TWI274735B - Bulk single crystal production facility employing supercritical ammonia - Google Patents
Bulk single crystal production facility employing supercritical ammonia Download PDFInfo
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- TWI274735B TWI274735B TW091136024A TW91136024A TWI274735B TW I274735 B TWI274735 B TW I274735B TW 091136024 A TW091136024 A TW 091136024A TW 91136024 A TW91136024 A TW 91136024A TW I274735 B TWI274735 B TW I274735B
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- autoclave
- single crystal
- crystallization
- nitride
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- 239000013078 crystal Substances 0.000 title claims abstract description 93
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 title claims description 62
- 229910021529 ammonia Inorganic materials 0.000 title claims description 29
- 150000004767 nitrides Chemical class 0.000 claims abstract description 49
- 239000002904 solvent Substances 0.000 claims abstract description 26
- 230000012010 growth Effects 0.000 claims abstract description 25
- 238000002425 crystallisation Methods 0.000 claims description 51
- 230000008025 crystallization Effects 0.000 claims description 51
- 238000004090 dissolution Methods 0.000 claims description 42
- 238000001816 cooling Methods 0.000 claims description 22
- 239000002994 raw material Substances 0.000 claims description 22
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 20
- 229910052733 gallium Inorganic materials 0.000 claims description 20
- 238000010438 heat treatment Methods 0.000 claims description 16
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 15
- 239000000126 substance Substances 0.000 claims description 15
- 229910001413 alkali metal ion Inorganic materials 0.000 claims description 10
- 229910000831 Steel Inorganic materials 0.000 claims description 4
- 239000010959 steel Substances 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 229910052715 tantalum Inorganic materials 0.000 claims description 2
- 239000000243 solution Substances 0.000 claims 3
- 239000011557 critical solution Substances 0.000 claims 1
- 238000004043 dyeing Methods 0.000 claims 1
- 230000002269 spontaneous effect Effects 0.000 abstract description 5
- 230000001105 regulatory effect Effects 0.000 abstract 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 34
- 229910002601 GaN Inorganic materials 0.000 description 28
- 238000000034 method Methods 0.000 description 25
- 150000001875 compounds Chemical class 0.000 description 16
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonium chloride Substances [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 14
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 14
- 235000011114 ammonium hydroxide Nutrition 0.000 description 14
- 238000006243 chemical reaction Methods 0.000 description 9
- 238000002248 hydride vapour-phase epitaxy Methods 0.000 description 8
- 229910052783 alkali metal Inorganic materials 0.000 description 6
- -1 alkali metal azide Chemical class 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 150000001340 alkali metals Chemical class 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 229910021055 KNH2 Inorganic materials 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 239000011734 sodium Substances 0.000 description 3
- VZXTWGWHSMCWGA-UHFFFAOYSA-N 1,3,5-triazine-2,4-diamine Chemical compound NC1=NC=NC(N)=N1 VZXTWGWHSMCWGA-UHFFFAOYSA-N 0.000 description 2
- 229910002704 AlGaN Inorganic materials 0.000 description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 2
- PXIPVTKHYLBLMZ-UHFFFAOYSA-N Sodium azide Chemical compound [Na+].[N-]=[N+]=[N-] PXIPVTKHYLBLMZ-UHFFFAOYSA-N 0.000 description 2
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052793 cadmium Inorganic materials 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 238000007716 flux method Methods 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 229910052500 inorganic mineral Inorganic materials 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 2
- 239000011707 mineral Substances 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 229910000069 nitrogen hydride Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 229910052707 ruthenium Inorganic materials 0.000 description 2
- 238000010956 selective crystallization Methods 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- 101100181929 Caenorhabditis elegans lin-3 gene Proteins 0.000 description 1
- 241000207199 Citrus Species 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- NPYPAHLBTDXSSS-UHFFFAOYSA-N Potassium ion Chemical compound [K+] NPYPAHLBTDXSSS-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000001339 alkali metal compounds Chemical class 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- IVRMZWNICZWHMI-UHFFFAOYSA-N azide group Chemical group [N-]=[N+]=[N-] IVRMZWNICZWHMI-UHFFFAOYSA-N 0.000 description 1
- 230000033558 biomineral tissue development Effects 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- XOYLJNJLGBYDTH-UHFFFAOYSA-M chlorogallium Chemical compound [Ga]Cl XOYLJNJLGBYDTH-UHFFFAOYSA-M 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 235000020971 citrus fruits Nutrition 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000034373 developmental growth involved in morphogenesis Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 150000002259 gallium compounds Chemical class 0.000 description 1
- 230000002140 halogenating effect Effects 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 150000004678 hydrides Chemical class 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 238000005184 irreversible process Methods 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- GUWHRJQTTVADPB-UHFFFAOYSA-N lithium azide Chemical compound [Li+].[N-]=[N+]=[N-] GUWHRJQTTVADPB-UHFFFAOYSA-N 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 229910001414 potassium ion Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 229910001415 sodium ion Inorganic materials 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- 238000000927 vapour-phase epitaxy Methods 0.000 description 1
- 238000001947 vapour-phase growth Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B7/00—Single-crystal growth from solutions using solvents which are liquid at normal temperature, e.g. aqueous solutions
- C30B7/10—Single-crystal growth from solutions using solvents which are liquid at normal temperature, e.g. aqueous solutions by application of pressure, e.g. hydrothermal processes
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
- C30B29/403—AIII-nitrides
- C30B29/406—Gallium nitride
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B7/00—Single-crystal growth from solutions using solvents which are liquid at normal temperature, e.g. aqueous solutions
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B7/00—Single-crystal growth from solutions using solvents which are liquid at normal temperature, e.g. aqueous solutions
- C30B7/08—Single-crystal growth from solutions using solvents which are liquid at normal temperature, e.g. aqueous solutions by cooling of the solution
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
- Y10T117/10—Apparatus
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
- Y10T117/10—Apparatus
- Y10T117/102—Apparatus for forming a platelet shape or a small diameter, elongate, generally cylindrical shape [e.g., whisker, fiber, needle, filament]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
- Y10T117/10—Apparatus
- Y10T117/1024—Apparatus for crystallization from liquid or supercritical state
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Description
1274735 ⑼
玖、發明說明 (發明說明應敘明:發明所屬之技術區域、先前技術、内容、實施方式及圖式簡單說明) 技術領域 本發明係關於製造氮化物塊狀單晶之生產設備之改良 ,其係藉由超臨界溶液於晶種形成結晶。 先前技術 採用藉由自超臨界氨溶液之再結晶獲得氮化物塊狀單 晶之方法,已見於特願2002-143449。該利用超臨界氨溶液 製得氮化物塊狀單晶之生產設備,係一種具有生成超臨界 溶媒之高壓釜之設備,而該高壓釜不僅具備對流控制設 備,並具備包含加熱裝置及冷卻裝置之爐體。 上述爐體係藉由加熱裝置及/或冷卻裝置,調整於保持 一定溫度梯度。 上述對流控制裝置係以1片或數片之與中心及/或高壓 釜内壁之間有間隙之橫型擋板構成,並在擋板上方形成配 置原料之溶解區域,及在擋板下方形成配置晶種之結晶化 區域。 但是,本發明人等發現,如上構成尚未完善,需再藉由 上述控制裝置之開度及依據上述溶解區域與結晶化區域 之溫差等設定上述溶解區域與上述結晶化區域間之超臨 界溶液之對流速度。 因此本發明人等悉心研究結果發現,為工業上量產氮化 物,其結晶成長速度需為10 //m/h以上,為達成此目標, 氮化物須溶解於含有氨及至少有鹼金屬離子之超臨界溶
1274735 ⑴ 液中,而當由上述溶解區域藉著上述對流控制裝置供給溶 解度為負溫度係數之超臨界溶液時,將溫度提昇至特定溫 度,超臨界溶液溶解度調整對晶種呈過飽和域以防自動結 晶化之濃度以下,方能使氮化物結晶選擇性成長於配置於 高壓釜内之晶種面。 發明内容 本發明之目的為提供一種高壓釜,其為可控制高壓釜内 之對流速度以利氮化物塊狀單晶之成長者。 本發明之另一目的為提供一種高壓釜,其係可抑制來自 高壓釜壁面之雜質混進者。 本發明之另一目的為提供一種高壓釜,其係可達成工業 上有價值之成長速度者。 為達成上述目的,本發明係根據氨驗性(ammono-basic) 結晶成長技術;則在含有可對氨鹼性之一種或多種礦化劑 (mineralizer)之超臨界氣媒中發生化學輸送,由此得氮化物 早晶之成長。 其係具有可生成超臨界溶媒之高壓釜1之設備,且在該 高壓釜設置對流控制裝置2,具備包含加熱裝置5及冷卻裝 置6之爐體4。 該爐體4係藉由加熱裝置5及/或冷卻裝置6調整為保持 特定溫度梯度。 上述對流控制裝置2係由1至數片與中心及/或高壓釜内 壁之間有空隙之橫型擋板1 2構成,擋板上方則形成配置原 料1 6之溶解區域1 3,擋板下方則形成配置晶種1 7之結晶化 1274735 變_趣_: (2) 區域。 而將上述溶解區域1 3與上述結晶化區域1 4之間之超臨 界溶液對流速度,藉由上述控制裝置2之開度及上述溶解 區域1 3與結晶化區域1 4間之溫差設定所構成。
由此提供一種高壓釜,其中為將氮化物溶解於含有氨及 至少有鹼金屬離子之超臨界溶媒中,而其溶解度為負溫度 係數之超臨界溶液,藉著上述對流控制裝置2,由上述溶 解區域1 3供給於配置晶種之結晶化區域1 4,以提昇至特定 溫度,使超臨界溶液溶解度成為對晶種過飽和域,並調整 為不致於產生自動成長之濃度以下,由此使氮化物結晶能 在配置於高壓釜内之晶種面進行選擇性成長。
於上述氨驗性結晶成長技術中,已知超臨界氨液之組成 及濃度、溶解區域與結晶區域之溫差、依溫差控制對流速 度之擋板之位置及面積、氨充填率、晶種與原料之表面積 比率等,對結晶之成長均產生影響,但若根據本發明,由 於可藉由上述控制裝置2及上述溫差,設定上述溶解區域 1 3與上述結晶化區域1 4間之超臨界溶液對流速度,可將結 晶化區域之超臨界溶液之溶解度調整為對晶種成過飽 和,且不致於產生自動結晶化之濃度以下,以利氮化物結 晶在晶種面進行選擇性成長。 此外,由於含鹼金屬離子之超臨界氨溶液具有良好溶解 性,因此若在高壓釜内壁施加由Ag、Mo、Fe或Ta構成之 金屬或合金襯裏,則可抑制來自壁面之雜質摻雜,其效果
1274735 (3) 較佳。
上述對流控制裝置係扮演對溶解區域及結晶化區域賦 予階梯性溫差之角色,儘管其形狀及面積因高壓釜内容積 之大小及内徑與長度之比率而異,以内剖面積之7 0 %至 9 0 %為宜,而擋板之開口率則以3 0 %以下為宜。擋板之位 置應配合成長之結晶量而上下變動,宜設置於高壓釜内部 全長之1/3至2/3部位,並能配合需求調整上述溶解區域與 結晶化區域之比率為宜。設置於上述溶解區域之原料之充 填量,宜在溶解區域之一半以下,若以鎵金屬為原料時, 由於鎵金屬在柑堝内將成為氮化鎵(GaN)而增加體積,其 充填量應為溶解區域之約1 /4。 設置上述對流控制裝置2之區域,若配置冷卻用冷卻裝 置6,則較易在上述溶解區域1 3與結晶化區域1 4之間形成 溫差,同時宜在上述結晶化區域之底部流域配置冷卻用冷 卻裝置1 8,以利於結晶化結束後急速冷卻。
如上構成之高壓爸,可提昇晶種上之成長速度,其最佳 數據為高壓蒼之直徑/全長比率為1/15〜7/15,其剖面積在 上述橫型擋板之開口率為3 0 %以下,而其在晶種上之成長 速度為10 /zm/hr以上。 圖式簡單說明 圖1係於T = 400°C及T = 500°C時,壓力與含氨化鉀(KNH2 : ΝΗ3 = 0.07)之超臨界氨於GaN溶解度之關係圖表。 圖2係本發明中p = const.時,隨著時間經過於高壓釜内產 生之溫度變化及溶解工序與結晶化工序之變化之相關關 -10-
1274735 (4) 係圖表。 圖3係本發明中T = const.時,隨著時間經過於高壓釜内產 生之壓力變化及溶解工序與結晶化工序之變化之相關關 係圖表。 圖4係本發明使用之高壓釜及爐體之剖面圖。 圖5係生產氮化物塊狀單晶之設備概要圖。
圖6係實施例中,隨伴時間經過於高壓釜内產生之溫度 變化與溶解工序及結晶化工序之變化之相關關係圖表。 實施方式 生產氮化物單晶之設備,係由具備對流控制裝置2之生 成超臨界溶媒之高壓釜1及配置於高壓爸之具備加熱裝置 5及冷卻裝置6之1至數部爐體4構成,該爐體具備相當於高 壓釜之結晶化區域之加熱裝置4之高溫區域1 4,及相當於 高壓釜之溶解區域之備有加熱裝置之低溫區域1 3。亦可使 用具備有加熱、冷卻裝置之高溫區域,與具備加熱,冷卻 裝置之有低溫區域之爐體。與上述對流控制裝置之間,得 用中心部或周邊部有空隙之橫型擋板1片至數片區隔結晶 化區域與溶解區域。高壓釜内則將原料配置於溶解區域, 而晶種則配置於結晶化區域。溶解區域與結晶化區域間之 超臨界溶液之對流,係藉由上述裝置控制。溶解區域之位 置係在橫型擋板之上方,而結晶化區域則橫型擋板之下方 -11 -
1274735 (5)
本發明之塊狀單晶生產設備如圖4及圖5。該設備之主要 部分係由生成超臨界溶媒之高壓釜1,及可執行高壓釜1 中之超臨界溶液内化學移動之控制裝置2構成。將上述高 壓釜1投進具備加熱裝置5或冷卻裝置6之爐體4(2部)之室 内3,而以螺釘固定裝置7固定,以對爐體4保持一定位置。 爐體4係設置於爐底8,以繞圍爐體4及爐底8周圍之鋼帶9 固定。將爐底8及爐體4設置於旋轉台10,依特定角度,用 銷固定裝置1 1固定,則可控制高壓釜1内之對流種類及對 流速度。將投進於爐體4之高壓釜1内超臨界溶液之對流, 區隔為結晶化區域1 4與溶解區域1 3,藉由面積約有高壓釜 剖面積之7 0 %之橫型擋板1 2構成之對流控制裝置2設定。 設定位置係在全長之約一半部位。高壓釜1内之兩區域之 溫度,則藉由設置於爐體4内之控制裝置1 5,設定於100 °C〜800°C範圍内。相當於爐體4之低溫區域之高壓釜1内溶 解區域1 3之位置,係置於橫型擋板1 2之上方,而原料1 6 則配置於該區域1 3内。其充填量應為溶解區域之約一半程 度。若使用鎵金屬,坩堝容積應為溶解區域之約1 /2。相 當於爐體4之高溫區域之高壓釜内結晶化區域1 4之位置係 置於橫型擋板1 2之下方。晶種1 7係配置於此區域1 4,其配 置位置則設定於對流之上游與下游交差部位之下方而爐 底部之稍上方。設置上述對流控制裝置2之區域,則配置 可執行冷卻之冷卻裝置6 -1。如此配置則可在上述溶解區 域1 3與結晶化區域1 4之間形成所需溫差。上述結晶化區域 之底部流域則配置可執行冷卻之冷卻裝置6-1,以利結晶 -12-
1274735 , 化結束後急速冷卻,防止結晶成長後冷卻爐内時結晶再度 溶解。 據本發明人實施之研究結果,氮化鎵(GaN)對含有鹼金 屬或其化合物(如KNH2)等之氨,有較佳溶解度。圖1之圖 表中,超臨界溶媒内之GaN溶解度係以400°C與500°C之溫 度壓力之函數表示,該溶解度係以莫耳% : S m三{ GaN溶液: (KNH2+NH3)} X 100%定義。此時,該溶媒係指莫耳比χ Ξ KNH2 : ΝΗ3為0.07之超臨界氨溶液。溶解度sm係溫度、壓 力及礦化物之莫耳比函數’以Sm三Sm(T,p,X)表示,微小 _ 變化△ S m則以下式表示。 Δ Sm^(5Sm/0T)p5xA T+(SSm/βΡ)τ,χΔ P+(0Sm/5X)T XA χ 式中,(3Sm/3T)P,x等係數係表示溶解度之溫度、壓力及 礦化之莫耳比係數(coefficient)。 根據上述圖表,溶解度是一種壓力之增加函數而是溫度 之減少函數,利用該關係,以溶解度較高條件進行氮化物 之溶解,而以溶解度較低條件結晶化,則可使GaN之塊狀 單晶成長。此種負溫度梯度表示,當產生溫差時氮化物之 鲁 化學輸送係由低溫之溶解區域向高溫之結晶化區域進 订。此外’本發明人亦獲悉’其他嫁化合物及金屬錄亦可 作為GaN配位化合物之供給源。 、於疋’可將最簡單之金屬鎵或其他鎵配位化合物投進於 、上述成刀,、且口之/合媒’然後藉由加熱等條件變化,形成 對氮化物之過飽和溶液’則可使結晶成長於晶種面。因 此,本發明可在晶種成長氮化物之塊狀單晶,結果可在 -13 - 1274735 __/ ‘ (7)
GaN結晶所成之晶種上達成GaN之化學量論成長,製得GaN 之塊狀單晶層。 由於該單晶係成長於含鹼金屬離子之超臨界溶液内,製 得之單晶亦含〇· 1 ppm以上之驗金屬。此外,為保持防止設 備之腐蝕之超臨界溶液之鹼性,對溶媒則故意不加鹵素化 合物。本發明之方法,得用入丨或In取代〇〇5〜〇·5之鎵。運 用此種成分變更可調整製得之氮化物之晶格常數。此外, 亦可對GaN塊狀單晶添補濃度i〇i7〜1〇2i/cm3之予體(d〇nor ; ^
Si ’ Ο 等)’受體(acceptor ; Mg,Zn等),磁性物質(Mn,Cr 等)。添補可改變氮化物之光學、電氣、磁氣特性。至於 其他物理特性,成長後之GaN塊狀單晶表面之缺陷密度應 為106/cm2以下,宜為l〇5/cm2以下,以i〇4/cm2以下更佳。 此外,對於(0002)面之X光半值寬度應為600 arcsec以下, 宜為300 arcsec以下,以60 arcsec以下更佳。最佳塊狀GaN 單晶,可在缺陷密度約104/cm2以下,表面(0002)之X光測 定半值寬度60 arcsec以下成長。 (結晶化區域與溶解區域間之溫差) 馨 根據上述構成,欲在高壓釜内同時形成溶解區域及結晶 化區域兩種區域時,宜藉由溶解溫度及結晶化溫度之調整 實施對晶種之超臨界溶液之過飽和控制。此時將結晶化區 域設定於400〜600°C,而將高壓釜内之溶解區域與結晶化 區域之溫差保持於15CTC以下則更容易控制,若保持於1〇〇 C以下更佳。此外’對晶種之超6¾界溶液之過飽和調整, 則宜藉由在高壓釜内設置區分低溫之溶解區域與高溫之 •14- 1274735 ⑻ 結晶化區域之擋板1至數片,以調整溶解區域與結晶化區 域之對流量進行。此外,若欲在高壓釜内形成有特定溫差 之溶解區域及結晶化區域二種區域時’對晶種之超臨界溶 液之過飽和調整,則宜利用其總面積大於晶種總面積之 GaN結晶形態之含鎵原料投進。
本發明係利用一種氨鹼性結晶成長技術,亦則在含可付 予一種或數種礦化物質之超臨界氨溶媒中引發化學輸送 以達成氮化物單晶之成長者,本發明所用下列用詞,均依 下列說明中定義之意義。 (氮化物) 氮化物是一種含以氮原子為構成要素之化合物,可以式 AlxGabx.ylnyNfOS xS 1、0$ yS 1、0$ x + yS 1)表示,並至 少得含二元化合物GaN、AIN,三元化合物AlGaN、InGaN 及四元化合物AlInGaN。最好以AlxGa^x.yNCiXxcl)為對象。 配合用途得含有予體,受體或磁性添補劑。
氮化物之塊狀單晶係指,藉由MOCVD或HVPE等差向成 長方法能形成LED或LD等光及電子元件之氮化物單晶基 板而言。 (先質(precurser)) 氮化物之先質係指,一種至少含鎵或鋁,最好含鹼金 屬,XIII族元素,氮及/或氫之物質或其混合物,而為金 屬鎵或鋁,其合金或金屬間化合物,其氫化物,醯胺類, 亞醯胺類,醯胺-亞醯胺類,迭氮基類,且可形成可溶於 下列定義之超臨界氨溶媒之鎵化合物或鋁化合物而言。 -15-
1274735 (9) (原料)(Feed stock) 原料係指含鎵氮化物或含紹氮化物或其先質。本發明方 法係根據氨鹼性反應,但即使採用之原料為依H VPE形成 之GaN,Α1Ν或依化學反應形成之GaN,Α1Ν而原本已含氣 者,祇要不妨礙氨鹼性超臨界反應,使用上並無問題。亦 可採用對超臨界氨溶媒依平衡反應溶解之氮化物與對超 臨界氨溶媒以不可逆反應之鎵或鋁金屬之組合。
上述氮化物中,若用氮化鎵,其結晶化反應控制較容 易。此時,晶種宜用GaN單晶。GaN用原料可使用依焊劑 法製得之GaN,在鎵金屬超臨界氨中多晶化之聚氮化鎵 (polygallium nitride)等均可使用。 (超臨界氨溶媒) 超臨界氨溶媒係如下定義,而含有NH3或其衍生物,且 至少含鈉或鉀離子等金屬離子礦物質。超臨界氨溶媒係指 至少含氨,而含有為溶解氮化物之一種至數種鹼金屬離 子。
(礦化劑:mineralizer) 礦化劑係指,為使氮化物溶解於超臨界氨溶媒而供給一 種或數種驗金屬離子之化合物而言。礦化劑係以在超臨界 氨溶媒中給予鹼金屬或鹼金屬離子之鹼金屬化合物形態 供給,從純度觀點而言,以鹼金屬迭氮化物(NaN3,KN3, LiN3),驗金屬(Na,K,Li)形態供給為宜,但若有需要可 與鹼金屬醯胺併用。超臨界溶媒中之鹼金屬離子濃度,係 調整為能確保原料及氮化物之特定溶解度,其在超臨界溶 -16- 1274735
(10) 液中之對其他成分之鹼金屬離子莫耳比為1 : 200〜1 : 2, 但宜為1 : 100〜1 : 5,若控制於1 : 20〜1 : 8範圍内更佳。 鹼金屬離子若混合2種以上使用,則可提昇較單獨使用時 為佳之結晶成長速度或結晶品質。此外,若有需要可併用 Mg,Zn,Cd等鹼土族金屬。此外,只要不阻礙在超臨界 氨中之鹼性反應,亦可併用中性物質(鹵化鹼金屬鹽),酸 性物質(i化銨)等。
(原料溶解) 原料溶解係指上述原料對超臨界溶媒形成溶解性氮化 化合物,如鎵或鋁錯體化合物形態之可逆性或非可逆性過 程而言。鎵錯體化合物是一種NH3或其衍生物ΝΗ2·,NH2 以鎵為位向中心圍繞而成之錯體化合物。 (超臨界氨溶液)
超臨界氨溶液係指由上述超臨界氨溶媒與原料溶解產 生溶解性鎵或鋁化合物之現象。本發明人等經實驗發現, 在十分高溫高壓下,固體金屬氮化物與超臨界溶液之間有 一平衡關係存在,因此,溶解性氮化物之溶解度可定義為 在固體氮化物存在下之上述溶解性鎵或鋁化合物之平衡 濃度。在該工序,該項平衡可藉由溫度及/或壓力變化移 動。 (溶解度) 溶解度之負溫度係數係指,將其他全部參數保持一定 時,溶解度可用溫度減少函數(monotonically decreasing function)表示之意,同樣,溶解度之正壓力係數係指,將 -17- 1274735 _懿__ (η) 其他全部參數固定時,溶解度係以壓力之增加函數表示之 意。據本發明人等之研究,在超臨界氨溶媒中之氮化物之 溶解度,至少在300至550°C之溫度區域以及1至5.5 kbar壓 力範圍内,以負溫度係數及正壓力係數表現。因此,如圖 2所示,將爐内溫度保持於400°C 8天,溶解原料(溶解工 序)後,將爐内溫度保持於500°C,則可使溶解之氮化鎵析 出結晶(結晶化工序)。
