TWI371777B - Heat treatment unit, heat treatment method, and computer-readable recording medium - Google Patents
Heat treatment unit, heat treatment method, and computer-readable recording mediumInfo
- Publication number
- TWI371777B TWI371777B TW095144627A TW95144627A TWI371777B TW I371777 B TWI371777 B TW I371777B TW 095144627 A TW095144627 A TW 095144627A TW 95144627 A TW95144627 A TW 95144627A TW I371777 B TWI371777 B TW I371777B
- Authority
- TW
- Taiwan
- Prior art keywords
- heat treatment
- computer
- recording medium
- readable recording
- treatment method
- Prior art date
Links
- 238000010438 heat treatment Methods 0.000 title 2
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Tunnel Furnaces (AREA)
- Photovoltaic Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005352131A JP4672538B2 (en) | 2005-12-06 | 2005-12-06 | Heat treatment device |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200802531A TW200802531A (en) | 2008-01-01 |
TWI371777B true TWI371777B (en) | 2012-09-01 |
Family
ID=38130874
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW095144627A TWI371777B (en) | 2005-12-06 | 2006-12-01 | Heat treatment unit, heat treatment method, and computer-readable recording medium |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4672538B2 (en) |
KR (1) | KR101332120B1 (en) |
CN (1) | CN100454482C (en) |
TW (1) | TWI371777B (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101464207B1 (en) * | 2008-05-30 | 2014-11-24 | 세메스 주식회사 | Flat panel display manufacturing apparatus and ir heater used in manufacturing flat panel display |
JP4592787B2 (en) * | 2008-07-11 | 2010-12-08 | 東京エレクトロン株式会社 | Substrate processing equipment |
JP4638931B2 (en) * | 2008-09-12 | 2011-02-23 | 東京エレクトロン株式会社 | Substrate processing equipment |
JP4813583B2 (en) * | 2009-07-15 | 2011-11-09 | 東京エレクトロン株式会社 | Substrate processing equipment |
JP2011222834A (en) * | 2010-04-12 | 2011-11-04 | Hoya Corp | Baking apparatus, method for forming resist pattern, method for manufacturing photo mask, and method for manufacturing mold for nanoimprint |
JP5063741B2 (en) * | 2010-06-03 | 2012-10-31 | 東京エレクトロン株式会社 | Heat treatment apparatus and heat treatment method |
JP5226037B2 (en) * | 2010-06-04 | 2013-07-03 | 東京エレクトロン株式会社 | Heat treatment apparatus and heat treatment method |
JP5048810B2 (en) * | 2010-06-23 | 2012-10-17 | 東京エレクトロン株式会社 | Heat treatment apparatus and heat treatment method |
JP5377463B2 (en) * | 2010-11-16 | 2013-12-25 | 東京エレクトロン株式会社 | Heat treatment device |
TWI557389B (en) * | 2014-10-24 | 2016-11-11 | Dong-Ming Li | Improvement of Heating Device of Light Resistance Pre - oven |
JP7403234B2 (en) * | 2019-04-25 | 2023-12-22 | 東京エレクトロン株式会社 | Substrate processing equipment and substrate processing method |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5875154A (en) * | 1981-10-29 | 1983-05-06 | Toppan Printing Co Ltd | Heater |
JPH0193121A (en) * | 1987-10-05 | 1989-04-12 | Kawasaki Steel Corp | Semiconductor wafer baking device |
JPS64738A (en) * | 1988-05-20 | 1989-01-05 | Hitachi Ltd | Heat treatment of semiconductor wafer |
JP2691907B2 (en) * | 1988-05-27 | 1997-12-17 | 東京エレクトロン株式会社 | Heating method, processing apparatus and processing method |
JP2931992B2 (en) * | 1990-06-02 | 1999-08-09 | 東京エレクトロン株式会社 | Heat treatment equipment |
JPH05304085A (en) * | 1992-04-27 | 1993-11-16 | Fujitsu Ltd | Semiconductor wafer baking device |
JPH07135154A (en) * | 1993-06-18 | 1995-05-23 | Hitachi Ltd | Method and device of baking photoresist film |
JP3052116B2 (en) * | 1994-10-26 | 2000-06-12 | 東京エレクトロン株式会社 | Heat treatment equipment |
JPH0953881A (en) * | 1995-08-11 | 1997-02-25 | Fuji Photo Film Co Ltd | Baking device of hard board |
JP3811247B2 (en) * | 1997-02-17 | 2006-08-16 | 大日本スクリーン製造株式会社 | Substrate heating device |
JP3596312B2 (en) * | 1998-10-27 | 2004-12-02 | 松下電器産業株式会社 | Heat treatment equipment |
JP4040814B2 (en) * | 1998-11-30 | 2008-01-30 | 株式会社小松製作所 | Disk heater and temperature control device |
JP4042244B2 (en) * | 1999-02-23 | 2008-02-06 | 松下電工株式会社 | Semiconductor microactuator, semiconductor microvalve, and semiconductor microrelay |
US20020088608A1 (en) * | 1999-07-26 | 2002-07-11 | Park Chan-Hoon | Method and apparatus for heating a wafer, and method and apparatus for baking a photoresist film on a wafer |
JP2001230199A (en) * | 1999-07-28 | 2001-08-24 | Komatsu Ltd | Temperature controller for semiconductor substrate and heat exchange plate |
US6344631B1 (en) * | 2001-05-11 | 2002-02-05 | Applied Materials, Inc. | Substrate support assembly and processing apparatus |
JP2003279245A (en) * | 2002-03-19 | 2003-10-02 | Seiko Epson Corp | Drying method and device for coating film, manufacturing method for device, and device |
WO2004010480A1 (en) * | 2002-07-24 | 2004-01-29 | Applied Materials, Inc. | Apparatus and method for thermally isolating a heat chamber |
JP4384538B2 (en) * | 2003-06-16 | 2009-12-16 | 東京エレクトロン株式会社 | Substrate processing apparatus and substrate processing method |
JP4257586B2 (en) * | 2003-10-20 | 2009-04-22 | 富士電機システムズ株式会社 | Substrate processing method |
JP4741307B2 (en) * | 2005-05-20 | 2011-08-03 | 富士フイルム株式会社 | Heating apparatus and heating method |
-
2005
- 2005-12-06 JP JP2005352131A patent/JP4672538B2/en active Active
-
2006
- 2006-12-01 TW TW095144627A patent/TWI371777B/en not_active IP Right Cessation
- 2006-12-05 KR KR1020060122100A patent/KR101332120B1/en active IP Right Grant
- 2006-12-06 CN CNB2006101633986A patent/CN100454482C/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN100454482C (en) | 2009-01-21 |
JP4672538B2 (en) | 2011-04-20 |
KR101332120B1 (en) | 2013-11-21 |
TW200802531A (en) | 2008-01-01 |
JP2007158088A (en) | 2007-06-21 |
KR20070059990A (en) | 2007-06-12 |
CN1979764A (en) | 2007-06-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |