1244667 九、發明說明： 【發明所屬之技術領域】 本發明係關於電漿顯示面板與撓性印刷基板之連接構 造’並針對防止電漿顯示面板之電極、特別是Ag電極的 遷移。 【先前技術】 電漿顯示面板之電極之連接構造，一般如圖8所示， 係將漿顯示面板1之玻璃基板2上之電極3，與撓性印 刷基板1 0之配線端子12，透過異向導電性黏著劑2〇以壓 接工具加熱加壓來連接。 在此，電漿顯示面板1之電極3，係由Cr/Cu/Cr、A1、 Ag專幵y成，但為降低成本，多半係使用Ag糊來形成。 另一方面，撓性印刷基板1 〇，係在PET等絕緣性薄膜 所構成之撓性基板11上形成Cu等構成之配線，將被覆層 3積層於其上方來構成，在配線端子12之表面，通常施 加錢金。 將電毅顯示面板1之電極3與撓性印刷基板1〇之配線 端子12,透過異向導電性黏著劑2〇藉加熱加壓來連接後， 以石夕’樹脂等構成之密封樹脂31、32密封。 【發明内容】 但是，在電t顯示面板1之相鄰電極間，會產生5〇v 以上之電位差。又’電漿顯示…之電極3之間距，因 例如小至〇. 2随程度，故在相鄰電才亟3間之極性不相同時， 電極3間所產生之電場強度則變大。因此，依使用環境， Ϊ244667 若在電極3存在濕氣或水分，則形成電極3之金屬被離子 化’從-方之電極移動至另_方之電極並將金屬析出於該 處，而引起所謂遷移（migratiGn)，會使電極3間產生短路。 特別是，-般廣泛使用Ag作為電極3之形成金屬，但“ 容易引起遷移。再者，在電默顯示面& )之製造過程，有 *離子從基板材料所含之化合物侵入電極之情形，而在此 情形’更容易引起遷移。因此’為了要防止電⑯3遭受濕 氣或水分’必須將電衆顯示面板！之電極3與撓性印刷基 板10之配線端子12的連接部以密封樹脂31、32密封。 然而’僅以密封樹脂3卜32來密封連接部並不能充分 防止遷移。對於此，雖已提案以A古 ^ Μ 3有陽離子交換體與陰離 子交換體之樹脂在配線間形成障壁（專利文獻丨），但連接 步驟變成複雜，成本會增加。 (專利文獻1)日本特開2000_ 18347〇號公報 本發明之目的在於，針對雷將姑-T . 、 你 T對冤漿顯不面板與撓性印刷基 板之連接構造，使用習知之壓接 i搔工具間便地防止電漿顯示 Z之電極、特別係、Ag電極之遷移’以提高配線之可靠 本發明人發現，將電漿顯示面板之電極、與挽性印刷 基板之配線端子透過異向導電性黏著劑以壓接工具加敎加 壓來連接時，藉由將壓接工具之邊緣、電聚顯示面板I電 2、及撓性印刷基板之配線端子配置於特定之位置關係， 月色顯著地抑制遷移之產生。 即，本發明提供-種電路之連接方法，係將電裝顯示 1244667 面板之電極與撓性印刷基板之配線端子透過異向導電性黏 著；=1]以壓接工具加熱加壓來連接，其特徵在於··設壓接工 /、之見度為a、電漿顯示面板之電極與撓性印刷基板之配 線端子的璺合寬度& b、從壓接工具之撓性印刷基板側邊 緣至電漿顯示面板之電極端部之距離I c、從壓接工具之 撓性印刷基板側邊緣至挽性印刷基板之被覆層端部之距離 為d、連接後之異向導電性黏著劑之寬度為e、從壓接工 /、之电水頌不面板側邊緣至撓性印刷基板之配線端子端部 之距離為f、異向導電性黏著劑所含之導電粒子之平均粒鲁 徑為m，以滿足下列條件： e> b 〇 d:m=20:l 〜2〇〇··ι 之方式’酉己置電漿顯示面板與撓性印刷基板及壓接工具。 又本發明提供一種電路之連接構造，係將電漿顯示 :板之包極與撓性印刷基板之配線端子透過異向導電性黏 著劑藉加熱加壓而構成，其特徵在於： 田人：電漿顯示面板之電極與撓性印刷基板之配線端子的 豐合寬度4 b、異向導電性黏著劑之寬度為e、撓性印刷 基板之破覆層端部與電漿顯示面板之電極端部之距離為 g、異向導電性黏著劑所含之導電粒子之平均粒 ： 滿足下列條件： m b 7 1244667 g:m=20:1〜200:1。 依本發明’使用習知之壓接工具，於電漿顯示面板與 撓性印刷基板之連接構造中，能防止電聚顯示面板之電 極、特別係Ag電極之遷移，以提高配線之可 【實施方式】 以下，參閱圖式詳細說明本發明。又，各圖中，同一 符號係表示同一或同等構成要件。 圖1纟、、員示之截面圖，係依本發明之一實施形態，將電 漿顯示面板1與撓性印刷基板1〇透過異向導電性黏著劑2〇 以壓接工具40加熱加壓來連接時，表示壓接工具40、電 漿顯示面板1及撓性印刷基板1〇之位置關係。 此電漿顯不面板1，係隔著放電空間使玻璃基板2、2， 相對向者，在其下側之玻璃基板2設置“糊印刷成之電極 3。此電極3,係將寬度〇· π] · 〇_之電極線以線距〇•卜2〇_ 並列多數條而成，在與撓性印刷基板1〇之連接部露出。 另一方面，撓性印刷基板1 ϋ，係在聚醯亞胺等構成之 撓性基板（厚度1〇〜100//m)u上積層Cu配線（厚度5〜4〇# m)且在其上方设置聚醯亞胺等構成之被覆層（厚度1〇〜5〇 13，此Cu配線之配線端子12，在與電漿顯示面板1 之連接部露出。 /、白i電性黏著劑2 0 ’係將粒徑〇 · 1〜15 e m、較佳者 為1〜1 〇 // m之導電性粒子分散於絕緣性黏著劑，成形為厚 度1 0〜5 0 /z m之薄膜狀者。此異向導電性黏著劑2 〇，藉由 力熱加壓，僅在其厚度方向出現導電性，在除此以外之方 !244667 向，不顯示導電性。又，異向導電性黏著劑2〇，亦可使用 塗料狀者’使用其塗膜藉由加熱加壓出現導電性者。 壓接工具40，使用能將被壓接物以溫度15〇〜2〇〇〇c、 壓力2〜1 〇MPa加熱加壓者。 圖1所示之本發明之方法，設壓接工具4〇之寬度為a1244667 IX. Description of the invention: [Technical field to which the invention belongs] The present invention relates to a connection structure of a plasma display panel and a flexible printed circuit board 'and aims to prevent migration of electrodes of the plasma display panel, especially Ag electrodes. [Previous technology] The connection structure of the electrodes of the plasma display panel is generally shown in FIG. 8, which connects the electrode 3 on the glass substrate 2 of the plasma display panel 1 and the wiring terminal 12 of the flexible printed substrate 10 through a different circuit. The conductive adhesive 20 is connected by heating and pressing with a crimping tool. Here, the electrode 3 of the plasma display panel 1 is made of Cr / Cu / Cr, A1, and Ag. However, in order to reduce costs, most of the electrodes are formed using an Ag paste. On the other hand, the flexible printed circuit board 10 is formed by forming a wiring made of Cu or the like on a flexible substrate 11 made of an insulating film such as PET, and a coating layer 3 is laminated on top of it, and is formed on the surface of the wiring terminal 12 Money is usually imposed. The electrodes 3 of the Yiyi display panel 1 and the wiring terminals 12 of the flexible printed circuit board 10 are connected by heat and pressure through an anisotropic conductive adhesive 20, and then a sealing resin 31 made of a resin such as Shiyuki's resin, 32 seals. SUMMARY OF THE INVENTION However, a potential difference of 50 V or more occurs between adjacent electrodes of the electric display panel 1. Also, the plasma shows that the distance between the electrodes 3 is as small as 0.2, so when the polarities between the adjacent electrodes 3 are different, the electric field intensity generated between the electrodes 3 becomes larger. Therefore, depending on the use environment, if there is moisture or moisture in the electrode 3, the metal forming the electrode 3 is ionized 'moved from the -side electrode to the other -side electrode and the metal is precipitated there, causing the so-called Migration (migratiGn) can cause a short circuit between the electrodes 3. In particular, Ag is widely used as the forming metal of the electrode 3, but "easily causes migration. Furthermore, in the manufacturing process of the electromagnetism display surface &), * ions may invade the electrode from the compound contained in the substrate material. In this case, 'migration is more likely to occur. Therefore, in order to prevent the battery 3 from being exposed to moisture or moisture', the connection between the electrode 3 display panel! Electrode 3 and the wiring terminal 12 of the flexible printed circuit board 10 must be sealed with resin. Sealing 31 and 32. However, the sealing of the connection portion with the sealing resin 3 and 32 alone cannot sufficiently prevent migration. For this reason, it has been proposed to form a resin having a cation exchanger and an anion exchanger in the wiring room. Barrier (Patent Document 丨), but the connection steps become complicated, and the cost will increase. (Patent Document 1) Japanese Patent Laid-Open No. 2000_18347〇 The purpose of the present invention is to target the thief-T. The connection structure between the panel and the flexible printed circuit board can be easily prevented by using the conventional crimping tool, and the plasma display Z electrode, especially the Ag system, can be migrated to improve the reliability of the wiring. The inventors have found that when the electrodes of the plasma display panel and the wiring terminals of the pull-type printed circuit board are connected with a crimping tool and pressurized through an anisotropic conductive adhesive, the edges of the crimping tool are electrically connected. The poly display panel I2, and the wiring terminals of the flexible printed circuit board are arranged