TWI244667B - Connecting structure and connecting method of circuit - Google Patents

Connecting structure and connecting method of circuit Download PDF

Info

Publication number
TWI244667B
TWI244667B TW093125319A TW93125319A TWI244667B TW I244667 B TWI244667 B TW I244667B TW 093125319 A TW093125319 A TW 093125319A TW 93125319 A TW93125319 A TW 93125319A TW I244667 B TWI244667 B TW I244667B
Authority
TW
Taiwan
Prior art keywords
circuit board
printed circuit
flexible printed
display panel
plasma display
Prior art date
Application number
TW093125319A
Other languages
English (en)
Chinese (zh)
Other versions
TW200522121A (en
Inventor
Maikio Sakairi
Original Assignee
Sony Chemicals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chemicals Corp filed Critical Sony Chemicals Corp
Publication of TW200522121A publication Critical patent/TW200522121A/zh
Application granted granted Critical
Publication of TWI244667B publication Critical patent/TWI244667B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
    • H01J11/20—Constructional details
    • H01J11/46—Connecting or feeding means, e.g. leading-in conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/02—Manufacture of electrodes or electrode systems
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2211/00—Plasma display panels with alternate current induction of the discharge, e.g. AC-PDPs
    • H01J2211/20—Constructional details
    • H01J2211/46—Connecting or feeding means, e.g. leading-in conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Gas-Filled Discharge Tubes (AREA)
  • Combinations Of Printed Boards (AREA)
TW093125319A 2003-12-26 2004-08-23 Connecting structure and connecting method of circuit TWI244667B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003435618A JP4423970B2 (ja) 2003-12-26 2003-12-26 回路の接続構造及び接続方法

Publications (2)

Publication Number Publication Date
TW200522121A TW200522121A (en) 2005-07-01
TWI244667B true TWI244667B (en) 2005-12-01

Family

ID=34746908

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093125319A TWI244667B (en) 2003-12-26 2004-08-23 Connecting structure and connecting method of circuit

Country Status (6)

Country Link
JP (1) JP4423970B2 (ko)
KR (1) KR100939607B1 (ko)
CN (1) CN1898764B (ko)
HK (1) HK1099124A1 (ko)
TW (1) TWI244667B (ko)
WO (1) WO2005066992A1 (ko)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100820631B1 (ko) * 2006-10-10 2008-04-11 엘지전자 주식회사 플라즈마 디스플레이 장치
KR100814819B1 (ko) 2006-10-31 2008-03-20 삼성에스디아이 주식회사 플라즈마 디스플레이 장치
JP2008205132A (ja) * 2007-02-19 2008-09-04 Nec Corp プリント配線板及びこれとフレキシブルプリント基板とのはんだ接続構造並びに方法
WO2009047846A1 (ja) * 2007-10-10 2009-04-16 Hitachi, Ltd. 表示パネルおよび点灯試験装置
KR100904710B1 (ko) 2007-11-01 2009-06-29 삼성에스디아이 주식회사 연성인쇄회로기판, 이의 접합방법 및 이를 구비하는 배터리팩
JP5247571B2 (ja) * 2008-04-24 2013-07-24 パナソニック株式会社 配線基板と配線基板の接続方法
CN101713875B (zh) * 2008-10-07 2011-10-12 元太科技工业股份有限公司 软性显示面板
JP5293955B2 (ja) * 2009-02-18 2013-09-18 コニカミノルタ株式会社 カメラモジュール
KR20110066597A (ko) 2009-12-11 2011-06-17 삼성에스디아이 주식회사 발광 장치 및 이를 구비한 표시 장치
JP2012069548A (ja) * 2010-09-21 2012-04-05 Brother Ind Ltd 配線基板の接続構造及び接続方法
JP5695881B2 (ja) * 2010-10-28 2015-04-08 デクセリアルズ株式会社 電子部品の接続方法及び接続構造体
JP5382010B2 (ja) 2011-01-24 2014-01-08 ブラザー工業株式会社 配線基板、及び、配線基板の製造方法
KR101966241B1 (ko) * 2012-05-31 2019-04-05 엘지이노텍 주식회사 터치윈도우 및 그 제조방법
JP6344888B2 (ja) * 2013-03-27 2018-06-20 デクセリアルズ株式会社 接続体の製造方法、電子部品の接続方法、接続構造体
JP6329014B2 (ja) * 2014-06-19 2018-05-23 積水化学工業株式会社 接続構造体及び接続構造体の製造方法
MX2018013731A (es) * 2016-05-11 2019-08-01 Flex Automotive Gmbh Montaje de circuitos electricos y metodo para la fabricacion del mismo.
CN107979915B (zh) * 2016-10-25 2020-10-30 宁波舜宇光电信息有限公司 线路板基板和摄像模组及其制造方法以及电子设备
JP6600019B2 (ja) * 2017-09-08 2019-10-30 株式会社タムラ製作所 電子基板の製造方法および異方性導電ペースト
JPWO2023171464A1 (ko) * 2022-03-08 2023-09-14

