TW509715B - Energy beam curable hydrophilic pressure sensitive adhesive composition and use thereof - Google Patents
Energy beam curable hydrophilic pressure sensitive adhesive composition and use thereof Download PDFInfo
- Publication number
- TW509715B TW509715B TW087113958A TW87113958A TW509715B TW 509715 B TW509715 B TW 509715B TW 087113958 A TW087113958 A TW 087113958A TW 87113958 A TW87113958 A TW 87113958A TW 509715 B TW509715 B TW 509715B
- Authority
- TW
- Taiwan
- Prior art keywords
- sensitive adhesive
- pressure
- energy beam
- hydrophilic
- adhesive composition
- Prior art date
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- 239000004820 Pressure-sensitive adhesive Substances 0.000 title claims abstract description 214
- 239000000203 mixture Substances 0.000 title claims abstract description 78
- 150000001875 compounds Chemical class 0.000 claims abstract description 33
- 239000003999 initiator Substances 0.000 claims abstract description 12
- 239000000178 monomer Substances 0.000 claims description 38
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 37
- 239000000853 adhesive Substances 0.000 claims description 22
- 229920001577 copolymer Polymers 0.000 claims description 22
- 230000001070 adhesive effect Effects 0.000 claims description 21
- 239000003795 chemical substances by application Substances 0.000 claims description 21
- 239000003431 cross linking reagent Substances 0.000 claims description 15
- 238000006243 chemical reaction Methods 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims description 10
- 230000003472 neutralizing effect Effects 0.000 claims description 9
- 125000004432 carbon atom Chemical group C* 0.000 claims description 8
- 238000010528 free radical solution polymerization reaction Methods 0.000 claims description 8
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 6
- 230000000379 polymerizing effect Effects 0.000 claims description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 3
- 239000011203 carbon fibre reinforced carbon Substances 0.000 claims description 3
- 125000001183 hydrocarbyl group Chemical group 0.000 claims description 3
- 229910052739 hydrogen Inorganic materials 0.000 claims description 3
- 239000001257 hydrogen Substances 0.000 claims description 3
- 230000000977 initiatory effect Effects 0.000 claims description 2
- 150000003512 tertiary amines Chemical class 0.000 claims description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 claims 1
- 239000004927 clay Substances 0.000 claims 1
- 239000002131 composite material Substances 0.000 claims 1
- 229910052744 lithium Inorganic materials 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 34
- 238000005406 washing Methods 0.000 abstract description 8
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- 235000012431 wafers Nutrition 0.000 description 56
- -1 3-methoxybutyl Chemical group 0.000 description 27
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 17
- 239000010410 layer Substances 0.000 description 15
- 238000004519 manufacturing process Methods 0.000 description 15
- 238000005498 polishing Methods 0.000 description 15
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 12
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- 229920000642 polymer Polymers 0.000 description 12
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- 230000000052 comparative effect Effects 0.000 description 9
- 239000000428 dust Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- 229920001223 polyethylene glycol Polymers 0.000 description 9
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 8
- 229910052757 nitrogen Inorganic materials 0.000 description 8
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 7
- 239000005977 Ethylene Substances 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 235000019441 ethanol Nutrition 0.000 description 7
- 239000007787 solid Substances 0.000 description 7
- 239000004094 surface-active agent Substances 0.000 description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000002253 acid Substances 0.000 description 6
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 6
- 229920001971 elastomer Polymers 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 238000006116 polymerization reaction Methods 0.000 description 6
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- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 5
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 5
- 125000003545 alkoxy group Chemical group 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 5
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical class OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 5
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 5
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 5
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- 238000002360 preparation method Methods 0.000 description 5
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 239000004971 Cross linker Substances 0.000 description 4
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical class OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 4
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- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 3
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical compound ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 150000002009 diols Chemical class 0.000 description 3
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- 238000007720 emulsion polymerization reaction Methods 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 150000002430 hydrocarbons Chemical group 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
- 229910052753 mercury Inorganic materials 0.000 description 3
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- 239000002736 nonionic surfactant Substances 0.000 description 3
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- 229920002635 polyurethane Polymers 0.000 description 3
- 230000002829 reductive effect Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- OAUFYPSOBZURDI-UHFFFAOYSA-N C1=CC=CC=2C3=CC=CC=C3CC12.C1=CC=CC=2C3=CC=CC=C3CC12.[C].[C] Chemical compound C1=CC=CC=2C3=CC=CC=C3CC12.C1=CC=CC=2C3=CC=CC=C3CC12.[C].[C] OAUFYPSOBZURDI-UHFFFAOYSA-N 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
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- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 2
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
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- 150000001412 amines Chemical class 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
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Classifications
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- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
- Y10T428/2852—Adhesive compositions
- Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
- Y10T428/2891—Adhesive compositions including addition polymer from unsaturated monomer including addition polymer from alpha-beta unsaturated carboxylic acid [e.g., acrylic acid, methacrylic acid, etc.] Or derivative thereof
