TW200741812A - Substrate cooling device - Google Patents

Substrate cooling device

Info

Publication number
TW200741812A
TW200741812A TW095147441A TW95147441A TW200741812A TW 200741812 A TW200741812 A TW 200741812A TW 095147441 A TW095147441 A TW 095147441A TW 95147441 A TW95147441 A TW 95147441A TW 200741812 A TW200741812 A TW 200741812A
Authority
TW
Taiwan
Prior art keywords
cooling device
substrate
substrate cooling
transported
cooling
Prior art date
Application number
TW095147441A
Other languages
Chinese (zh)
Other versions
TWI323483B (en
Inventor
Yasutaka Souma
Mitsuhiro Sakai
Norio Wada
Shunichi Yahiro
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200741812A publication Critical patent/TW200741812A/en
Application granted granted Critical
Publication of TWI323483B publication Critical patent/TWI323483B/en

Links

Classifications

    • E—FIXED CONSTRUCTIONS
    • E03—WATER SUPPLY; SEWERAGE
    • E03D—WATER-CLOSETS OR URINALS WITH FLUSHING DEVICES; FLUSHING VALVES THEREFOR
    • E03D3/00—Flushing devices operated by pressure of the water supply system flushing valves not connected to the water-supply main, also if air is blown in the water seal for a quick flushing
    • E03D3/12—Flushing devices discharging variable quantities of water

Landscapes

  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Hydrology & Water Resources (AREA)
  • Public Health (AREA)
  • Water Supply & Treatment (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Tunnel Furnaces (AREA)

Abstract

Substrate cooling device 25 has a roller transportation mechanism 5 as transportation road where a substrate G is transported to one direction and a cooling mechanism 7 that touches the substrate G transported with the roller transportation mechanism 5 to the cooling medium in casing 6 and cools.
TW095147441A 2006-01-24 2006-12-18 Substrate cooling device TWI323483B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006015250A JP4537323B2 (en) 2006-01-24 2006-01-24 Substrate cooling device

Publications (2)

Publication Number Publication Date
TW200741812A true TW200741812A (en) 2007-11-01
TWI323483B TWI323483B (en) 2010-04-11

Family

ID=38455306

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095147441A TWI323483B (en) 2006-01-24 2006-12-18 Substrate cooling device

Country Status (4)

Country Link
JP (1) JP4537323B2 (en)
KR (1) KR101299898B1 (en)
CN (1) CN100505155C (en)
TW (1) TWI323483B (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009158792A (en) * 2007-12-27 2009-07-16 Dainippon Screen Mfg Co Ltd Substrate processing apparatus
KR100921523B1 (en) * 2008-05-30 2009-10-12 세메스 주식회사 Method and apparatus for fabricating substrates used in manufacturing flat panel display
JP4675401B2 (en) * 2008-08-29 2011-04-20 東京エレクトロン株式会社 Substrate transfer device
JP2010083610A (en) * 2008-09-30 2010-04-15 Tokyo Electron Ltd Treatment system
TWI582256B (en) * 2013-02-04 2017-05-11 愛發科股份有限公司 Thin substrate processing apparatus
KR20160041175A (en) 2014-10-06 2016-04-18 삼성디스플레이 주식회사 Method of manufacturing thin film transistor substrate and manufacturing apparatus therefor
US9412671B1 (en) * 2015-04-30 2016-08-09 Taiwan Semiconductor Manufacturing Co., Ltd. Method for controlling processing temperature in semiconductor fabrication
KR101930742B1 (en) * 2017-05-29 2019-03-11 주식회사 이오테크닉스 Warpage reduction device and method

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0715873B2 (en) * 1983-11-30 1995-02-22 株式会社東芝 Resist pattern formation method
JPS6119131A (en) * 1984-07-06 1986-01-28 Toshiba Corp Resist processor
JPS6428918A (en) * 1987-07-24 1989-01-31 Mitsubishi Electric Corp Resist baking device
JP3872535B2 (en) * 1996-03-14 2007-01-24 株式会社オーク製作所 Work charge erasing neutralization device
JP4380966B2 (en) * 2002-05-20 2009-12-09 富士フイルム株式会社 Photosensitive layer transfer method and apparatus
JP2004299850A (en) * 2003-03-31 2004-10-28 Dainippon Printing Co Ltd Processing method and processing device

Also Published As

Publication number Publication date
KR20070077784A (en) 2007-07-27
JP2007200993A (en) 2007-08-09
CN100505155C (en) 2009-06-24
TWI323483B (en) 2010-04-11
JP4537323B2 (en) 2010-09-01
CN101009209A (en) 2007-08-01
KR101299898B1 (en) 2013-08-23

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees