TW200802531A - Heat treatment unit, heat treatment method, and computer-readable recording medium - Google Patents
Heat treatment unit, heat treatment method, and computer-readable recording mediumInfo
- Publication number
- TW200802531A TW200802531A TW095144627A TW95144627A TW200802531A TW 200802531 A TW200802531 A TW 200802531A TW 095144627 A TW095144627 A TW 095144627A TW 95144627 A TW95144627 A TW 95144627A TW 200802531 A TW200802531 A TW 200802531A
- Authority
- TW
- Taiwan
- Prior art keywords
- heat treatment
- temperature
- computer
- recording medium
- readable recording
- Prior art date
Links
- 238000010438 heat treatment Methods 0.000 title abstract 9
- 238000000034 method Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 abstract 3
- 238000011144 upstream manufacturing Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Tunnel Furnaces (AREA)
- Photovoltaic Devices (AREA)
Abstract
Heat treatment unit 28 has the roller transportation mechanism 5 as the transportation path where the substrate G is transported to one direction and the heating mechanism 7 that heats the substrate G which are transported on the transportation path. As for the heating mechanism 7, a preheating part 7a and a main heating part 7b are arranged from the transportation direction upstream side along the transportation path. A main heating part 7b is set at the first temperature, and the preheating part 7a is set at the second temperature that is higher than the first temperature. After the substrate G is heated to the first temperature neighborhood in the preheating part 7a, the heating mechanism 7 is heated at the first temperature in a main heating part 7b.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005352131A JP4672538B2 (en) | 2005-12-06 | 2005-12-06 | Heat treatment device |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200802531A true TW200802531A (en) | 2008-01-01 |
TWI371777B TWI371777B (en) | 2012-09-01 |
Family
ID=38130874
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095144627A TWI371777B (en) | 2005-12-06 | 2006-12-01 | Heat treatment unit, heat treatment method, and computer-readable recording medium |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4672538B2 (en) |
KR (1) | KR101332120B1 (en) |
CN (1) | CN100454482C (en) |
TW (1) | TWI371777B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI557389B (en) * | 2014-10-24 | 2016-11-11 | Dong-Ming Li | Improvement of Heating Device of Light Resistance Pre - oven |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101464207B1 (en) * | 2008-05-30 | 2014-11-24 | 세메스 주식회사 | Flat panel display manufacturing apparatus and ir heater used in manufacturing flat panel display |
JP4592787B2 (en) * | 2008-07-11 | 2010-12-08 | 東京エレクトロン株式会社 | Substrate processing equipment |
JP4638931B2 (en) * | 2008-09-12 | 2011-02-23 | 東京エレクトロン株式会社 | Substrate processing equipment |
JP4813583B2 (en) * | 2009-07-15 | 2011-11-09 | 東京エレクトロン株式会社 | Substrate processing equipment |
JP2011222834A (en) * | 2010-04-12 | 2011-11-04 | Hoya Corp | Baking apparatus, method for forming resist pattern, method for manufacturing photo mask, and method for manufacturing mold for nanoimprint |
JP5063741B2 (en) * | 2010-06-03 | 2012-10-31 | 東京エレクトロン株式会社 | Heat treatment apparatus and heat treatment method |
JP5226037B2 (en) * | 2010-06-04 | 2013-07-03 | 東京エレクトロン株式会社 | Heat treatment apparatus and heat treatment method |
JP5048810B2 (en) * | 2010-06-23 | 2012-10-17 | 東京エレクトロン株式会社 | Heat treatment apparatus and heat treatment method |
