KR100904710B1 - 연성인쇄회로기판, 이의 접합방법 및 이를 구비하는 배터리팩 - Google Patents
연성인쇄회로기판, 이의 접합방법 및 이를 구비하는 배터리팩 Download PDFInfo
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- KR100904710B1 KR100904710B1 KR1020070110922A KR20070110922A KR100904710B1 KR 100904710 B1 KR100904710 B1 KR 100904710B1 KR 1020070110922 A KR1020070110922 A KR 1020070110922A KR 20070110922 A KR20070110922 A KR 20070110922A KR 100904710 B1 KR100904710 B1 KR 100904710B1
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- South Korea
- Prior art keywords
- circuit board
- printed circuit
- flexible printed
- terminal portion
- insulating layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/42—Methods or arrangements for servicing or maintenance of secondary cells or secondary half-cells
- H01M10/425—Structural combination with electronic components, e.g. electronic circuits integrated to the outside of the casing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
- H01M50/204—Racks, modules or packs for multiple batteries or multiple cells
- H01M50/207—Racks, modules or packs for multiple batteries or multiple cells characterised by their shape
- H01M50/209—Racks, modules or packs for multiple batteries or multiple cells characterised by their shape adapted for prismatic or rectangular cells
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
- H01M50/204—Racks, modules or packs for multiple batteries or multiple cells
- H01M50/207—Racks, modules or packs for multiple batteries or multiple cells characterised by their shape
- H01M50/211—Racks, modules or packs for multiple batteries or multiple cells characterised by their shape adapted for pouch cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
- H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
- H01M50/296—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders characterised by terminals of battery packs
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M2200/00—Safety devices for primary or secondary batteries
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0397—Tab
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49126—Assembling bases
Abstract
Description
Claims (14)
- 단자부를 포함하는 배선, 상기 배선을 가운데에 두고 양측에 위치하는 제1 절연층 및 제2 절연층으로 이루어지는 다층 구조의 연성인쇄회로기판에 있어서,상기 단자부의 끝단과 상기 제1 절연층의 끝단 사이에 상기 제2 절연층의 끝단이 위치하는 것을 특징으로 하는 연성인쇄회로기판.
- 제 1 항에 있어서,상기 제1 절연층은 폴리 에틸렌 테레프탈레이트 또는 폴리 이미드로 형성되는 것을 특징으로 하는 연성인쇄회로기판.
- 제 1 항에 있어서,상기 제2 절연층은 회로보호용 절연 필름인 것을 특징으로 하는 연성인쇄회로기판.
- 제 1 항에 있어서,상기 배선은 구리 또는 니켈로 형성되는 것을 특징으로 하는 연성인쇄회로기판.
- 서로 다른 회로기판 사이에 구비되어 회로기판을 서로 전기적으로 연결시키 는 연성인쇄회로기판의 접합방법에 있어서,제1 단자부를 포함하는 배선, 상기 배선을 가운데에 두고 양측에 위치하는 제1 절연층 및 제2 절연층의 다층 구조로 이루어지며, 상기 제1 단자부의 끝단과 상기 제1 절연층의 끝단 사이에 상기 제2 절연층의 끝단이 위치하는 연성인쇄회로기판을 제공하고,제2 단자부를 포함하는 회로기판을 제공하고,상기 제1 단자부와 상기 제2 단자부가 접합되는 것을 포함하는 연성인쇄회로기판의 접합방법.
- 제 5 항에 있어서,상기 제1 단자부와 상기 제2 단자부의 접합은 솔더링으로 이루어지는 것을 특징으로 하는 연성인쇄회로기판의 접합방법.
- 제 5 항에 있어서,상기 제1 단자부는 상기 제2 단자부와 접촉되는 하부면; 및상기 하부면과 대향되는 상부면을 포함하며,상기 상부면은 노출된 전면이 땜 납에 의해 감싸지도록 솔더링이 실시되는 것을 특징으로 하는 연성인쇄회로기판의 접합방법.
- 제 7 항에 있어서,상기 하부면 측에 상기 제1 절연층이 위치하고, 상기 상부면 측에 상기 제2 절연층이 위치하는 것을 특징으로 하는 연성인쇄회로기판의 접합방법.
- 제 8 항에 있어서,상기 제1 절연층의 끝단이 상기 회로기판과 일정 간격을 유지하도록 접합이 이루어지는 것을 특징으로 하는 연성인쇄회로기판의 접합방법.
- 제 5 항에 있어서,상기 제1 절연층은 폴리 에틸렌 테레프탈레이트 또는 폴리 이미드로 형성되는 것을 특징으로 하는 연성인쇄회로기판의 접합방법.