in a specific positional relationship, and the moonlight significantly suppresses the occurrence of migration. That is, the present invention provides a circuit connection method, which is to display Denso 1244667 panel The electrode and the wiring terminal of the flexible printed circuit board are adhered through anisotropic conductivity; = 1] It is connected by heating and pressing with a crimping tool, which is characterized by setting the crimper /, the visibility is a, and the plasma display The combined width of the panel electrode and the wiring terminal of the flexible printed circuit board & b, the distance from the side of the flexible printed circuit board of the crimping tool to the electrode end of the plasma display panel I c, the flexure of the crimping tool The distance from the side edge of the flexible printed circuit board to the end of the cover layer of the printed circuit board is d, and the width of the anisotropic conductive adhesive after connection is e. Of printed substrates The distance between the end of the wire terminal is f, and the average particle diameter of the conductive particles contained in the anisotropic conductive adhesive is m, so as to satisfy the following conditions: e > b 〇d: m = 20: l ~ 2〇〇 ·· The way of ι 'is to place a plasma display panel, a flexible printed circuit board, and a crimping tool. The present invention also provides a circuit connection structure, which transmits the plasma display: the cover of the board and the wiring terminals of the flexible printed circuit board. The anisotropic conductive adhesive is formed by heating and pressurizing, and is characterized by: Tian Ren: The full width of the electrodes of the plasma display panel and the wiring terminals of the flexible printed circuit board is 4 b. The width of the anisotropic conductive adhesive is e. The distance between the end of the cover layer of the flexible printed circuit board and the electrode end of the plasma display panel is g, and the average particle size of the conductive particles contained in the anisotropic conductive adhesive: meets the following conditions: mb 7 1244667 g: m = 20: 1 ~ 200: 1. According to the present invention, using a conventional crimping tool, in the connection structure of the plasma display panel and the flexible printed circuit board, it is possible to prevent the migration of the electrode of the display panel, especially the Ag electrode, so as to improve the wiring. [Embodiment Hereinafter, the present invention will be described in detail with reference to the drawings. In the drawings, the same reference numerals indicate the same or equivalent constituent elements. 1 and 2 are cross-sectional views showing a plasma display panel 1 and a flexible printed circuit board 10 through an anisotropic conductive adhesive 20 and heated and pressurized by a crimping tool 40 according to an embodiment of the present invention. When it comes to connection, it shows the positional relationship of the crimping tool 40, the plasma display panel 1, and the flexible printed circuit board 10. The plasma display panel 1 has glass substrates 2 and 2 across a discharge space. The opposite side is provided with a paste-printed electrode 3 on the lower glass substrate 2. The electrode 3 has a width of 0 · π] · 〇_ The electrode wires are formed by juxtaposing a plurality of lines with a pitch of 〇 • 卜 2〇_ and exposed at the connection portion with the flexible printed circuit board 10. On the other hand, the flexible printed circuit board 1 Flexible substrate (thickness: 10 ~ 100 // m) made of fluorene and other materials. Cu wiring (thickness: 5 ~ 4 ##) is laminated on top of it, and a coating layer made of polyimide and other materials (thickness: 1) 〇 ~ 5〇13, the wiring terminal 12 of this Cu wiring is exposed at the connection portion with the plasma display panel 1. /, the white i electric adhesive 2 0 'is a particle diameter of 0 · 1 ~ 15 em, preferably 1 to 1 〇 // m of conductive particles dispersed in an insulating adhesive, formed into a thin film thickness of 10 to 50 / zm. This anisotropic conductive adhesive 2 〇, by force heating Pressure, only conductivity occurs in the thickness direction, in other directions! 244667 direction, does not show conductivity. In addition, anisotropic conductive adhesive 20, can also be used as a paint 'Use the coating film to be conductive by heat and pressure. The crimping tool 40 uses a person who can heat and press the object to be crimped at a temperature of 150 to 2000c and a pressure of 2 to 10 MPa. The method of the present invention shown in 1 is set as a width of the crimping tool 40.
電漿顯示面板1之電極3與撓性印刷基板之配線端子i2 的®合寬度為b，從壓接工具40之撓性印刷基板丨〇侧邊 緣至電漿顯不面板1之電極端部之距離（即，若從壓接工 具40之撓性印刷基板丨〇側邊緣朝電漿顯示面板1中央部 勺方向為正日守，該邊緣與電漿顯示面板丨之電極端部之距 離）為c，從壓接工具4〇之撓性印刷基板1〇側邊緣至撓性 印刷基板1 〇之被覆層丨3端部之距離（即，若從壓接工具 之撓性印刷基板1〇側邊緣朝撓性印刷基板1〇中央部的方 向為正時，該邊緣與被覆層13端部之距離）為d，連接後 一-向導電性黏著劑之寬度為e，從壓接卫具⑼之電裝顯 面板1側邊緣至撓性印刷基板i 〇之配線端子丄2端部之 距離(即’若從壓接工具4〇之電漿顯示面板“則邊緣朝撓 ^印刷基板1〇中央部的方向為正時，該邊緣與配線端子12 端部之距離)為f，異向導電性黏著劑所含之導電粒子之平 :句粒徑為m，以滿足下列條件之方式，配置電漿顯示面板 1、撓性印刷基板10及壓接工具40。 3 ~ 6 ^ b 9 1244667 d:m=20:1-200:1 藉由使e - b，連接部之Ag電極3露出部分減少，再 者藉由使a g e ’能以壓接工具4 0將異向導電性黏著劑2 〇 充为黏者於連接部全體。又’圖1雖表示連接後之里向導 電性黏著劑2 0未達到撓性印刷基板1 〇之被覆層13之形 態，但亦可如圖2所示，連接後之異向導電性黏著劑2〇， 不僅覆蓋連接部之Ag電極’並且亦將挽性印刷基板1 Q之 被覆層13覆蓋一部分。 又，本發明，藉由使c-0、f-0，因能以壓接工具4〇 將連接部全體加熱壓接，故能將異向導電性黏著劑2〇充 分黏貼於連接部全體。 再者，在Ag電極3與配線端子12之間藉由壓接工具 40將異向導電性黏著劑20加熱加壓，使異向導電性黏著 劑20中之導電性粒子與絕緣性黏著劑流動至連接部之周 圍時，若d小，導電性粒子之流動被撓性印刷基板1 〇之被 覆層13妨礙，導電性粒子將聚積於連接部之被覆層13側， 容易在該處引起短路。又，以壓接工具40加熱加壓時， 亦有使撓性印刷基板1 〇之非壓接部分彎曲之情形，在此 情形亦使導電性粒子聚積於連接部之被覆層13側，容易 在該處引起短路。對於此，在本發明，因使 d:m=20 : 1〜200 :1，使d充分寬廣，故能防止此種短路。 如此般，加熱壓接後之電漿顯示面板1與撓性印刷基 板10之連接構造，成為e—b，因藉由強固黏接之異向導 笔性黏著劑之絕緣性黏著劑覆蓋連接部’故能防止Ag電 10 1244667 極遭受濕氣或水分所引起之遷移。 ,c 1Λ 、 喝狀丹有右叹撓性印刷基 之被覆層1 3端部與電漿顯示面板j之電極3端部 ::為g之情形’由於g:m，:卜敝”，亦不會在連接部 異向導電性黏著劑中之導電性粒子所引起之短路。 在本發明，為了進-步防止電聚顯示面板i之電極3 的遷移產生’亦可如圖8之習知例所示，將連接部之電货 顯不面板之中央部側與挽性印刷基板之中央部側分別 封樹脂31、32密封。 (實施例） 實施例1，比較例2〜5 ^使用一般使用於電衆顯示面板之電極之連接的異向導 電性黏著劑(索尼化學公司，CP7642K，導電粒子之平均粒 徑6“），以圖！所示之配置，藉由使用壓接工具將電聚 顯示面板1之玻璃基板2(旭玻璃公司製，pD2〇〇)上之電極 3(Ag電極’厚度’線距〇 2顔，線數⑽條）、與撓 性印刷基板10之配線端子12(在厚度35"m之&配線上 依序施加鍍Ni與鍍Au者，線距〇.2mm(L/s=1/1))加熱壓 接（17(TC，3MPa’ 20秒，緩衝材料1.2咖矽橡膠）來連接。 然後，在6(TC、95%RH之環境下，進行5〇〇小時、施 加DC100V之時效（aging)處理，將鄰接端子間之連接電阻 降至106 Ω卩下之情形判定為短路，而敎短路為止之時 間。 又’除將前述之a、b、c、d、e、f之距離與—設定 如表1所示以外，同樣連接電漿顯示面板與撓性印刷基板， 1244667 調查時效處理所造成之短路產生。 又，將表1所示之比較例 1〜5之 將結果表示於表 配置，表示於圖3〜圖 實施例2 除使用如下所調製之異向導電性黏著劑者以外，盘實 施例丨同樣連接電黎顯示面板與撓性印刷基板，調查時效 處理所造成之短路產生。將結果表示於表i。 異向導電性黏著劑之調製方法：所準備之絕緣性黏著 劑，係苯氧基樹脂（東都化成公司，YP50)4〇重量份、環氧 樹脂（油化殼牌公司，EP828)30重量份與潛伏性硬化劑旭 化成λ司HX3741 ) 30重置份混合者，對此絕緣性黏著劑^ 〇 重量份，將導電性粒子（二乙烯苯進行鍍鎳/金而成，平均 粒徑2.5#m，積水精密化學公司製，微珍珠Au21〇)5重量 伤分散於其中，來製成異向導電性黏著劑。 實施例3 所使用之異向導電性黏著劑，係對實施例2之絕緣性 黏著劑1 Ο Ο ί1份，將形成鎳電鍍層於苯併4糞胺樹脂粒 _ 子表面而成的導電性粒子（平均粒子丨〇 # (日本化學公 司）5重量份分散於其中而構成。除此以外與實施例1同樣 連接電漿顯示面板與撓性印刷基板，調查時效處理所造成 之短路發生。將結果表示於表1。 12 1244667 [表1] (單位：mm) a b c d d/m e f 短路為止之時間 實施例1 J-tiA Ο 4 3 0.5 0.2 33.33 3.5 0.5 bUUhr以上 貫她例2 Ail 0 4 3 0.5 0.2 80 3.5 0.5 bUOhr以上 貫把例d lL Αιϊ 1 4 3 0.5 0.2 20 3.5 0.5 bUOhr以上 比竿父例i 2 3 Ό.5 1.5 250 2.5 -0.5 60hr 比竿父例z vU ^ jt%A 0 4 3 - 0·5 0.2 33. 33 3.2 1.5 70hi~ - 比竿父例cJ uU ^ Jl%A A 4 3 2 0.2 33. 33 3.2 -1 70hi~ ' 比牧1列4 rL· /-rt] Γ 4 3 0.5 0.2 33. 33 2.7 0.5 50hr 比毕父例l3 4 3 0.5 0.05 8. 33 3.5 0.5 Wn7 ' 從表1得知：依本發明之實施例1〜3，雖經5 〇 〇小時 _ 之N·效處理後’鄰接端子間之電阻均超過1 〇6 Ω，配線之 可靠性良好，但在比較例丨〜5均發生短路。特別，在距離 d係〇.〇5_、d/m未滿20之比較例5，在連接部之撓性印 刷基板1側異向導電性黏著劑之導電性粒子聚積，立即產 生短路。 本發明，㈣電漿顯示面板之電極與撓性印刷基板之 配線端子以異向導電性黏著劑連接時，極為有用。 【圖式簡單說明】 _ 圖㉝*纟么明之方法中、電漿顯示面板與挽性印 刷基板與壓接工具之配置的截面圖。 圖 2顯示，本發明之方法φ、+政 _ 套中電漿顯示面板與撓性印 刷基板與壓接工具之配置的截面圖。 圖3顯示，比較例中、雷漿_ + 电水顯不面板與撓性印刷基板 與壓接工具之配置的截面圖。 圖4顯示，比較例中、雷喈顧； 电水,、、、員不面板與撓性印刷基板 13 1244667 與壓接工具之配置的截面圖。 圖5顯示，比較例中、雷喈f 电水顯不面板與撓性印刷基板 與壓接工具之配置的截面圖。 圖6顯示，比較例中、雷喈翩— 电水顯不面板與撓性印刷基板 與壓接工具之配置的截面圖。 圖7顯示，比較例中、雷喈— θ 电水顯不面板與撓性印刷基板 與壓接工具之配置的截面圖。 圖8,係顯示電漿顯示器之電極連接構造的立體圖（圖 (a))及X-X截面圖（圖（b))。 春 【主要元件符號說明】 1 電漿顯示面板 2 玻璃基板 3 電裝顯不面板之電極（A g電極） I 〇 挽性印刷基板 II 撓性基板 12 配線端子 13被覆層 · 異向導電性黏著劑 31 密封樹脂 32 密封樹脂 40 壓接工具 14The bonding width of the electrode 3 of the plasma display panel 1 and the wiring terminal i2 of the flexible printed circuit board is b, from the side edge of the flexible printed circuit board of the crimping tool 40 to the electrode end of the plasma display panel 1. The distance (that is, if the edge from the flexible printed circuit board of the crimping tool 40 to the plasma display panel 1 is in the direction of the sun, the distance from the edge to the electrode end of the plasma display panel 丨 is c. The distance from the edge of the flexible printed circuit board 10 side of the crimping tool 40 to the end of the covering layer 3 of the flexible printed circuit board 10 (ie, if the edge of the flexible printed circuit board 10 side of the crimping tool The timing toward the center of the flexible printed circuit board 10 is timing, the distance between the edge and the end of the coating layer 13) is d, and the width of the unidirectional conductive adhesive after connection is e. The distance from the side edge of the electrical display panel 1 to the end of the wiring terminal 丄 2 of the flexible printed circuit board i (ie, if the plasma display panel from the crimping tool 40 is used, the edge is toward the central portion of the flexible printed circuit board 10. When the direction is positive, the distance between the edge and the end of the wiring terminal 12) is f, and the anisotropic conductive adhesive The level of conductive particles contained in the agent: the particle size is m, so that the plasma display panel 1, the flexible printed circuit board 10, and the crimping tool 40 are arranged in a manner that satisfies the following conditions: 3 ~ 6 ^ b 9 1244667 d: m = 20: 1-200: 1 By reducing e-b, the exposed portion of the Ag electrode 3 at the connection portion is reduced, and by using age ', the anisotropic conductive adhesive 2 can be filled with the crimping tool 40. It is adhered to the entire connection part. Also, although FIG. 1 shows the form of the inward conductive adhesive 20 after the connection does not reach the coating layer 13 of the flexible printed circuit board 10, it can also be shown in FIG. 2 after the connection. The anisotropic conductive adhesive 20 not only covers the Ag electrode 'at the connection portion, but also partially covers the covering layer 13 of the printed circuit board 1 Q. In addition, in the present invention, c-0, f-0, Since the entire connecting portion can be heated and crimped with the crimping tool 40, the anisotropic conductive adhesive 20 can be sufficiently adhered to the entire connecting portion. Furthermore, the Ag electrode 3 and the wiring terminal 12 are pressed by pressure. The connecting tool 40 heats and pressures the anisotropic conductive adhesive 20 to make the conductive particles and the insulating adhesive in the anisotropic conductive adhesive 20 When moving to the periphery of the connection portion, if d is small, the flow of conductive particles is hindered by the coating layer 13 of the flexible printed circuit board 10, and the conductive particles will accumulate on the coating layer 13 side of the connection portion, which is likely to cause a short circuit there. In addition, when heating and pressing with the crimping tool 40, the non-crimped portion of the flexible printed circuit board 10 may be bent. In this case, it is also easy to accumulate conductive particles on the covering layer 13 side of the connection portion, which is easy. A short circuit is caused there. In the present invention, since d: m = 20: 1 to 200: 1, and d is sufficiently wide, such a short circuit can be prevented. In this way, the plasma display after heating and crimping is displayed The connection structure between the panel 1 and the flexible printed circuit board 10 becomes e-b. Since the connection portion is covered by an insulating adhesive with a strong adhesion of an isotropic adhesive, it can prevent the Ag electricity 10 1244667 from being subjected to moisture. Or migration caused by moisture. , c 1Λ, the shape of Dan has the right end of the coating layer 1 3 of the flexible printing base and the end of the electrode 3 of the plasma display panel j :: the case of g 'because of g: m ，: 卜 敝 ”, also No short circuit caused by conductive particles in the anisotropic conductive adhesive in the connection portion. In the present invention, in order to further prevent the migration of the electrode 3 of the electropolymer display panel i, it can also be as shown in FIG. 8. As shown in the example, the central portion side of the electrical goods display panel of the connection portion and the central portion side of the pull printed substrate are sealed with resins 31 and 32, respectively. (Example) Example 1, Comparative Examples 2 to 5 ^ General use Anisotropic conductive adhesive (Sony Chemical Co., CP7642K, average particle diameter of conductive particles 6 ") used to connect the electrodes of the electric display panel. In the configuration shown, the electrode 3 (Ag electrode 'thickness') line pitch of the electrode substrate 3 (Ag electrode 'thickness') on the glass substrate 2 (manufactured by Asahi Glass Co., Ltd., pD2OO) of the electropolymer display panel 1 using a crimping tool was used. Strips), and wiring terminals 12 with flexible printed circuit board 10 (those with Ni and Au plating on the wiring of thickness 35 " m & wiring in order, line spacing 0.2mm (L / s = 1/1)) heating Pressure bonding (17 (TC, 3 MPa '20 seconds, cushioning material 1.2 coffee silicone rubber) to connect. Then, under the environment of 6 (TC, 95% RH), for 500 hours, DC 100V aging treatment was applied. , The case where the connection resistance between adjacent terminals is lowered to 106 Ω 卩 is judged as a short circuit, and 为止 is the time until short circuit. Also 'except the a, b, c, d, e, f distances and- Other than those shown in Table 1, the plasma display panel and the flexible printed circuit board were also connected in the same way, and 1244667 was investigated to investigate the occurrence of short circuits caused by the aging treatment. In addition, the results of Comparative Examples 1 to 5 shown in Table 1 are shown in the table configuration and shown As shown in Fig. 3 to Fig. 2, except that the anisotropic conductive adhesive prepared as follows is used, the disk embodiment 丨 is also connected in the same manner. The display panel and the flexible printed circuit board were investigated for short circuit caused by aging treatment. The results are shown in Table i. Modulation method of anisotropic conductive adhesive: The prepared insulating adhesive is a phenoxy resin (Dongdu Chemical Co., YP50) 40 parts by weight, 30 parts by weight of epoxy resin (Petrochemical Shell, EP828) and 30 parts by latent hardener Asahi Kasei λ Division HX3741) 30 parts by weight, this is an insulating adhesive ^ 〇 weight Conductive particles (made of nickel / gold plating of divinylbenzene with an average particle diameter of 2.5 # m, manufactured by Sekisui Fine Chemicals Co., Ltd., micro pearls Au21〇) 5 weights are dispersed therein to make anisotropic conductivity Adhesive. The anisotropic conductive adhesive used in Example 3 is 1 〇 Ο ί 1 part of the insulating adhesive of Example 2, and a nickel plating layer will be formed on the surface of the benzo 4 amine resin particles. 5 parts by weight of conductive particles (average particles 丨 〇 # (Nippon Chemical Co., Ltd.) are dispersed therein. Other than that, a plasma display panel and a flexible printed circuit board are connected in the same manner as in Example 1, and a short circuit caused by aging treatment is investigated. hair The results are shown in Table 1. 