(過飽和:oversaturation) 對氮化物之超臨界氨溶液之過飽和係指,在上述超臨界 氨溶液中之可溶性鎵或鋁化合物之濃度高於平衡狀態濃 度則溶解度之狀態。於密閉系中,氮化物溶解時,此過飽 和係從負溫度係數成正壓力係數,可藉由溫度增加或壓力 減少而達成。 (化學輸送:chemical transport)
在超臨界氨溶液中之氮化物之化學輸送,係指含原料之 溶解,可溶性氮化物透過超臨界氨溶液之移動以及氮化物 從過飽和臨界氨溶液之結晶化之連續過程,一般而言,化 學輸送過程係藉由溫度差距,壓力差距,濃度差距及已溶 解之原料與結晶化生成物間之化學或物理上之不同性質 等驅動力進行。本發明方法雖可製得氮化物之塊狀單晶, 但以分別在不同區域進行溶解過程與結晶化過程,亦則將 結晶化區域溫度保持於高於溶解區域溫度而進行上述化 學輸送之方式較有利。 (晶種:seed) •18- 1274735 (12) 晶種已在本發明内容中屢次舉例說明,係提供進行氮化 物結晶化之區域者,由於其係支配結晶之成長品質,應選 自與擬成長之結晶同質且品質良好,而缺陷密度l〇5/cm2 以下者為宜。此外,亦可使用依焊劑法、高壓法製得之天 然晶種,由塊狀單晶截取之A面、Μ面、R面晶種。亦可 利用添補S i而呈η型導電性之晶種面之晶種。此種晶種係 藉由HVPE或MOCVD等氣相成長法成長氮化物,而於成長 中添補Si 1016〜1021/cm3,賦予η型導電性者。可使用在SiC 等導電性基板上成長A1N或GaN之層疊晶種。 (自發成長:spontaneous crystallization) 自發成長(自發性結晶化)係指,在高壓釜中之任何部位 均可能發生之由過飽和超臨界氨溶液形成氮化物核及成 長之不宜工序,含晶種表面之各向異性成長(disoriented growth) 〇 (選擇性析出:selective crystallization)
對晶種之選擇性結晶析出係指,實質上無自發成長而在 晶種上進行結晶化之工序。該工序是塊狀單晶成長上不可 或缺之工序,亦是本發明方法之一。 (原料:feedstock) 本發明使用之片(pellet)係指,將粉末成形,燒成,使密 度達7 0 %以上者,密度愈高愈佳。 (反應溫度及壓力) 本發明之實施例中所述高壓釜内溫度分布,係在不存在 超臨界氨之下測定空高壓釜之數據,並非實際超臨界溫 -19-
1274735 (13) 度。至於壓力則為直接測定結果,或根據當初引進之氨量 及高壓釜溫度、容積計算而決定者。 (實施例) 於直徑40 mm,長480 mm(D/L=l/12),内容積585 cm3之高 壓高壓釜1(圖9)之溶解區域13,置容於坩堝之GaN原料30 g,並於結晶化區域1 4置依HVPE法製得之Φ 1英寸之GaN晶 種。另添補純度6N之金屬鎵1.2 g及純度3N之金屬鈉23 g 作礦化劑,再加5N氨液238 g,密封高壓釜1。將該高壓釜 1放進爐體4内,以3天時間加熱至200°C。 然後將溶解區域1 3之溫度提昇至425°C,並將結晶化區 域14之溫度提高至525°C。得壓力約2.5 kbar。將此狀態之 高壓釜再放置28日(圖6)。經此工序後,溶解區域13中之 部分原料乃溶解,而結晶化區域1 4之HVPE · GaN晶種上則 成長GaN,雙面單晶層之厚度為約3 mm。 對如上製得之結晶施加下列處理,以便用於基板。
1) 將成長於HVPE · GaN晶種上之厚3 mm單晶置於加熱爐 内,在600〜900°C,含少量氧氣之氮氣環境中進行退火處 理1 - 5小時。 2) 將樣品設置於TAKATORI公司製鋼索鋸。設置時樣品係 傾斜1 °以下,以形成離角(off angle)。使用鑽石切片機,將 檢品截成5片,得離角0.05-0.2 °之樣品。 3) 將截成之樣品置於加熱爐内,在600〜900°C,含少量氧 氣之氮氣環境内,再進行退火處理1 - 5小時。如此處理者 -20- 1274735 mmmw (14) 稱為GaN基板。 4) 用接著劑將GaN基板黏附於研磨用滑塊上,將該滑塊 設置於Logitech公司製研磨機’分別研磨一面。研磨條件 為使用鑽石漿及PH3-6或PH9-11之膠狀矽或氧化鋁溶液, 研磨到最後粗細度1 0 Λ以下。 5) 然後,依HVPE法,並依下列條件在GaN基板表面形成 數//m以下之GaN或AlGaN膜層,作為型板(template)。 6) 此外,在具有上述膜層之〇aN基板及不具該膜層之GaN 基板上’依HVPE法形成約3 mm之GaN層,以上述方法戴片 ,研磨,製成約0_5 mm之發光元件用型板。 HVPE條件:反應溫度:1〇5〇°c,反應壓力:常壓。 氨分壓 0.3 atm,GaCl分壓 ixio·3 atm。 氫氣載體氣體 視需要’於6)之研磨後保持於2 〇 °c,不含礦化劑之超臨 界氣中1天’以去除表面雜質。 產業上利用領域 得由超臨界氨溶液製造高品質氮化物塊狀單晶。 圖式代表符號說明 1 局壓爸 2 對流控制裝置 3 室内 4 爐體 5 加熱裝置 6 冷卻裝置 -21 -
1274735 (15) 7 固定裝置 8 爐底 9 鋼帶 10 旋轉台 11 鎖固定裝置 12 橫型擋板 13 溶解區域 14 結晶化區域 15 控制裝置 16 原料 17 晶種 18 冷卻裝置
-22-
Claims (1)
1274m.- r - ..