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Polymers & Plastics (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Medicinal Chemistry (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23223897A JP4072927B2 (ja) | 1997-08-28 | 1997-08-28 | エネルギー線硬化型親水性粘着剤組成物およびその利用方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW509715B true TW509715B (en) | 2002-11-11 |
Family
ID=16936147
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW087113958A TW509715B (en) | 1997-08-28 | 1998-08-25 | Energy beam curable hydrophilic pressure sensitive adhesive composition and use thereof |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US6040048A (cg-RX-API-DMAC7.html) |
| EP (1) | EP0899316B1 (cg-RX-API-DMAC7.html) |
| JP (1) | JP4072927B2 (cg-RX-API-DMAC7.html) |
| KR (1) | KR100539009B1 (cg-RX-API-DMAC7.html) |
| CN (1) | CN1136283C (cg-RX-API-DMAC7.html) |
| DE (1) | DE69824502T2 (cg-RX-API-DMAC7.html) |
| SG (1) | SG70118A1 (cg-RX-API-DMAC7.html) |
| TW (1) | TW509715B (cg-RX-API-DMAC7.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI404785B (zh) * | 2006-09-01 | 2013-08-11 | Nitto Denko Corp | 施加於切割中之活性表面之感壓黏著帶或片及切割工件之拾取方法 |
Families Citing this family (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6235387B1 (en) * | 1998-03-30 | 2001-05-22 | 3M Innovative Properties Company | Semiconductor wafer processing tapes |
| JP4053656B2 (ja) | 1998-05-22 | 2008-02-27 | リンテック株式会社 | エネルギー線硬化型親水性粘着剤組成物およびその利用方法 |
| JP4149583B2 (ja) * | 1998-09-10 | 2008-09-10 | 株式会社ディスコ | 研削装置 |
| JP2000328023A (ja) * | 1999-05-21 | 2000-11-28 | Lintec Corp | 粘着シート |
| US7476533B2 (en) | 2002-04-19 | 2009-01-13 | Adhesives Research, Inc. | Diagnostic devices for use in the assaying of biological fluids |
| JP4812963B2 (ja) * | 2001-05-18 | 2011-11-09 | リンテック株式会社 | 半導体ウエハ加工用粘着シートおよび半導体ウエハの加工方法 |
| JP2005179496A (ja) * | 2003-12-19 | 2005-07-07 | Nitto Denko Corp | 加熱剥離型粘着シート |
| KR100686772B1 (ko) * | 2004-10-06 | 2007-02-23 | 엘지전자 주식회사 | 전기오븐레인지 |
| JP2006165004A (ja) * | 2004-12-02 | 2006-06-22 | Sumitomo Bakelite Co Ltd | 半導体ウエハ加工用粘着テープ |
| SG160396A1 (en) * | 2005-03-18 | 2010-04-29 | Denki Kagaku Kogyo Kk | Adhesive composition and temporary fixation method of member using it |
| TWI333672B (en) * | 2005-03-29 | 2010-11-21 | Furukawa Electric Co Ltd | Wafer-dicing adhesive tape and method of producing chips using the same |
| EP1972663A4 (en) * | 2006-01-13 | 2010-06-02 | Denki Kagaku Kogyo Kk | HARDENABLE RESIN COMPOSITION, SURFACE PROTECTION METHOD, METHOD OF TEMPORARY FIXING AND SEPARATION METHOD |
| WO2010040103A1 (en) | 2008-10-03 | 2010-04-08 | Micronics, Inc. | Microfluidic apparatus and methods for performing blood typing and crossmatching |
| KR101006526B1 (ko) * | 2008-10-22 | 2011-01-07 | 주식회사 하이닉스반도체 | 웨이퍼 마운트 테이프, 이를 이용한 웨이퍼 가공 장치 및 방법 |
| KR101832735B1 (ko) | 2011-09-27 | 2018-02-28 | 율촌화학 주식회사 | 웨이퍼 다이싱용 점착 테이프 |
| JP5376345B2 (ja) * | 2011-10-11 | 2013-12-25 | 綜研化学株式会社 | 光重合性粘着剤組成物及びこれを使用した粘着シート |
| JP5376346B2 (ja) * | 2011-10-18 | 2013-12-25 | 綜研化学株式会社 | 光重合性粘着剤組成物及びこれを利用した粘着シート |
| JP5909460B2 (ja) * | 2012-09-28 | 2016-04-26 | 富士フイルム株式会社 | 半導体装置製造用仮接着剤、並びに、それを用いた接着性支持体、及び、半導体装置の製造方法。 |
| WO2014182844A1 (en) | 2013-05-07 | 2014-11-13 | Micronics, Inc. | Microfluidic devices and methods for performing serum separation and blood cross-matching |
| CN105143385B (zh) * | 2013-09-27 | 2017-09-29 | 琳得科株式会社 | 电剥离性粘合剂组合物、电剥离性粘合片、以及电剥离性粘合片的使用方法 |
| WO2018118767A1 (en) | 2016-12-22 | 2018-06-28 | Avery Dennison Corporation | Convertible pressure sensitive adhesives comprising urethane (meth) acrylate oligomers |
| CN107446516B (zh) * | 2017-09-01 | 2020-10-23 | 安徽明讯新材料科技股份有限公司 | 一种基材可回收的保护膜及其制备方法 |
