TW421664B - Epoxy resin composition for print circuit board and its laminate sheet - Google Patents
Epoxy resin composition for print circuit board and its laminate sheet Download PDFInfo
- Publication number
- TW421664B TW421664B TW085107522A TW85107522A TW421664B TW 421664 B TW421664 B TW 421664B TW 085107522 A TW085107522 A TW 085107522A TW 85107522 A TW85107522 A TW 85107522A TW 421664 B TW421664 B TW 421664B
- Authority
- TW
- Taiwan
- Prior art keywords
- epoxy resin
- condensate
- bisphenol
- item
- flame retardant
- Prior art date
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- 239000003822 epoxy resin Substances 0.000 title claims abstract description 68
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 68
- 239000000203 mixture Substances 0.000 title claims abstract description 23
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims abstract description 57
- 125000003700 epoxy group Chemical group 0.000 claims abstract description 5
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 claims abstract description 5
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 30
- -1 isocyanate-protected imidazole Chemical class 0.000 claims description 21
- 238000011049 filling Methods 0.000 claims description 16
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 15
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 15
- 150000002989 phenols Chemical class 0.000 claims description 15
- 229920005989 resin Polymers 0.000 claims description 15
- 239000011347 resin Substances 0.000 claims description 15
- 229920003986 novolac Polymers 0.000 claims description 14
- 239000003063 flame retardant Substances 0.000 claims description 13
- 239000002648 laminated material Substances 0.000 claims description 13
- RGHHSNMVTDWUBI-UHFFFAOYSA-N 4-hydroxybenzaldehyde Chemical compound OC1=CC=C(C=O)C=C1 RGHHSNMVTDWUBI-UHFFFAOYSA-N 0.000 claims description 12
- SMQUZDBALVYZAC-UHFFFAOYSA-N salicylaldehyde Chemical compound OC1=CC=CC=C1C=O SMQUZDBALVYZAC-UHFFFAOYSA-N 0.000 claims description 12
- 239000004593 Epoxy Substances 0.000 claims description 10
- 230000002079 cooperative effect Effects 0.000 claims description 8
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 claims description 7
- 238000006735 epoxidation reaction Methods 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 5
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 claims description 3
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical group C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 239000011888 foil Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 238000009833 condensation Methods 0.000 claims description 2
- 230000005494 condensation Effects 0.000 claims description 2
- PCTMTFRHKVHKIS-BMFZQQSSSA-N (1s,3r,4e,6e,8e,10e,12e,14e,16e,18s,19r,20r,21s,25r,27r,30r,31r,33s,35r,37s,38r)-3-[(2r,3s,4s,5s,6r)-4-amino-3,5-dihydroxy-6-methyloxan-2-yl]oxy-19,25,27,30,31,33,35,37-octahydroxy-18,20,21-trimethyl-23-oxo-22,39-dioxabicyclo[33.3.1]nonatriaconta-4,6,8,10 Chemical compound C1C=C2C[C@@H](OS(O)(=O)=O)CC[C@]2(C)[C@@H]2[C@@H]1[C@@H]1CC[C@H]([C@H](C)CCCC(C)C)[C@@]1(C)CC2.O[C@H]1[C@@H](N)[C@H](O)[C@@H](C)O[C@H]1O[C@H]1/C=C/C=C/C=C/C=C/C=C/C=C/C=C/[C@H](C)[C@@H](O)[C@@H](C)[C@H](C)OC(=O)C[C@H](O)C[C@H](O)CC[C@@H](O)[C@H](O)C[C@H](O)C[C@](O)(C[C@H](O)[C@H]2C(O)=O)O[C@H]2C1 PCTMTFRHKVHKIS-BMFZQQSSSA-N 0.000 claims 2
- 150000001299 aldehydes Chemical class 0.000 claims 2
- 150000002632 lipids Chemical class 0.000 claims 2
- 239000002023 wood Substances 0.000 claims 2
- ABRVLXLNVJHDRQ-UHFFFAOYSA-N [2-pyridin-3-yl-6-(trifluoromethyl)pyridin-4-yl]methanamine Chemical compound FC(C1=CC(=CC(=N1)C=1C=NC=CC=1)CN)(F)F ABRVLXLNVJHDRQ-UHFFFAOYSA-N 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 239000007859 condensation product Substances 0.000 abstract description 5
- 239000000654 additive Substances 0.000 abstract description 2
- 230000009477 glass transition Effects 0.000 abstract description 2
