the conveyance direction upstream along the said conveyance path, and cools the board | substrate after heating in the said precooling part, After performing the heat removal of the board | substrate, this board | substrate is cooled to predetermined temperature by the control of the said control mechanism in the said main cooling part, The board | substrate cooling apparatus is provided.

In the present invention, the control mechanism is configured in the main cooling unit of the cooling mechanism such that the substrate is at a predetermined temperature based on a temperature detection signal of the temperature detection unit provided near the transport path corresponding to the main cooling unit position. It is desirable to control the cooling of the. In this case, the cooling mechanism supplies cooling fluid to the substrate in the main cooling unit to cool the substrate, and the control mechanism causes the substrate to reach a predetermined temperature based on a temperature detection signal of the temperature detection unit. It is preferable to control at least one of a flow rate and a temperature of the cooling fluid from the said conveyance path, and the roller member conveys a board | substrate by the rotation of the roller member arrange | positioned in multiple at one direction, and the said roller member corresponding to the said main cooling part position At least a portion of the roller member is cooled from the inside thereof to function as the cooling mechanism, and the control mechanism is configured to adjust the position of the roller member corresponding to the main cooling portion position so that the substrate is at a predetermined temperature based on a temperature detection signal of the temperature detection portion. It is desirable to control at least part of the temperature.

Moreover, this invention is a board | substrate cooling apparatus which cools the board | substrate after a heating, The board | substrate provided in the conveyance path which conveys the board | substrate after heating to one direction, the board | substrate conveyed by the said conveyance path, and the said casing The cooling mechanism is equipped with a cooling mechanism for cooling, wherein the preliminary cooling portion and the main cooling portion are arranged in order from the upstream side in the conveying direction along the conveying path, and the substrate after heating is cooled in the preliminary cooling portion to perform heat removal of the substrate. Thereafter, the substrate is cooled to a predetermined temperature in the main cooling unit. A substrate cooling apparatus is provided.

Moreover, this invention is a board | substrate cooling apparatus which cools the board | substrate after heating, The conveyance path which conveys the board | substrate after heating to one direction, the casing provided so as to accommodate the board | substrate which conveys the said conveyance path, and a board | substrate in the said casing are provided. A cooling mechanism for cooling and a control mechanism for controlling the cooling mechanism so that the substrate is at a predetermined temperature, wherein the cooling mechanism is provided with a preliminary cooling portion and a main cooling portion sequentially from the upstream side in the conveying direction along the conveying path; And after cooling the substrate after the heating in the preliminary cooling section to remove heat from the substrate, the substrate cooling apparatus is cooled to a predetermined temperature by the control mechanism in the main cooling section. do.

In the present invention, the control mechanism is configured to perform cooling in the main cooling unit of the cooling mechanism such that the substrate is at a predetermined temperature based on a temperature detection signal of a temperature detection unit provided in the casing corresponding to the main cooling unit position. It is desirable to control. In this case, a partition wall is provided between the preliminary cooling section and the main cooling section and has a passageway through which the substrate conveying the conveying path can pass, and the cooling mechanism is connected to the substrate in the casing. Cooling the substrate by supplying a cooling fluid, the control mechanism preferably controls at least one of the flow rate and the temperature of the cooling fluid from the cooling mechanism so that the substrate is a predetermined temperature based on the temperature detection signal of the temperature detector. Do. In this case, it is preferable that the cooling mechanism cools the substrate by supplying the atmosphere outside the casing to the substrate by the preliminary cooling section. In this case, it is preferable that the preliminary cooling section has a fan provided in the wall portion of the casing, and the cooling mechanism supplies the atmosphere outside the casing by the fan in the preliminary cooling section and supplies it to the substrate.

Moreover, this invention cools the board | substrate after heating conveyed in one direction along a conveyance path by the substrate cooling apparatus which arrange | positions a precooling part and a main cooling part sequentially from the conveyance direction upstream along the said conveyance path. A substrate cooling method is provided, wherein the substrate after heating is cooled in the preliminary cooling section to remove heat from the substrate, and the substrate is cooled to a predetermined temperature in the main cooling section.

The present invention also provides a control program which operates on a computer and controls the processing apparatus of the computer to perform the substrate cooling method at the time of execution.

In addition, the present invention is a computer readable storage medium storing a control program running on a computer, wherein the control program controls the processing unit of the computer to perform the substrate cooling method when executed. Provide a storage medium.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 1 performs the formation process of the resist film on the glass substrate for FPD (henceforth only a "substrate") in which the board | substrate cooling apparatus which concerns on one Embodiment of this invention is mounted, and the development process of the resist film after an exposure process. It is a schematic plan view of the resist coating and image development processing system shown.

The resist coating and developing processing system 100 includes a cassette station 1 in which a cassette for accommodating a plurality of substrates G is disposed, and a processing station that applies a series of processing including resist coating and development to the substrate G. (2) and the interface station 4 which transfers the board | substrate G between the exposure apparatus 9 which performs exposure processing to the board | substrate G, The cassette station 1 and the interface station ( 4) are disposed on both sides of the processing station 2, respectively. In addition, in FIG. 1, the longitudinal direction of the resist coating and image development processing system 100 is made into the X direction, and the direction orthogonal to the X direction on a plane is made into the Y direction.

The cassette station 1 carries and unloads and unloads the board | substrate G between the loading stand 12 which can load the cassette C in parallel in the Y direction, and the processing station 2. And the cassette C is conveyed between the mounting table 12 and the outside. The conveying arm 11a provided in the conveying apparatus 11 is movable along the guide 10 extending in a Y direction, and can move up and down, back and forth, and horizontal rotation, and the cassette C and the processing station 2 Loading and unloading of the substrate G is performed during the process.

The processing station 2 has conveying lines A and B of two parallel rows of substrates G extending in the X direction between the cassette station 1 and the interface station 4. The conveyance line A is comprised so that the board | substrate G may be conveyed toward the interface station 4 side from the cassette station 1 side by what is called horizontal advancing conveyance, such as roller conveyance and belt conveyance, and the conveyance line B It is comprised so that board | substrate G may be conveyed toward the cassette station 1 side from the interface station 4 side by what is called horizontal advancing conveyance, such as roller conveyance and belt conveyance.

On the conveying line A, the excimer UV irradiation unit (e-UV) 21, the scrub cleaning unit (SCR) 22, and the preheat unit (from the cassette station 1 side toward the interface station 4 side) PH) 23, ADH unit (AD) 24, cooling unit (COL) 25, resist coating unit (CT) 26, reduced pressure drying unit (DP) 27, heat treatment unit (HT) ) 28 and cooling units (COL) 29 are arranged one after the other.

The excimer UV irradiation unit (e-UV) 21 performs the removal process of the organic substance contained in the substrate G, and the scrub cleaning unit (SCR) 22 performs the scrub cleaning treatment and the drying treatment of the substrate G. . The preheat unit (PH) 23 performs the heat treatment of the substrate G, and the adhesion unit (AD) 24 performs the hydrophobization treatment of the substrate G, and the cooling unit (COL) 25 described later. ) Cools the substrate (G). The resist coating unit (CT) 26 supplies a resist liquid onto the substrate G to form a resist film, and the reduced pressure drying unit (DP) 27 volatilizes contained in the resist film on the substrate G under reduced pressure. The component is evaporated to dry the resist film. The heat treatment unit (HT) 28 performs the heat treatment of the substrate G, and the cooling unit COL 29 described later cools the substrate G in the same manner as the cooling unit COL 25. .

On the conveying line B, the developing unit (DEV) 30, the heating processing unit (HT) 31, and the cooling unit (COL) 32 are sequentially turned from the interface station 4 side toward the cassette station 1 side. It is arranged. Moreover, between the cooling unit (COL) 32 and the cassette station 1, the test | inspection apparatus (IP) 35 which inspects the board | substrate G by which a series of process including resist application | coating and image development was performed is provided.

The developing unit (DEV) 30 performs application of the developing solution on the substrate G, rinsing the substrate G, and drying processing of the substrate G in this order. The heat treatment unit (HT) 31 performs the heat treatment of the substrate G in the same manner as the heat treatment unit (HT) 28, and the cooling unit (COL) 32 described later is a cooling unit (COL; The substrate G is cooled in the same manner as in 25 and 29.

The interface station 4 receives the rotary stage (RS) 44 which is a delivery part of the board | substrate G in which the buffer cassette which can accommodate the board | substrate G is arranged, and the board | substrate G conveyed by the conveyance line A. FIG. And the conveying arm 43 conveyed to the rotary stage (RS) 44 is provided. The conveyance arm 43 is capable of vertical movement, forward and backward movement and horizontal rotation, and is adjacent to the exposure apparatus 9 provided adjacent to the conveyance arm 43, the conveyance arm 43, and the developing unit (DEV) 30. The external device block 90 having the installed peripheral exposure device EE and the titler TITLER is also accessible.

The resist coating and developing processing apparatus 100 is configured to be connected to and controlled by a process controller 101 having a CPU. The process controller 101 visualizes and displays the operation status of the keyboard or each part or each unit where a process manager performs a command input operation or the like to manage each part or each unit of the resist coating and developing processing apparatus 100. A control program, processing condition data, and the like for recording a user interface 102 including a display and the like, and various processes executed by the resist coating and developing processing apparatus 100 are realized by the control of the process controller 101. The storage unit 103 in which the recipe is stored is connected.

Then, if necessary, an arbitrary recipe is called from the storage unit 103 by an instruction from the user interface 102 or the like, and executed by the process controller 101, and under the control of the process controller 101, application of resist is performed. The development processing apparatus 100 performs a desired process. Recipes such as control programs and processing condition data may be stored in computer-readable storage media such as CD-ROMs, hard disks, flexible disks, flash memories, or the like, or may be prepared from other devices. For example, it is also possible to transmit online at any time via a dedicated line or use it online.

In the resist coating and developing apparatus 100 configured as described above, first, the substrate G in the cassette C stacked on the mounting table 12 of the cassette station 1 is the transfer arm 11a of the transfer apparatus 11. Is conveyed to the upstream end part of the conveyance line A of the processing station 2, and is conveyed on the conveyance line A, and is carried out to the board | substrate G by the excimer UV irradiation unit (e-UV) 21. The removal process of the organic substance contained is performed. The board | substrate G by which the removal process of the organic substance in the excimer UV irradiation unit (e-UV) 21 was complete | finished is conveyed on the conveyance line A, and the scrub cleaning process is carried out by the scrub cleaning unit (SCR) 22. And drying treatment.

The board | substrate G in which the scrub cleaning process and the drying process in the scrub cleaning unit (SCR) 22 were complete | finished is conveyed on the conveyance line A, and heat processing is performed by the preheat unit PH 23. Dehydrated. The board | substrate G in which the heat processing in the preheat unit PH 23 was complete | finished is conveyed on the conveyance line A, and hydrophobization process is performed by the adhesion unit (AD) 24. The board | substrate G in which the hydrophobization process in the adhire unit (AD) 24 was complete | finished is conveyed on the conveyance line A, and is cooled by the cooling unit (COL) 25. As shown in FIG. Cooling of the board | substrate G is performed, conveying on the conveyance line A by the roller conveyance mechanism 5 mentioned later.

The substrate G cooled by the cooling unit (COL) 25 is conveyed onto the transfer line A, and a resist film is formed by the resist coating unit (CT) 26. The formation of the resist film in the resist coating unit (CT) 26 is performed by supplying a resist liquid onto the substrate G while the substrate G is conveyed onto the transfer line A. FIG.

The substrate G on which the resist film is formed by the resist coating unit (CT) 26 is conveyed onto the conveying line A and exposed to the reduced pressure environment in the reduced pressure drying unit (DP) 27, whereby the drying treatment of the resist film is performed. Is carried out.

The substrate G subjected to the drying treatment of the resist film in the reduced pressure drying unit (DP) 27 is conveyed onto the conveying line A, and the heat treatment is performed by the heat treatment unit (HT) 28 to the resist film. The solvent contained is removed. The board | substrate G by which the heat processing in the heat processing unit (HT) 28 was complete | finished is conveyed on the conveyance line A, and is cooled by the cooling unit (COL) 29. As shown in FIG. Cooling of the board | substrate G is performed, conveying on the conveyance line A by the roller conveyance mechanism 5 mentioned later.

After the board | substrate G cooled by the cooling unit (COL) 29 is conveyed to the downstream end on the conveyance line A, the rotary stage RS is carried out by the conveyance arm 43 of the interface station 4. Returned to (44). Next, the board | substrate G is conveyed to the peripheral exposure apparatus EE of the external device block 90 by the conveyance arm 43, and the peripheral exposure apparatus EE removes the outer peripheral part (unnecessary part) of the resist film. Exposure treatment is performed. Subsequently, the board | substrate G is conveyed to the exposure apparatus 9 by the conveyance arm 43, and the exposure process of a predetermined pattern is given to the resist film. In addition, the board | substrate G may be conveyed to the exposure apparatus 9 after being temporarily accommodated in the buffer cassette on the rotary stage (RS) 44. FIG. The substrate G on which the exposure process is completed is conveyed to the titler TITLER of the external device block 90 by the transfer arm 43, and predetermined information is recorded by the titler TITLER.

The board | substrate G in which predetermined | prescribed information was recorded by the titler TITLER is conveyed on the conveyance line B, and the application | coating process of a developing solution, the rinse process, and the drying process were performed by the developing unit (DEV) 30 in order. All. In the coating treatment, the rinse treatment and the drying treatment of the developer, for example, while the substrate G is conveyed onto the transfer line B, the developer is accumulated on the substrate G, and then the conveyance is once stopped and the substrate ( G) is inclined at a predetermined angle so that the developer flows down. In this state, the rinse liquid is supplied onto the substrate G, and the developer is washed away. Then, the substrate G returns to the horizontal position and is conveyed again. ) Is performed in the order in which dry gas is sprayed.

The board | substrate G in which the coating process, the rinse process, and the drying process of the developing solution in the developing unit (DEV) 30 was complete | finished is conveyed on the conveyance line B, and is heated by the heat processing unit (HT) 31. The treatment is performed to remove the solvent and water contained in the resist film. An i-ray UV irradiation unit for decolorizing the developer may be provided between the developing unit (DEV) 30 and the heat treatment unit (HT) 31. The board | substrate G by which the heat processing in the heat processing unit (HT) 31 was complete | finished is conveyed on the conveyance line B, and is cooled by the cooling unit (COL) 32. As shown in FIG. Cooling of the board | substrate G is performed, conveying on the conveyance line B by the roller conveyance mechanism 5 mentioned later.

The board | substrate G cooled by the cooling unit (COL) 32 is conveyed on the conveyance line B, and is examined by the inspection unit (IP) 35. The board | substrate G which passed the test | inspection is accommodated in the predetermined | prescribed cassette C mounted on the mounting table 12 by the conveyance arm 11a of the conveying apparatus 11 installed in the cassette station 1.

Next, the cooling unit (COL) 25 is demonstrated in detail. The cooling units (COL) 29 and 32 also have the same structure as that of the cooling unit (COL) 25.

FIG. 2 is a sectional view in a planar direction showing a cooling unit COL 25 (substrate cooling device), and FIG. 3 is a sectional view in a lateral direction thereof.

The cooling unit (COL) 25 is the substrate G conveyed by the roller conveyance mechanism 5 which conveys the board | substrate G toward one side of an X direction, and the roller conveyance mechanism 5 and the roller conveyance mechanism 5. ) And a cooling mechanism 7 for cooling the substrate G, which is roller-conveyed by the roller conveyance mechanism 5, in the casing 6 and the casing 6 provided to enclose or accommodate.

The roller conveyance mechanism 5 is a roller member 50a having a rotating shaft extending in the Y direction; a roller member 50b in the preliminary cooling chamber 65a described later; The roller member in the main cooling chamber 65b mentioned later is provided in plurality at intervals in the X direction. Each roller member 50a, 50b is connected directly or indirectly to the drive source of the motor etc. which the rotating shaft 59 does not show in figure, and rotates by the drive of the drive source, by which the board | substrate G rotates by the roller member 50a, 50b) is conveyed toward one side in the X direction. Moreover, each roller member 50a, 50b is formed in the substantially cylindrical shape extended in the Y direction so that it may contact over the full width (Y direction) of the board | substrate G. As shown in FIG. In the roller conveyance mechanism 5, the conveyance path or conveyance surface comprises a part of conveyance line A. FIG. In addition, in the cooling unit COL 29, the conveyance path or conveyance surface of the roller conveyance mechanism 5 comprises a part of conveyance line A similarly to the cooling unit COL 25, and refrigeration unit COL In (32), the conveyance path or conveyance surface of the roller conveyance mechanism 5 comprises a part of conveyance line B. As shown in FIG.

The casing 6 is formed in a thin box shape so as to accommodate the substrate G, and the substrates on the conveying line A are arranged along the conveying line A and face each other in the X direction. G) has a slit-shaped inlet 61 and an outlet 62 extending in the Y-direction. Each roller member 50a, 50b of the roller conveyance mechanism 5 is rotatably supported by the bearing 60 provided in the side wall part in which the rotating shaft 59 opposes the Y direction of the casing 6, and the casing 6 is carried out. It is arranged inside. In the X-direction intermediate | middle part in the casing 6, the partition 64 which has the passageway 63 which the board | substrate G conveyed by the conveyance line A can pass is provided, and by this, the inside of the casing 6 The partition 64 is divided into a preliminary cooling chamber 65a on the upstream side in the X direction and a main cooling chamber 65b on the downstream side in the X direction.

The cooling mechanism 7 is provided outside the casing 6 and is provided with an air supply source 73a for supplying a cooling fluid, for example, room temperature air, into the preliminary cooling chamber 65a, and the wall portion of the preliminary cooling chamber 65a. A cooling fluid, eg, installed in the main cooling chamber 65b, installed outside the nozzle 71a and the casing 6 which are installed and connected to the air supply 73a and direct air from the air supply 73a into the preliminary cooling chamber 65a. For example, it is installed on the wall of the air source 73b and the main cooling chamber 65b for supplying air regulated to a predetermined temperature, and is connected to the air source 73b and the air source 73b. The nozzle 71b and the supply ring 71c which guide the air from the inside into the main cooling chamber 65b are provided. The preliminary cooling chamber 65a, the nozzle 71a and the air supply 73a constitute the preliminary cooling section 7a, and the main cooling chamber 65b, the nozzle 71b, the supply ring 71c and the warm air supply source ( 73b) constitutes the main cooling part 7b.

The temperature sensor (temperature detection part) 105 is provided in the vicinity of the conveyance path of the board | substrate G by the roller conveyance mechanism 5 in the main cooling chamber 65b, and the flow volume of the air from the air conditioning air supply source 73b. And the temperature is configured to be controlled by the unit controller (control unit) 104 which has received the temperature detection signal of the temperature sensor 105 and the command from the process controller 101 in accordance with the temperature of the substrate G required. In addition, either one of the flow rate and temperature of the air from the on-air air supply source 73b may be configured to be controlled by the unit controller 104, and the flow rate of air from the air supply source 73a is also the unit controller 104. Can be configured to be controlled by

The nozzles 71a and 71b respectively face sidewalls in the Y direction of the preliminary cooling chamber 65a and the main cooling chamber 65b so as to extend in the Y direction in the preliminary cooling chamber 65a and the main cooling chamber 65b, respectively. It is installed in department. Moreover, the nozzles 71a and 71b are respectively provided in the both surfaces of the board | substrate G conveyed by the roller conveyance mechanism 5, and are arranged in multiple numbers in the X direction. The nozzles 71a and 71b provided on the back surface side or lower side of the board | substrate G conveyed by the roller conveyance mechanism 5 are respectively provided between the roller members 50, and the casing 6 is thereby carried out. The thinning of is planned.

As shown in FIG. 4, the nozzles 71a and 71b provided on the front surface side and the back surface side of the board | substrate G conveyed by the roller conveyance mechanism 5 are respectively shown in FIG. 71b) in cross-section in the lateral direction], but cooling fluid supply ports 72a and 72b are formed below and above the main surface to supply the cooling fluid toward the front surface and the rear surface (main surface) of the substrate G, The supply ports 72a and 72b are formed on the circumferential surface of the nozzles 71a and 71b so as to be inclined to the upstream side in the X direction, more preferably at an angle of 30 to 40 degrees. That is, the nozzles 71a and 71b respectively supply air from the supply ports 72a and 72b to the X-direction upstream side with respect to the conveyance direction of the board | substrate G so that it may cross | intersect the main surface of the board | substrate G. As a result, the air blown out from the supply sources 73a and 73b can be efficiently brought into contact with the substrate G, and the contact time with the substrate G of the unit amount of air can be shortened. The warming of the air by the contact with the substrate G is suppressed, and the substrate G can be cooled effectively. In addition, the supply ports 72a and 72b may be respectively formed in the slit shape extended in a Y direction, and many may be formed in the mesh shape.

In addition, a plurality of supply ports 72a and 72b are formed on the circumferential surfaces of the nozzles 71a and 71b at intervals in the Y direction, and the nozzles 71b between the nozzles 71a adjacent to each other in the X direction. ), And between the nozzles 71a and 71b, the Y width direction positions are formed to be different. Thereby, the board | substrate G conveyed by the roller conveyance mechanism 5 can be cooled evenly over substantially the whole surface.

The supply ring 71c is formed in the mesh shape which has many air supply holes, for example, and is provided in the upper wall part of the main cooling chamber 65b. In addition, the supply ring 71c is widely spread throughout the main cooling chamber 65b by using the board | substrate G conveyed by the roller conveyance mechanism 5 by the air sent from the on-air air supply source 73b, It is provided in the X-direction upstream end part of the main cooling chamber 65b. In addition, in the main cooling chamber 65b, when the cooling effect of the board | substrate G is fully acquired only by air supply from the nozzle 71b, the supply ring 71c may not be provided.

As shown in FIG. 5, the roller member 50b arrange | positioned in the main cooling chamber 65b is respectively a figure for demonstrating the cooling aspect of the roller member 50b provided in the board | substrate cooling apparatus, and the Y direction ( At the same time as having an unillustrated flow path penetrating in the axial direction, both ends of the Y-direction are connected to a pipe 52 having a cooler 51 via a rotary joint, and the cooler 51 is predetermined. The cooling fluid, for example, cooling water, in the pipe 52 adjusted to the temperature of the gas is configured to flow inside. Thereby, the roller member 50b is comprised so that it may function as a part of the cooling mechanism 7 which cools the board | substrate G, respectively when it cools to predetermined temperature and contacts the board | substrate G. As shown in FIG. In addition, between the roller members 50b adjacent to each other in the X direction, the flow direction of the cooling water is reversed (see arrow), whereby the entirety of the substrate G conveyed by the roller conveyance mechanism 5 is obtained. Cooling can be performed evenly over the width. In addition, reference numerals 53 and 54 in the drawings denote pumps for circulating the cooling water in the pipe 52 and the roller member 50b, respectively, to adjust the flow rates of the cooling water sent from the inside of the pipe 52 to the roller member 50b. For the valve. The flow rate of the cooling water by the pump 53, the valve 54 and the cooling temperature of the cooling water by the cooler 51, that is, the temperature of the roller member 50b, depends on the required temperature of the substrate G. It is configured to be controlled by).

Each of the roller members 50a disposed in the preliminary cooling chamber 65a is formed of a low thermal conductive material such as resin at least on the outer circumferential surface thereof so as not to affect the substrate G.

The upper wall portion and the bottom wall portion of the casing 6 have a double wall structure provided with an inner wall 66 and an outer wall 67 provided with empty spaces. The inner wall 66 is provided with a plurality of, for example, mesh exhaust ports 68a extending in the Y direction at intervals in the X direction, and an exhaust port 68b is provided on the outer wall 67 to form the inner wall ( In the space between the 66 and the outer wall 67, an exhaust passage 68c for communicating the plurality of exhaust ports 68a and the exhaust ports 68b is provided. The exhaust port 68a, the exhaust port 68b, and the exhaust path 68c constitute an exhaust part for exhausting the inside of the casing 6. In addition, when sufficient exhaust effect can be obtained only by the exhaust part provided in the low wall part, it is not necessary to provide an exhaust part in the upper wall part, and when the exhaust part is provided in the upper wall part, exhaust sources, such as a fan for ventilation, in order to improve the exhaust effect ( It is preferable to connect 68d).

Next, the cooling process of the board | substrate G in the cooling unit (COL) 25 comprised as mentioned above is demonstrated.

It is a figure for demonstrating the cooling process of the board | substrate in a board | substrate cooling apparatus.

In the cooling unit (COL) 25, in the adhering unit (AD) 24 and the cooling units COL, 29, 32, respectively, by the conveyance mechanism of the heat processing unit (HT) 28, 31 side. When the conveyed board | substrate G passes through the carrying-in port 61, it is transmitted to the roller conveyance mechanism 5, and conveyed by this roller conveyance mechanism 5, and is conveyed to the cooling mechanism 7 in the casing 6. By cooling. Therefore, since conveyance and cooling of a board | substrate are performed in parallel, processing time can be shortened.

At this time, the board | substrate G is first cooled to normal temperature by the supply of the normal temperature air from the nozzle 71a in the preliminary cooling chamber 65a, and heat regulation is removed (refer FIG. 6 (a)). The substrate G then passes through the passage opening 63 and air and rollers from the nozzle 71b and the supply ring 71c which are flow rate and temperature controlled by the unit controller 104 in the main cooling chamber 65b. It cools to predetermined temperature by the contact with member 50b (refer FIG. 6 (b)). Therefore, precise cooling can be performed, preventing generation | occurrence | production of the distortion of the board | substrate G. In addition, since the substrate G is cooled from both sides by the nozzles 71a and 71b, the supply ring 71c and the roller member 50b, the occurrence of the bent state is also prevented.

