TWI305383B - Method for fabricating a nitrided silicon-oxide gate dielectric - Google Patents

Method for fabricating a nitrided silicon-oxide gate dielectric Download PDF

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Publication number
TWI305383B
TWI305383B TW093125245A TW93125245A TWI305383B TW I305383 B TWI305383 B TW I305383B TW 093125245 A TW093125245 A TW 093125245A TW 93125245 A TW93125245 A TW 93125245A TW I305383 B TWI305383 B TW I305383B
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TW
Taiwan
Prior art keywords
nitrogen
layer
gas
substrate
mixture
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Application number
TW093125245A
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English (en)
Chinese (zh)
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TW200514164A (en
Inventor
Jay S Burnham
James S Nakos
James J Quinlivan
Bernie Roque Jr
Steven M Shank
Beth A Ward
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Ibm
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Publication of TW200514164A publication Critical patent/TW200514164A/zh
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Publication of TWI305383B publication Critical patent/TWI305383B/zh

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    • H10P14/60
    • H10P14/6927
    • H10D64/01344
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/60Electrodes characterised by their materials
    • H10D64/66Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
    • H10D64/68Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator
    • H10D64/693Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator the insulator comprising nitrogen, e.g. nitrides, oxynitrides or nitrogen-doped materials
    • H10P10/00
    • H10P14/6526
    • H10P14/6532
    • H10D64/01306
    • H10P14/6336
    • H10P14/69433

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  • Formation Of Insulating Films (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Thin Film Transistor (AREA)
TW093125245A 2003-08-26 2004-08-20 Method for fabricating a nitrided silicon-oxide gate dielectric TWI305383B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/604,905 US7291568B2 (en) 2003-08-26 2003-08-26 Method for fabricating a nitrided silicon-oxide gate dielectric

Publications (2)

Publication Number Publication Date
TW200514164A TW200514164A (en) 2005-04-16
TWI305383B true TWI305383B (en) 2009-01-11

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Family Applications (1)

Application Number Title Priority Date Filing Date
TW093125245A TWI305383B (en) 2003-08-26 2004-08-20 Method for fabricating a nitrided silicon-oxide gate dielectric

Country Status (7)

Country Link
US (2) US7291568B2 (enExample)
EP (1) EP1661163A4 (enExample)
JP (1) JP4617306B2 (enExample)
KR (1) KR100843496B1 (enExample)
CN (1) CN1894781B (enExample)
TW (1) TWI305383B (enExample)
WO (1) WO2005020291A2 (enExample)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060275975A1 (en) * 2005-06-01 2006-12-07 Matt Yeh Nitridated gate dielectric layer
US7429538B2 (en) * 2005-06-27 2008-09-30 Applied Materials, Inc. Manufacturing method for two-step post nitridation annealing of plasma nitrided gate dielectric
US20070049048A1 (en) * 2005-08-31 2007-03-01 Shahid Rauf Method and apparatus for improving nitrogen profile during plasma nitridation
KR100718835B1 (ko) 2005-09-13 2007-05-16 삼성전자주식회사 반도체 모스 트랜지스터와 그 제조 방법
JP5070702B2 (ja) * 2006-01-19 2012-11-14 富士通セミコンダクター株式会社 半導体装置の製造方法及び製造装置
US7737050B2 (en) * 2006-10-30 2010-06-15 International Business Machines Corporation Method of fabricating a nitrided silicon oxide gate dielectric layer
US20080200039A1 (en) * 2007-02-16 2008-08-21 United Microelectronics Corp. Nitridation process
US20090209854A1 (en) * 2008-02-19 2009-08-20 Parihar Shailendra K Biopsy method
KR101008994B1 (ko) * 2009-05-13 2011-01-17 주식회사 하이닉스반도체 듀얼 폴리 게이트의 산화막 형성 방법
US20110071391A1 (en) * 2009-09-24 2011-03-24 Speeg Trevor W V Biopsy marker delivery device with positioning component
JP5920684B2 (ja) * 2010-02-10 2016-05-18 株式会社東芝 半導体装置
US20110218433A1 (en) * 2010-03-02 2011-09-08 Speeg Trevor W V Biopsy Marker Delivery Device
US8450221B2 (en) * 2010-08-04 2013-05-28 Texas Instruments Incorporated Method of forming MOS transistors including SiON gate dielectric with enhanced nitrogen concentration at its sidewalls
CN102486999A (zh) * 2010-12-01 2012-06-06 中芯国际集成电路制造(北京)有限公司 栅极氧化层的形成方法
WO2012102756A1 (en) 2011-01-25 2012-08-02 Applied Materials, Inc. Floating gates and methods of formation
FR2974446A1 (fr) * 2011-04-19 2012-10-26 St Microelectronics Crolles 2 Procédé de réalisation de l'isolant de grille d'un transistor mos
US10049881B2 (en) 2011-08-10 2018-08-14 Applied Materials, Inc. Method and apparatus for selective nitridation process
JP2013084918A (ja) 2011-09-27 2013-05-09 Hitachi Kokusai Electric Inc 基板処理装置、半導体装置の製造方法及びプログラム
US8741785B2 (en) * 2011-10-27 2014-06-03 Applied Materials, Inc. Remote plasma radical treatment of silicon oxide
WO2013074369A1 (en) * 2011-11-15 2013-05-23 Applied Materials, Inc. Method and apparatus for selective nitridation process
TWI492343B (zh) * 2012-11-02 2015-07-11 矽品精密工業股份有限公司 半導體基板及其製法
US9006064B2 (en) * 2013-03-11 2015-04-14 International Business Machines Corporation Multi-plasma nitridation process for a gate dielectric
JPWO2014196107A1 (ja) * 2013-06-04 2017-02-23 株式会社Joled 薄膜トランジスタ素子とその製造方法及び表示装置
JP2016111294A (ja) * 2014-12-10 2016-06-20 住友電気工業株式会社 半導体受光素子を作製する方法
US10509008B2 (en) 2015-04-29 2019-12-17 Taiwan Semiconductor Manufacturing Co., Ltd. Biological device and biosensing method thereof
CN109473439A (zh) * 2018-11-16 2019-03-15 上海华力微电子有限公司 一种sonos存储器件制备的集成工艺
CN113808939B (zh) * 2020-06-15 2023-09-22 长鑫存储技术有限公司 二氧化硅薄膜的形成方法和金属栅极的形成方法
WO2022187299A1 (en) * 2021-03-04 2022-09-09 Applied Materials, Inc. Treatments to improve device performance
CN115602537A (zh) * 2021-07-08 2023-01-13 长鑫存储技术有限公司(Cn) 半导体结构及其制备方法
JP2024125810A (ja) * 2023-03-06 2024-09-19 東京エレクトロン株式会社 酸化膜を還元する方法、装置、及び基板を処理するシステム

Family Cites Families (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0072603B1 (en) * 1978-06-14 1986-10-01 Fujitsu Limited Process for producing a semiconductor device having an insulating layer of silicon dioxide covered by a film of silicon oxynitride
US4510172A (en) * 1984-05-29 1985-04-09 International Business Machines Corporation Technique for thin insulator growth
US4762728A (en) * 1985-04-09 1988-08-09 Fairchild Semiconductor Corporation Low temperature plasma nitridation process and applications of nitride films formed thereby
US4715937A (en) * 1986-05-05 1987-12-29 The Board Of Trustees Of The Leland Stanford Junior University Low-temperature direct nitridation of silicon in nitrogen plasma generated by microwave discharge
US5219773A (en) 1990-06-26 1993-06-15 Massachusetts Institute Of Technology Method of making reoxidized nitrided oxide MOSFETs
JP2652108B2 (ja) 1991-09-05 1997-09-10 三菱電機株式会社 電界効果トランジスタおよびその製造方法
US5726087A (en) 1992-04-30 1998-03-10 Motorola, Inc. Method of formation of semiconductor gate dielectric
US5445999A (en) 1992-11-13 1995-08-29 Micron Technology, Inc. Advanced technique to improve the bonding arrangement on silicon surfaces to promote uniform nitridation
US5596218A (en) 1993-10-18 1997-01-21 Digital Equipment Corporation Hot carrier-hard gate oxides by nitrogen implantation before gate oxidation
JP3963961B2 (ja) * 1994-08-31 2007-08-22 株式会社半導体エネルギー研究所 半導体装置の作製方法
US6136654A (en) * 1996-06-07 2000-10-24 Texas Instruments Incorporated Method of forming thin silicon nitride or silicon oxynitride gate dielectrics
US5926730A (en) * 1997-02-19 1999-07-20 Micron Technology, Inc. Conductor layer nitridation
JPH10313114A (ja) 1997-05-14 1998-11-24 Nec Corp 半導体装置の製造方法
JP3222404B2 (ja) * 1997-06-20 2001-10-29 科学技術振興事業団 半導体基板表面の絶縁膜の形成方法及びその形成装置
US6200651B1 (en) 1997-06-30 2001-03-13 Lam Research Corporation Method of chemical vapor deposition in a vacuum plasma processor responsive to a pulsed microwave source
US6013553A (en) 1997-07-24 2000-01-11 Texas Instruments Incorporated Zirconium and/or hafnium oxynitride gate dielectric
US6399445B1 (en) 1997-12-18 2002-06-04 Texas Instruments Incorporated Fabrication technique for controlled incorporation of nitrogen in gate dielectric
US6140024A (en) * 1997-12-31 2000-10-31 Texas Instruments Incorporated Remote plasma nitridation for contact etch stop
TW419732B (en) * 1998-07-15 2001-01-21 Texas Instruments Inc A method for gate-stack formation including a high-k dielectric
JP2000164870A (ja) * 1998-09-24 2000-06-16 Toshiba Corp 半導体装置及びその製造方法
US6114258A (en) 1998-10-19 2000-09-05 Applied Materials, Inc. Method of oxidizing a substrate in the presence of nitride and oxynitride films
US6380056B1 (en) 1998-10-23 2002-04-30 Taiwan Semiconductor Manufacturing Company Lightly nitridation surface for preparing thin-gate oxides
US6228779B1 (en) * 1998-11-06 2001-05-08 Novellus Systems, Inc. Ultra thin oxynitride and nitride/oxide stacked gate dielectrics fabricated by high pressure technology
US6450116B1 (en) * 1999-04-22 2002-09-17 Applied Materials, Inc. Apparatus for exposing a substrate to plasma radicals
TW410382B (en) * 1999-06-11 2000-11-01 United Microelectronics Corp Method of manufacturing forming metal oxide semiconductor transistor with raised source/drain
JP2001044419A (ja) * 1999-07-14 2001-02-16 Texas Instr Inc <Ti> 高k誘電体を有するゲート積層の形成方法
US7125768B2 (en) * 1999-08-25 2006-10-24 Micron Technology, Inc. Method for reducing single bit data loss in a memory circuit
US6171911B1 (en) 1999-09-13 2001-01-09 Taiwan Semiconductor Manufacturing Company Method for forming dual gate oxides on integrated circuits with advanced logic devices
JP2001168323A (ja) 1999-12-06 2001-06-22 Mitsubishi Electric Corp 半導体装置の製造方法
TW520453B (en) * 1999-12-27 2003-02-11 Seiko Epson Corp A method to fabricate thin insulating films
US6413881B1 (en) * 2000-03-09 2002-07-02 Lsi Logic Corporation Process for forming thin gate oxide with enhanced reliability by nitridation of upper surface of gate of oxide to form barrier of nitrogen atoms in upper surface region of gate oxide, and resulting product
TW466606B (en) 2000-04-20 2001-12-01 United Microelectronics Corp Manufacturing method for dual metal gate electrode
US6649543B1 (en) * 2000-06-22 2003-11-18 Micron Technology, Inc. Methods of forming silicon nitride, methods of forming transistor devices, and transistor devices
US6380104B1 (en) * 2000-08-10 2002-04-30 Taiwan Semiconductor Manufacturing Company Method for forming composite gate dielectric layer equivalent to silicon oxide gate dielectric layer
US6800830B2 (en) * 2000-08-18 2004-10-05 Hitachi Kokusai Electric, Inc. Chemistry for boron diffusion barrier layer and method of application in semiconductor device fabrication
US6933248B2 (en) * 2000-10-19 2005-08-23 Texas Instruments Incorporated Method for transistor gate dielectric layer with uniform nitrogen concentration
US6610615B1 (en) * 2000-11-15 2003-08-26 Intel Corporation Plasma nitridation for reduced leakage gate dielectric layers
US20040142577A1 (en) 2001-01-22 2004-07-22 Takuya Sugawara Method for producing material of electronic device
JP4535629B2 (ja) * 2001-02-21 2010-09-01 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
US6893979B2 (en) * 2001-03-15 2005-05-17 International Business Machines Corporation Method for improved plasma nitridation of ultra thin gate dielectrics
US6596570B2 (en) * 2001-06-06 2003-07-22 International Business Machines Corporation SOI device with reduced junction capacitance
JP4369091B2 (ja) * 2001-07-18 2009-11-18 東京エレクトロン株式会社 基板処理方法
JP2003060198A (ja) * 2001-08-10 2003-02-28 Matsushita Electric Ind Co Ltd 半導体装置及びその製造方法
US6555485B1 (en) * 2002-01-28 2003-04-29 United Microelectronics Corp. Method for fabricating a gate dielectric layer
JP4035600B2 (ja) 2002-05-22 2008-01-23 国立大学法人 東京大学 イマチニブに対する感受性の判定方法
JP2006505954A (ja) * 2002-11-08 2006-02-16 アヴィザ テクノロジー インコーポレイテッド 高k誘電体の窒化物形成
DE10255936B4 (de) * 2002-11-29 2005-12-29 Advanced Micro Devices, Inc., Sunnyvale Verfahren zur Herstellung einer Isolationsschicht und Verfahren zum Steuern einer Stickstoffkonzentration während der Herstellung der Isolationsschicht
US6962873B1 (en) * 2002-12-10 2005-11-08 Novellus Systems, Inc. Nitridation of electrolessly deposited cobalt
US6821868B2 (en) * 2002-12-27 2004-11-23 Taiwan Semiconductor Manufacturing Co., Ltd. Method of forming nitrogen enriched gate dielectric with low effective oxide thickness
US6906398B2 (en) * 2003-01-02 2005-06-14 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor chip with gate dielectrics for high-performance and low-leakage applications
US6821833B1 (en) * 2003-09-09 2004-11-23 International Business Machines Corporation Method for separately optimizing thin gate dielectric of PMOS and NMOS transistors within the same semiconductor chip and device manufactured thereby

Also Published As

Publication number Publication date
TW200514164A (en) 2005-04-16
CN1894781B (zh) 2010-05-05
US8709887B2 (en) 2014-04-29
KR100843496B1 (ko) 2008-07-04
WO2005020291A3 (en) 2006-05-18
EP1661163A2 (en) 2006-05-31
WO2005020291A2 (en) 2005-03-03
JP4617306B2 (ja) 2011-01-26
EP1661163A4 (en) 2008-08-06
JP2007504652A (ja) 2007-03-01
CN1894781A (zh) 2007-01-10
US7291568B2 (en) 2007-11-06
US20050048705A1 (en) 2005-03-03
KR20060066069A (ko) 2006-06-15
US20080014692A1 (en) 2008-01-17

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