- 230000000996 additive effect Effects 0.000 abstract 1
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- LLEMOWNGBBNAJR-UHFFFAOYSA-N biphenyl-2-ol Chemical class OC1=CC=CC=C1C1=CC=CC=C1 LLEMOWNGBBNAJR-UHFFFAOYSA-N 0.000 abstract 1
- 230000003628 erosive effect Effects 0.000 abstract 1
- BTNMPGBKDVTSJY-UHFFFAOYSA-N keto-phenylpyruvic acid Chemical compound OC(=O)C(=O)CC1=CC=CC=C1 BTNMPGBKDVTSJY-UHFFFAOYSA-N 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 15
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 12
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 12
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 12
- 239000002966 varnish Substances 0.000 description 12
- 238000005260 corrosion Methods 0.000 description 10
- 238000002845 discoloration Methods 0.000 description 10
- 230000007797 corrosion Effects 0.000 description 9
- 239000004843 novolac epoxy resin Substances 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 239000011889 copper foil Substances 0.000 description 8
- 229960003742 phenol Drugs 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 238000013329 compounding Methods 0.000 description 7
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 7
- CDFCBRMXZKAKKI-UHFFFAOYSA-N 2-hydroxybenzaldehyde;phenol Chemical compound OC1=CC=CC=C1.OC1=CC=CC=C1C=O CDFCBRMXZKAKKI-UHFFFAOYSA-N 0.000 description 6
- 238000010521 absorption reaction Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 6
- 239000004744 fabric Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 239000000123 paper Substances 0.000 description 5
- 239000004848 polyfunctional curative Substances 0.000 description 5
- CXCSZVYZVSDARW-UHFFFAOYSA-N 1,2-dicyanoguanidine Chemical compound N#CNC(N)=NC#N CXCSZVYZVSDARW-UHFFFAOYSA-N 0.000 description 4
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 4
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N 4-methylimidazole Chemical compound CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 description 4
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 4
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 4
- 229910052794 bromium Inorganic materials 0.000 description 4
- 229930003836 cresol Natural products 0.000 description 4
- 239000011810 insulating material Substances 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 239000012948 isocyanate Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000003377 acid catalyst Substances 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 150000002513 isocyanates Chemical class 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- LLPKQRMDOFYSGZ-UHFFFAOYSA-N 2,5-dimethyl-1h-imidazole Chemical compound CC1=CN=C(C)N1 LLPKQRMDOFYSGZ-UHFFFAOYSA-N 0.000 description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 2
- IBGBGRVKPALMCQ-UHFFFAOYSA-N 3,4-dihydroxybenzaldehyde Chemical compound OC1=CC=C(C=O)C=C1O IBGBGRVKPALMCQ-UHFFFAOYSA-N 0.000 description 2
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 229920001665 Poly-4-vinylphenol Polymers 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 125000002723 alicyclic group Chemical group 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 2
- 238000003491 array Methods 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000006482 condensation reaction Methods 0.000 description 2
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 2
- 238000005187 foaming Methods 0.000 description 2
- 150000004820 halides Chemical class 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- ALQLPWJFHRMHIU-UHFFFAOYSA-N 1,4-diisocyanatobenzene Chemical compound O=C=NC1=CC=C(N=C=O)C=C1 ALQLPWJFHRMHIU-UHFFFAOYSA-N 0.000 description 1
- BKFRZOZNMWIFLH-UHFFFAOYSA-N 1-decyl-2-methylimidazole Chemical compound CCCCCCCCCCN1C=CN=C1C BKFRZOZNMWIFLH-UHFFFAOYSA-N 0.000 description 1
- AJHFBIPDUISYDU-UHFFFAOYSA-N 2-(2-ethyl-5-methyl-1h-imidazol-4-yl)propanenitrile Chemical compound CCC1=NC(C(C)C#N)=C(C)N1 AJHFBIPDUISYDU-UHFFFAOYSA-N 0.000 description 1
- PQAMFDRRWURCFQ-UHFFFAOYSA-N 2-ethyl-1h-imidazole Chemical compound CCC1=NC=CN1 PQAMFDRRWURCFQ-UHFFFAOYSA-N 0.000 description 1
- QUPKCFBHJFNUEW-UHFFFAOYSA-N 2-ethyl-4,5-dihydro-1h-imidazole Chemical compound CCC1=NCCN1 QUPKCFBHJFNUEW-UHFFFAOYSA-N 0.000 description 1
- YTWBFUCJVWKCCK-UHFFFAOYSA-N 2-heptadecyl-1h-imidazole Chemical compound CCCCCCCCCCCCCCCCCC1=NC=CN1 YTWBFUCJVWKCCK-UHFFFAOYSA-N 0.000 description 1
- NCVGSSQICKMAIA-UHFFFAOYSA-N 2-heptadecyl-4,5-dihydro-1h-imidazole Chemical compound CCCCCCCCCCCCCCCCCC1=NCCN1 NCVGSSQICKMAIA-UHFFFAOYSA-N 0.000 description 1
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 description 1
- VWSLLSXLURJCDF-UHFFFAOYSA-N 2-methyl-4,5-dihydro-1h-imidazole Chemical compound CC1=NCCN1 VWSLLSXLURJCDF-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- BKCCAYLNRIRKDJ-UHFFFAOYSA-N 2-phenyl-4,5-dihydro-1h-imidazole Chemical compound N1CCN=C1C1=CC=CC=C1 BKCCAYLNRIRKDJ-UHFFFAOYSA-N 0.000 description 1
- FUOZJYASZOSONT-UHFFFAOYSA-N 2-propan-2-yl-1h-imidazole Chemical compound CC(C)C1=NC=CN1 FUOZJYASZOSONT-UHFFFAOYSA-N 0.000 description 1
- LLEASVZEQBICSN-UHFFFAOYSA-N 2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=CN1 LLEASVZEQBICSN-UHFFFAOYSA-N 0.000 description 1
- FQHUDZKKDCTQET-UHFFFAOYSA-N 2-undecyl-4,5-dihydro-1h-imidazole Chemical compound CCCCCCCCCCCC1=NCCN1 FQHUDZKKDCTQET-UHFFFAOYSA-N 0.000 description 1
- UIDDPPKZYZTEGS-UHFFFAOYSA-N 3-(2-ethyl-4-methylimidazol-1-yl)propanenitrile Chemical compound CCC1=NC(C)=CN1CCC#N UIDDPPKZYZTEGS-UHFFFAOYSA-N 0.000 description 1
- UCNCZASVJWGNBZ-UHFFFAOYSA-N 3-(2-ethyl-5-methyl-1h-imidazol-4-yl)propanenitrile Chemical compound CCC1=NC(CCC#N)=C(C)N1 UCNCZASVJWGNBZ-UHFFFAOYSA-N 0.000 description 1
- RXXCIBALSKQCAE-UHFFFAOYSA-N 3-methylbutoxymethylbenzene Chemical compound CC(C)CCOCC1=CC=CC=C1 RXXCIBALSKQCAE-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- CPHGOBGXZQKCKI-UHFFFAOYSA-N 4,5-diphenyl-1h-imidazole Chemical compound N1C=NC(C=2C=CC=CC=2)=C1C1=CC=CC=C1 CPHGOBGXZQKCKI-UHFFFAOYSA-N 0.000 description 1
- PBEHQFUSQJKBAS-UHFFFAOYSA-N 4-[2-(4-hydroxyphenyl)propan-2-yl]phenol;phenol Chemical compound OC1=CC=CC=C1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 PBEHQFUSQJKBAS-UHFFFAOYSA-N 0.000 description 1
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 description 1
- JJUVAPMVTXLLFR-UHFFFAOYSA-N 5-methyl-2-phenyl-4,5-dihydro-1h-imidazole Chemical compound N1C(C)CN=C1C1=CC=CC=C1 JJUVAPMVTXLLFR-UHFFFAOYSA-N 0.000 description 1
- 241000473391 Archosargus rhomboidalis Species 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 235000000177 Indigofera tinctoria Nutrition 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
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- 150000001298 alcohols Chemical class 0.000 description 1
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- 125000000217 alkyl group Chemical group 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 1
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- 239000004842 bisphenol F epoxy resin Substances 0.000 description 1
- 210000000988 bone and bone Anatomy 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
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- 239000003054 catalyst Substances 0.000 description 1
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- 238000000576 coating method Methods 0.000 description 1
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- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- GPLRAVKSCUXZTP-UHFFFAOYSA-N diglycerol Chemical group OCC(O)COCC(O)CO GPLRAVKSCUXZTP-UHFFFAOYSA-N 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- 238000006266 etherification reaction Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 description 1