JP5377463B2 (en) * | 2010-11-16 | 2013-12-25 | 東京エレクトロン株式会社 | Heat treatment device |
JP7403234B2 (en) * | 2019-04-25 | 2023-12-22 | 東京エレクトロン株式会社 | Substrate processing equipment and substrate processing method |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5875154A (en) * | 1981-10-29 | 1983-05-06 | Toppan Printing Co Ltd | Heater |
JPH0193121A (en) * | 1987-10-05 | 1989-04-12 | Kawasaki Steel Corp | Semiconductor wafer baking device |
JPS64738A (en) * | 1988-05-20 | 1989-01-05 | Hitachi Ltd | Heat treatment of semiconductor wafer |
JP2691907B2 (en) * | 1988-05-27 | 1997-12-17 | 東京エレクトロン株式会社 | Heating method, processing apparatus and processing method |
JP2931992B2 (en) * | 1990-06-02 | 1999-08-09 | 東京エレクトロン株式会社 | Heat treatment equipment |
JPH05304085A (en) * | 1992-04-27 | 1993-11-16 | Fujitsu Ltd | Semiconductor wafer baking device |
JPH07135154A (en) * | 1993-06-18 | 1995-05-23 | Hitachi Ltd | Method and device of baking photoresist film |
JP3052116B2 (en) * | 1994-10-26 | 2000-06-12 | 東京エレクトロン株式会社 | Heat treatment equipment |
JPH0953881A (en) * | 1995-08-11 | 1997-02-25 | Fuji Photo Film Co Ltd | Baking device of hard board |
JP3811247B2 (en) * | 1997-02-17 | 2006-08-16 | 大日本スクリーン製造株式会社 | Substrate heating device |
JP3596312B2 (en) * | 1998-10-27 | 2004-12-02 | 松下電器産業株式会社 | Heat treatment equipment |
JP4040814B2 (en) * | 1998-11-30 | 2008-01-30 | 株式会社小松製作所 | Disk heater and temperature control device |
JP4042244B2 (en) * | 1999-02-23 | 2008-02-06 | 松下電工株式会社 | Semiconductor microactuator, semiconductor microvalve, and semiconductor microrelay |
US20020088608A1 (en) * | 1999-07-26 | 2002-07-11 | Park Chan-Hoon | Method and apparatus for heating a wafer, and method and apparatus for baking a photoresist film on a wafer |
JP2001230199A (en) * | 1999-07-28 | 2001-08-24 | Komatsu Ltd | Temperature controller for semiconductor substrate and heat exchange plate |
US6344631B1 (en) * | 2001-05-11 | 2002-02-05 | Applied Materials, Inc. | Substrate support assembly and processing apparatus |
JP2003279245A (en) * | 2002-03-19 | 2003-10-02 | Seiko Epson Corp | Drying method and device for coating film, manufacturing method for device, and device |
WO2004010480A1 (en) * | 2002-07-24 | 2004-01-29 | Applied Materials, Inc. | Apparatus and method for thermally isolating a heat chamber |
JP4384538B2 (en) * | 2003-06-16 | 2009-12-16 | 東京エレクトロン株式会社 | Substrate processing apparatus and substrate processing method |
JP4257586B2 (en) * | 2003-10-20 | 2009-04-22 | 富士電機システムズ株式会社 | Substrate processing method |
JP4741307B2 (en) * | 2005-05-20 | 2011-08-03 | 富士フイルム株式会社 | Heating apparatus and heating method |
-
2005
- 2005-12-06 JP JP2005352131A patent/JP4672538B2/en active Active
-
2006
- 2006-12-01 TW TW095144627A patent/TWI371777B/en not_active IP Right Cessation
- 2006-12-05 KR KR1020060122100A patent/KR101332120B1/en active IP Right Grant
- 2006-12-06 CN CNB2006101633986A patent/CN100454482C/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI557389B (en) * | 2014-10-24 | 2016-11-11 | Dong-Ming Li | Improvement of Heating Device of Light Resistance Pre - oven |
Also Published As
Publication number | Publication date |
---|---|
CN100454482C (en) | 2009-01-21 |
JP4672538B2 (en) | 2011-04-20 |
KR101332120B1 (en) | 2013-11-21 |
JP2007158088A (en) | 2007-06-21 |
TWI371777B (en) | 2012-09-01 |
KR20070059990A (en) | 2007-06-12 |
CN1979764A (en) | 2007-06-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |