MX2018013731A - Montaje de circuitos electricos y metodo para la fabricacion del mismo. - Google Patents

Montaje de circuitos electricos y metodo para la fabricacion del mismo.

Info

Publication number
MX2018013731A
MX2018013731A MX2018013731A MX2018013731A MX2018013731A MX 2018013731 A MX2018013731 A MX 2018013731A MX 2018013731 A MX2018013731 A MX 2018013731A MX 2018013731 A MX2018013731 A MX 2018013731A MX 2018013731 A MX2018013731 A MX 2018013731A
Authority
MX
Mexico
Prior art keywords
metal plate
electrical circuitry
circuit
manufacturing
circuitry assembly
Prior art date
Application number
MX2018013731A
Other languages
English (en)
Inventor
Lutz Peter
Buermann Kevin
Original Assignee
Flex Automotive Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US15/152,218 external-priority patent/US9844146B2/en
Priority claimed from DE202016102522.2U external-priority patent/DE202016102522U1/de
Application filed by Flex Automotive Gmbh filed Critical Flex Automotive Gmbh
Publication of MX2018013731A publication Critical patent/MX2018013731A/es

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/091—Locally and permanently deformed areas including dielectric material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

La invención se refiere a un montaje de circuitos eléctricos (1), que incluye una placa metálica (20) conductora de electricidad, y un circuito (10) para conectarse de forma eléctrica a dicha placa metálica (20), en donde dicho circuito (10) incluye al menos una la película aislante (12, 13) y una capa conductora (11) estando cubierta al menos parcialmente por la al menos una película aislante (12, 13). Además, el circuito (10) comprende, en un área de conexión preferida (14) donde se establecerá la conexión eléctrica entre dicho circuito (10) y dicha placa metálica (20), al menos una sección expuesta (15) orientada hacia la placa metálica (20), y dicha sección expuesta (15) está al menos conectada parcialmente de forma eléctrica a dicha placa metálica (20). Además, la invención se refiere a un método para fabricar un montaje de circuitos eléctricos (1).
MX2018013731A 2016-05-11 2017-05-10 Montaje de circuitos electricos y metodo para la fabricacion del mismo. MX2018013731A (es)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/152,218 US9844146B2 (en) 2016-05-11 2016-05-11 Electrical circuitry assembly and method for manufacturing the same
DE202016102522.2U DE202016102522U1 (de) 2016-05-11 2016-05-11 Elektrische Leiterbaugruppe
PCT/EP2017/061210 WO2017194618A1 (en) 2016-05-11 2017-05-10 Electrical circuitry assembly and method for manufacturing the same

Publications (1)

Publication Number Publication Date
MX2018013731A true MX2018013731A (es) 2019-08-01

Family

ID=58699135

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2018013731A MX2018013731A (es) 2016-05-11 2017-05-10 Montaje de circuitos electricos y metodo para la fabricacion del mismo.

Country Status (4)

Country Link
EP (1) EP3456161A1 (es)
CN (1) CN109315068A (es)
MX (1) MX2018013731A (es)
WO (1) WO2017194618A1 (es)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5526563A (en) * 1994-03-10 1996-06-18 Matsushita Electric Industrial Co., Ltd. Method for manufacturing an electronic component
TW357332B (en) * 1997-03-12 1999-05-01 Seiko Epson Corp Electronic parts module and the electronic machine
WO1999049708A1 (en) * 1998-03-27 1999-09-30 Minnesota Mining And Manufacturing Company Method for making electrical connections between conductors separated by a dielectric
TW486721B (en) * 2000-08-30 2002-05-11 Acer Display Tech Inc Plasma display having auxiliary bonding pad
JP4318201B2 (ja) * 2003-02-27 2009-08-19 株式会社山武 回路基板組立体
JP4423970B2 (ja) * 2003-12-26 2010-03-03 ソニーケミカル＆インフォメーションデバイス株式会社 回路の接続構造及び接続方法
JP4518024B2 (ja) * 2004-02-06 2010-08-04 日立化成工業株式会社 電子装置
DE102005035102A1 (de) * 2005-07-27 2007-02-01 Robert Bosch Gmbh Elektrisch leitende Verbindung und Verfahren zum Herstellen einer solchen
EP2473014A2 (en) * 2006-03-20 2012-07-04 Sumitomo Bakelite Company, Ltd. Circuit board and connection substrate
KR20090055673A (ko) * 2007-11-29 2009-06-03 삼성전자주식회사 인쇄회로기판 조립체 및 그 제조방법
CN201639856U (zh) * 2009-11-17 2010-11-17 王定锋 带元件的双面电路板
CN202496133U (zh) * 2012-02-28 2012-10-17 比亚迪股份有限公司 一种集成柔性印刷电路板

Also Published As

Publication number Publication date
EP3456161A1 (en) 2019-03-20
CN109315068A (zh) 2019-02-05
WO2017194618A1 (en) 2017-11-16

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