JP2016111294A - 半導体受光素子を作製する方法 - Google Patents
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 185
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 39
- 238000000034 method Methods 0.000 title claims abstract description 34
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 89
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 87
- 239000000758 substrate Substances 0.000 claims abstract description 87
- 239000010703 silicon Substances 0.000 claims abstract description 86
- 150000001875 compounds Chemical class 0.000 claims abstract description 47
- 238000002161 passivation Methods 0.000 claims abstract description 44
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 29
- 239000001301 oxygen Substances 0.000 claims abstract description 29
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 27
- 239000000470 constituent Substances 0.000 claims abstract description 22
- 238000005530 etching Methods 0.000 claims abstract description 12
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910052733 gallium Inorganic materials 0.000 claims abstract description 11
- 229910000077 silane Inorganic materials 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 14
- -1 silane compound Chemical class 0.000 claims description 14
- 229910005542 GaSb Inorganic materials 0.000 claims description 12
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 8
- 229910000673 Indium arsenide Inorganic materials 0.000 claims description 6
- RPQDHPTXJYYUPQ-UHFFFAOYSA-N indium arsenide Chemical compound [In]#[As] RPQDHPTXJYYUPQ-UHFFFAOYSA-N 0.000 claims description 6
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 claims description 5
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 5
- 230000008569 process Effects 0.000 abstract description 14
- 229910052787 antimony Inorganic materials 0.000 abstract description 5
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 abstract description 5
- 230000015572 biosynthetic process Effects 0.000 description 25
- 150000001282 organosilanes Chemical class 0.000 description 10
- 239000007789 gas Substances 0.000 description 8
- 230000003647 oxidation Effects 0.000 description 7
- 238000007254 oxidation reaction Methods 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 6
- 229910052581 Si3N4 Inorganic materials 0.000 description 5
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 5
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 150000003377 silicon compounds Chemical class 0.000 description 4
- 229910021417 amorphous silicon Inorganic materials 0.000 description 3
- 229910052785 arsenic Inorganic materials 0.000 description 3
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 238000001312 dry etching Methods 0.000 description 3
- 229910052738 indium Inorganic materials 0.000 description 3
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 3
- 239000011259 mixed solution Substances 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 150000002927 oxygen compounds Chemical class 0.000 description 3
- 239000000376 reactant Substances 0.000 description 3
- 235000012239 silicon dioxide Nutrition 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 238000004528 spin coating Methods 0.000 description 3
- 229910021642 ultra pure water Inorganic materials 0.000 description 3
- 239000012498 ultrapure water Substances 0.000 description 3
- 238000007740 vapor deposition Methods 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 description 2
- GQPLMRYTRLFLPF-UHFFFAOYSA-N Nitrous Oxide Chemical compound [O-][N+]#N GQPLMRYTRLFLPF-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000011835 investigation Methods 0.000 description 2
- 230000031700 light absorption Effects 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 150000002894 organic compounds Chemical class 0.000 description 2
- 239000012071 phase Substances 0.000 description 2
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 125000000123 silicon containing inorganic group Chemical group 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910002656 O–Si–O Inorganic materials 0.000 description 1
- 229910003902 SiCl 4 Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000006664 bond formation reaction Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- WPYVAWXEWQSOGY-UHFFFAOYSA-N indium antimonide Chemical compound [Sb]#[In] WPYVAWXEWQSOGY-UHFFFAOYSA-N 0.000 description 1
- 238000009616 inductively coupled plasma Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000001451 molecular beam epitaxy Methods 0.000 description 1
- 239000001272 nitrous oxide Substances 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000000927 vapour-phase epitaxy Methods 0.000 description 1
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- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/184—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof the active layers comprising only AIIIBV compounds, e.g. GaAs, InP
-
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- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
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- H01L31/0352—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
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Abstract
Description
基板11及び半導体積層13を含むエピタキシャル基板EPの一例。
基板11:p型GaSb基板。
第1導電型化合物半導体層17:InAs。
半導体層15の超格子構造21(繰り返し数:100層〜500層)。
第1III−V化合物半導体層21a:GaSb(厚さ1nm〜5nm)。
第2III−V化合物半導体層21b:InAs(厚さ1nm〜5nm)。
第2導電型化合物半導体層19:GaSb。
超格子構造21は、上記の組み合わせのGaSb/InAsに限定されることなく、InGaAs/GaAsSb等であることができる。半導体積層13の厚さは例えば3〜7マイクロメートルである。また、基板11が導電性を有するときは、半導体積層13は、第2導電型化合物半導体層19を含まなくても良い。
一実施例における条件は以下のものである。
基板温度:摂氏150度。
チャンバの圧力:1.7Torr。
SiH4の流量:5sccm。
処理時間:5秒。
成膜レート:10nm/分。
この処理により、約1nmの厚さのSi膜が形成され、このSi膜の屈折率は2.2〜3.9である。
Claims (6)
- 半導体受光素子を作製する方法であって、
基板の主面上に設けられた半導体積層上のマスクを用いて前記半導体積層をエッチングして、半導体受光素子のための半導体メサを備える基板生産物を形成する工程と、
無機シラン系化合物及び有機シラン系化合物の少なくともいずれかを含むシリコン源を、該シリコン源とは別に酸素源を供給することなく、前記基板生産物に供給して、前記シリコン源からのシリコンを備える堆積物を前記基板生産物上に形成する工程と、
前記堆積物を前記基板生産物上に形成した後に、パッシベーション膜を前記基板生産物上に成長する工程と、
を備え、
前記半導体メサは、超格子構造を有する受光層を含み、
前記超格子構造は、構成元素としてガリウムを含む第1III−V化合物半導体層と、該第1III−V化合物半導体層の材料と異なる第2III−V化合物半導体層とを含む、半導体受光素子を作製する方法。 - 堆積物を前記基板生産物上に形成する前記工程では、前記シリコン源のプラズマの生成、前記シリコン源の塗布、及び前記シリコン源の雰囲気の適用のいずれかが行われる、請求項1に記載された半導体受光素子を作製する方法。
- 前記シリコン源は、SiH4及びSi2H6の少なくともいずれかを含む、請求項1又は請求項2に記載された半導体受光素子を作製する方法。
- 前記シリコン源は、テトラエトキシシランを含む、請求項1〜請求項3のいずれか一項に記載された半導体受光素子を作製する方法。
- 前記パッシベーション膜は、シリコン酸化物、シリコン酸窒化物、及びアルミニウム酸化物の少なくともいずれかを備える、請求項1〜請求項4のいずれか一項に記載された半導体受光素子を作製する方法。
- 前記超格子構造は、GaSb/InAsを備える、請求項1〜請求項5のいずれか一項に記載された半導体受光素子を作製する方法。
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JP2018113407A (ja) * | 2017-01-13 | 2018-07-19 | 富士通株式会社 | 半導体結晶基板、赤外線検出装置、光半導体装置、熱電変換素子、半導体結晶基板の製造方法及び赤外線検出装置の製造方法 |
WO2021187055A1 (ja) * | 2020-03-17 | 2021-09-23 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像装置及び電子機器 |
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JP6459460B2 (ja) * | 2014-12-10 | 2019-01-30 | 住友電気工業株式会社 | 半導体受光素子を作製する方法 |
JP6720710B2 (ja) * | 2016-06-14 | 2020-07-08 | 住友電気工業株式会社 | 赤外線検知素子 |
WO2020123161A1 (en) * | 2018-12-14 | 2020-06-18 | Flir Commercial Systems, Inc. | Superlattice-based detector systems and methods |
US11495707B2 (en) * | 2020-04-17 | 2022-11-08 | Changchun Institute Of Optics, Fine Mechanics And Physics, Chinese Academy Of Sciences | AlGaN unipolar carrier solar-blind ultraviolet detector and manufacturing method thereof |
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