WO2020148877A1

WO2020148877A1 - Conductor softening processing device and conductor softening processing method

Info

Publication number: WO2020148877A1
Application number: PCT/JP2019/001340
Authority: WO
Inventors: 善洋中澤; 春彦田中
Original assignee: 住友電工ウインテック株式会社
Priority date: 2019-01-17
Filing date: 2019-01-17
Publication date: 2020-07-23
Also published as: JP7302142B2; JPWO2020148877A1; CN113272462B; CN113272462A

Abstract

A conductor softening processing device according to one aspect of the present invention continuously heats and cools a wire-shaped conductor, and comprises: a conveyance mechanism that continuously conveys the conductor in the axial direction thereof; a heater that heats the conductor conveyed by the conveyance mechanism; a cooling tank that stores a cooling water, in which the conductor that was heated by the heater is submerged; and a dissolved oxygen quantity regulation mechanism that keeps the quantity of dissolved oxygen in the cooling water stored in the cooling tank within a predetermined set range, wherein the heater has a conveyance pipe that extends in the conveyance direction of the conductor and has a cavity formed in an interior section thereof, said cavity being for conveying the conductor, and a plurality of conductive wires that are embedded within the conveyance pipe along the conveyance direction and are wired such that a magnetic field becomes stronger at the center of a plane that is perpendicular to the conveyance direction in the cavity.

Description

Conductor softening treatment device and conductor softening treatment method

The present disclosure relates to a conductor softening treatment device and a conductor softening treatment method.

Patent Document 1 (Japanese Unexamined Patent Publication No. 2016-79436) describes a conductor softening treatment device capable of suppressing oxidation of a conductor. This conductor softening treatment apparatus reduces the amount of oxygen around the conductor to be cooled from the heated state by immersing the conductor after heating in cooling water in which the dissolved oxygen amount is within a predetermined setting range, and Inhibits oxidation.

JP, 2016-79436, A

A conductor softening treatment apparatus according to an aspect of the present invention is a conductor softening treatment apparatus that continuously heats and cools a linear conductor, and a feeding mechanism that continuously conveys the conductor in its axial direction, A heater for heating the conductor conveyed by the feeding mechanism, a cooling tank for storing cooling water in which the conductor heated by the heater is immersed, and a dissolved oxygen amount of the cooling water stored in the cooling tank are set in advance. And a carrier pipe having a dissolved oxygen amount adjusting mechanism for maintaining the temperature within a predetermined set range, wherein the heater extends in the conductor transport direction and a cavity for transporting the conductor is formed therein, and the transport pipe. A plurality of conductive lines embedded along the direction in the carrier pipe and wired so that the magnetic field is strengthened at the center of the plane of the cavity perpendicular to the carrier direction.

A conductor softening treatment method according to another aspect of the present invention is a conductor softening treatment method of continuously heating and cooling a linear conductor, wherein the conductor softening treatment device is used and the conductor is Direction, the step of continuously conveying the conductor, the step of heating the conductor to be conveyed, the step of cooling the heated conductor by immersion in cooling water, and the amount of dissolved oxygen in the cooling water set in advance. Maintaining within the range.

FIG. 1 is a schematic diagram showing the configuration of a conductor softening treatment apparatus according to an embodiment of the present invention. FIG. 2 is a schematic cross-sectional view taken along line AA of the heater of the conductor softening treatment device shown in FIG. FIG. 3 is a schematic cross-sectional view showing a state where the magnetic body of the heater shown in FIG. 2 is divided.

[Problems to be solved by the present disclosure]
Patent Document 1 describes, as a heater for heating a conductor, a configuration in which a conductor is inserted into a tubular member made of transparent glass or the like and heated by an induction heating coil arranged outside the tubular member. In order to improve the heating efficiency in such a configuration, it is effective to bring the coil close to the conductor. However, it is necessary to make the tubular member thinner in order to bring the coil closer to the conductor. For this reason, the tubular member is likely to be damaged, it is difficult to insert the conductor into the tubular member, and it is difficult to check the state of the inside of the tube and to clean the tubular member. Therefore, in the above-mentioned conventional heater configuration, there is a limit to making the tubular member thin and bringing the coil close to the conductor, and it is difficult to improve heating efficiency.

The present disclosure has been made based on the above circumstances, and a conductor softening treatment device having a heater capable of enhancing the heating efficiency of a conductor while suppressing damage to the device and a conductor using the conductor softening treatment device. It is intended to provide a softening treatment method.

[Effect of the present disclosure]
The heater of the conductor softening treatment device of the present disclosure can improve the heating efficiency of the conductor while suppressing damage to the device. Therefore, the conductor softening treatment method using the conductor softening treatment device of the present disclosure can improve the energy efficiency of the conductor softening treatment device while suppressing damage to the conductor softening treatment device, and thus is excellent in manufacturing efficiency.

[Description of Embodiments of the Present Invention]
A conductor softening treatment apparatus according to an aspect of the present invention is a conductor softening treatment apparatus that continuously heats and cools a linear conductor, and a feeding mechanism that continuously conveys the conductor in its axial direction, A heater for heating the conductor conveyed by the feeding mechanism, a cooling tank for storing cooling water in which the conductor heated by the heater is immersed, and a dissolved oxygen amount of the cooling water stored in the cooling tank are set in advance. And a carrier pipe having a dissolved oxygen amount adjusting mechanism for maintaining the temperature within a predetermined set range, wherein the heater extends in the conductor transport direction and a cavity for transporting the conductor is formed therein, and the transport pipe. A plurality of conductive lines embedded along the direction in the carrier pipe and wired so that the magnetic field is strengthened at the center of the plane of the cavity perpendicular to the carrier direction.

The conductor softening treatment device reduces the amount of oxygen around the conductor to be cooled from the heated state by immersing the conductor after heating in the cooling water in which the dissolved oxygen amount is within a predetermined setting range. Oxidation can be suppressed. Further, in the heater of the conductor softening processing apparatus, a cavity for carrying the conductor is formed inside the carrying pipe, and a conductive wire for generating a magnetic field for heating the conductor is embedded in the carrying pipe along the carrying direction of the conductor. Has been done. Therefore, even if the heater of the conductor softening apparatus is configured to bring the conductive wire closer to the conductor to improve the heating efficiency, it is not necessary to reduce the wall thickness of the carrier pipe, so that damage to the carrier pipe is suppressed. Therefore, the conductor softening treatment can improve the heating efficiency of the conductor while suppressing damage to the device.

ㆍIt is recommended that the main component of the above-mentioned carrier pipe is heat-resistant resin. In this way, by using a heat-resistant resin having no conductivity as the main component of the carrier pipe, it is possible to enhance the effect of suppressing damage to the carrier pipe while maintaining the heating efficiency of the conductor. Further, since the heat resistance effect of the carrier pipe can be further enhanced, the heater can easily withstand the heat from the conductor which becomes hot.

The heater may be embedded in the transfer pipe along the transfer direction and may have a heat shield plate surrounding the cavity. In this way, the heater is embedded in the transfer pipe along the transfer direction and has the heat shield plate surrounding the cavity, whereby the heating efficiency of the conductor can be further increased.

The average thickness of the heat shield plate is preferably 0.5 mm or more and 5 mm or less. In this way, by setting the average thickness of the heat shield plate within the above range, it is possible to enhance the heat shield effect while maintaining the heating efficiency of the conductor by the conductive wire.

The heater is preferably embedded in the transfer tube along the transfer direction and has a magnetic body surrounding the cavity. In this way, the heater is embedded in the transfer tube along the transfer direction and has the magnetic body surrounding the cavity, so that the magnetic field of the cavity is further increased, and thus the heating efficiency of the conductor is further increased. be able to.

The distance between magnetic bodies in the magnetic flux direction at the center of the cavity in a plane perpendicular to the transport direction is preferably shorter than the distance between magnetic bodies in the direction orthogonal to the magnetic flux direction. Thus, by making the distance between magnetic bodies in the magnetic flux direction at the center of the cavity in the plane perpendicular to the transport direction shorter than the distance between magnetic bodies in the direction orthogonal to the magnetic flux direction, the magnetic field in the cavity is reduced. Is further increased, the heating efficiency of the conductor can be further increased.

ㆍIt is preferable that the carrier pipe is configured to be separable so as to open the cavity. In this way, by configuring the transfer pipe so that it can be divided so as to open the cavity, it is possible to facilitate insertion of the conductor into the cavity, and it is possible to facilitate confirmation of the inside of the cavity and cleaning.

　It is recommended that the conductive wires be covered with insulation. By insulatingly coating the conductive wires in this manner, even when the magnetic body is configured to be dividable, an electrical short circuit may occur between a plurality of conductive wires due to water ingress into the carrier tube. Can be deterred. Therefore, damage to the conductor softening device can be further suppressed.

The length of the cavity is preferably 50 mm or more and 1500 mm or less. By setting the length of the cavity within the above range, it is possible to suppress an increase in the size of the conductor softening treatment device, reduce the amount of oxygen around the conductor, and enhance the effect of suppressing the oxidation of the conductor.

Since the conductor softening treatment method uses the conductor softening treatment device of the present invention, the energy efficiency of the conductor softening treatment device can be enhanced while suppressing damage to the conductor softening treatment device. Therefore, the conductor softening method is excellent in manufacturing efficiency.

Here, the “dissolved oxygen amount” is a value measured according to JIS-K-0101:1998. The "main component" means a component having the largest content, for example, a component having a content of 50% by mass or more. Further, the “average thickness” refers to the average value of the thickness measured at any 10 points.

[Details of the embodiment of the present invention]
Hereinafter, embodiments of a conductor softening treatment apparatus and a conductor softening treatment method according to the present invention will be described in detail with reference to the drawings.

[Conductor softening device]
The conductor softening treatment device shown in FIG. 1 continuously heats and cools the linear conductor C. This conductor softening apparatus includes a feeding mechanism 1 that continuously conveys the conductor C in the axial direction thereof, a heater 2 that heats the conductor C that is conveyed by the feeding mechanism 1, and a conductor C that is heated by the heater 2. The cooling tank 3 that stores the cooling water W in which the water is immersed, the dissolved oxygen amount adjusting mechanism 4 that maintains the dissolved oxygen amount of the cooling water W stored in the cooling tank 3 within a predetermined setting range, and the conductor C An air blower 5 is provided for blowing air to remove water adhering to the surface.

<conductor>
The conductor C to be softened in the conductor softening device is not particularly limited, but for example, copper wire, copper alloy wire, tin-plated copper wire, aluminum wire, aluminum alloy wire, steel core aluminum wire, copper fly wire, nickel. Examples of the copper wire include a plated copper wire, a silver-plated copper wire, and a copper-clad aluminum wire, and typically a copper wire. The average cross-sectional area of the conductor C is not particularly limited, but is, for example, 0.01 mm ² or more and 10 mm ² or less. Moreover, the cross-sectional shape of the conductor C is not particularly limited, and may be circular or rectangular, for example.

<Feeding mechanism>
The feeding mechanism 1 includes a plurality of guide sheaves (pulleys) on which the conductor C is bridged, and is configured to convey the conductor C in a constant direction indicated by an arrow D. The feed mechanism 1 of FIG. 1 is configured by three guide sheaves, a first guide sheave 11, a second guide sheave 12, and a third guide sheave 13 from the upstream side in the transport direction. The first guide sheave 11 on the upstream side and the third guide sheave 13 on the downstream side are arranged above the cooling tank 3, and the second guide sheave 12 in the middle is arranged in the cooling tank 3. The mechanism 1 conveys the conductor C so as to pass through the cooling water W stored in the cooling tank 3. Preferably, the feed mechanism 1 conveys the conductor C so as to enter the cooling water W stored in the cooling tank 3 downward in the vertical direction.

The feeding speed of the conductor C by the feeding mechanism 1 is not particularly limited, but is, for example, 1 m/min or more and 1000 m/min or less, typically 5 m/min or more and 100 m/min or less.

<Heater>
As shown in FIGS. 1 to 3, the heater 2 includes a transport pipe 21 extending in the transport direction of the conductor C, a plurality of conductive wires 22 embedded in the transport pipe 21 along the transport direction, and a heat shield plate 23. And a magnetic body 24.

(Conveyor tube)
The carrier pipe 21 has a cavity 21a for carrying the conductor C formed therein. In the cavity 21a, the conductor C is heated and then cooled by the cooling water W. When the conductor C in the heated state is immersed in the cooling water W, the cooling water W takes away the heat of the conductor C and becomes steam. The water vapor thus generated in the cavity 21a rises in the cavity 21a and pushes out the oxygen-containing air present in the cavity 21a. As a result, the supply of oxygen to the conductor C in a heated state is cut off, and the oxidation of the conductor C is suppressed.

The cross-sectional shape of the cavity 21a formed inside the carrier pipe 21 is not particularly limited, but may be, for example, a square shape or a circular shape as shown in FIG. The cavity 21a is arranged so that the center M of the cross section of the transfer tube 21, that is, the center M of the cross section of the cavity 21a (the surface perpendicular to the transfer direction) coincides with the center of the cross section of the transfer tube 21. Preferably. The cross-section of the carrier pipe 21 and the cross-section of the cavity 21a may have similar shapes, but may have different shapes.

Since the conductor C is transported inside the cavity 21a, the cross section of the cavity 21a is sized so as to include at least the maximum cross section of the conductor C. The lower limit of the ratio of the cross-sectional area of the cavity 21a to the maximum cross-sectional area of the conductor C is preferably 2 times and more preferably 4 times. On the other hand, the upper limit of the cross-sectional area ratio is preferably 20 times, more preferably 10 times. If the ratio of the above-mentioned cross-sectional areas is less than the above lower limit, the conductor C may come into contact with the inner wall of the cavity 21a, resulting in damage to the conductor C or uneven softening treatment. On the contrary, if the ratio of the cross-sectional area exceeds the upper limit, it becomes difficult to dispose the plurality of conductive wires 22 embedded in the carrier pipe 21 close to the conductor C, so that the heating efficiency of the conductor C is sufficiently increased. In addition, there is a risk that oxygen will not be removed sufficiently by water vapor. The cavity 21a may be composed of a heat shield plate 23 or the like in which a part or all of the inner wall is buried in the carrier pipe 21 as shown in FIG. 2, for example. It refers to the area of the space surrounded by the inner wall regardless of its constituent elements.

The inter-magnetic body distance (T1 in FIG. 2) in the magnetic flux direction (S direction in FIG. 2, which will be described later in detail) at the center of the cavity 21a in the plane perpendicular to the transport direction is a direction orthogonal to the magnetic flux direction S. It is preferable to be shorter than the inter-magnetic substance distance (T2 in FIG. 2). As described above, by making the inter-magnetic-body distance T1 in the magnetic flux direction S at the center M of the cavity 21a in the plane perpendicular to the transport direction shorter than the inter-magnetic body distance T2 in the direction orthogonal to the magnetic flux direction S, Since the magnetic field in 21a is further enhanced, the heating efficiency of the conductor C can be further enhanced.

The length of the cavity 21a (the length of the carrier pipe 21 in which the cavity 21a is formed) is preferably such that at least the portion of the conductor C that is easily oxidized, that is, the portion in the heated state, can be surrounded by the cavity 21a. .. That is, at least the lower end of the cavity 21a is immersed in the cooling water W, and the upper end is arranged at a height higher than the upper end of the conductive wire 22 described later.

The lower limit of the length of the cavity 21a is preferably 50 mm, more preferably 100 mm. On the other hand, the upper limit of the length of the cavity 21a is preferably 1500 mm, more preferably 1000 mm. If the length of the cavity 21a is less than the above lower limit, the oxygen amount in the atmosphere of the conductor C at the position where the conductor C is in a heated state may not be sufficiently reduced. On the contrary, if the length of the cavity 21a exceeds the upper limit, the conductor softening device may unnecessarily increase in size.

As described above, the lower end of the cavity 21a (lower end of the heater 2) is configured to be located inside the cooling water W stored in the cooling tank 3. As the configuration of the lower end of the cavity 21 a, in FIG. 1, the lower end of the cavity 21 a is located inside the cooling water W by extending only the transport pipe 21 without including the conductive wire 22, the heat shield plate 23 and the magnetic body 24. However, the configuration of the lower end of the cavity 21a is not limited to this, and may have another configuration. As another configuration, for example, a configuration in which only the conductive wire 22 is not included and the lower end of the cavity 21a is located in the cooling water W by extending the transport pipe 21, the heat shield plate 23, and the magnetic body 24 downward, and the like are given. be able to. The lower end of the conductive wire 22 may be located in the cooling water W, but from the viewpoint of heating efficiency, the lower end of the conductive wire 22 is preferably located above the liquid surface of the cooling water W.

As the configuration of the lower end described above, as shown in FIG. 1, only the carrier pipe 21 is extended downward without including the conductive wire 22, the heat shield plate 23, and the magnetic body 24, and the lower end of the cavity 21 a is placed in the cooling water W. Positioned configurations are preferred. In such a configuration, the lower limit of the distance between the lower end of the conductive wire 22 and the liquid surface of the cooling water W described later is preferably 0.01 m, and more preferably 0.05 m. On the other hand, the upper limit of the distance between the lower end of the conductive wire 22 and the liquid surface of the cooling water W is preferably 1 m, more preferably 0.7 m. Even after the conductor C is conveyed below the lower end of the conductive wire 22, the temperature is maintained to some extent and the annealing effect continues. Then, the conductor C is conveyed to below the liquid surface of the cooling water W, and is rapidly cooled. Therefore, if the distance between the lower end of the conductive wire 22 and the liquid surface of the cooling water W is less than the above lower limit, the continuous annealing effect is reduced, and the heating efficiency may be reduced. On the contrary, if the distance between the lower end of the conductive wire 22 and the liquid surface of the cooling water W exceeds the upper limit, the conductor softening treatment device may unnecessarily increase in size.

The lower limit of the length of the portion where the lower end of the cavity 21a is immersed in the cooling water W is preferably 0.01 m, more preferably 0.03 m. On the other hand, the upper limit of the length of the portion where the lower end of the cavity 21a is immersed in the cooling water W is preferably 0.15 m, more preferably 0.1 m. When the length of the portion where the lower end of the cavity 21a is immersed in the cooling water W is less than the above lower limit, water vapor generated by cooling the conductor C with the cooling water W easily leaks to the outside of the cavity 21a, and The amount of oxygen may not be reduced sufficiently. On the contrary, if the length of the portion where the lower end of the cavity 21a is immersed in the cooling water W exceeds the upper limit, the conductor softening treatment device may unnecessarily increase in size.

As described above, the upper end of the cavity 21a is arranged at a height higher than the upper end of the conductive wire 22. The lower limit of the difference between the upper end of the cavity 21a and the upper end of the conductive wire 22 is preferably 0.01 m, more preferably 0.03 m. On the other hand, the upper limit of the difference between the upper end of the cavity 21a and the upper end of the conductive wire 22 is preferably 0.15 m, more preferably 0.1 m. If the difference between the upper end of the cavity 21a and the upper end of the conductive wire 22 is less than the above lower limit, the oxygen amount in the atmosphere of the conductor C at the position where the conductor C is heated may not be sufficiently reduced. On the contrary, if the difference between the upper end of the cavity 21a and the upper end of the conductive wire 22 exceeds the above upper limit, the conductor softening treatment device may unnecessarily increase in size.

Heat-resistant resin is preferable as the main component of the carrier pipe 21. In this way, by using the heat-resistant resin having no conductivity as the main component of the carrier pipe 21, it is possible to enhance the damage suppressing effect of the carrier pipe 21 while maintaining the heating efficiency of the conductor C. Further, since the heat resistance effect of the carrier pipe 21 can be further enhanced, the heater 2 can easily withstand the heat from the conductor C which becomes hot.

Examples of the heat-resistant resin include known engineering plastics such as polycarbonate, polybutylene terephthalate, nylon 66, modified polyphenyl ether, polyphenylene sulfide, polyether ether ketone, polytetrafluoroethylene, polyetherimide, polyamideimide, and polyimide. be able to.

The lower limit of the continuous use temperature (UL) of the heat resistant resin is preferably 120°C, more preferably 200°C. If the UL of the heat-resistant resin is less than the above lower limit, the heat resistance of the transport pipe 21 may be insufficient. On the other hand, the upper limit of the continuous use temperature (UL) of the heat resistant resin is not particularly limited, and the higher the better. The “continuous use temperature” is a temperature specified in UL standard UL746B.

The lower limit of the toughness of the heat-resistant resin is preferably ^{^{1kJ / m 2, 3kJ / m}} 2 is more preferable. If the toughness of the heat-resistant resin is less than the above lower limit, the effect of suppressing damage to the transport pipe 21 may be insufficient. On the other hand, the upper limit of the toughness of the heat resistant resin is not particularly limited, and the higher the better. Here, the "toughness" means a numerical value obtained based on the method for obtaining the Charpy impact property described in JIS-K-7111-1:2012.

Note that the thickness of the carrier tube 21 can be appropriately determined within a range in which the heater 2 does not become excessively large while maintaining the strength of the heater 2.

(Conductive wire)
The plurality of conductive lines 22 generate a magnetic field whose magnetic flux density changes by passing an alternating current. An eddy current is generated in the conductor C due to this change in the magnetic field, and the conductor C itself generates heat due to the Joule loss. The heating temperature of the conductor C by the plurality of conductive wires 22 is selected according to the material of the conductor C and the like, but is, for example, 300° C. or more and 500° C. or less.

The number of the conductive wires 22 is not particularly limited, but it is preferable that the number of the conductive wires 22 is 2 or 4 so that the magnetic field can be easily strengthened. When the number of the conductive wires 22 is two, as shown in FIG. 2, it is preferable that the conductive wires 22 are arranged at point symmetric positions with the center M of the cavity 21a as the center. Further, when the number of the conductive wires 22 is four, the conductive wires 22 are arranged on each side of the magnetic flux direction S such that two conductive wires 22 are point-symmetrical along the magnetic flux direction S about the center M of the cavity 21a. Good to do. Hereinafter, the case where two conductive wires 22 are arranged as shown in FIG. 2 will be described as an example, but the number and the position of the conductive wires 22 are not limited, and the number and the arrangement of the conductive wires 22 are not limited. The same applies when the installation positions are different.

The two conductive wires 22 are laid out so that the magnetic field is strengthened at the center M of the cavity 21a in the plane perpendicular to the above-mentioned transport direction. That is, since the voltage applied to the conductive wire 22 is an alternating current, when the alternating voltage becomes positive, the conductive wire 22 below the center M of the cavity 21a in FIG. It is preferable that the conductive wire 22 that is wired so as to flow and that is located above the center M of the cavity 21a be such that a downward current flows from above the paper surface. With such wiring, the magnetic flux of the two conductive wires 22 tends to strengthen the magnetic flux in the magnetic flux direction S when the AC voltage becomes positive, so that the magnetic field strengthens at the center M of the cavity 21a. In the above example, the magnetic flux direction S is set from the right to the left in FIG. 2, but it may be set from the left to the right. In this case, contrary to the above, the conductive wire 22 below the center M of the cavity 21a is wired so that a downward current flows from above the paper surface, and the conductive wire 22 above the center M of the cavity 21a. Is wired so that an upward current flows from the bottom of the paper.

The conductive wire 22 preferably has a conductor portion 22a through which electricity flows and a covering portion 22b that covers the periphery of the conductor portion 22a. That is, it is preferable that the conductive wire 22 is covered with insulation. By insulatingly coating the conductive wires 22 in this way, even when the transport pipe 21 is configured to be dividable, an electrical short circuit may occur between a plurality of conductive wires due to infiltration of water into the transport pipe 21 or the like. Can be suppressed. Therefore, damage to the conductor softening device can be further suppressed. The covering portion 22b can be formed of, for example, a heat-resistant resin tube or the like.

From the viewpoint of heating uniformity of the conductor C, it is preferable that the plurality of conductive wires 22 have the same length. The length of the conductive wire 22 is determined so that the conductor C can be sufficiently heated, and the specific length is, for example, 10 cm or more and 200 cm or less.

The conductor portion 22a of the conductive wire 22 is preferably tubular so that cooling water can pass through it in order to prevent it from becoming too hot. When the conductor portion 22a is tubular as described above, the thickness of the conductor portion 22a is appropriately determined so that the conductor 22a does not become too thin and the pressure loss of the cooling water does not increase, and that the conductor 22a does not become too thick and the heating efficiency decreases. It Further, the average thickness of the covering portion 22b is appropriately determined so as to ensure the insulation between the conductor portion 22a and the outside.

(Heat shield plate)
The heat shield plate 23 surrounds the cavity 21a. By disposing the heat shield plate 23 so as to surround the cavity 21a in this manner, it is possible to prevent heat from diffusing from the cavity 21a to the outside and to improve the heating efficiency of the conductor C.

From the viewpoint of improving the heating efficiency, the heat shield plate 23 is preferably located closer to the cavity 21a, more preferably closer to the cavity 21a than the conductive wire 22, and as shown in FIG. It is more preferable to set the position to form the side wall of the cavity 21a.

The heat shield plate 23 has an insulating property. As a result, the heat shield plate 23 also functions as an insulating plate for the buried conductive wire 22, and can prevent an electrical short circuit from occurring between the plurality of conductive wires 22. Therefore, damage to the conductor softening device is further suppressed.

The lower limit of the average thickness of the heat shield plate 23 is preferably 0.5 mm, more preferably 0.7 mm. On the other hand, the upper limit of the average thickness of the heat shield plate 23 is preferably 5 mm, more preferably 3 mm. If the average thickness of the heat shield plate 23 is less than the above lower limit, the heat shield effect may be insufficient. On the contrary, if the average thickness of the heat shield plate 23 exceeds the upper limit, the heating efficiency of the conductor C may not be sufficiently improved.

The lower limit of the continuous use temperature (UL) of the heat shield plate 23 is preferably 350°C, more preferably 500°C. If the UL of the heat shield plate 23 is less than the above lower limit, the heat shield effect may be insufficient. On the other hand, the upper limit of the continuous use temperature (UL) of the heat shield plate 23 is not particularly limited, and the higher the better.

The toughness of the lower limit of the heat shield plate 23 is preferably ^{^{0.5kJ / m 2, 1kJ / m}} 2 is more preferable. If the toughness of the heat shield plate 23 is less than the above lower limit, the heat shield plate 23 may be easily damaged. On the other hand, the upper limit of the toughness of the heat shield plate 23 is not particularly limited, and the higher the better.

(Magnetic material)
The magnetic body 24 surrounds the cavity 21a. The magnetic body 24 strengthens the magnetic field induced by the conductive wire 22 and promotes heating of the conductor C. Specifically, as shown in FIG. 2, the cavity 21a is surrounded by a total of four magnetic bodies 24, that is, a pair of magnetic bodies 24 parallel to the magnetic flux direction S and a pair of magnetic bodies 24 perpendicular to the magnetic flux direction. There is. By thus configuring the heater 2 to have the magnetic body 24 that surrounds the cavity 21a, the magnetic field of the cavity 21a can be further enhanced, so that the heating efficiency of the conductor C can be further enhanced.

The material of the magnetic body 24 is not particularly limited, and a known material such as ferrite can be used.

The shape of each cross section of the magnetic body 24 is not particularly limited, but can be, for example, a square shape (square shape or rectangular shape). The overall size of the cross section of the magnetic body 24 (the total size of the four magnetic bodies 24 in FIG. 2) is appropriately determined according to the material and the like of the conductor C so that the conductor C can be sufficiently heated.

The magnetic body 24 is preferably arranged so that the conductor 22 is located in the space surrounded by the four magnetic bodies 24, as shown in FIG. By disposing the magnetic body 24 in this way, the conductive wire 22 can be brought close to the cavity 21a while maintaining the effect of improving the heating efficiency of the conductor C by the magnetic body 24, so that the heating efficiency of the conductor C is further increased.

(Division of carrier pipe)
The carrier pipe 21 is dividable so as to open the cavity 21a. By this division, a part of the cavity 21a is opened to the outside along the carrying direction. By configuring the transport pipe 21 so that it can be divided so as to open the cavity 21a, it is possible to facilitate the insertion of the conductor C into the cavity 21a, and also to facilitate confirmation of the state inside the cavity 21a and cleaning.

The width of the opened portion of the cavity 21a (the length in the direction perpendicular to the transport direction) is set to a size that allows at least the conductor C to be taken in and out of the cavity 21a, and in consideration of maintenance such as cleaning inside the cavity 21a. The maximum width of the cavity 21a is preferable. For example, in the case of the carrier tube 21 having a rectangular cavity 21a whose cross section is as shown in FIG. 2, it is preferable that the carrier tube 21 is divided into the postures as shown in FIG. Specifically, in the plane perpendicular to the transport direction, the transport line is a polygonal line that includes one of the inner wall surfaces of the cavity 21a orthogonal to the magnetic flux direction S and does not include the plurality of conductive lines 22. It may be divided into two parts that are cut along the direction.

The method of opening and closing the dividable carrier pipe 21 is not particularly limited as long as airtightness can be ensured in the closed state, but for example, a method of using a sealing material made of heat-resistant rubber or the like, or a main body portion and a dividing portion. There may be mentioned a method of providing an engaging mechanism in the.

<Cooling tank>
The cooling tank 3 is a water tank having an open upper portion for storing the cooling water W. The cooling tank 3 has an upper part sealed by a lid 31 having a hole formed through the heater 2. The cooling tank 3 also has an overflow mechanism 32 that keeps the water level of the cooling water W within a predetermined range.

The capacity of the cooling tank 3 is not particularly limited, and is selected according to the size of the second guide sheave 12 and the like. As a material forming the cooling tank 3, for example, one kind or a combination of plural kinds of metal, resin, glass and the like is used.

(Cooling water)
The cooling water W is stored in the cooling tank 3 so as to immerse the lower end of the heater 2 (the lower end of the cavity 21a).

The immersion depth of the conductor C in the cooling tank 3, that is, the vertical distance from the liquid surface of the cooling water W to the lower end of the second guide sheave 12 in the cooling tank 3 depends on the cross-sectional area of the conductor C and the transport speed. The depth is set so that C can be sufficiently cooled.

(Lid)
The lid 31 restricts the entry and exit of air to and from the cooling tank 3, but is not airtight enough to make the pressure in the cooling tank 3 different from the atmospheric pressure. As a material for forming the lid 31, for example, one kind or a combination of plural kinds of metal, resin, glass and the like is used.

(Overflow mechanism)
The overflow mechanism 32 causes the cooling water W to overflow so that the water level in the cooling tank 3 does not exceed a certain height. In the conductor softening treatment device, when oxygen in the atmosphere is dissolved in the cooling water W in the cooling tank 3 and the dissolved oxygen amount rises, a new cooling with a small dissolved oxygen amount is performed in the cooling tank 3 from the dissolved oxygen amount adjusting mechanism 4 described later. Water W is supplied. The conductor softening treatment device has the overflow mechanism 32, so that when the new cooling water W is supplied, the old cooling water W is preferentially overflowed, so that the dissolved oxygen of the cooling water W in the cooling tank 3 is dissolved. The amount can be kept within the set range.

As this overflow mechanism 32, a pipe or the like that opens to the side wall of the cooling tank 3 is used. As shown in FIG. 1, the overflow mechanism 32 may have a trap 32a that isolates the internal space of the cooling tank 3 from the outside by the overflowed cooling water W.

<Dissolved oxygen control mechanism>
The dissolved oxygen amount adjusting mechanism 4 includes a supply unit 41 that supplies new cooling water W to the cooling tank 3, and a dissolved oxygen amount detection unit 42 that measures the dissolved oxygen amount of the cooling water W stored in the cooling tank 3. A control unit 43 that controls the cooling water supply amount of the supply unit 41 based on the detection value of the dissolved oxygen amount detection unit 42, and a deoxidation unit 44 that reduces the dissolved oxygen amount of the cooling water W supplied by the supply unit 41. Have.

In this dissolved oxygen amount adjusting mechanism 4, for example, the dissolved oxygen amount detection unit 42 detects the dissolved oxygen amount of the cooling water W stored in the cooling tank 3, and the detected value indicates the upper limit value of the preset range. When it exceeds, new cooling water W with the amount of dissolved oxygen reduced by the deoxidizing unit 44 is supplied from the supply unit 41 to the cooling tank 3. Further, the dissolved oxygen amount adjusting mechanism 4 stops the supply of the new cooling water W from the supply unit 41 to the cooling tank 3 when the detected value of the dissolved oxygen amount detection unit 42 becomes less than the lower limit value of the above setting range. .. As a result, the dissolved oxygen amount of the cooling water W stored in the cooling tank 3 is maintained within the above set range. Further, the supply amount of the cooling water W may be adjusted so that the detection value of the dissolved oxygen amount detection unit 42 becomes a representative value within the above setting range.

The lower limit value of the above-mentioned set range of the dissolved oxygen amount of the cooling water W in the cooling tank 3 is preferably 0.1 mg/L, more preferably 0.3 mg/L. On the other hand, the upper limit of the above setting range is preferably 6 mg/L, more preferably 3 mg/L, further preferably 2 mg/L, particularly preferably 1 mg/L. In order to prevent the amount of dissolved oxygen in the cooling water W in the cooling tank 3 from falling below the lower limit value of the above setting range, a large equipment cost and running cost are required, which may be uneconomical and may result in halfway oxidation. The adhesion of the surface of the conductor C may be lowered due to the formation of the coating film. On the contrary, if the amount of dissolved oxygen in the cooling water W in the cooling tank 3 exceeds the above upper limit, the oxidation of the conductor C may not be sufficiently suppressed. That is, the dissolved oxygen amount of the cooling water W in the cooling tank 3 is preferably maintained at a value lower than the dissolved oxygen amount of water in the air-opened state, but the smaller it is, the closer the conductor C surface adheres after the softening treatment. It is not possible to improve the sex. Therefore, by maintaining the dissolved oxygen amount of the cooling water W in the cooling tank 3 within the above-mentioned preferable range, the adhesion of the surface of the conductor C after the softening treatment can be maximized. The lower limit value of the above setting range may be 0 mg/L if there is no problem in operation and control. In this case, the dissolved oxygen amount of the cooling water W in the cooling tank 3 need only be a preset value (corresponding to the upper limit of the above setting range) or less. Further, the lower limit value of the setting range may be the same as the upper limit value. That is, the dissolved oxygen amount of the cooling water W in the cooling tank 3 may be adjusted by the dissolved oxygen amount adjusting mechanism 4 so that the difference from the set value becomes as small as possible.

(Supply Department)
The supply unit 41 is formed from a pipe that supplies new cooling water W to the cooling tank 3, and has a regulating valve 45 that adjusts the flow rate of the cooling water W supplied to the cooling tank 3.

The position inside the cooling tank 3 where the supply unit 41 supplies the cooling water W is preferably a position away from the overflow mechanism 32 of the cooling tank 3. With this arrangement, by supplying new cooling water W having a small dissolved oxygen amount from the supply unit 41, old cooling water W having an increased dissolved oxygen amount overflows, and the entire cooling water W in the cooling tank 3 is dissolved oxygen. The amount can be reduced.

Furthermore, it is preferable that the supply unit 41 supplies new cooling water W through a pipe that opens into the cooling water W stored in the cooling tank 3. By supplying the new cooling water W to the inside of the cooling tank 3 in this manner, it is possible to prevent the oxygen existing in the space above the liquid surface from dissolving into the cooling water W due to the stirring of the liquid surface of the cooling water W.

(Dissolved oxygen amount detector)
The dissolved oxygen amount detection unit 42 detects the dissolved oxygen amount of the cooling water W stored in the cooling tank 3 and sends it as a detection signal to the control unit 43. As the dissolved oxygen amount detection unit 42, for example, an automatic dissolved oxygen measuring device based on JIS-K-0803:1995 can be used.

As the disposing position of the dissolved oxygen amount detection unit 42, it is preferable to avoid a position where the amount of dissolved oxygen may be smaller than that of other portions by supplying new cooling water W from the supply unit 41, and to suppress the oxidation of the conductor C. It is more preferable that the position where the dissolved oxygen amount of the cooling water W contributing to the measurement can be measured, that is, the vicinity of the position where the conductor C enters the cooling water W.

(Control unit)
The control unit 43 adjusts the opening degree of the adjustment valve 45 of the supply unit 41 so as to maintain the detected value of the dissolved oxygen amount detection unit 42 within a predetermined setting range. The supply amount of new cooling water W is controlled.

The control unit 43 can be composed of, for example, a general-purpose computer, a PID controller, a sequencer, or the like. As the control method, for example, PID control, proportional control, on/off control, fuzzy (membership function) control, or the like can be applied.

(Deoxidizer part)
The deoxidizing unit 44 is configured by, for example, a chemical deoxidizer, a heating deoxidizer, a vacuum deoxidizer, a reverse osmosis membrane deoxidizer, a nitrogen deoxidizer, and the like.

The above chemical deoxidizer removes oxygen by a chemical reaction by adding a deoxidizer to the makeup water. Examples of the oxygen scavenger include hydrazine, sodium sulfite, and natural organic compounds.

The above-mentioned heated deoxidizer removes dissolved oxygen by heating make-up water to boil. Examples of the method of boiling the makeup water include a method of heating the makeup water with a heater and a method of introducing steam into the makeup water.

The vacuum deoxidizer removes dissolved oxygen by decompressing the makeup water. Make-up water may be sprayed to promote degassing of dissolved oxygen.

The above reverse osmosis membrane deoxidizer obtains water with a small amount of dissolved oxygen by filtering water using a reverse osmosis membrane that blocks the permeation of oxygen.

The above-mentioned nitrogen deoxidizer makes nitrogen gas vapor-liquid contact with the makeup water, and moves the dissolved oxygen in the makeup water to the nitrogen gas side due to the difference in partial pressure.

The lower limit of the dissolved oxygen amount of the new cooling water W obtained by removing oxygen from the makeup water by the deoxidizing unit 44 as described above is preferably 0.05 mg/L, more preferably 0.1 mg/L. On the other hand, the upper limit of the dissolved oxygen amount of the new cooling water W is preferably 2 mg/L, more preferably 1 mg/L. In order to prevent the amount of dissolved oxygen in the new cooling water W from falling below the lower limit, a large equipment cost and running cost are required, which may be uneconomical. On the contrary, if the amount of dissolved oxygen in the new cooling water W exceeds the upper limit, the amount of dissolved oxygen in the cooling water W in the cooling tank 3 may not be sufficiently reduced.

<Air blow>
The air blow 5 is a non-contact wiper that blows off air onto the surface of the conductor C coming out of the cooling tank 3 to wipe off water droplets adhering to the surface of the conductor C. In this air blow 5, it is preferable to set the blowing direction and the distance from the lid 31 so that the air blown on the surface of the conductor C does not easily enter the inside of the cooling tank 3 through the hole of the lid 31.

<Advantages>
The conductor softening treatment apparatus reduces the amount of oxygen around the conductor C cooled from the heated state by immersing the conductor C after heating in the cooling water W in which the dissolved oxygen amount is within a predetermined setting range. The oxidation of the conductor C can be suppressed. Further, in the heater 2 of the conductor softening processing apparatus, a cavity 21a for transporting the conductor C is formed inside the transport pipe 21, and a conductive wire 22 for generating a magnetic field for heating the conductor C is further provided in the transport direction of the conductor C. Is embedded in the carrier pipe 21 along the. For this reason, in the heater 2 of the conductor softening treatment device, even if the conductive wire 22 is brought close to the conductor C to improve the heating efficiency, it is not necessary to reduce the wall thickness of the carrier pipe 21, so that the carrier pipe 21 is not damaged. Be deterred. Therefore, the conductor softening treatment can improve the heating efficiency of the conductor C while suppressing damage to the device.

[Conductor softening method]
A conductor softening treatment method according to an aspect of the present invention is a conductor softening treatment method of continuously heating and cooling a linear conductor C. The conductor softening method is performed by using the conductor softening device shown in FIG.

The conductor softening treatment method includes a step of continuously transporting the conductor C in the axial direction thereof, a step of heating the transported conductor C, and a step of cooling the heated conductor C by immersion in cooling water W. , Maintaining the dissolved oxygen amount of the cooling water W within a predetermined set range.