- 제 5 항에 있어서,상기 제2 절연층은 회로보호용 절연 필름인 것을 특징으로 하는 연성인쇄회로기판의 접합방법.
- 제 1 항 내지 제 4 항 중 어느 한 항의 연성인쇄회로기판을 포함하는 배터리 팩.
- 제 12 항에 있어서,상기 배터리 팩은 다수개의 베어 셀로 이루어지는 제1 전지부;하나 또는 다수개의 베어 셀로 이루어지는 제2 전지부;상기 제1 전지부와 연결되며, 제1 패드부를 구비하는 제1 보호회로기판;상기 제2 전지부와 연결되며, 제2 패드부를 구비하는 제2 보호회로기판을 포함하고,상기 연성인쇄회로기판의 단자부는 제1 단자부 및 제2 단자부를 구비하며,상기 제1 단자부는 상기 제1 패드부와 전기적으로 연결되고, 상기 제2 단자부는 상기 제2 패드부와 전기적으로 연결되는 것을 특징으로 하는 배터리 팩.
- 제 13 항에 있어서,상기 제1 단자부 및 상기 제2 단자부는 상기 제1 패드부 및 상기 제2 패드부와 각각 접촉되는 하부면; 및상기 하부면과 대향되는 상부면을 포함하고,상기 하부면 측에 상기 제1 절연층이 위치하고, 상기 상부면 측에 상기 제2 절연층이 위치하는 것을 특징으로 하는 배터리 팩.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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KR1020070110922A KR100904710B1 (ko) | 2007-11-01 | 2007-11-01 | 연성인쇄회로기판, 이의 접합방법 및 이를 구비하는 배터리팩 |
US12/285,243 US8790130B2 (en) | 2007-11-01 | 2008-09-30 | Flexible printed circuit (PC) board, junction method thereof, and battery pack using the flexible PC board |
Applications Claiming Priority (1)
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KR1020070110922A KR100904710B1 (ko) | 2007-11-01 | 2007-11-01 | 연성인쇄회로기판, 이의 접합방법 및 이를 구비하는 배터리팩 |
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KR20090044704A KR20090044704A (ko) | 2009-05-07 |
KR100904710B1 true KR100904710B1 (ko) | 2009-06-29 |
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KR1020070110922A KR100904710B1 (ko) | 2007-11-01 | 2007-11-01 | 연성인쇄회로기판, 이의 접합방법 및 이를 구비하는 배터리팩 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20200143111A (ko) | 2019-06-14 | 2020-12-23 | 유트로닉스주식회사 | 전기 자동차 배터리 모듈용 연성인쇄회로기판 및 그 제조방법 |
US11503721B2 (en) | 2018-08-28 | 2022-11-15 | Lg Energy Solution, Ltd. | PCB assembly and manufacturing method thereof |
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KR101065963B1 (ko) * | 2009-07-28 | 2011-09-19 | 삼성에스디아이 주식회사 | 배터리팩 및 그 제조방법 |
KR101621099B1 (ko) | 2009-12-18 | 2016-05-16 | 삼성에스디아이 주식회사 | 전지 팩 및 그의 제조 방법 |
KR101199179B1 (ko) * | 2010-06-09 | 2012-11-07 | 삼성에스디아이 주식회사 | 전지스택의 전원단 연결구조 |
JP5583538B2 (ja) * | 2010-10-01 | 2014-09-03 | 三洋電機株式会社 | 電池パック |
US8609266B2 (en) * | 2011-02-18 | 2013-12-17 | Samsung Sdi Co., Ltd. | Battery pack |
US20140120401A1 (en) * | 2012-10-30 | 2014-05-01 | Samsung Sdi Co., Ltd. | Connecting structure between circuit boards and battery pack having the same |
CN103906374B (zh) * | 2012-12-28 | 2017-02-15 | 富葵精密组件(深圳)有限公司 | 刚挠结合板及其制作方法 |
DE102014212247A1 (de) * | 2014-06-26 | 2015-12-31 | Robert Bosch Gmbh | Elektrischer Verbinder für ein Batteriemodul |
CN105228343A (zh) * | 2015-09-22 | 2016-01-06 | 广东欧珀移动通信有限公司 | 一种软硬结合板及其制作方法 |
DE102019219593A1 (de) * | 2019-12-13 | 2021-06-17 | Elringklinger Ag | Elektrochemische Speichereinheit, elektrochemisches Speichersystem und Verfahren zur Herstellung einer elektrochemischen Speichereinheit |
CN111403437B (zh) * | 2020-03-16 | 2023-04-11 | 京东方科技集团股份有限公司 | 一种柔性基板和显示装置 |
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US20090117458A1 (en) | 2009-05-07 |
KR20090044704A (ko) | 2009-05-07 |
US8790130B2 (en) | 2014-07-29 |
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