12 1244667 [Table 1] (Unit: mm) Time until abcdd / mef short circuit Example 1 J-tiA Ο 4 3 0.5 0.2 33.33 3.5 0.5 bUUhr above her example 2 Ail 0 4 3 0.5 0.2 80 3.5 0.5 bUOhr or above d lL Αιϊ 1 4 3 0.5 0.2 20 3.5 0.5 bUOhr or more than the rod parent i 2 3 Ό. 5 1.5 250 2.5 -0.5 60hr than the rod parent z vU ^ jt% A 0 4 3-0 · 5 0.2 33. 33 3.2 1.5 70hi ~-Compared to the parent cJ uU ^ Jl% AA 4 3 2 0.2 33. 33 3.2 -1 70hi ~ 'Bimu 1 column 4 rL · / -rt] Γ 4 3 0.5 0.2 33. 33 2.7 0.5 50hr Than the father's example l3 4 3 0.5 0.05 8. 33 3.5 0.5 Wn7 'It is known from Table 1 that according to the embodiments 1 to 3 of the present invention, although 5,000 hours_ After N · effect treatment, the resistance between the adjacent terminals exceeded 1.06 Ω, and the reliability of the wiring was good, but short circuits occurred in Comparative Examples 1 to 5. Particularly, in Comparative Example 5 in which the distance d is 0.05 and d / m is less than 20, the conductive particles of the anisotropic conductive adhesive on the flexible printed circuit board 1 side of the connection portion accumulate, and a short circuit immediately occurs. The present invention is extremely useful when electrodes of a plasma display panel and wiring terminals of a flexible printed circuit board are connected with an anisotropic conductive adhesive. [Brief description of the drawings] _ Figure ㉝ * 纟 Meming's method, the cross-sectional view of the configuration of the plasma display panel, the pull printing substrate and the crimping tool. FIG. 2 shows a cross-sectional view of the configuration of the plasma display panel, the flexible printed circuit board, and the crimping tool in the method φ, + policy of the method of the present invention. Fig. 3 is a cross-sectional view showing the arrangement of a lightning plasma display panel, a flexible printed circuit board, and a crimping tool in a comparative example. FIG. 4 shows a cross-sectional view of the configuration of the comparative example, Lei Jiu; Electro-hydraulic panel, flexible printed circuit board, and flexible printed circuit board. Fig. 5 is a cross-sectional view showing the arrangement of a Leifen f electro-hydraulic display panel, a flexible printed circuit board, and a crimping tool in a comparative example. Fig. 6 shows a cross-sectional view of the configuration of the comparative example, Lei Pianping-an electro-hydraulic display panel, a flexible printed circuit board, and a crimping tool. Fig. 7 is a cross-sectional view showing the arrangement of a thunder-theta electro-hydraulic display panel, a flexible printed circuit board, and a crimping tool in a comparative example. Fig. 8 is a perspective view (Fig. (A)) and an X-X sectional view (Fig. (B)) showing the electrode connection structure of the plasma display. Spring [Description of main component symbols] 1 Plasma display panel 2 Glass substrate 3 Electrode (Ag electrode) for electrical display panel I 〇 Printed printed circuit board II Flexible substrate 12 Wiring terminal 13 Covering layer · Anisotropic conductive adhesion Agent 31 Sealing resin 32 Sealing resin 40 Crimping tool 14