- 229910052839 forsterite Inorganic materials 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- OTGHWLKHGCENJV-UHFFFAOYSA-N glycidic acid Chemical compound OC(=O)C1CO1 OTGHWLKHGCENJV-UHFFFAOYSA-N 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 239000004845 glycidylamine epoxy resin Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical class [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004356 hydroxy functional group Chemical group O* 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 125000000879 imine group Chemical group 0.000 description 1
- 125000001841 imino group Chemical group [H]N=* 0.000 description 1
- 229940097275 indigo Drugs 0.000 description 1
- COHYTHOBJLSHDF-UHFFFAOYSA-N indigo powder Natural products N1C2=CC=CC=C2C(=O)C1=C1C(=O)C2=CC=CC=C2N1 COHYTHOBJLSHDF-UHFFFAOYSA-N 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 150000002903 organophosphorus compounds Chemical class 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- KSSNXJHPEFVKHY-UHFFFAOYSA-N phenol;hydrate Chemical compound O.OC1=CC=CC=C1 KSSNXJHPEFVKHY-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- LBAXOHQGCISIGG-UHFFFAOYSA-N prop-2-enenitrile 1,3,5-triazine-2,4,6-triamine Chemical compound N1=C(N)N=C(N)N=C1N.C(C=C)#N LBAXOHQGCISIGG-UHFFFAOYSA-N 0.000 description 1
- QCTJRYGLPAFRMS-UHFFFAOYSA-N prop-2-enoic acid;1,3,5-triazine-2,4,6-triamine Chemical compound OC(=O)C=C.NC1=NC(N)=NC(N)=N1 QCTJRYGLPAFRMS-UHFFFAOYSA-N 0.000 description 1
- FVSKHRXBFJPNKK-UHFFFAOYSA-N propionitrile Chemical compound CCC#N FVSKHRXBFJPNKK-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000003223 protective agent Substances 0.000 description 1
- 229960003371 protocatechualdehyde Drugs 0.000 description 1
- 150000003335 secondary amines Chemical class 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229910052596 spinel Inorganic materials 0.000 description 1
- 239000011029 spinel Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- KCDXJAYRVLXPFO-UHFFFAOYSA-N syringaldehyde Chemical compound COC1=CC(C=O)=CC(OC)=C1O KCDXJAYRVLXPFO-UHFFFAOYSA-N 0.000 description 1
- COBXDAOIDYGHGK-UHFFFAOYSA-N syringaldehyde Natural products COC1=CC=C(C=O)C(OC)=C1O COBXDAOIDYGHGK-UHFFFAOYSA-N 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 150000003866 tertiary ammonium salts Chemical class 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical class C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 1
- MWOOGOJBHIARFG-UHFFFAOYSA-N vanillin Chemical compound COC1=CC(C=O)=CC=C1O MWOOGOJBHIARFG-UHFFFAOYSA-N 0.000 description 1
- FGQOOHJZONJGDT-UHFFFAOYSA-N vanillin Natural products COC1=CC(O)=CC(C=O)=C1 FGQOOHJZONJGDT-UHFFFAOYSA-N 0.000 description 1
- 235000012141 vanillin Nutrition 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
- DIHAURBCYGTGCV-UHFFFAOYSA-N xi-4,5-Dihydro-2,4(5)-dimethyl-1H-imidazole Chemical compound CC1CN=C(C)N1 DIHAURBCYGTGCV-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3218—Carbocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5046—Amines heterocyclic
- C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
- C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
- C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
- C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
- C08L61/12—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols with polyhydric phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C08L63/04—Epoxynovolacs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/145—Organic substrates, e.g. plastic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/012—Flame-retardant; Preventing of inflammation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2913—Rod, strand, filament or fiber
- Y10T428/2915—Rod, strand, filament or fiber including textile, cloth or fabric
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Epoxy Resins (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
經濟部中央標準局員工消費合作社印製 421 664 A7 B7五、發明説明(1 ) 本發明係有關,製造印刷電路板所使用之印刷電路板 用環氧樹脂組成物及使用其之印刷電路板用層合板* 隨著電子機器的小型化、高性能化,其中所搭配的印 刷電路板亦趨向於高層化,薄物化、通孔之小口徑化及孔 洞間隔之縮減等高密度化。又近年來•半導體晶片直接搭 載於印刷電路板上並以樹脂封口等之塑膠針柵陣列或塑膠 球柵陣列等半導體,皆有使用到印刷電路板。在使用半導 體片時,印刷電路板在製造過程中必須經過1 7 5 °C以上 之高溫金屬線熱接著(wirebonding)或樹脂封口等步驟 。此時印刷電路板之強度或弾性率不足時易引起熱接著之 接觸不良或樹脂封口後發生翹曲、扭曲等問題*在使7 5 °C以上之髙溫域中強度或彈性率等高溫特性提高,則印刷 電路板須較以後具有更高之Tg (玻璃移轉溫度)方可。 且半導體片用的印刷電路板則被要求更高的高密度線路, 且須具有絕緣性。 在此要求下,印刷電路板中絕緣材料之環氧樹脂進入 了高T g化。高Tg化方法,例如特開昭 6 0 — 1 5 5 4 5 3號公報所載般,多官能環氧樹脂係以 二氰基胍硬化而得之系統進行廣泛研究。但,二氰基胍硬 化系具高吸濕性的缺點,而無法滿足隨著今後層合材料之 高密度化而要求之髙度絕緣性,特別是在絕緣特性中,在 絕綠材料上或絕緣材料內構成配線或布局圖樣或電極等金 靥,因在高濕度環境下,依電位差作用而在絕緣材料上或 絕緣材料內移動的金屬移位(電蝕)常會造成極大的問題 I.--------^------ΐτ------^ (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS ) Α4規格(21〇Χ 297公釐) 經濟部中夬標隼局貝工消費合作杜印製 421 664 A7 __B7 五、發明説明(2 ) 0 相對於此,使用多官能性苯酚類爲硬化劑的印刷電路 板,因吸水性低故具有良好的耐電蝕性。但使用此多官能 性苯酚類之印刷電路板,因多官能性苯酚類種類之不同而 會產生加熱處理時的變色問題。特公昭6 2 — 28 1 68 號公報,以提高此加熱變色性爲目的*而提出了以苯酚或 雙酚A爲主原料配合高鄰苯酚•甲醛樹脂製得之硬化劑系 ,而可得到耐1 75 °C以上高溫之具Tg的印刷電路板。 本發明鑑於各種背景,而以提供一用於印刷電路板製 造上,具低吸濕性、優良耐熱性及有髙溫特性、耐電蝕性 、耐加熱變色性,及高T g之可用於製造印刷電路板之環 氧樹脂組成物爲目的。 本發明又以提供一使用上記環氧樹脂組成物製得之具 優良耐熱性、有高溫特性、耐電蝕性、耐加熱變色性、及 髙T g之印刷電路板用層合板爲目的。 即,本發明係以提供一種含(a )苯酚類與羥基苯甲 醛之縮合物經環氧化所得之環氧樹脂及(b )雙酚A與甲 醛之縮合物、(c)難燃劑、(d)硬化促進劑爲必要組 成份之印刷電路板用環氧樹脂組成物。 又*本發明係提供一種,將由上記印刷電路板用環氧 樹脂組成物構成的樹脂漆滲浸基材,將乾燥後所得之層合 材料(pre preg)重合,將其單面或雙面貼附金屬箔,再 經加熱加壓成型而得之印刷電路板用層合板》 以下,將本發明再予詳細說明。 本紙張尺度適用中國國家標準(〔~5)六4規格(2〗0\297公釐) I--------裝------訂------^ (請先閲讀背面之注項再填寫本頁) -5 - 421664 經濟部中央標準局員工消費合作社印袋 A7 B7 五、發明説明(3 ) (a )之環氧樹脂係由苯酚類與羥基苯甲醛之縮合物 經環氧化而得。苯酚類以使用例如苯酚 '甲酚,具有丙基 、第三丁基等烷基之一價苯酚類爲佳,而以苯酚爲最常使 用*羥基苯甲醛例如,水楊醛、m -羥基苯甲醛、p~羥 基苯甲醛、香草醛、丁香醛、J3 -間羥苯甲醛、原兒茶醛 等,而以水楊醛最常使用。 苯酚類與羥基苯甲醛之縮合反應並無特別限定,在酸 觸媒下苯酚類1莫耳的對羥基苯甲醛〇..〇莫耳 ,較佳爲0.3〜·15莫耳反應即可。 所得縮合物以環氣氯丙烷等環氧化劑進行環氧化即可 得(a )之環氧樹脂。 作爲(a )之環氧樹脂原料所用之苯酚類、羥基苯甲 醛、環氧化劑之種類並沒有特別的限定,縮合及環氧化的 方法也沒有特別限定,較佳之(a )環氧樹脂爲,對1莫 耳苯酚,配合水楊醛〇 _ 1〜3 . 0莫耳在鹽酸等酸觸媒 的存在下’於8 0〜2 5 0 °C反應1〜6小時所得縮合物 之羥基配合至少3當量環氧氯丙烷反應而得環氧樹脂,以 其重量平均分子量爲700〜5,000,軟化溫度爲 40〜1 40 °C,環氧當量爲1 30〜280者爲佳。 又’本發明中,亦可併用(a )之環氧樹脂以外的環 氧樹脂°例如,雙酚A型環氧樹脂、雙酚F型環氧樹脂、 雙酚S型環氧樹脂,聯苯酚型環氧樹脂、酚醛清漆型環氧 樹脂、甲酚清漆型環氧樹脂、雙酚A酚醛清漆型環氧樹脂 、雙酣F酚醛清漆型環氧樹脂 '脂環式環氧樹脂' 脂肪族 本紙張尺度適用中國國家標準(C\TS ) A4说格(2丨0 X 297公釐) 装------ΪΤ------冰 (請先閱讀背面之注意事項再填寫本頁) -6 - 2 1 664 經濟部中央標準局員工消費合作社印裝 A7 B7五、發明説明(4 ) 鏈狀環氣樹脂、縮水甘油酸酯型環氧樹脂、縮水甘油胺型 環氧樹脂、乙內醯脲型環氧樹脂、異氰酸酯型環氧樹脂' 其他,如二官能性苯酚類縮水甘油醚化合物、二官能性醇 之縮水甘油醚化合物、及其氫添加物等等。此些環氧樹脂 皆可相互併用。 (a )之環氧樹脂以外之其他環氧樹脂的配合比例爲 ,對(a)環氧樹脂1〇〇重量份,以〇〜200重量份 爲佳。更佳爲10〜100重量份。 (b)之雙酚A與甲醛的縮合物其分子量並無特別限 制’以重量平均分子量爲250〜20,000爲佳。縮 合物中可含有雙酚A單體。縮合反應在酸觸媒的存在下, 以雙酚A 1莫耳對甲醛0 _ 1〜6 _ 0莫耳於80〜2 5 0 °C下反應爲佳。 雙酚A與甲醛之縮合物較佳例子如,羥基當量爲 1 0 0〜1 3 0之雙酚A酚醛清漆樹脂等》 此雙酚Α與甲醛之縮合物係作爲硬化劑使用,其配合 量爲•對(a )之環氧樹脂中環氧基而言,(b )之縮合 物的苯酚性羥基之當量介於〇 _ 5〜1 . 5當量範圍爲佳 。更佳爲0 _ 9〜1 _ 1當量範圍間。 又’可併用雙酚A與甲醛的縮合物以外的硬化劑,例 如,雙酚F、聚乙烯苯酚、又如苯酚,甲苯酚,烷基苯酚 、鄰苯二酚、雙酚F等所得之酚醛清漆樹脂。此些化合物 之分子量並無特別限制,亦可數種類合併使用。此些化合 物之配合比例爲對(b )之雙酚A與甲醛的縮合物1 〇 〇 (請先閱讀背面之注意事項再填寫本頁} 本紙張尺度適用中國國家標準(〇1\'5)八4規格(2丨0/297公着) "7 - 421664 A7 B7 經濟部中央標準局員工消費合作社印製 五、發明説明(5) 重量份,以0〜1 0 0重量份爲佳。 (C )之難燃劑只要爲一般稱爲難燃劑之物質皆可’ 例如,雙酚A型環氧樹脂、雙酚F型環氧樹脂、雙酚S型 環氧樹脂、酚醛清漆型環氧樹脂、甲苯酚醛清漆型環氧樹 脂、雙酚A酚醛清漆型環氧樹脂、雙酚F酚醛清漆型環氧 樹脂、脂環式環氧樹脂、脂肪族鏈狀環氧樹脂、縮水甘油 酸酯型環氧樹脂、縮水甘油胺型環氧樹脂、乙內醯腺型環 氧樹脂、異氰酸酯型環氧樹脂•其他’二官能性苯酚類之 縮水甘油醚化合物、二官能醇之縮水甘油醚化合物等之鹵 化物、雙酚A、雙酚F、聚乙烯苯酚、或苯酚、甲苯酚、 烷基苯酚、鄰苯酚、雙苯酚F等酚醛清漆樹脂等之鹵化物 、三氧化銻、三苯基磷鹽等。其中,以四溴基雙酚A、四 溴基雙酚A之縮水甘油醚化合物、苯酚與甲醛的縮合物之 縮水甘油醚化合物之溴化物爲最佳。 (c )之難燃劑之配合比例爲,對(a )之環氧樹脂 100重量份,較佳爲20〜500重量份、更佳爲30 〜2 0 0重量份。 (d )之硬化促進劑爲,可促進環氧基與苯酚性羥基 之乙醚化反應且具觸媒機能之化合物皆可使用,例如,碱 金屬化合物、碱土金屬化合物、咪唑化合物、有機磷化合 物、第2級胺、第三級胺、第四級銨鹽等等。 較佳爲使用咪唑化合物。使用亞胺基經丙烯睛、異氰 酸酯、三聚氤胺丙烯腈等保護化之咪唑化合物時,可得較 以往具2倍以上保存安定性之層合材料。
In n n I I I n^ (請先聞讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CN'S ) A4规格(210x297公釐) 8 421664 經濟部中央標隼局員工消資合作社印製 A7 B7五、發明説明(6 ) 此處所用之咪唑化合物,包含咪唑環之化合物及咪哩 啉環化合物,例如,咪唑、2 —乙基咪唑、2 —乙基—4 一甲基咪唑' 2 -苯基咪唑、2 -十一烷基咪唑、1—爷 基一 2 —甲基咪唑、2 —十七烷基咪唑、4,5 —二苯基 咪唑,2 —甲基咪唑啉、2 —苯基咪唑啉、2 —十一烷基 咪唑啉、2 -十七烷基咪唑啉、2 -異丙基咪唑、2,4 一二甲基咪唑、2 —苯基一 4 一甲基咪唑、2 —乙基咪哩 啉' 2-異丙基咪唑啉、2,4 一二甲基咪唑啉、2 -苯 基- 4 -甲基咪唑啉等等,亞胺基之保護化劑,例如丙嫌 腈、對苯二異氰酸酯、甲苯胺異氰酸酯、對某二異氰酸酯 、亞甲基雙苯基異氰酸酯、三聚氰胺丙烯酸酯等等。 此些硬化促進劑可數種併用,其配合量爲,對環氧樹 脂100重量份爲0.01〜5重量份爲佳。而以 0.05〜2重量份爲更佳。低於0.01重量份則不具 促進效果,超過5重量份時則保存安定性不佳。 本發明之環氧樹脂組成物,可於各種利用形態如基材 塗佈、滲浸時使用溶劑》其溶劑可爲丙酮,甲基乙基酮、 甲苯、二甲苯、甲基異丁基酮、醋酸乙酯、乙二醇一甲醚 、N,N —二甲替乙醯胺、甲醇、乙醇等,其可數種混合 使用β 本發明之環氧樹脂組成物中,可配合一種以上無機填 充劑,如結晶矽、溶融矽、鋁粉、锆石'矽酸鈣、碳酸鈣 、碳化矽、氮化矽、氮化硼、氧化鈹、氧化鎂、氧化鉻、 鎂橄欖石、塊骨石、尖晶石、模來石、二氧化鈦等粉體及 (請先閣讀背面之注項再填寫本頁) 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -9 - m 664 經濟部中央標準局員Η消費合作.'4印製 A7 B7 五、發明説明(7 ) 鈦酸鉀、碳化矽、氮化矽、鋁粉等單結晶纖維、玻璃織維 等。 無機填充劑之配合量,以對(a) 、( b ) 、( c ) 合計1 Ο 0重量份爲6 5 0重量份以下,較佳爲2 Ο 〇重 量份以下。配合比例可爲2〜6 5 0重量份。 依前項各成份配合而得之漆,可滲浸玻璃布、玻塙不 織布或紙、玻璃成份以外的布等基材中,於乾燥逋內以 8 0〜2 0 0 °C範圍內乾燥,可製得印刷電路用層合材料 。將此層合材料數片重叠,必要時可將單面或雙面壓覆鲷 箔等金靥箔,於1 50〜1 90°C,以20〜80kgf / c ni範圍內加熱加壓而可製造印刷電路板用層合板《 又,使用此層合材料與印刷電路板接著時,可製得多 層印刷電路板》 又,層合材料製法中之乾燥步驟,於使用溶劑時爲去 除溶劑,未使用溶劑時爲至室溫下不具流動性爲止。 本發明爲使用苯酚類與羥基苯甲醛之縮合物經環氧化 所得環氧樹脂及配合雙酚A與甲醛之縮合物、難燃劑,硬 化促進劑等,可較以往環氧樹脂組成物之縮水甘油醚基與 苯酚性羥基的反應率提高,硬化物的架橋密度增加’降低 成爲印刷電路板時之吸濕性,具優良耐熱性與高溫特性、 耐電蝕性、耐加熱變色性。且具高T g之環氧樹脂組成物 實施例 本紙張尺度適用t國國家標準(CNS ) Α4規格(210ΧΜ7公釐) (請先閱讀背面之注意事項再填寫本頁} -訂. -10 - 經濟部中央標準局負τ;消費合作社印製 421664 A7 _______B7 五、發明説明(8 ) 以下將本發明以實施例爲基礎作詳細說明,但本發明 並不受此限制。 實施例1 將苯酚水楊醛清漆型環氧樹脂(環氧當量1 7 〇 ) 1 0 0重量份與雙酚A酚醛清漆樹脂(羥基當量1 i 4) 4 6重量份及四溴基雙酚A (溴含有率5 8重量%,羥基 當量272) 5 1重量份溶於甲基乙基酮中》配合硬化促 進劑之1 一氰乙基一 2 —乙基一4 —甲基咪唑0 . 3重量 份,製得不揮發成份爲6 5重量%之清漆》 實施例2 將苯酚水楊醛清漆型環氧樹脂5 4重量份與溴化雙酚 A型環氧樹脂(溴含量4 9重量%,環氧當量4 0 0 ) 4 6重量份及雙酚A酚醛清漆型樹脂5 0重量份溶於甲基 乙基酮中<配合硬化促進劑之1 一氰乙基-2-乙基-4 一甲基咪唑0 . 3重量份,製得不揮發成份爲6 5重量% 之清漆。 實施例3 將苯酚水楊醛清漆型環氧樹脂3 6重量份與溴化酚醛 清漆型環氧樹脂(溴含量3 5 . 5重量%,環氧當量 2 8 4 ) 6 4重量份及雙酚A酚醛清漆型樹脂5 0重量份 溶於甲基乙基酮中。配合硬化促進劑之1 一氰乙基-2 — 本紙張尺度適用中國國家標準(CN’S ) Λ4規格(2Ι0Χ297公釐) I---------^------、玎------^ (請先閱讀背面之注意事項再填寫本頁) -11 - 421664 A7 ____B7 "X、發明説明(9 ) 乙基-4 一甲基咪唑〇 . 3重量份,製得不揮發成份爲 6 5重量%之清漆^ 實施例4 將1 —氰乙基一 2_乙基一 4 —甲基咪唑以六甲撐二 異氰酸酯保護之2 -乙基一 4 —甲基咪唑0 · 5重量份取 代外,其他皆依實施例相同比例製造清漆· 比較例1 實施例1中,將苯酚水楊醛清漆型環氧樹脂以鄰甲酚 酚醛清漆型環氧樹脂(環氧當量195) 1〇〇重量取代 ,配合雙酚A酚醛清漆樹脂3 8重量份及四溴基雙酣A 4 8重量份以外,其他皆依實施例1相同之比例製造清漆 比較例2 實施例1中,將雙酚A酚醛清漆樹脂以®酸清漆樹脂 (羥基當量1 0 6 ) 4 6重量份取代’配合雙 漆5 0重量份以外,其他皆依實施例1相同之比例製造清 漆。 比較例3 將低溴化環氧樹脂(溴含量2 1重量% ’環氧當量 4 8 5 ) 8 0重量份與苯酚水楊醛清漆型樹脂2 0重量份 本紙張尺度適用中國國家標隼(CNS ) A4规格(210X29*7公釐〉 __ I I I I I 1 I i I I I I 訂— I I I —^‘ (請先閱讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消赀合作社印裂 12 4 2 1 b 6 4 A7 B7 經濟部中央標準局員工消費合作社印梦 五、發明説明(10) ’配合溶於乙二醇-甲醚之二氰基胍}重量份。及配合硬 化促進劑之1—氰乙基一2 —乙基一4 一甲基咪唑0 · 2 重量份以製造不揮發成份6 5重量份之清漆* 比較例4 於比較例3中,將苯酚水楊醛清漆型環氧樹脂以鄰甲 酚酚醛清漆型環氧樹脂取代外,其他依比較例3相同比例 製造清漆》 各實施例及比較例1〜4之主要配合內容如表1所示 。表1中配合量之單位爲重量份。又,將各實施例及比較 例1〜4所得清漆’滲浸入厚〇 . 2咖I之玻璃布,於 1 60 °C經2〜5分加熱得靥合材料。對製得之層合材料 ,於製得後立即於25°C、50%RH進行60日保存, 隨後以凝膠時間進行保存安定性之評恬。又,將所得層合 材料4枚重疊’其兩側再壓以1 8 之銅箔,以1 7 5 X、90分、2 5MPa之壓合條件製作兩面銅箔之層 合板。對所得兩面銅箔之層合板測試其電焊耐熱性、吸水 率、耐電蝕性、加熱變色性及常溫與2 0 0°C之曲折強度 、曲折彈性率等。其結果如表2及表3所示*又,上述兩 面銅箔層合板,全部具有相當於UL - 9 4 V0之耐燃 性。 ---------裝------訂------^ (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS ) A4規格(210 X 297公釐) -13 - 經濟部中史標卒局吳工消費合作"印掣 4(1664 A7 __B7 五、發明説明(U) 表1
I, i 訂-J, (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS ) Λ4規格(210X 297公釐〉 14 - ^ 2 1 b 6 4 A7 ___B7 五、發明説明(12 ) 表2 經濟部中央標準局員1:消費合作社印製 實施例 1 2 3 層合材料之凝膠時間(秒) ®後 122 121 120 125 6 0日後 100 103 101 12 1 Tg 205 200 195 210 電焊耐熱性 ΟΚ ΟΚ ΟΚ ΟΚ 吸水率(麗%) 0.56 0-45 0.48 0-59 至導通破壞爲止之日數 >250 >250 >250 >250 加觀色性 〇 〇 〇 〇 曲折強度 常溫 620 638 660 600 2 0CTC 82 84 78 86 ,隐 常溫 22.6 23.1 23-3 22.5 2 0CTC 13.3 13.1 13.1 13.4 本紙張尺度適用中國國家標準(CNS ) Λ4規格(210乂29?公釐) ---------裝------,訂------/. (請先閲讀背面之注意事項再填寫本頁) -15 - .'C. 4 4 b Ο
7 B 五、發明説明(13) 表 3 經濟部令央標準局1貝5消費合作社印製 比較例 1 2 3 4 層合材料之凝膠時間(秒) 製造後 120 12 1 117 120 6 0日後 101 100 9 5 98 Tg 135 175 162 132 電焊耐熱性 NG OK NG OK 吸水率(龍%) 0.55 0.58 1.12 1.05 至導通破壤爲止之曰數 205 200 50 5 5 力_變色性 〇 X Δ △ 曲折強度 常溫 6 18 633 621 642 2 0 0°C 32 57 35 25 曲折彈性率 常溫 22.8 23.1 22.7 23.5 2 0 0。。 10.4 12.4 10.2 9.5 —----------裝— (請先閲讀背面之注意事項再填寫本頁) 訂 -Λ 本紙張尺度適用中國國家標準(CNS ) Λ4規格(2】0X297公釐) -16 - 864 864 經濟部中央標隼局員T:消費合作社印袈 A7 ____B7 五、發明説明(μ) 試驗方法如以下敘述。