拾、申請專利範圍 1. 一種塊狀單晶生產設備,其係具備生成超臨界溶媒之 高壓釜者,於該高壓釜中設置有對流控制裝置,並具 有包含加熱裝置及冷卻裝置之爐體, 該爐體係藉由加熱裝置及/或冷卻裝置被調整到可 保持特定之溫度梯度, 上述對流控制裝置係由與中心及/或高壓釜内壁之 間具有空隙之1片或數片橫型擋板所構成,並以於該擋 板上方形成配置原料之溶解區域,及於擋板下方形成 配置晶種之結晶化區域之方式配置,
並以藉由上述控制裝置之開度及上述溶解區域與結 晶化區域之溫差設定上述溶解區域與結晶化區域之間 之超臨界溶液之對流速度的方式構成, 並將氮化物溶解於含有氨及至少含鹼金屬離子之超 臨界溶液中,將溶解度為負溫度係數之超臨界溶液, 由上述溶解區域藉著上述對流控制裝置供給於配置晶 種之結晶化區域,昇溫至特定溫度,且將超臨界溶液 之溶解度調整為對晶種呈過飽和區域但不致產生自發 成長之濃度以下,以使氮化物結晶選擇性成長於配置 在高壓爸内之晶種表面。 2.如申請專利範圍第1項之塊狀單晶生產設備,其中以冷 -23 - 1274735
卻上述對流控制裝置所在區域之方式配置冷卻裝置, 並於上述溶解區域與結晶化區域之間形成特定溫度 差。 3 .如申請專利範圍第1項之塊狀單晶生產設備,其中配置 冷卻裝置以冷卻上述結晶化區域之底部流域,以便結 晶化結束後能迅速冷卻該流域。 4 .如申請專利範圍第1項之塊狀單晶生產設備,該高壓蚤 内壁係加附有由Ag,Mo,Fe或Ta所構成之金屬或合金 襯裏者。 5 .如申請專利範圍第1項之塊狀單晶生產設備,其中上述 對流控制裝置係設置於高壓釜内部全長之1 /3至1 /2位 置,而上述溶解區域與結晶化區域之比率係可隨需要 調整。 6.如申請專利範圍第1項之塊狀單晶生產設備,其設置於 上述溶解區域之原料係鎵金屬且其充填量為溶解區域 之一半以下。 7 .如申請專利範圍第1項之塊狀單晶生產設備,其中該高 壓釜之直徑/全長比為1/15至7/15,且其於剖面積之上 述橫型擋板之開口率為3 0 %以下,而於晶種上之成長速 度為10 //m/hr以上。 •24- 1274735 陸、(一)、本案指定代表圖為:第m (二)、本代表圖之元件代表符號簡單說明: 1 高 壓 釜 3 室 内 4 爐 體 7 固 定 裝 置 8 爐 底 9 鋼 帶 10 旋 轉 台 11 銷 固 定 裝置 15 控 制 裝 置 染、本案若有化學式時’請揭不最能顯不發明特巍的化學式·
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2002
- 2002-12-11 US US10/514,639 patent/US7335262B2/en not_active Expired - Lifetime
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CN102618916A (zh) * | 2012-03-29 | 2012-08-01 | 江南大学 | 一种晶体培养连续过滤自动控制方法 |
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EP1514958B1 (en) | 2014-05-14 |
EP1514958A1 (en) | 2005-03-16 |
WO2003097906A1 (fr) | 2003-11-27 |
US7335262B2 (en) | 2008-02-26 |
TW200306945A (en) | 2003-12-01 |
US20060191472A1 (en) | 2006-08-31 |
AU2002354463A8 (en) | 2003-12-02 |
JP4403067B2 (ja) | 2010-01-20 |
AU2002354463A1 (en) | 2003-12-02 |
JPWO2003097906A1 (ja) | 2005-09-15 |
EP1514958A4 (en) | 2008-10-22 |
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