| JP7201529B2 (ja) * | 2019-04-26 | 2023-01-10 | 藤森工業株式会社 | 光学用粘着剤組成物、及びそれを用いた粘着フィルム、粘着シート |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5653171A (en) * | 1979-09-11 | 1981-05-12 | Hitachi Chem Co Ltd | Preparation of adhesive film |
| JPH0616524B2 (ja) * | 1984-03-12 | 1994-03-02 | 日東電工株式会社 | 半導体ウエハ固定用接着薄板 |
| JPS60223139A (ja) * | 1984-04-18 | 1985-11-07 | Nitto Electric Ind Co Ltd | 半導体ウエハ固定用接着薄板 |
| JPS6143677A (ja) * | 1984-08-07 | 1986-03-03 | Mitsui Toatsu Chem Inc | Ｉｃプロセス用フイルム |
| JPH0811788B2 (ja) * | 1985-10-30 | 1996-02-07 | 日東電工株式会社 | 半導体ウエハの保護部材 |
| DE3639266A1 (de) * | 1985-12-27 | 1987-07-02 | Fsk K K | Haftfolie |
| JPS62205180A (ja) * | 1986-03-03 | 1987-09-09 | F S K Kk | 粘着シ−ト |
| DE3787680T2 (de) * | 1986-07-09 | 1994-03-10 | Lintec Corp | Klebestreifen zum Kleben von Plättchen. |
| US5149586A (en) * | 1987-07-08 | 1992-09-22 | Furukawa Electric Co., Ltd. | Radiation-curable adhesive tape |
| US5281473A (en) * | 1987-07-08 | 1994-01-25 | Furakawa Electric Co., Ltd. | Radiation-curable adhesive tape |
| JP3181284B2 (ja) * | 1990-01-12 | 2001-07-03 | 旭電化工業株式会社 | エネルギー線反応性粘着剤組成物 |
| JP3014203B2 (ja) * | 1992-02-07 | 2000-02-28 | 日本カーバイド工業株式会社 | 活性エネルギー線硬化型感圧接着剤組成物 |
| US5302629A (en) * | 1992-05-15 | 1994-04-12 | Berejka Anthony J | Hydrophilic acrylic pressure sensitive adhesives |
| JP3208501B2 (ja) * | 1992-06-02 | 2001-09-17 | 日東電工株式会社 | 半導体ウエハの保護部材 |
| JP2736486B2 (ja) * | 1992-07-03 | 1998-04-02 | 花王株式会社 | クレンジング用組成物 |
| JP3260845B2 (ja) * | 1992-09-07 | 2002-02-25 | 株式会社リコー | 記録装置 |
| JP2590682B2 (ja) * | 1993-03-30 | 1997-03-12 | 荒川化学工業株式会社 | 活性エネルギー線硬化性含水樹脂組成物 |
| JPH0766102A (ja) * | 1993-08-24 | 1995-03-10 | Nitto Denko Corp | レジスト剥離用の吸水性シート類、及びこれを用いたレジストの剥離方法 |
| JP2984549B2 (ja) * | 1994-07-12 | 1999-11-29 | リンテック株式会社 | エネルギー線硬化型感圧粘着剤組成物およびその利用方法 |
| JPH08253736A (ja) * | 1995-01-20 | 1996-10-01 | Kansai Paint Co Ltd | 活性エネルギー線硬化型接着剤組成物、該組成物を用いるラミネートフィルムの形成方法およびラミネートフィルム |
| JPH08302309A (ja) * | 1995-04-27 | 1996-11-19 | Nitto Denko Corp | レジスト剥離用接着シ―ト類と剥離方法 |
| DE19520238C2 (de) * | 1995-06-02 | 1998-01-15 | Beiersdorf Ag | Selbstklebeband |
-
1997
- 1997-08-28 JP JP23223897A patent/JP4072927B2/ja not_active Expired - Lifetime
-
1998
- 1998-08-25 TW TW087113958A patent/TW509715B/zh not_active IP Right Cessation
- 1998-08-27 KR KR1019980034896A patent/KR100539009B1/ko not_active Expired - Lifetime
- 1998-08-27 DE DE69824502T patent/DE69824502T2/de not_active Expired - Lifetime
- 1998-08-27 EP EP98306877A patent/EP0899316B1/en not_active Expired - Lifetime
- 1998-08-27 US US09/141,385 patent/US6040048A/en not_active Expired - Lifetime
- 1998-08-28 CN CNB981185231A patent/CN1136283C/zh not_active Expired - Fee Related
- 1998-08-28 SG SG1998003344A patent/SG70118A1/en unknown
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI404785B (zh) * | 2006-09-01 | 2013-08-11 | Nitto Denko Corp | 施加於切割中之活性表面之感壓黏著帶或片及切割工件之拾取方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1210126A (zh) | 1999-03-10 |
| KR100539009B1 (ko) | 2006-03-20 |
| DE69824502T2 (de) | 2004-11-04 |
| JPH1161090A (ja) | 1999-03-05 |
| SG70118A1 (en) | 2000-01-25 |
| DE69824502D1 (de) | 2004-07-22 |
| US6040048A (en) | 2000-03-21 |
| KR19990023936A (ko) | 1999-03-25 |
| HK1017372A1 (en) | 1999-11-19 |
| JP4072927B2 (ja) | 2008-04-09 |
| CN1136283C (zh) | 2004-01-28 |
| EP0899316A1 (en) | 1999-03-03 |
| EP0899316B1 (en) | 2004-06-16 |
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| GD4A | Issue of patent certificate for granted invention patent | ||
| MK4A | Expiration of patent term of an invention patent |