When the board | substrate G conveyed by the roller conveyance mechanism 5 passes the carrying out opening 62, in the resist coating unit CT 26 and the cooling units COL 29 and 32, respectively, an interface station ( 4) It is transmitted to the conveyance mechanism on the inspection unit (IP) 35 side, and it is conveyed on the conveyance lines A and B by this conveyance mechanism. Therefore, the conveyance of the board | substrate G at the time of cooling and before and behind cooling is safe only by what is called a horizontal progression type by the roller conveyance mechanism 5 etc.

Next, a change example of the preliminary cooling part 7a and the main cooling part 7b is demonstrated.

FIG. 7 is a diagram showing a modification of the preliminary cooling unit 7a and the main cooling unit 7b provided in the substrate cooling device.

As shown in FIG. 7A, the preliminary cooling unit 7a replaces the air supply source 73a and the nozzle 71a, and is provided with a fan 75a and a filter provided in the upper wall of the preliminary cooling chamber 65a. The fan filter unit 75 having 75b) may be provided and configured. As the fan 75a rotates, the fan filter unit 75 puts air outside of the casing 6, for example, cleans it with the filter 75b, and is conveyed by the roller conveyance mechanism 5. Supply toward the surface of the substrate (G). Since the fan filter unit 75 is not only thin in general, but also requires an external air supply source 73a, the footprint of the entire apparatus can be reduced while the thickness of the casing 6 is reduced. The fan filter unit 75 is arranged in plural in the X direction and the Y direction, for example, according to the size of the substrate G so as to supply air over the entire surface of the substrate G in the preliminary cooling chamber 65a. .

As shown in FIG. 7B, the main cooling unit 7b is connected to the on-air air supply source 73b in place of the nozzle 71b and the supply ring 71c and installed on the upper wall of the main cooling chamber 65b. The duct 76 may be provided and configured. The duct 76 is formed so that the opening part 76a may gradually enlarge diameter so that air may be supplied to the whole surface of the board | substrate G from the main cooling chamber 65b. Also in this case, the duct 76 is a diffuser plate 76b having a plurality of supply holes, or a filter or a fan filter unit (all not shown), so that the air can be supplied evenly to the entire surface of the substrate G. It is preferable that the back is disposed in the opening 76a.

In addition, this invention is not limited to the said embodiment, A various deformation | transformation is possible. For example, the preliminary cooling chamber 65a may be provided by installing the nozzle 71a and the fan filter unit 75, or the main cooling chamber 65b may be formed by installing the nozzle 71b and the duct 76. Okay. Moreover, you may comprise so that cooling is possible similarly to the roller member 50a and the roller member 50b.

According to the present invention, the substrate is particularly suitable when the substrate is large, such as a glass substrate for FPD. However, the present invention is not limited to the glass substrate, but can be widely applied to heat treatment of other substrates such as semiconductor wafers.

According to the present invention, since the substrate being conveyed in one direction to the conveying path is configured to be cooled by the cooling mechanism, a large impact due to the conveyance is not applied to the substrate, and the substrate can be conveyed and cooled in parallel. Further, the cooling mechanism is composed of a preliminary cooling portion and a main cooling portion in order from the upstream side in the conveying direction along the conveyance path, and the substrate after heating is cooled in the preliminary cooling portion to remove heat from the substrate. Since the main cooling unit is configured to cool down to a predetermined temperature, the processing time including conveyance can be shortened without quenching the substrate after heating. Therefore, even if the substrate is large, it is possible to reliably prevent warpage and damage of the substrate while improving the throughput.

Claims (18)

delete delete delete delete delete delete delete delete It is a board | substrate cooling apparatus which cools the board | substrate after a heating, A conveying path for conveying the substrate after heating in one direction, A casing provided to accommodate the substrate being conveyed in the conveying path; A cooling mechanism for cooling the substrate in the casing; A control mechanism for controlling the cooling mechanism so that the substrate is at a predetermined temperature The cooling mechanism is provided, A precooling part and a main cooling part are sequentially arranged along the conveyance path from an upstream side in the conveying direction, After the heating of the substrate is cooled in the preliminary cooling section to remove heat from the substrate, the substrate is cooled to a predetermined temperature by the control mechanism in the main cooling section, The control mechanism controls the cooling in the main cooling unit of the cooling mechanism such that the substrate is at a predetermined temperature based on the temperature detection signal of the temperature detection unit provided in the casing corresponding to the main cooling unit position. In the casing, a partition wall is provided between the preliminary cooling section and the main cooling section and has a passageway through which the substrate conveyed by the conveying path can pass. The cooling mechanism cools the substrate by supplying a cooling fluid to the substrate from the main cooling unit, And the control mechanism controls at least one of a flow rate and a temperature of the cooling fluid from the cooling mechanism so that the substrate is at a predetermined temperature based on the temperature detection signal of the temperature detection unit. The substrate cooling device according to claim 9, wherein the cooling mechanism cools the substrate by taking an atmosphere outside the casing from the preliminary cooling unit and supplying the substrate to the substrate. The method of claim 10, wherein the preliminary cooling portion has a fan installed in the wall portion of the casing, And the cooling mechanism blows the atmosphere outside the casing by the fan in the preliminary cooling unit and supplies the cooling mechanism to the substrate. delete delete It is a board | substrate cooling apparatus which cools the board | substrate after a heating, A conveying path for conveying the substrate after heating in one direction, Cooling mechanism for cooling the substrate conveyed by the conveyance path Is provided, the cooling mechanism, A precooling part and a main cooling part are sequentially arranged along the conveyance path from an upstream side in the conveying direction, The substrate after heating is cooled in the preliminary cooling section to remove heat from the substrate, and then the substrate is cooled to a predetermined temperature in the main cooling section. The said conveyance path roller conveys a board | substrate by rotation of the roller member arrange | positioned in multiple at one direction, At least a part of the roller member corresponding to the main cooling portion position is cooled from the inside thereof to function as the cooling mechanism. It is a board | substrate cooling apparatus which cools the board | substrate after a heating, A conveying path for conveying the substrate after heating in one direction, A cooling mechanism for cooling the substrate being conveyed from the conveying path; A control mechanism for controlling the cooling mechanism so that the substrate is at a predetermined temperature Is provided, the cooling mechanism, A precooling part and a main cooling part are sequentially arranged along the conveyance path from an upstream side in the conveying direction, The substrate after heating is cooled in the preliminary cooling section to remove heat from the substrate, and then the substrate is cooled to a predetermined temperature by the control mechanism in the main cooling section. The said conveyance path roller conveys a board | substrate by rotation of the roller member arrange | positioned in multiple at one direction, At least a part of the roller member corresponding to the main cooling portion position is cooled from the inside thereof to function as the cooling mechanism. It is a board | substrate cooling apparatus which cools the board | substrate after a heating, A conveying path for conveying the substrate after heating in one direction, A casing provided to accommodate the substrate being conveyed in the conveying path; Cooling mechanism for cooling the substrate in the casing Is provided, the cooling mechanism, A precooling part and a main cooling part are sequentially arranged along the conveyance path from an upstream side in the conveying direction, After the heating of the substrate is cooled in the preliminary cooling section to remove heat from the substrate, the substrate is cooled to a predetermined temperature in the main cooling section, The said conveyance path roller conveys a board | substrate by rotation of the roller member arrange | positioned in multiple at one direction, At least a part of the roller member corresponding to the main cooling portion position is cooled from the inside thereof to function as the cooling mechanism. It is a board | substrate cooling apparatus which cools the board | substrate after a heating, A conveying path for conveying the substrate after heating in one direction, A casing provided to accommodate the substrate being conveyed in the conveying path; A cooling mechanism for cooling the substrate in the casing; A control mechanism for controlling the cooling mechanism so that the substrate is at a predetermined temperature Is provided, the cooling mechanism, A precooling part and a main cooling part are sequentially arranged along the conveyance path from an upstream side in the conveying direction, The substrate after heating is cooled in the preliminary cooling section to remove heat from the substrate, and then the substrate is cooled to a predetermined temperature by the control mechanism in the main cooling section. The said conveyance path roller conveys a board | substrate by rotation of the roller member arrange | positioned in multiple at one direction, At least a part of the roller member corresponding to the main cooling portion position is cooled from the inside thereof to function as the cooling mechanism. It is a board | substrate cooling method which cools the board | substrate after the heating conveyed in one direction along a conveyance path with the board | substrate cooling apparatus which arrange | positions a precooling part and a main cooling part sequentially from the conveyance direction upstream along the said conveyance path, The said conveyance path carries out roller conveyance of a board | substrate by rotation of the roller member arrange | positioned in multiple at one direction, cools at least a part of the said roller member corresponding to the said main cooling part position from the inside, and functions as the said cooling mechanism, A substrate cooling method, wherein the substrate after heating is cooled in the preliminary cooling section to remove heat from the substrate, and the substrate is cooled to a predetermined temperature in the main cooling section.

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