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3492195B2 (ja) * 1997-04-30 2004-02-03 松下電器産業株式会社 プラズマディスプレイパネルの電極接合方法
JP2000299555A (ja) * 1999-04-13 2000-10-24 Advanced Display Inc 回路基板の接続方法
JP2003297516A (ja) 2002-03-29 2003-10-17 Optrex Corp フレキシブル基板の接続方法

Also Published As

Publication number Publication date
JP2005197001A (ja) 2005-07-21
CN1898764A (zh) 2007-01-17
KR100939607B1 (ko) 2010-02-01
HK1099124A1 (en) 2007-08-03
WO2005066992A1 (ja) 2005-07-21
KR20060103460A (ko) 2006-09-29
JP4423970B2 (ja) 2010-03-03
TW200522121A (en) 2005-07-01
CN1898764B (zh) 2010-05-12

Similar Documents

Publication Publication Date Title
TWI244667B (en) Connecting structure and connecting method of circuit
US4755659A (en) Combined busbar and electrical lead assembly
WO1993010573A1 (en) Die mounting with uniaxial conductive adhesive
CN102625564A (zh) 屏蔽印刷电路板
WO2016032006A1 (ja) フレキシブルプリント配線板用補強部材、及びそれを備えたフレキシブルプリント配線板
CN109892020A (zh) 接地构件、屏蔽印制线路板及屏蔽印制线路板的制造方法
TW201225759A (en) Method for connecting electronic part and connecting structure
JP5476168B2 (ja) 導電性粒子、異方性導電材料及び接続構造体
JP2005197660A (ja) 過電流保護素子およびその製造方法
JPWO2003079495A1 (ja) 柔軟性良導電層及びそれを用いた異方導電シート
JP2008210908A (ja) 電子部品の実装方法
US7038327B2 (en) Anisotropic conductive film bonding pad
JP3622792B2 (ja) 接続部材及び該接続部材を用いた電極の接続構造・接続方法
JPH0628121B2 (ja) 異方導電フイルム
JP5032961B2 (ja) 異方性導電膜及びこれを用いた接合体
JP5209778B2 (ja) 異方性導電膜及びこれを用いた接合体
JP5476262B2 (ja) 接続構造体及び接続構造体の製造方法
WO2003079496A1 (fr) Feuille anisotrope conductrice et son procede de production
CN108777911B (zh) 电性连接结构及其形成方法
JP5608504B2 (ja) 接続方法及び接続構造体
JP2017199808A (ja) 接続構造およびこれを用いた大電力フィルム状回路
JP3438583B2 (ja) 異方導電性フィルムの接続方法
JP2006310583A (ja) 複合基板およびその製造方法
JP3757759B2 (ja) 接続構造体
JP2011211245A (ja) 接続構造体の製造方法及び接続構造体並びに接続方法