<Conveying process>
The carrying step can be performed using the feeding mechanism 1 of the conductor softening device of FIG. Therefore, the transport conditions such as the transport speed are the same as those described for the conductor softening device in FIG.

If the conductor C is a rectangular conductor having a rectangular cross section, the conductor C may be conveyed so that the long side of the cross section of the conductor C is perpendicular to the magnetic flux direction S. By carrying in this manner, the conductor C can be efficiently heated.

<Heating process>
The heating step can be performed using the heater 2 of the conductor softening device of FIG. Therefore, the heating conditions are the same as those described for the conductor softening device in FIG.

<Cooling process>
The cooling step can be performed by immersing the conductor C in the cooling water W stored in the cooling tank 3 of the conductor softening device of FIG.

<Maintenance process>
The maintaining step can be performed using the dissolved oxygen amount adjusting mechanism 4 of the conductor softening device of FIG. Therefore, the conditions and the like of the cooling water W are the same as those described for the conductor softening device of FIG.

<Advantages>
Since the conductor softening treatment method uses the conductor softening treatment device of the present invention, it is possible to enhance the energy efficiency of the conductor softening treatment device while suppressing damage to the conductor softening treatment device. Therefore, the conductor softening method is excellent in manufacturing efficiency.

[Insulated wire manufacturing method]
Then, the manufacturing method of the insulated wire using the said conductor softening method is demonstrated. The insulated wire includes a step of softening the conductor by the conductor softening treatment method, a step of applying an insulating coating (varnish) on the surface of the softened conductor, and a step of baking the insulating coating applied on the surface of the conductor by heating. It is manufactured by the method of preparing.

<Softening process>
The softening treatment step is performed according to the conductor softening treatment method described above.

<Coating process>
In the coating step, the conductor C is penetrated through a coating tank that stores the insulating coating material, and the insulating coating material attached to the surface of the conductor C is adjusted to have a constant thickness by a die.

The main component of the insulating paint may be a resin having high insulation and heat resistance, and examples thereof include polyamide, polyimide, polyamideimide, polyesterimide, and the like. The insulating paint may contain a solvent such as N-methyl-2-pyrrolidone or cresol.

As the die, a known die having an inner surface formed into a conical surface and having the effect of automatically aligning the conductor C by the wedge film effect and making the film thickness constant in the circumferential direction is used.

<Baking process>
In the baking step, the insulating coating material is cured by heating the conductor whose surface is coated with the insulating coating material. When the insulating paint contains a solvent, first, the solvent is volatilized at a temperature lower than the curing temperature of the resin component, and then the temperature is raised to a temperature at which the resin component is cured, thereby forming an insulating coating without bubbles. it can.

As the heating method, for example, induction heating that heats the conductor by electromagnetic induction, radiant heating that heats the insulating paint by radiant heat of the heater, hot air heating that circulates hot air to heat the insulating paint, and the like can be adopted.

<Advantages>
In the above-described method for manufacturing an insulated wire, the conductor C is softened by the conductor softening treatment method and then the insulating coating is formed. Therefore, the conductor C is not oxidized and an insulated wire having high flexibility and conductivity can be manufactured. ..

[Other Embodiments]
The embodiments disclosed this time are to be considered as illustrative in all points and not restrictive. The scope of the present invention is not limited to the configurations of the above-described embodiments, but is defined by the scope of the claims, and is intended to include meanings equivalent to the scope of the claims and all modifications within the scope.

In the above embodiment, as the conductor softening treatment device, the heater has the heat shield plate surrounding the cavity, but the heat shield plate may not surround the cavity. For example, even if the heat shield plate is embedded in the transfer pipe along a part of the cavity, a certain effect can be obtained for improving the heating efficiency. Furthermore, a configuration in which the heat shield plate is omitted is also intended by the present invention.

In the above embodiment, the case where the cavity is surrounded by a total of four magnetic bodies has been described, but the number of magnetic bodies surrounding the cavity is not limited to four, and for example, one magnetic body may surround the cavity. .. Since the strength against deformation can be particularly improved by adopting a structure in which the cavity is surrounded by one magnetic body in this way, the effect of suppressing damage to the transport pipe can be further enhanced. When the cavity is surrounded by one magnetic body, the carrier tube may be composed of only the magnetic body.

In the above embodiment, as the conductor softening treatment device, the case where the heat shield plate, the magnetic body, and the conductive wire are independently embedded in the carrier pipe has been described. However, for example, the conductive wire is embedded in the heat shield plate and the magnetic body. It is also possible to have a different configuration.

In the above embodiment, as the conductor softening treatment device, the case where the carrier pipe is configured to be divisible so as to open the cavity formed inside has been described, but the structure that the carrier pipe is divisible is not essential. A conductor softening treatment device composed of an indivisible carrier pipe is also intended by the present invention.

In the above embodiment, the case where the conductive wire is covered with insulation has been described, but this is not an indispensable constituent requirement, and the conductive wire may not be covered with insulation. For example, when the conductive wire is embedded in the heat shield plate, insulation may be achieved by the heat shield plate.

The supply unit may be omitted in the conductor softening device. If the cooling tank is sufficiently large, the amount of dissolved oxygen in the cooling water in the cooling tank can be kept low for a certain period of time without supplying new cooling water from the supply unit.

The overflow mechanism may be omitted in the conductor softening device. If there is no excess supply of new cooling water, it is not necessary to discharge the cooling water from the cooling tank.Even when the cooling water is discharged from the cooling tank, a discharge passage is formed at the bottom of the cooling tank or a suction pump is used. Other means such as drawing out the cooling water may be used.

In the conductor softening treatment device, a deoxidizing unit may be provided in the cooling tank as a dissolved oxygen amount adjusting mechanism in place of the supplying unit. For example, by disposing a device for supplying an oxygen scavenger or a device for supplying nitrogen gas to the cooling tank, the amount of dissolved oxygen in the cooling water stored in the cooling tank can be kept low. The dissolved oxygen amount adjusting mechanism may be not only automatically controlled by the control unit but also operated by an operator. In addition, the amount of dissolved oxygen can be kept low for a certain period of time by previously adding an excess amount of oxygen scavenger to the cooling tank.

In the conductor softening treatment device, if the amount of oxygen dissolved in the cooling water from the liquid surface is small, the cooling tank lid may be omitted.

Also, in order to reduce the amount of oxygen that dissolves in the cooling water from the liquid surface, the shape of the cooling tank may be designed so that the area of the liquid surface is small.

Furthermore, air blow may be omitted in the conductor softening processing device.

Hereinafter, the present invention will be described in detail based on examples, but the present invention is not limitedly interpreted based on the description of the examples.

[No. 1]
A test for softening a hard copper wire as a conductor was conducted using an apparatus having a configuration similar to that of the conductor softening treatment apparatus of FIG.

No. In 1, the heater uses a glass tube that extends in the conductor transport direction and has a cavity for transporting the conductor, and the heater faces the outside of the glass tube with the cavity therebetween. The structure is such that two conductive wires are arranged. In addition, No. In No. 1, the heater was configured to have no magnetic substance, and the length of the conductive wire (length in the carrying direction of the conductor) was 10 cm. Further, the conductive wire is wired so that the magnetic field is strengthened at the center of the plane of the cavity which is perpendicular to the transport direction.

The conductor is a rectangular copper wire (rectangular shape whose cross section has an area equivalent to a circle with a diameter of 3 mm), and the conductor transport speed was set to 15 m/min. The amount of power supplied was adjusted so that the heating rate by the heater was 100° C./second, and the conductor was heated to 300° C. The heating efficiency at this time is shown in Table 1.

Also, as shown in Table 1, No. When the conductor softening treatment test was performed 10 times using the apparatus of No. 1, the breakage of the heater was confirmed in three of them.

[No. 2]
No. In No. 2, the heater has a pair of magnetic bodies. No. In No. 2, except for the structure of this heater, The configuration is the same as that of 1. The pair of magnetic bodies were arranged on the opposite sides of the cavities with the conductive wires sandwiched therebetween. That is, the magnetic flux direction is open (the magnetic substance distance T1 is infinite), and the magnetic substance distance T1 in the magnetic flux direction at the center of the cavity is longer than the magnetic substance distance T2 in the direction orthogonal to the magnetic flux direction.

Using the above conductor softening device, No. The conductor was heated under the same conditions as in 1. The heating efficiency at this time is shown in Table 1.

Also, as shown in Table 1, No. When the conductor softening treatment test was performed 20 times using the apparatus of No. 2, the breakage of the heater was confirmed in 5 of them.

[No. 3]
No. In 3, the heater uses a carrier pipe that extends in the conductor carrying direction and has a cavity for carrying the conductor therein, and two conductive wires and four magnetic bodies are provided in the carrier pipe. It was configured to be embedded as shown in FIG. The distance T1 between magnetic bodies in the magnetic flux direction at the center of the cavity is made shorter than the distance T2 between magnetic bodies in the direction orthogonal to the magnetic flux direction. The carrier tube was made of a heat-resistant resin as a main component, and the conductive wire had a length of 10 cm.

Also, as shown in Table 1, No. When the conductor softening treatment test was performed 35 times using the apparatus of No. 3, no damage to the heater was confirmed.

In Table 1, "heating efficiency" means the value obtained by multiplying the temperature rise of the conductor by the specific heat per unit length of the conductor, divided by the input power amount.

From Table 1, No. 1 using a heater in which a conductive wire is embedded in the carrier pipe. The conductor softening treatment device of No. 3 is No. 3 in which the conductive wire is not buried. 1 or No. It can be seen that the heater is less likely to be damaged as compared with the conductor softening treatment device of 2. From this, it can be said that by embedding the conductive wire in the transport pipe along the transport direction of the conductor, damage to the transport pipe can be suppressed.

In addition, the heater has a magnetic body No. 2 and No. The conductor softening treatment device of No. 3 has No. The heating efficiency is higher than that of the conductor softening treatment device of No. 1. From this, it can be said that the heating efficiency of the conductor can be further increased by using the heater having the magnetic material.

Further, the distance T1 between magnetic bodies in the magnetic flux direction at the center of the cavity is shorter than the distance T2 between magnetic bodies in the direction orthogonal to the magnetic flux direction. The conductor softening treatment apparatus of No. 3 has No. 1 in which T1 is longer than T2. The heating efficiency is higher than that of the second conductor softening treatment device. Therefore, the heating efficiency of the conductor is further improved by making the distance between magnetic bodies in the magnetic flux direction at the center of the cavity in the plane perpendicular to the transport direction shorter than the distance between magnetic bodies in the direction orthogonal to the magnetic flux direction. It can be said that you can.

1 Feed Mechanism 11 1st Guide Sheave 12 2nd Guide Sheave 13 3rd Guide Sheave 2 Heater 21 Carrier Pipe 21a Cavity 22 Conductive Wire 22a Conductor 22b Covering Part 23 Heat Shield Plate 24 Magnetic Material 3 Cooling Tank 31 Lid 32 Overflow Mechanism 32a Trap 4 Dissolved oxygen amount adjusting mechanism 41 Supply unit 42 Dissolved oxygen amount detecting unit 43 Control unit 44 Deoxidizing unit 45 Adjustment valve 5 Air blow C Conductor M Center of cavity W Cooling water

Claims

A conductor softening treatment device for continuously heating and cooling a linear conductor,
A feed mechanism that continuously conveys the conductor in its axial direction,
A heater for heating the conductor conveyed by the feeding mechanism,
A cooling tank that stores cooling water for immersing the conductor heated by the heater,
With a dissolved oxygen amount adjusting mechanism for maintaining the dissolved oxygen amount of the cooling water stored in the cooling tank within a predetermined setting range,
The heater is
A carrier pipe extending in the conductor carrying direction and having a cavity formed therein for carrying the conductor;
A conductor softening treatment device having a plurality of conductive wires embedded along the carrying direction in the carrying pipe and wired so that a magnetic field is strengthened at the center of a plane of the cavity perpendicular to the carrying direction.
The conductor softening device according to claim 1, wherein a main component of the carrier pipe is a heat resistant resin.
The conductor softening device according to claim 1 or 2, wherein the heater has a heat shield plate that is embedded in the transfer pipe along the transfer direction and surrounds the cavity.
The conductor softening device according to claim 3, wherein the heat shield plate has an average thickness of 0.5 mm or more and 5 mm or less.
The conductor softening device according to any one of claims 1 to 4, wherein the heater has a magnetic body embedded in the transport pipe along the transport direction and surrounding the cavity.
The conductor softening device according to claim 5, wherein a distance between magnetic bodies in a magnetic flux direction at a center of the cavity in a plane perpendicular to the transport direction is shorter than a distance between magnetic bodies in a direction orthogonal to the magnetic flux direction.
The conductor softening device according to any one of claims 1 to 6, wherein the carrier pipe is configured to be divisible so as to open the cavity.
The conductor softening device according to any one of claims 1 to 7, wherein the conductive wire is insulation-coated.
The conductor softening device according to any one of claims 1 to 8, wherein the cavity has a length of 50 mm or more and 1500 mm or less.
A conductor softening treatment method of continuously heating and cooling a linear conductor,
Using the conductor softening apparatus according to any one of claims 1 to 9,
A step of continuously transporting the conductor in its axial direction,
Heating the carried conductor,
A step of cooling the heated conductor by immersion in cooling water,
A step of maintaining the dissolved oxygen amount of the cooling water within a predetermined set range.