MA39723A - Agencement de composants électriques - Google Patents

Agencement de composants électriques

Info

Publication number
MA39723A
MA39723A MA039723A MA39723A MA39723A MA 39723 A MA39723 A MA 39723A MA 039723 A MA039723 A MA 039723A MA 39723 A MA39723 A MA 39723A MA 39723 A MA39723 A MA 39723A
Authority
MA
Morocco
Prior art keywords
arrangement
electrical components
housing outer
component assembly
electric component
Prior art date
Application number
MA039723A
Other languages
English (en)
Inventor
Roman Jamy
Ernst Prand-Stritzko
Original Assignee
Egston System Electronics Eggenburg Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Egston System Electronics Eggenburg Gmbh filed Critical Egston System Electronics Eggenburg Gmbh
Publication of MA39723A publication Critical patent/MA39723A/fr

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/258—Metallic materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03K—PULSE TECHNIQUE
    • H03K17/00—Electronic switching or gating, i.e. not by contact-making and –breaking
    • H03K17/51—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used
    • H03K17/56—Electronic switching or gating, i.e. not by contact-making and –breaking characterised by the components used by the use, as active elements, of semiconductor devices
    • H03K17/567—Circuits characterised by the use of more than one type of semiconductor device, e.g. BIMOS, composite devices such as IGBT
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00

Landscapes

  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Motor Or Generator Frames (AREA)

Abstract

L'invention concerne un agencement de composants électriques (1) qui comprend au moins un premier composant semi-conducteur discret (2) pourvu d'un premier boîtier (3) ayant une première surface extérieure de boîtier (4) qui sert de contact électrique pour le premier composant semi-conducteur (2). Selon l'invention, la première surface extérieure de boîtier (4) est reliée de manière électriquement conductrice à une platine (5) électriquement conductrice de l'agencement de composants électriques (1) et la platine (5) électriquement conductrice est reliée de manière électriquement isolée à un dissipateur thermique (6) de l'agencement de composants électriques (1).
MA039723A 2014-03-10 2015-03-10 Agencement de composants électriques MA39723A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ATA171/2014A AT515440B1 (de) 2014-03-10 2014-03-10 Elektrische Bauteilanordnung

Publications (1)

Publication Number Publication Date
MA39723A true MA39723A (fr) 2017-01-18

Family

ID=53005436

Family Applications (1)

Application Number Title Priority Date Filing Date
MA039723A MA39723A (fr) 2014-03-10 2015-03-10 Agencement de composants électriques

Country Status (4)

Country Link
EP (1) EP3117458B1 (fr)
AT (1) AT515440B1 (fr)
MA (1) MA39723A (fr)
WO (1) WO2015135010A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202016100481U1 (de) * 2016-02-01 2017-05-04 Gebr. Bode Gmbh & Co. Kg Elektronikmodul mit einer Leistungshalbleiteranordnung
DE102016120071A1 (de) 2016-10-21 2018-04-26 Eaton Industries (Austria) Gmbh Niederspannungs-Schutzschaltgerät
EP3852138B1 (fr) 2020-01-20 2023-11-08 Infineon Technologies Austria AG Module électronique comprenant un boîtier à semi-conducteur connecté à un dissipateur thermique fluide

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2337694C2 (de) * 1973-07-25 1984-10-25 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleitergleichrichteranordnung hoher Strombelastbarkeit
US4853828A (en) * 1985-08-22 1989-08-01 Dart Controls, Inc. Solid state device package mounting apparatus
DE4025170A1 (de) * 1990-08-08 1992-02-13 Siemens Ag Elektrische baugruppe, insbesondere fuer leistungsverstaerker
EP0489958B1 (fr) * 1990-12-12 1994-03-16 Siemens Aktiengesellschaft Plaquette de circuit pour appareillage électronique de contrôle et procédé de fabrication d'une telle plaquette
JP2005079386A (ja) * 2003-09-01 2005-03-24 Toshiba Corp パワー半導体応用装置
US7427566B2 (en) * 2005-12-09 2008-09-23 General Electric Company Method of making an electronic device cooling system
JP4826426B2 (ja) * 2006-10-20 2011-11-30 株式会社デンソー 半導体装置
DE102010000082B4 (de) * 2010-01-14 2012-10-11 Woodward Kempen Gmbh Schaltungsanordnung von elektronischen Leistungsschaltern einer Stromerzeugungsvorrichtung
JP5659542B2 (ja) * 2010-04-07 2015-01-28 三菱マテリアル株式会社 絶縁基板及びパワーモジュール
KR101572787B1 (ko) * 2010-04-28 2015-11-27 가부시키가이샤 도요다 지도숏키 방열 장치 및 반도체 장치
JP2012174856A (ja) * 2011-02-21 2012-09-10 Hitachi Cable Ltd ヒートシンク及びその製造方法
JP5517988B2 (ja) * 2011-04-22 2014-06-11 日立オートモティブシステムズ株式会社 エンジン始動装置
JP2013123014A (ja) * 2011-12-12 2013-06-20 Toyota Industries Corp 半導体装置
FR2984680B1 (fr) * 2011-12-15 2014-10-31 Valeo Sys Controle Moteur Sas Structure portant un ou plusieurs composants electroniques
US9147637B2 (en) * 2011-12-23 2015-09-29 Infineon Technologies Ag Module including a discrete device mounted on a DCB substrate

Also Published As

Publication number Publication date
WO2015135010A1 (fr) 2015-09-17
EP3117458A1 (fr) 2017-01-18
EP3117458B1 (fr) 2022-01-26
AT515440A1 (de) 2015-09-15
AT515440B1 (de) 2019-07-15

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