TWI232544B - Semiconductor devices with reduced active region defects and unique contacting schemes - Google Patents

Semiconductor devices with reduced active region defects and unique contacting schemes Download PDF

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Publication number
TWI232544B
TWI232544B TW092128288A TW92128288A TWI232544B TW I232544 B TWI232544 B TW I232544B TW 092128288 A TW092128288 A TW 092128288A TW 92128288 A TW92128288 A TW 92128288A TW I232544 B TWI232544 B TW I232544B
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Taiwan
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area
region
opening
cladding
pixel
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TW092128288A
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English (en)
Chinese (zh)
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TW200419721A (en
Inventor
Jeffrey Devin Bude
Malcolm Carroll
Clifford Alan King
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Agere Systems Inc
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Publication of TW200419721A publication Critical patent/TW200419721A/zh
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00Constructional details of devices covered by this subclass
    • H10F77/10Semiconductor bodies
    • H10F77/12Active materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • H10P14/2901Materials
    • H10P14/2902Materials being Group IVA materials
    • H10P14/2905Silicon, silicon germanium or germanium
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • H10F39/18Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
    • H10F39/184Infrared image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/24Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using chemical vapour deposition [CVD]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/27Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using selective deposition, e.g. simultaneous growth of monocrystalline and non-monocrystalline semiconductor materials
    • H10P14/271Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using selective deposition, e.g. simultaneous growth of monocrystalline and non-monocrystalline semiconductor materials characterised by the preparation of substrate for selective deposition
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34Deposited materials, e.g. layers
    • H10P14/3402Deposited materials, e.g. layers characterised by the chemical composition
    • H10P14/3404Deposited materials, e.g. layers characterised by the chemical composition being Group IVA materials
    • H10P14/3411Silicon, silicon germanium or germanium

Landscapes

  • Light Receiving Elements (AREA)
  • Recrystallisation Techniques (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
TW092128288A 2002-12-18 2003-10-13 Semiconductor devices with reduced active region defects and unique contacting schemes TWI232544B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US43435902P 2002-12-18 2002-12-18
US10/453,037 US7012314B2 (en) 2002-12-18 2003-06-03 Semiconductor devices with reduced active region defects and unique contacting schemes

Publications (2)

Publication Number Publication Date
TW200419721A TW200419721A (en) 2004-10-01
TWI232544B true TWI232544B (en) 2005-05-11

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Family Applications (1)

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TW092128288A TWI232544B (en) 2002-12-18 2003-10-13 Semiconductor devices with reduced active region defects and unique contacting schemes

Country Status (8)

Country Link
US (2) US7012314B2 (https=)
EP (1) EP1573790B1 (https=)
JP (2) JP5489387B2 (https=)
KR (1) KR20050093785A (https=)
AU (1) AU2003303492A1 (https=)
DE (1) DE60310762T2 (https=)
TW (1) TWI232544B (https=)
WO (1) WO2004061911A2 (https=)

Cited By (1)

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TWI736892B (zh) * 2018-07-27 2021-08-21 台灣積體電路製造股份有限公司 用以降低影像感測器中暗電流的覆蓋結構及其形成方法

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TW200419721A (en) 2004-10-01
WO2004061911A8 (en) 2005-08-25
EP1573790A2 (en) 2005-09-14
US7297569B2 (en) 2007-11-20
KR20050093785A (ko) 2005-09-23
US7012314B2 (en) 2006-03-14
JP2006513584A (ja) 2006-04-20
DE60310762T2 (de) 2007-10-11
JP2011238942A (ja) 2011-11-24
WO2004061911A3 (en) 2004-09-16
WO2004061911A2 (en) 2004-07-22
US20060057825A1 (en) 2006-03-16
US20040121507A1 (en) 2004-06-24
AU2003303492A8 (en) 2004-07-29
JP5489387B2 (ja) 2014-05-14
AU2003303492A1 (en) 2004-07-29
DE60310762D1 (de) 2007-02-08

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