Tg :將銅箔侵入,以ΤΜΑ (熱機械分析)測定*單位 :°C電焊耐熱性:將銅箔侵入,於加壓加熱測試機中保持 2小時後,浸入2 6 0°C焊料2 0秒後,以目視觀察外觀 變化》表中NG爲,產生水紋或起泡之意,0K爲,未產 生水紋或起泡之意。 吸水率:將銅箔侵入,於加壓加熱測試機中保持4小時, 並計算其前後的重量差》單位:重量% 加熱變色性:將銅箔侵入,於大氣中以1 6 0°C處理5小 時後’以目視評估。未變色者爲〇,些許變色者爲△,變 色者爲X。 耐電蝕試劑:使用通孔間隔爲3 5 0 之試驗板,對各 試料測定經過4 0 0孔之絕緣電阻時間<測試條件,8 5 °C、9 0%RH環境下附加1 〇 〇v,測定發生導通破壞 時所需時間。 曲析試驗:依J I S C6481規定,於常溫及200 °C下測定*單位:曲折強度(GPa)、曲折彈性率( MPa) 由上述結果得知下列事項。 環氧樹脂使用苯酚水楊醛清漆型環氧樹脂之實施例1 〜4 ’具有1 95°(:以上的高Tg、及良好的電焊耐熱性 、耐電蝕性。又’對常溫之曲折強度、曲折弾性率而言, 2 0 0 °C之曲折強度' 曲折彈性率降低不多。又,硬化促 進劑使用異氤酸酯保護之咪唑的實施例4,對層合材料具 本紙張尺度適用中國_國_家榇準(CNS ) A4规格「210X297公楚) ~~— -17 - --.-------.裝------訂------.-Λ (請先閲讀背面之注意事項再填寫本頁) 421664 A7 ______B7_五、發明説明(15) 良好的保存安定性》 又,使用雙酚A酚醛樹脂之實施例1〜4及比較例1 具有良好的加熱變色性》 相對於此,環氧樹脂使用鄰甲酚酚醛清漆型環氧樹脂 之比較例1及,取代雙酚A酚醛清漆樹脂之酚醛清漆樹脂 之比較例2,Tg較低、200 °C之曲折強度、曲折強性 率亦不佳。硬化劑使用酚醛清漆之比較例2其加熱變色性 不佳,又,使用二氰基胍之比較例3及比較例4吸水率高 ,且耐電蝕性劣化。 使用本發明之印刷電路板用環氧樹脂組成物製造印刷 電路板時,可製得低吸濕性,優良耐熱性及具高溫特性、 耐電蝕性、耐加熱變色性,且高Tg之印刷電路板。 I n I I I I 11. . (. - I 1 II I (請先閲讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作it印絮 本紙張尺度適用中囤國家標準(CNS ) A4規格(2I0X297公釐) -18 -
Claims (1)
- ABCD 421664 經濟部智慧財4局員工消费合作社印袈 六、 t緣暑利範1 S | η 1 t j V. * — 第 85107522 號 專 利 串 請 案 1 1 午 η -iEj 中 文 串 m 專 利 範 圍 修 正 本 1 1 L_ _ 1 _ 民 國 89年 9月 修 正 I 請 1 I 先 1 閲 1 . ~ 種 印 刷 電 路 板 用 環 氧 樹 脂 組 成 物 t 其 特 徵 係 由 讀 背 面 ! 1 ( a )苯 酚 類 與 羥 基 苯 甲 醛 之 縮 合 物 經 環 氧 化 所 得 之 環 氧 之 注 1 1 樹 脂 及( b ) 雙 酚 A 與 甲 醛 之 縮 合 物 > ( C ) 難 燃 劑 、 ( 1 項 1 1 再 1 d ) 硬化 促 進 劑 爲 必 要 組 成 份 所 組 成 其 中 寫 木 裝 1 (a ) 之 環 氧 樹 脂 係 由 苯 酚 與水 楊 醛 之 縮 合 物 經 環 氧 頁 I 1 化 所 得之 樹 脂 1 I (b ) 之 雙 酚 A 與 甲 醛 之 縮 合 物 爲 雙 酚 A 酚 醛 清 漆樹 1 1 I 脂 1 訂 I 對( a ) 之 環 氧 樹 脂 之 環 氧 基 而 ( b ) 縮 合 物 的 1 1 苯 酚 性羥 基 之 當 量 係 以 0 5 1 5 當 量 之範 圍 來 配 合 1 1 1 ( d ) 之 硬 化 促 進劑 爲 異 氰 酸 酯 保 護 之 咪 唑 〇 1 1 2 . 如 串 請 專 利 範 圍 第 1 項 所述 之 組 成 物 其 中 ( 各卜 1 C ) 之難 燃 劑 爲 四 溴 基 雙 酚 A 9 1 3 如 丰 請 專 利 範 圍 第 1 項 所 述 之 組 成物 其 中 ( 1 1 I C ) 之難 燃 劑 爲 四 溴 基 雙 酚 A 之 縮 水 甘 油 醚 化 合 物 P 1 4 . 如 串 專 利 範 圍 第 1 項 所 述 之 組 成 物 其 中 ( 1 1 C ) 之難 燃 劑 爲 苯 酚 與 甲 醛 之 縮 合 物 的 縮 水 甘 油 醚 化 合物 1 1 之 溴 化物 1 1 5 — 種 印 刷 電 路 用 層 合板 其 係 將 串 請 專 利 範 圍 第 1 1 1 項 所述 之 印 刷 電 路 板 用 環 氧 樹 脂 組 成 物 所 形 成 之 樹 脂 清 1 1 表紙張尺度適用中國國家梂牵(CNS) A4規格(210X297公着) 421664 as Β8 C8 D8 六、申請專利範圍漆浸滲入基材後,將乾燥所得層合材料重合,其單面或兩 面以金屬箔覆蓋後加壓加熱而製得。 -* . 裝 IίτA. (請先閱讀背面之注意事項再填寫本頁) 經濟部智.¾財4.局員工消費合作社印製 本紙乐尺度通用中國國家橾牵(CNS)A4说格( 210X 297公釐) - 2 _ ABCD 421664 經濟部智慧財4局員工消费合作社印袈 六、 t緣暑利範1 S | η 1 t j V. * — 第 85107522 號 專 利 串 請 案 1 1 午 η -iEj 中 文 串 m 專 利 範 圍 修 正 本 1 1 L_ _ 1 _ 民 國 89年 9月 修 正 I 請 1 I 先 1 閲 1 . ~ 種 印 刷 電 路 板 用 環 氧 樹 脂 組 成 物 t 其 特 徵 係 由 讀 背 面 ! 1 ( a )苯 酚 類 與 羥 基 苯 甲 醛 之 縮 合 物 經 環 氧 化 所 得 之 環 氧 之 注 1 1 樹 脂 及( b ) 雙 酚 A 與 甲 醛 之 縮 合 物 > ( C ) 難 燃 劑 、 ( 1 項 1 1 再 1 d ) 硬化 促 進 劑 爲 必 要 組 成 份 所 組 成 其 中 寫 木 裝 1 (a ) 之 環 氧 樹 脂 係 由 苯 酚 與水 楊 醛 之 縮 合 物 經 環 氧 頁 I 1 化 所 得之 樹 脂 1 I (b ) 之 雙 酚 A 與 甲 醛 之 縮 合 物 爲 雙 酚 A 酚 醛 清 漆樹 1 1 I 脂 1 訂 I 對( a ) 之 環 氧 樹 脂 之 環 氧 基 而 ( b ) 縮 合 物 的 1 1 苯 酚 性羥 基 之 當 量 係 以 0 5 1 5 當 量 之範 圍 來 配 合 1 1 1 ( d ) 之 硬 化 促 進劑 爲 異 氰 酸 酯 保 護 之 咪 唑 〇 1 1 2 . 如 串 請 專 利 範 圍 第 1 項 所述 之 組 成 物 其 中 ( 各卜 1 C ) 之難 燃 劑 爲 四 溴 基 雙 酚 A 9 1 3 如 丰 請 專 利 範 圍 第 1 項 所 述 之 組 成物 其 中 ( 1 1 I C ) 之難 燃 劑 爲 四 溴 基 雙 酚 A 之 縮 水 甘 油 醚 化 合 物 P 1 4 . 如 串 專 利 範 圍 第 1 項 所 述 之 組 成 物 其 中 ( 1 1 C ) 之難 燃 劑 爲 苯 酚 與 甲 醛 之 縮 合 物 的 縮 水 甘 油 醚 化 合物 1 1 之 溴 化物 1 1 5 — 種 印 刷 電 路 用 層 合板 其 係 將 串 請 專 利 範 圍 第 1 1 1 項 所述 之 印 刷 電 路 板 用 環 氧 樹 脂 組 成 物 所 形 成 之 樹 脂 清 1 1 表紙張尺度適用中國國家梂牵(CNS) A4規格(210X297公着)
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JP16067195 | 1995-06-27 |
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TW085107522A TW421664B (en) | 1995-06-27 | 1996-06-22 | Epoxy resin composition for print circuit board and its laminate sheet |
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US (1) | US6329474B1 (zh) |
EP (1) | EP0835892B1 (zh) |
KR (1) | KR100271050B1 (zh) |
CN (1) | CN1109702C (zh) |
DE (1) | DE69610771T2 (zh) |
HK (1) | HK1015388A1 (zh) |
TW (1) | TW421664B (zh) |
WO (1) | WO1997001591A1 (zh) |
Families Citing this family (13)
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JPH10279779A (ja) * | 1997-04-07 | 1998-10-20 | Hitachi Chem Co Ltd | 印刷配線板用エポキシ樹脂組成物及び該組成物を用いたプリプレグ、金属張り積層板 |
JPH10279778A (ja) * | 1997-04-07 | 1998-10-20 | Hitachi Chem Co Ltd | 印刷配線板用エポキシ樹脂組成物及び該組成物を用いたプリプレグ、金属張り積層板 |
JPH11209456A (ja) * | 1998-01-29 | 1999-08-03 | Hitachi Chem Co Ltd | 印刷配線板用難燃性エポキシ樹脂組成物及びこれを用いたプリプレグ、金属箔張り積層板 |
CN1091452C (zh) * | 1999-11-26 | 2002-09-25 | 巴陵石化岳阳石油化工总厂 | 一种酚醛型环氧树脂固化剂的制造方法 |
KR100419063B1 (ko) * | 2000-06-10 | 2004-02-14 | 주식회사 엘지화학 | 에폭시 수지 조성물 및 이를 이용한 적층판 |
