TWI279876B - Substrate support, load-lock chamber for transferring substrates and methods for aligning a substrate on a substrate support - Google Patents
Substrate support, load-lock chamber for transferring substrates and methods for aligning a substrate on a substrate support Download PDFInfo
- Publication number
- TWI279876B TWI279876B TW092103577A TW92103577A TWI279876B TW I279876 B TWI279876 B TW I279876B TW 092103577 A TW092103577 A TW 092103577A TW 92103577 A TW92103577 A TW 92103577A TW I279876 B TWI279876 B TW I279876B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- axis
- rotating shaft
- push
- edge
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 201
- 238000000034 method Methods 0.000 title claims abstract description 29
- 230000007246 mechanism Effects 0.000 claims abstract description 90
- 238000001816 cooling Methods 0.000 claims abstract description 35
- 230000037452 priming Effects 0.000 claims description 8
- 238000006073 displacement reaction Methods 0.000 claims 1
- 238000002955 isolation Methods 0.000 description 27
- 238000009413 insulation Methods 0.000 description 8
- 230000015654 memory Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 238000000151 deposition Methods 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 230000013011 mating Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 229920002313 fluoropolymer Polymers 0.000 description 2
- 239000004811 fluoropolymer Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 244000025254 Cannabis sativa Species 0.000 description 1
- 235000012766 Cannabis sativa ssp. sativa var. sativa Nutrition 0.000 description 1
- 235000012765 Cannabis sativa ssp. sativa var. spontanea Nutrition 0.000 description 1
- 241000196324 Embryophyta Species 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 235000009120 camo Nutrition 0.000 description 1
- 235000005607 chanvre indien Nutrition 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- YBMRDBCBODYGJE-UHFFFAOYSA-N germanium oxide Inorganic materials O=[Ge]=O YBMRDBCBODYGJE-UHFFFAOYSA-N 0.000 description 1
- 239000013529 heat transfer fluid Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011487 hemp Substances 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- PVADDRMAFCOOPC-UHFFFAOYSA-N oxogermanium Chemical compound [Ge]=O PVADDRMAFCOOPC-UHFFFAOYSA-N 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 231100000241 scar Toxicity 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/136—Associated with semiconductor wafer handling including wafer orienting means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/084,762 US6824343B2 (en) | 2002-02-22 | 2002-02-22 | Substrate support |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200305245A TW200305245A (en) | 2003-10-16 |
| TWI279876B true TWI279876B (en) | 2007-04-21 |
Family
ID=27753531
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW092103577A TWI279876B (en) | 2002-02-22 | 2003-02-20 | Substrate support, load-lock chamber for transferring substrates and methods for aligning a substrate on a substrate support |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US6824343B2 (enExample) |
| EP (1) | EP1485946B1 (enExample) |
| JP (1) | JP4290561B2 (enExample) |
| KR (1) | KR100636491B1 (enExample) |
| CN (1) | CN100413017C (enExample) |
| TW (1) | TWI279876B (enExample) |
| WO (1) | WO2003073479A1 (enExample) |
Families Citing this family (46)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6824343B2 (en) * | 2002-02-22 | 2004-11-30 | Applied Materials, Inc. | Substrate support |
| CA2527342A1 (en) * | 2003-06-05 | 2004-12-16 | Bioprocessors Corp. | System and method for process automation |
| DE102004036435B4 (de) * | 2003-08-07 | 2007-08-30 | Nanophotonics Ag | Haltevorrichtung für scheibenförmige Objekte |
| US7207766B2 (en) * | 2003-10-20 | 2007-04-24 | Applied Materials, Inc. | Load lock chamber for large area substrate processing system |
| US20050160992A1 (en) * | 2004-01-28 | 2005-07-28 | Applied Materials, Inc. | Substrate gripping apparatus |
| US7018161B2 (en) * | 2004-06-18 | 2006-03-28 | Blueprint Automation B.V. | Suction head |
| US7144813B2 (en) * | 2004-11-12 | 2006-12-05 | Semitool, Inc. | Method and apparatus for thermally processing microelectronic workpieces |
| US7440091B2 (en) * | 2004-10-26 | 2008-10-21 | Applied Materials, Inc. | Sensors for dynamically detecting substrate breakage and misalignment of a moving substrate |
| US7547181B2 (en) * | 2004-11-15 | 2009-06-16 | Dainippon Screen Mfg. Co., Ltd. | Substrate position correcting method and apparatus using either substrate radius or center of rotation correction adjustment sum |
| KR100710598B1 (ko) * | 2004-12-08 | 2007-04-24 | 주식회사 에이디피엔지니어링 | 평판표시소자 제조장치 |
| KR20070013134A (ko) | 2005-07-25 | 2007-01-30 | 삼성전자주식회사 | 표시장치용 기판의 제조장치 및 제조방법 |
| KR100749755B1 (ko) * | 2006-02-10 | 2007-08-16 | 주식회사 싸이맥스 | 웨이퍼 처리장치 |
| JP4098338B2 (ja) * | 2006-07-20 | 2008-06-11 | 川崎重工業株式会社 | ウェハ移載装置および基板移載装置 |
| KR100829923B1 (ko) * | 2006-08-30 | 2008-05-16 | 세메스 주식회사 | 스핀헤드 및 이를 이용하는 기판처리방법 |
| CN101563769B (zh) * | 2006-12-14 | 2012-07-18 | 凯思捷股份有限公司 | 圆板保持装置及缺陷异物检测装置 |
| US20080203083A1 (en) * | 2007-02-28 | 2008-08-28 | Wirth Paul Z | Single wafer anneal processor |
| US8234771B2 (en) * | 2007-03-21 | 2012-08-07 | General Electric Company | Method and system for machining an array of components |
| CN101663744B (zh) * | 2007-04-23 | 2012-08-15 | 株式会社爱发科 | 支撑部件以及托架和支撑方法 |
| US20090029502A1 (en) * | 2007-07-24 | 2009-01-29 | Applied Materials, Inc. | Apparatuses and methods of substrate temperature control during thin film solar manufacturing |
| US8276959B2 (en) | 2008-08-08 | 2012-10-02 | Applied Materials, Inc. | Magnetic pad for end-effectors |
| KR101111399B1 (ko) * | 2009-02-09 | 2012-02-24 | 주식회사 싸이맥스 | 웨이퍼 전달 및 열처리가 동시에 수행되는 로드락 챔버 |
| JP5501688B2 (ja) * | 2009-07-30 | 2014-05-28 | 東京エレクトロン株式会社 | 基板位置合わせ機構、それを用いた真空予備室および基板処理システム |
| KR20110019511A (ko) * | 2009-08-20 | 2011-02-28 | 삼성전자주식회사 | 매거진의 로킹 장치 |
| JP5258981B2 (ja) | 2010-02-05 | 2013-08-07 | 東京エレクトロン株式会社 | 基板保持具及び基板搬送装置及び基板処理装置 |
| KR101013019B1 (ko) * | 2010-06-21 | 2011-02-14 | 김정태 | 웨이퍼 이송 시스템 및 이송 방법 |
| US9371584B2 (en) * | 2011-03-09 | 2016-06-21 | Applied Materials, Inc. | Processing chamber and method for centering a substrate therein |
| US9421617B2 (en) | 2011-06-22 | 2016-08-23 | Tel Nexx, Inc. | Substrate holder |
| US8967935B2 (en) | 2011-07-06 | 2015-03-03 | Tel Nexx, Inc. | Substrate loader and unloader |
| US9082799B2 (en) * | 2012-09-20 | 2015-07-14 | Varian Semiconductor Equipment Associates, Inc. | System and method for 2D workpiece alignment |
| KR101404987B1 (ko) * | 2012-10-29 | 2014-06-10 | 주식회사 선익시스템 | 인라인 증착장비의 글라스 홀더용 냉각 챔버 |
| US10483143B2 (en) * | 2013-12-26 | 2019-11-19 | Kawasaki Jukogyo Kabushiki Kaisha | End effector and substrate conveying robot |
| CN105575868B (zh) * | 2014-11-10 | 2018-12-07 | 上海理想万里晖薄膜设备有限公司 | 基板校准方法与装置 |
| JP6535187B2 (ja) * | 2015-03-10 | 2019-06-26 | 株式会社荏原製作所 | 基板搬送用ハンド |
| JP6826044B2 (ja) | 2015-04-20 | 2021-02-03 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | バッファチャンバのウエハ加熱機構と支持ロボット |
| JP6942121B2 (ja) * | 2015-10-15 | 2021-09-29 | アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ | 基板キャリアシステム |
| CN105177509B (zh) * | 2015-10-16 | 2017-08-11 | 京东方科技集团股份有限公司 | 一种背板夹取装置、对位装置及蒸镀设备 |
| CN108352289B (zh) * | 2015-11-20 | 2019-10-29 | 株式会社岛津制作所 | 真空处理装置和质谱分析仪 |
| US10121655B2 (en) | 2015-11-20 | 2018-11-06 | Applied Materials, Inc. | Lateral plasma/radical source |
| JP6493339B2 (ja) * | 2016-08-26 | 2019-04-03 | 村田機械株式会社 | 搬送容器、及び収容物の移載方法 |
| CN107841727A (zh) * | 2017-12-15 | 2018-03-27 | 北京创昱科技有限公司 | 一种冷却构件及真空镀膜设备 |
| CN110970344B (zh) * | 2018-10-01 | 2024-10-25 | Asmip控股有限公司 | 衬底保持设备、包含所述设备的系统及其使用方法 |
| JP7280132B2 (ja) * | 2019-07-12 | 2023-05-23 | 株式会社アルバック | 真空チャンバ及び基板処理装置 |
| GB201913356D0 (en) | 2019-09-16 | 2019-10-30 | Spts Technologies Ltd | Wafer processing system |
| JP7752985B2 (ja) * | 2021-07-21 | 2025-10-14 | ダイキンファインテック株式会社 | 基板処理装置 |
| CN117645059A (zh) * | 2022-09-02 | 2024-03-05 | 群翊工业股份有限公司 | 直立式夹持基板载具结构 |
| DE102023212913A1 (de) * | 2023-12-19 | 2024-02-08 | Vitesco Technologies Germany Gmbh | Haltevorrichtung zum Halten eines Substrats, Anordnungsvorrichtung zum Halten und Verbinden von zumindest zwei Substraten und Lötwerkzeug |
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-
2002
- 2002-02-22 US US10/084,762 patent/US6824343B2/en not_active Expired - Lifetime
-
2003
- 2003-02-18 JP JP2003572077A patent/JP4290561B2/ja not_active Expired - Lifetime
- 2003-02-18 WO PCT/US2003/004885 patent/WO2003073479A1/en not_active Ceased
- 2003-02-18 CN CNB038043955A patent/CN100413017C/zh not_active Expired - Fee Related
- 2003-02-18 KR KR1020047013047A patent/KR100636491B1/ko not_active Expired - Fee Related
- 2003-02-18 EP EP03743151A patent/EP1485946B1/en not_active Expired - Lifetime
- 2003-02-20 TW TW092103577A patent/TWI279876B/zh not_active IP Right Cessation
-
2004
- 2004-11-16 US US10/990,094 patent/US7735710B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1639839A (zh) | 2005-07-13 |
| WO2003073479A1 (en) | 2003-09-04 |
| US20050063800A1 (en) | 2005-03-24 |
| KR100636491B1 (ko) | 2006-10-18 |
| TW200305245A (en) | 2003-10-16 |
| US6824343B2 (en) | 2004-11-30 |
| JP2005518674A (ja) | 2005-06-23 |
| EP1485946A1 (en) | 2004-12-15 |
| US7735710B2 (en) | 2010-06-15 |
| CN100413017C (zh) | 2008-08-20 |
| US20030161706A1 (en) | 2003-08-28 |
| EP1485946B1 (en) | 2007-01-24 |
| KR20040079446A (ko) | 2004-09-14 |
| JP4290561B2 (ja) | 2009-07-08 |
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| MM4A | Annulment or lapse of patent due to non-payment of fees |