DE10300462A1 (de) * | 2003-01-07 | 2004-07-15 | Bakelite Ag | Phosphormodifiziertes Epoxidharz |
US7078816B2 (en) * | 2004-03-31 | 2006-07-18 | Endicott Interconnect Technologies, Inc. | Circuitized substrate |
JP4634856B2 (ja) * | 2005-05-12 | 2011-02-16 | 利昌工業株式会社 | 白色プリプレグ、白色積層板、及び金属箔張り白色積層板 |
JP4961903B2 (ja) * | 2006-04-27 | 2012-06-27 | 日立化成工業株式会社 | エポキシ樹脂組成物、エポキシ樹脂プリプレグ、金属張積層板および印刷配線板 |
FR2929622B1 (fr) * | 2008-04-04 | 2011-03-04 | Eads Europ Aeronautic Defence | Revetements mesostructures comprenant un agent texturant particulier, pour application en aeronautique et aerospatiale |
JP5344394B2 (ja) * | 2008-07-10 | 2013-11-20 | 山栄化学株式会社 | 硬化性樹脂組成物、並びにハロゲンフリー樹脂基板及びハロゲンフリービルドアッププリント配線板 |
KR101084507B1 (ko) * | 2009-04-01 | 2011-11-18 | 아이디비켐(주) | 유기 인계 난연제 및 이의 제조방법 |
JP2021127404A (ja) * | 2020-02-14 | 2021-09-02 | 昭和電工マテリアルズ株式会社 | 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法 |
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JPS57141419A (en) | 1981-02-27 | 1982-09-01 | Mitsubishi Petrochem Co Ltd | Production of polyepoxide |
JPS6322824A (ja) * | 1986-07-15 | 1988-01-30 | Hitachi Chem Co Ltd | 電子部品封止用エポキシ樹脂成形材料 |
JPH0725865B2 (ja) * | 1987-09-07 | 1995-03-22 | 日本化薬株式会社 | 樹脂組成物 |
US5008350A (en) | 1987-12-16 | 1991-04-16 | Sumitomo Chemical Company, Limited | Glycidyl ethers of phenolic compounds and process for producing the same |
JPH0273818A (ja) | 1988-09-09 | 1990-03-13 | Mitsubishi Petrochem Co Ltd | ポリフエノールの製造法 |
JP2726483B2 (ja) * | 1989-03-17 | 1998-03-11 | 日本化薬株式会社 | 高耐熱難燃性樹脂組成物 |
EP0394965A3 (en) * | 1989-04-25 | 1991-12-18 | Mitsubishi Denki Kabushiki Kaisha | Resin composition for laminate |
US5661223A (en) | 1989-04-25 | 1997-08-26 | Mitsubishi Denki Kabushiki Kaisha | Composition of phenolic resin-modified epoxy resin and straight chain polymer |
JPH0379621A (ja) * | 1989-05-12 | 1991-04-04 | Mitsubishi Electric Corp | 積層板用樹脂組成物 |
JPH0776282B2 (ja) * | 1989-10-06 | 1995-08-16 | 日立化成工業株式会社 | 印刷配線板用プリプレグの製造方法 |
JPH04236216A (ja) * | 1991-01-14 | 1992-08-25 | Toshiba Chem Corp | 封止用樹脂組成物及び半導体封止装置 |
JP2702002B2 (ja) | 1991-05-16 | 1998-01-21 | 三菱電機株式会社 | 銅張積層板の製法 |
US5334674A (en) * | 1991-06-19 | 1994-08-02 | Dai-Ichi Kogyo Seiyaku Co., Ltd. | Polyhydroxy aromatic compounds, epoxy resins derived therefrom and epoxy resin compositions |
JP3331222B2 (ja) * | 1992-02-27 | 2002-10-07 | ジャパンエポキシレジン株式会社 | エポキシ樹脂及びエポキシ樹脂組成物 |
US5346743A (en) | 1992-03-13 | 1994-09-13 | Kabushiki Kaisha Toshiba | Resin encapsulation type semiconductor device |
JP3046443B2 (ja) * | 1992-03-13 | 2000-05-29 | 株式会社東芝 | 封止用エポキシ樹脂組成物および樹脂封止型半導体装置 |
JP3124735B2 (ja) | 1997-03-25 | 2001-01-15 | メルテックス株式会社 | 金めっき剥離液 |
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1996
- 1996-06-20 WO PCT/JP1996/001707 patent/WO1997001591A1/ja active IP Right Grant
- 1996-06-20 CN CN96195163A patent/CN1109702C/zh not_active Expired - Fee Related
- 1996-06-20 EP EP96918862A patent/EP0835892B1/en not_active Expired - Lifetime
- 1996-06-20 KR KR1019970709418A patent/KR100271050B1/ko not_active IP Right Cessation
- 1996-06-20 DE DE69610771T patent/DE69610771T2/de not_active Expired - Fee Related
- 1996-06-22 TW TW085107522A patent/TW421664B/zh not_active IP Right Cessation
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1998
- 1998-09-30 HK HK98111083A patent/HK1015388A1/xx not_active IP Right Cessation
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Also Published As
Publication number | Publication date |
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KR100271050B1 (ko) | 2001-03-02 |
HK1015388A1 (en) | 1999-10-15 |
WO1997001591A1 (en) | 1997-01-16 |
DE69610771D1 (de) | 2000-11-30 |
KR19990022948A (ko) | 1999-03-25 |
EP0835892A4 (en) | 1998-06-10 |
CN1189841A (zh) | 1998-08-05 |
DE69610771T2 (de) | 2001-02-22 |
CN1109702C (zh) | 2003-05-28 |
EP0835892A1 (en) | 1998-04-15 |
US6329474B1 (en) | 2001-12-11 |
EP0835892B1 (en) | 2000-10-25 |
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